JPH05228625A - Soldering tool of diamond single crystal - Google Patents
Soldering tool of diamond single crystalInfo
- Publication number
- JPH05228625A JPH05228625A JP4029505A JP2950592A JPH05228625A JP H05228625 A JPH05228625 A JP H05228625A JP 4029505 A JP4029505 A JP 4029505A JP 2950592 A JP2950592 A JP 2950592A JP H05228625 A JPH05228625 A JP H05228625A
- Authority
- JP
- Japan
- Prior art keywords
- tool
- single crystal
- diamond single
- base material
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、電気回路の配線工程
に使用される半田付け工具に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering tool used in an electric circuit wiring process.
【０００２】[0002]
【従来の技術】自動半田付け装置に組込まれる半田付け
工具として、熱伝導性の高い銅Ｃｕを工具素材とし、工
具全体または先端部にクロムメッキを施して耐摩耗性、
耐食性、耐熱性を高めたものが従来から知られている。2. Description of the Related Art As a soldering tool incorporated in an automatic soldering apparatus, copper Cu, which has high thermal conductivity, is used as a tool material, and the entire tool or the tip portion is plated with chrome to provide wear resistance.
Conventionally, those having improved corrosion resistance and heat resistance have been known.
【０００３】[0003]
【発明が解決しようとする課題】ところで、上記従来の
半田付け工具においては、使用中に工具先端に半田が付
着することが多くあり、高圧エアの吹付け等によって付
着半田を除去する必要がある。また、連続した半田付け
作業によって、工具先端に繰り返し応力が作用するた
め、メッキ膜に剥れが生じ易く、そのメッキ膜の剥れに
よって溶融半田が付着する。この半田の付着力はきわめ
て強く、高圧エアの吹付けだけでは除去することができ
ず、半田付け工具の取り替えを必要とし、その工具の取
り替え時、装置を停止させる必要があるため、装置の稼
働率を著しく低下させる問題がある。By the way, in the above-mentioned conventional soldering tool, solder is often attached to the tip of the tool during use, and it is necessary to remove the attached solder by blowing high-pressure air or the like. .. Further, since stress is repeatedly applied to the tool tip due to continuous soldering work, the plating film is likely to peel off, and the molten solder adheres due to the peeling off of the plating film. This solder has an extremely strong adhesive force and cannot be removed only by blowing high-pressure air, so it is necessary to replace the soldering tool, and it is necessary to stop the device when replacing the tool. There is a problem of significantly lowering the rate.
【０００４】この発明は、上記従来の問題点を解決し、
半田付け工具の寿命向上を図り、半田の付着を防止する
ことを技術的課題としている。The present invention solves the above-mentioned conventional problems,
A technical issue is to prevent the adhesion of solder by improving the life of the soldering tool.
【０００５】[0005]
【課題を解決するための手段】上記の課題を解決するた
めに、この発明においては、天然ダイヤモンド単結晶又
は合成ダイヤモンド単結晶を工具素材とし、その工具素
材を工具母材に接合した構成を採用したのである。In order to solve the above problems, the present invention adopts a constitution in which a natural diamond single crystal or a synthetic diamond single crystal is used as a tool material and the tool material is joined to a tool base material. I did.
【０００６】ここで、工具母材と工具素材の線膨脹係数
が大きく相違すると、両部材の接合時に、工具母材と工
具素材の熱膨脹差から応力が発生し、工具素材に亀裂が
入り易くなる。If the linear expansion coefficients of the tool base material and the tool material are significantly different, stress is generated due to the difference in thermal expansion between the tool base material and the tool material when joining the two members, and the tool material is likely to crack. ..
【０００７】したがって、工具母材は、工具素材と略同
等の線膨脹係数を有する材料で形成し、室温から５００
℃までの線膨脹係数が３×１０-6〜７．５-6／℃の範囲
にある材料を用いるのがよい。Therefore, the tool base material is formed of a material having a coefficient of linear expansion substantially equal to that of the tool material, and is from room temperature to 500.
It is preferable to use a material whose coefficient of linear expansion up to ° C is in the range of 3 x 10 -6 to 7.5 -6 / ° C.
【０００８】そのような材料として、ＳｉＣ、Ｓｉ3 Ｎ
4 、Ｍｏ、Ｗ、超硬合金、Ｆｅ−Ｎｉ合金、鋼等の金属
や合金、セラミック等を挙げることができる。As such materials, SiC, Si 3 N
4 , metals such as Mo, W, cemented carbide, Fe-Ni alloy, steel, alloys, ceramics and the like can be mentioned.
