JPH07112272A - Soldering iron tip - Google Patents
Soldering iron tipInfo
- Publication number
- JPH07112272A JPH07112272A JP25974393A JP25974393A JPH07112272A JP H07112272 A JPH07112272 A JP H07112272A JP 25974393 A JP25974393 A JP 25974393A JP 25974393 A JP25974393 A JP 25974393A JP H07112272 A JPH07112272 A JP H07112272A
- Authority
- JP
- Japan
- Prior art keywords
- tip
- solder
- surface layer
- layer
- soldering iron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は半田コテ先に係り、特に
耐久性が著しく改善された半田コテ先に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering iron tip, and more particularly to a soldering iron tip having significantly improved durability.
【０００２】[0002]
【従来の技術】半田コテは、ヒータを内蔵する半田コテ
本体の先端に半田コテ先が取り付けられている。第２図
に示す如く、従来の半田コテ先１０は、ヒータの熱伝導
性の面から、その本体１１は銅製（無酸素銅製）とされ
ている。そして、半田との濡れ性を確保するため及び銅
の高温酸化に伴う材料劣化を防止するために、先端部分
には０．５〜１ｍｍ厚さの鉄（純鉄）メッキ１２が施さ
れ、この先端部分以外の部分には、半田がコテ先１０を
登ってくるのを防止するために、クロム（硬質クロム）
メッキ１３が施されている。2. Description of the Related Art In a soldering iron, a soldering iron tip is attached to the tip of a soldering iron body containing a heater. As shown in FIG. 2, the body 11 of the conventional soldering iron tip 10 is made of copper (oxygen-free copper) in view of the heat conductivity of the heater. Then, in order to secure wettability with solder and prevent material deterioration due to high temperature oxidation of copper, the tip portion is plated with iron (pure iron) 12 having a thickness of 0.5 to 1 mm. In order to prevent solder from climbing up on the iron tip 10, chrome (hard chrome) is applied to parts other than the tip part.
Plating 13 is applied.
【０００３】即ち、コテ先１０の極先端部分について
は、半田成分と十分な濡れ性を有し、半田の“のり”が
良いことが必要とされる。半田との濡れ性の最も良い金
属は金、銀等であるが、これらは高価であるため、通常
コスト面から安価でかつ比較的半田との濡れ性も良好な
鉄が採用されている。この鉄メッキ１２は、銅製本体１
０が半田成分のＳｎと反応して浸食されるのを防止する
作用もある。因みに、銅は半田と直接接触した場合に
は、Ｓｎとの反応によりその寿命は２〜３時間である
が、鉄メッキの存在によりその寿命を２、３日〜１週間
に延長することができる。That is, the extreme tip of the iron tip 10 is required to have sufficient wettability with the solder component and to have a good "glue" of the solder. Although the metal having the best wettability with solder is gold, silver, etc., they are expensive, and therefore iron is usually used because of its low cost and relatively good wettability with solder. This iron plating 12 is a copper body 1
There is also an effect of preventing 0 from being eroded by reacting with Sn of the solder component. By the way, when copper is in direct contact with solder, its life is 2-3 hours due to the reaction with Sn, but its life can be extended to a few days to 1 week due to the presence of iron plating. .
【０００４】コテ先１０の先端部分以外は、半田が登っ
て半田のロスが生じたり、作業性が損なわれるのを防止
するために、半田との濡れ性が悪いことが要求されるこ
とから半田との濡れ性の悪いクロムメッキ１３が施され
ている。Except for the tip of the iron tip 10, solder is required to have poor wettability in order to prevent the solder from climbing up, resulting in loss of solder and impairing workability. Chrome plating 13 having poor wettability with is applied.
【０００５】一方、半田付けに用いられる半田はＰｂ−
Ｓｎ合金を主成分とするが、半田成分の濡れ性、広がり
性、半田付け性を改善するために、フラックスが配合さ
れており、一般に０．１〜０．８％程度の塩素を含む。On the other hand, the solder used for soldering is Pb-
Although the main component is Sn alloy, a flux is mixed in order to improve the wettability, spreadability and solderability of solder components, and generally contains chlorine of about 0.1 to 0.8%.