【０００９】また、ダイヤモンド結晶体の半田と接触す
る部分の面粗度は、半田の付着を防止する上において細
かい程好ましいが、細かくなると高精度の研磨を必要と
し、工具のコストが高くなる。このため、上記面粗度は
Ｒｍａｘ０．００５μｍ〜０．５μｍ程度とするのがよ
い。Further, the surface roughness of the portion of the diamond crystal body which comes into contact with the solder is preferably as small as possible in order to prevent the adhesion of the solder, but if it becomes fine, high precision polishing is required and the cost of the tool becomes high. Therefore, it is preferable that the surface roughness is about Rmax 0.005 μm to 0.5 μm.
【００１０】工具母材と工具素材の接合には、ロウ材を
用いるロウ接法を採用することができる。A brazing method using a brazing material can be used for joining the tool base material and the tool material.
【００１１】ロウ接法を採用する場合は、３００℃以上
の融点を有するロウ材を用いる。そのようなロウ材とし
て、周期律表第IVａ、Va、VIａ、VIIa族元素の少なくと
も１種以上を１〜４０重量％含有し、残部が周期律表第
VIII族、Ｃｕ、Ａｇ、Ａｕ、Ｂ、Ｉｎ、Ｓｎの少なくと
も１種以上から成る合金を挙げることができる。When the brazing method is used, a brazing material having a melting point of 300 ° C. or higher is used. As such a brazing filler metal, 1 to 40% by weight of at least one element of Group IVa, Va, VIa and VIIa of the Periodic Table is contained, and the balance is the Periodic Table
An alloy made of at least one of Group VIII, Cu, Ag, Au, B, In and Sn can be mentioned.
【００１２】上記ロウ接法を採用する接合において、工
具素材の接合面に周期律表第IVａ、Va、VIａ、VIIa族元
素の少なくとも１種以上から成る金属、合金又はこれら
元素の化合物から成る薄膜と、周期率表第VIII族、Ｃ
ｕ、Ａｇ、Ａｕの１種以上から成る薄膜をその順番で被
覆し、その被覆層を介して工具母材と工具素材とをロウ
接することにより、工具母材と工具素材をより強固に接
合することができる。In the joining using the above-mentioned brazing method, a thin film made of a metal, an alloy or a compound of these elements, which is made of at least one of Group IVa, Va, VIa and VIIa elements of the periodic table, on the joining surface of the tool material And the periodic table, group VIII, C
A thin film of at least one of u, Ag, and Au is coated in that order, and the tool base material and the tool material are brazed through the coating layer to more firmly bond the tool base material and the tool material. be able to.
【００１３】[0013]
【実施例１】高温高圧合成法により１カラットのダイヤ
モンド単結晶を合成し、切断面が１００方位となるよう
レーザーで切断し、その切断面をスカイフ盤で研磨し、
面粗度がＲｍａｘ０．０５μｍ、厚さ０．５mmのダイヤ
モンド単結晶から成る工具素材を形成した。Example 1 A 1-carat diamond single crystal was synthesized by a high-temperature high-pressure synthesis method, cut with a laser so that the cut surface had 100 orientations, and the cut surface was polished with a skiff machine.
A tool material made of a diamond single crystal having a surface roughness Rmax of 0.05 μm and a thickness of 0.5 mm was formed.
【００１４】上記工具素材をさらにレーザーで所定の寸
法に切断したのち、材質がＭｏである工具母材に、Ａｇ
−Ｃｕ−Ｔｉ合金のロウ材で真空ロウ付けを行ない、図
１に示す半田付け工具Ａを形成した。ここで、１は工具
素材、２は工具母材を示す。After cutting the above tool material into a predetermined size with a laser, Ag is added to a tool base material made of Mo.
Vacuum brazing was performed with a brazing material of a —Cu—Ti alloy to form a soldering tool A shown in FIG. Here, 1 indicates a tool material, and 2 indicates a tool base material.
【００１５】その半田付け工具Ａを加熱温度２００℃荷
重０．３kgで半田付け作業を繰り返し行なったところ、
工具素材１の摩耗は殆んどなく、３０万回の使用に充分
耐え、半田の付着は全くなかった。When the soldering tool A was repeatedly soldered at a heating temperature of 200 ° C. and a load of 0.3 kg,
The tool material 1 was scarcely worn, withstands enough use of 300,000 times, and has no solder adhesion.