【０００６】このため、先端部分に鉄メッキを施した従
来の半田コテ先では、次のような問題があり、十分な耐
食性、耐久性が得られなかった。For this reason, the conventional soldering iron tip having the tip end plated with iron has the following problems, and sufficient corrosion resistance and durability cannot be obtained.
【０００７】即ち、鉄メッキ層はポーラスであるため、
半田に含有される塩素等の腐食性物質により侵食され易
い。鉄メッキ層が侵食された場合には、銅製本体が局部
的に露出することとなり、この結果、Ｃｕと半田のＳｎ
とが反応してコテ先は損傷し、使用不可能となる。That is, since the iron plating layer is porous,
Easily corroded by corrosive substances such as chlorine contained in solder. When the iron plating layer is eroded, the copper body is locally exposed, and as a result, Sn of Cu and solder
And the iron tip is damaged and becomes unusable.
【０００８】このため、従来のコテ先においては、銅製
本体を鉄メッキ層で保護してはいるものの、その寿命は
２、３日〜１週間と十分長いとは言えず、コテ先の取替
作業を頻繁に行う必要があった。Therefore, in the conventional iron tip, although the copper body is protected by the iron-plated layer, its life cannot be said to be sufficiently long as a few days to one week, and the iron tip must be replaced. It was necessary to do the work frequently.
【０００９】コテ先の取替作業は、例えば自動半田装置
の場合、中心位置の設定等、非常に注意を要する作業で
あって、特に精密機器に用いる半田コテでは、正確に位
置決めを行なう必要があることから、コテ先の耐食性、
耐久性を向上させ、この作業頻度を低減することが強く
要望されている。In the case of an automatic soldering machine, for example, the replacement work of the iron tip requires very careful work such as setting the center position, and particularly in the soldering iron used for precision equipment, accurate positioning is required. Therefore, the corrosion resistance of the iron tip,
It is strongly desired to improve durability and reduce the frequency of this work.
【００１０】そこで、本出願人は、耐食性、耐久性に優
れた半田コテ先として、第３図に示す如く、先端に半田
との濡れ性の低いアモルファス金属のコーティング膜１
４を介して半田との濡れ性の良い鉄メッキ１２を施した
半田コテ先１０Ａを開発し、先に特許出願した（特願平
１−２０３１６）。この半田コテ先１０Ａによれば、鉄
メッキ１２が侵食された場合でも、下地層のアモルファ
ス金属のコーティング膜１４により、本体１１は確実に
保護されるため、耐久性、耐食性が改善される。Therefore, the applicant of the present invention, as a soldering iron tip excellent in corrosion resistance and durability, as shown in FIG. 3, has a coating film 1 of an amorphous metal having low wettability with solder on the tip.
A soldering iron tip 10A having an iron plating 12 having a good wettability with the solder was developed and a patent application was previously filed (Japanese Patent Application No. 1-20316). According to this soldering iron tip 10A, even when the iron plating 12 is corroded, the amorphous metal coating film 14 of the underlayer reliably protects the main body 11, so that the durability and corrosion resistance are improved.
【００１１】[0011]
【発明が解決しようとする課題】しかしながら、第３図
に示す半田コテ先１０Ａでは、鉄メッキ１２とアモルフ
ァス金属のコーティング膜１４との密着強度が不足し、
鉄メッキ１２が浮き上がって剥離する場合があるという
不具合がある。However, in the soldering iron tip 10A shown in FIG. 3, the adhesion strength between the iron plating 12 and the amorphous metal coating film 14 is insufficient,
There is a problem that the iron plating 12 may float and peel off.
【００１２】このため、半田コテ先の先端に耐食性に優
れると共に高い密着力を有する被膜を形成する技術が望
まれていた。Therefore, there has been a demand for a technique for forming a coating film having excellent corrosion resistance and high adhesion on the tip of the soldering iron tip.
【００１３】本発明は上記従来の実情に鑑みてなされた
ものであって、耐食性に優れ、しかも表面層の剥離の問
題もない、高耐久性の半田コテ先を提供することを目的
とする。The present invention has been made in view of the above conventional circumstances, and an object thereof is to provide a highly durable soldering iron tip which is excellent in corrosion resistance and has no problem of peeling of the surface layer.
【００１４】[0014]
【課題を解決するための手段】本発明の半田コテ先は、
先端部分に、高耐食性アモルファス金属よりなる下地層
と、半田との濡れ性の良い金属よりなる表面層とが、該
下地層と表面層との双方に密着性の良い材料よりなる中
間層を介して積層形成されてなることを特徴とする。The soldering iron tip of the present invention is
An underlayer made of a highly corrosion-resistant amorphous metal and a surface layer made of a metal having good wettability with solder are provided on the tip end portion with an intermediate layer made of a material having good adhesion to both the underlayer and the surface layer. It is characterized in that they are laminated and formed.
【００１５】なお、本明細書において、アモルファス金
属とは、金属単体の他、合金をも含む。In this specification, the amorphous metal includes an alloy as well as a simple metal.
【００１６】[0016]
【作用】アモルファス金属は、周知のように、 極めて耐食性が高い、 高硬度である、 機械的強度が高く靭性に優れる、 等の従来の結晶質の金属・合金には見られない優れた特
徴を有している。[Function] As is well known, amorphous metal has excellent characteristics not found in conventional crystalline metals and alloys such as extremely high corrosion resistance, high hardness, high mechanical strength and excellent toughness. Have
【００１７】本発明の半田コテ先は、その先端部に表面
層として半田との濡れ性の良い金属の被覆層が形成され
ているため、良好な半田付け作業を行える。また、下地
層として、前述の如く、優れた耐久性等の特性を有する
アモルファス金属の被覆層が形成されているため、表面
層が半田により侵食された場合でも、下地層のアモルフ
ァス金属の被覆層により、本体は確実に保護されるの
で、その耐久性は著しく改善される。In the soldering iron tip of the present invention, a metal coating layer having a good wettability with solder is formed as a surface layer on the tip end portion thereof, so that a good soldering work can be performed. As described above, since the amorphous metal coating layer having excellent durability and other properties is formed as the underlayer, even if the surface layer is corroded by solder, the amorphous metal coating layer of the underlayer is formed. This ensures that the body is protected and its durability is significantly improved.
【００１８】しかも、これら表面層と下地層との間に、
表面層と下地層との双方に密着性の良い材料よりなる中
間層が介在されているため、表面層の密着力が高めら
れ、表面層の剥離が防止される。Moreover, between the surface layer and the underlayer,
Since the intermediate layer made of a material having good adhesiveness is interposed between both the surface layer and the underlayer, the adhesiveness of the surface layer is enhanced and peeling of the surface layer is prevented.
【００１９】[0019]
【実施例】以下、図面を参照して本発明の実施例につい
て説明する。Embodiments of the present invention will be described below with reference to the drawings.
【００２０】第１図は、本発明の半田コテ先の一実施例
を示す断面図である。FIG. 1 is a sectional view showing an embodiment of the soldering iron tip of the present invention.
【００２１】本実施例の半田コテ先１は、無酸素銅より
なるコテ先本体２の先端部分に、高耐食性アモルファス
金属よりなる下地層３と、半田との濡れ性の良い金属よ
りなる表面層４（例えば、純鉄メッキ）とを、下地層３
と表面層４との双方に密着性の良い材料よりなる中間層
５を介して積層形成し、その他の部分は半田との濡れ性
の低い材料、例えば硬質クロムメッキ６を施したもので
ある。The soldering iron tip 1 of the present embodiment comprises a base layer 3 made of a highly corrosion-resistant amorphous metal and a surface layer made of a metal having a good wettability with solder, at the tip of the iron tip body 2 made of oxygen-free copper. 4 (for example, pure iron plating)
And the surface layer 4 are laminated and formed with an intermediate layer 5 made of a material having good adhesiveness interposed therebetween, and the other portions are coated with a material having low wettability with solder, for example, hard chrome plating 6.
【００２２】このような半田コテ先１は、先端部分が半
田との濡れ性の良い金属の表面層４とされているため、
半田付けの作業性が良好で、しかも、高耐食性アモルフ
ァス金属の下地層３を有するため耐食性に著しく優れ
る。また、中間層５の介在により表面層４の剥離の問題
もない。一方、先端部分以外は、クロムメッキ４等の半
田との濡れ性の良くない材料で形成されているため、半
田が登ることもない。Since the tip of the soldering iron tip 1 is a metal surface layer 4 having good wettability with solder,
The workability of soldering is good, and the corrosion resistance is remarkably excellent because of having the underlayer 3 of amorphous metal having high corrosion resistance. In addition, there is no problem of peeling of the surface layer 4 due to the intermediate layer 5. On the other hand, except for the tip portion, the solder does not climb because it is made of a material such as chrome plating 4 having poor wettability with the solder.
【００２３】本発明において、下地層を形成する高耐食
性アモルファス金属としては、下記，，の合金組
成のものが挙げられる。In the present invention, examples of the highly corrosion-resistant amorphous metal forming the underlayer include those having the following alloy compositions.
【００２４】 Ｔａ：３０〜６０原子％ Ｆｅ：３０〜５０原子％ Ｎｉ：３〜７原子％ Ｃｒ：７〜１５原子％ Ｗ ：１０〜７５原子％ Ｆｅ：３０〜５０原子％ Ｎｉ：３〜１０原子％ Ｃｒ：７〜２０原子％ Ｔｉ：１０〜７５原子％ Ｆｅ：３０〜５０原子％ Ｎｉ：３〜１０原子％ Ｃｒ：７〜２０原子％ このような高耐食性アモルファス金属よりなる下地層
は、薄過ぎると十分な耐食性が得られず、厚過ぎると剥
離やコスト高騰の問題が生じることから、０．１〜１０
μｍ程度の厚さとするのが好ましい。Ta: 30 to 60 atomic% Fe: 30 to 50 atomic% Ni: 3 to 7 atomic% Cr: 7 to 15 atomic% W: 10 to 75 atomic% Fe: 30 to 50 atomic% Ni: 3 to 10 Atomic% Cr: 7 to 20 atomic% Ti: 10 to 75 atomic% Fe: 30 to 50 atomic% Ni: 3 to 10 atomic% Cr: 7 to 20 atomic% The underlayer made of such a high corrosion resistant amorphous metal is If it is too thin, sufficient corrosion resistance cannot be obtained, and if it is too thick, problems such as peeling and cost increase occur.
The thickness is preferably about μm.
【００２５】また、表面層を形成する半田との濡れ性の
良い金属としては、鉄のほか、金、銀等も用い得るが、
コストの面から鉄が好ましい。この表面層の厚さは、薄
過ぎると十分な半田濡れ性が得られず、厚過ぎると剥離
の問題が生じることから、２００〜５００μｍ程度の厚
さとするのが好ましい。As the metal having good wettability with the solder forming the surface layer, iron, gold, silver or the like may be used.
Iron is preferable in terms of cost. If the surface layer is too thin, sufficient solder wettability cannot be obtained, and if it is too thick, a problem of peeling occurs. Therefore, the thickness of the surface layer is preferably about 200 to 500 μm.
【００２６】これら下地層と表面層との間に介在される
中間層を形成する、下地層と表面層との双方に密着性の
良い材料としては、通常の場合、表面層を構成する金属
と同種の金属を下地層の形成と同一手段、例えばスパッ
タ法等で形成したものが好ましい。In general, a material that forms an intermediate layer interposed between the underlayer and the surface layer and has good adhesion to both the underlayer and the surface layer is a metal that constitutes the surface layer. It is preferable that the same kind of metal is formed by the same means as that for forming the underlayer, for example, a sputtering method.
【００２７】この中間層の厚さについても、薄過ぎると
密着性の改善効果が不足し、厚過ぎると剥離の問題が生
じることから、０．０５〜３μｍ程度の厚さとするのが
好ましい。The thickness of the intermediate layer is preferably about 0.05 to 3 μm, because if it is too thin, the effect of improving the adhesiveness is insufficient, and if it is too thick, the problem of peeling occurs.
【００２８】なお、本発明の半田コテ先においては、先
端部に上述の３層積層被覆構造が形成されていれば良
く、先端部以外の構成には特に制限はない。In the soldering iron tip of the present invention, it is sufficient that the above-mentioned three-layer laminated coating structure is formed on the tip portion, and there is no particular limitation on the structure other than the tip portion.
【００２９】従って、先端部以外の部分は、下地層に連
続したアモルファス金属の被覆層が形成されたものであ
っても良い。この場合、アモルファス金属としては、半
田との濡れ性の低いものとする必要がある。或いは、先
端部以外の部分は下地層に連続したアモルファス金属の
被覆層上に更にクロムメッキ等の半田との濡れ性の低い
材料の被覆層を形成したものであっても良い。Therefore, the portion other than the tip portion may have a continuous amorphous metal coating layer formed on the underlayer. In this case, the amorphous metal needs to have low wettability with solder. Alternatively, a portion other than the tip may be formed by further forming a coating layer of a material having low wettability with solder such as chrome plating on a coating layer of amorphous metal continuous with the underlayer.
【００３０】なお、本発明において、半田コテ先の先端
部分とは、半田付に必要な作業端であって、作業内容に
よって、その幅等は適宜決定される。In the present invention, the tip portion of the soldering iron tip is a working end necessary for soldering, and its width and the like are appropriately determined depending on the work contents.
【００３１】また、半田としては、通常使われている組
成のものがあてはまる。具体的には、Ｐｂ−Ｓｎ系の半
田が例示される。Further, as the solder, one having a composition which is usually used is applicable. Specifically, Pb-Sn based solder is exemplified.
【００３２】本発明の半田コテ先は、通常、一か月ある
いはそれ以上の長期にわたって使用することができる。
以下に具体的な実施例及び、比較例を示す。The soldering iron tip of the present invention can generally be used for a long period of one month or more.
Specific examples and comparative examples are shown below.
【００３３】実施例１ 無酸素銅よりなるコテ先本体の先端部分に、下記の被覆
層を積層形成し、第１図に示す本発明の半田コテ先を作
成した。Example 1 A soldering iron tip of the present invention shown in FIG. 1 was prepared by laminating and forming the following coating layer on the tip portion of the iron tip body made of oxygen-free copper.
【００３４】下地層：スパッタ法により形成したアモル
ファス金属層（厚さ８μｍ） 中間層：スパッタ法により形成したＦｅ層（厚さ１μ
ｍ） 表面層：純Ｆｅメッキ層（厚さ２５０μｍ） 得られた半田コテ先の先端の曲げ試験を行ない、Ｆｅメ
ッキ層の剥離が生じる角度を調べた。その結果、先端を
９０°以上に曲げてもＦｅメッキ層の剥離は起こらなか
った。 比較例１ 中間層を形成しなかったこと以外は、実施例１と同様に
して半田コテ先を作成し、同様に曲げ試験を行なったと
ころ、先端を３０°曲げたところで、Ｆｅメッキ層の剥
離が発生した。Underlayer: Amorphous metal layer (thickness 8 μm) formed by sputtering method Intermediate layer: Fe layer (thickness 1 μm) formed by sputtering method
m) Surface layer: pure Fe plating layer (thickness: 250 μm) A bending test was performed on the tip of the obtained soldering iron tip to examine the angle at which the Fe plating layer was peeled off. As a result, the Fe plating layer did not peel even when the tip was bent at 90 ° or more. Comparative Example 1 A soldering iron tip was prepared in the same manner as in Example 1 except that the intermediate layer was not formed, and a bending test was conducted in the same manner. When the tip was bent by 30 °, the Fe plating layer was peeled off. There has occurred.
【００３５】[0035]
【発明の効果】以上詳述した通り、本発明の半田コテ先
は、半田とのなじみ性も良く、良好な半田付け作業を行
なえる上に、耐食性、耐久性に極めて優れるため、その
寿命は大幅に延長され、半田コテ先の取替作業頻度を著
しく低減し、半田付け作業効率を向上させることができ
る。As described above in detail, the soldering iron tip of the present invention has good compatibility with solder, can perform good soldering work, and is extremely excellent in corrosion resistance and durability. It is significantly extended, the frequency of solder iron tip replacement work can be significantly reduced, and the soldering work efficiency can be improved.
【００３６】本発明の半田コテ先は、特に電子回路、電
子材料の接合、組立技術分野に有用である。The soldering iron tip of the present invention is particularly useful in the field of electronic circuits, joining of electronic materials, and assembly technology.
【図１】本発明の半田コテ先の一実施例を示す断面図で
ある。FIG. 1 is a sectional view showing an embodiment of a soldering iron tip of the present invention.
【図２】従来の半田コテ先を示す断面図である。FIG. 2 is a cross-sectional view showing a conventional soldering iron tip.
【図３】従来の半田コテ先を示す断面図である。FIG. 3 is a cross-sectional view showing a conventional soldering iron tip.
１ 半田コテ先 ２ コテ先本体 ３ 下地層 ４ 表面層 ５ 中間層 ６ クロムメッキ層 1 Soldering iron tip 2 Iron tip body 3 Underlayer 4 Surface layer 5 Intermediate layer 6 Chrome plating layer
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｃ２５Ｄ 3/20 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display location C25D 3/20
Claims (1)
よりなる下地層と、半田との濡れ性の良い金属よりなる
表面層とが、該下地層と表面層との双方に密着性の良い
材料よりなる中間層を介して積層形成されてなることを
特徴とする半田コテ先。1. A base layer made of a highly corrosion-resistant amorphous metal and a surface layer made of a metal having a good wettability with solder are provided at a tip portion of the material having good adhesion to both the base layer and the surface layer. A soldering iron tip, which is formed by laminating an intermediate layer of
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25974393A JPH07112272A (en) | 1993-10-18 | 1993-10-18 | Soldering iron tip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25974393A JPH07112272A (en) | 1993-10-18 | 1993-10-18 | Soldering iron tip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07112272A true JPH07112272A (en) | 1995-05-02 |
Family
ID=17338337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25974393A Pending JPH07112272A (en) | 1993-10-18 | 1993-10-18 | Soldering iron tip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07112272A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005093113A1 (en) * | 2004-03-25 | 2005-10-06 | Topy Kogyo Kabushiki Kaisha | Metallic glass laminate, process for producing the same and use thereof |
| JP2006097132A (en) * | 2004-09-02 | 2006-04-13 | Tohoku Univ | Solder erosion resistant member |
| JP2008500184A (en) * | 2004-05-25 | 2008-01-10 | 白光株式会社 | Replaceable tip, solder heating device having the tip, and method for manufacturing the tip |
| US8237091B2 (en) | 2002-11-26 | 2012-08-07 | Hakko Corporation | Soldering iron with replaceable tip |
-
1993
- 1993-10-18 JP JP25974393A patent/JPH07112272A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8237091B2 (en) | 2002-11-26 | 2012-08-07 | Hakko Corporation | Soldering iron with replaceable tip |
| WO2005093113A1 (en) * | 2004-03-25 | 2005-10-06 | Topy Kogyo Kabushiki Kaisha | Metallic glass laminate, process for producing the same and use thereof |
| EP2479309A1 (en) | 2004-03-25 | 2012-07-25 | Topy Kogyo Kabushiki Kaisha | Metallic glass laminates, production methods and applications thereof |
| JP2008500184A (en) * | 2004-05-25 | 2008-01-10 | 白光株式会社 | Replaceable tip, solder heating device having the tip, and method for manufacturing the tip |
| JP4759562B2 (en) * | 2004-05-25 | 2011-08-31 | 白光株式会社 | Replaceable tip, solder heating device having the tip, and method for manufacturing the tip |
| JP2006097132A (en) * | 2004-09-02 | 2006-04-13 | Tohoku Univ | Solder erosion resistant member |
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