【００１６】その比較として、従来のクロムメッキ工具
を同条件で半田付け作業を行なったところ、約１万回の
使用によって半田が強く付着し、除去することができな
かった。As a comparison, when the conventional chromium plating tool was soldered under the same conditions, the solder adhered strongly after about 10,000 times use and could not be removed.
【００１７】このことから、本発明の半田付け工具は従
来の工具に比較して、３０倍以上の寿命をもつことが分
る。From this, it can be seen that the soldering tool of the present invention has a life of 30 times or more as compared with the conventional tool.
【００１８】[0018]
【実施例２】実施例１と同様の製造方法によって、表１
に示すダイヤモンド単結晶半田付け工具を形成した。Example 2 Table 1 was prepared by the same manufacturing method as in Example 1.
The diamond single crystal soldering tool shown in FIG.
【００１９】[0019]
【表１】 [Table 1]
【００２０】これらの半田付け工具の製作結果を表２に
示し、同時に、実施例１と同条件での半田付けテストの
結果を示す。The production results of these soldering tools are shown in Table 2, and at the same time, the results of the soldering test under the same conditions as in Example 1 are shown.
【００２１】[0021]
【表２】 [Table 2]
【００２２】[0022]
【実施例３】ダイヤモンド単結晶と数種の工具母材とを
下記２つの接合方法により接合してＮｏ，Ｇ乃至Ｋの工
具を形成し、各工具の工具素材と工具母材の接合強度
（剪断強度）を測定した。その結果を表３に示す。Example 3 A diamond single crystal and several types of tool base materials were joined by the following two joining methods to form No, G to K tools, and the joining strength between the tool material of each tool and the tool base material ( Shear strength) was measured. The results are shown in Table 3.
【００２３】接合方法 （Ｉ）：６０Ａｇ−３０Ｃｕ−１０Ｔｉ（重量％）のロ
ウ材を用いて真空ロウ付けするロウ付け方法 （II）：工具接合面に厚さ１μｍのＴｉとＮｉを被覆
し、７０Ａｇ−３０Ｃｕ（重量％）のロウ材を用いて高
周波加熱により大気中でロウ付けするロウ付け方法Joining method (I): Brazing method for vacuum brazing using a brazing material of 60Ag-30Cu-10Ti (wt%) (II): Ti and Ni with a thickness of 1 μm are coated on the tool joining surface, A brazing method of brazing in the atmosphere by high frequency heating using a brazing material of 70Ag-30Cu (wt%)
【００２４】[0024]
【表３】 [Table 3]
【００２５】[0025]
【発明の効果】以上のように、この発明に係る半田付け
工具においては、耐摩耗性、耐食性、耐熱性に優れたダ
イヤモンド単結晶から成る工具素材を工具母材に接合し
た構成を採用したので、工具の寿命の大幅な向上を図る
ことができると共に、ダイヤモンド単結晶体は濡れ性が
少ないため半田の付着がなく、半田の使用量を一定に制
御することが可能となり、半田の除去工程を省くことが
できる。As described above, in the soldering tool according to the present invention, the tool base material made of diamond single crystal having excellent wear resistance, corrosion resistance and heat resistance is joined to the tool base material. In addition, the tool life can be significantly improved, and since the diamond single crystal body has low wettability, there is no solder adhesion and it is possible to control the amount of solder used uniformly. It can be omitted.
【図１】この発明に係る半田付け工具の一実施例を示す
正面図FIG. 1 is a front view showing an embodiment of a soldering tool according to the present invention.
１ 工具素材 ２ 工具母材 1 Tool material 2 Tool base material
Claims (3)
モンド単結晶を工具素材とし、その工具素材を工具母材
に接合したダイヤモンド単結晶半田付け工具。1. A diamond single crystal soldering tool in which a natural diamond single crystal or a synthetic diamond single crystal is used as a tool material, and the tool material is joined to a tool base material.
×１０-6〜７．５×１０-6／℃の範囲にある金属、合
金、セラミックのいずれかを工具母材とした請求項１に
記載のダイヤモンド単結晶半田付け工具。2. The linear expansion coefficient from room temperature to 600 ° C. is 3.
The diamond single crystal soldering tool according to claim 1, wherein any one of a metal, an alloy, and a ceramic within a range of × 10 -6 to 7.5 × 10 -6 / ° C is used as a tool base material.
Ｗ、超硬合金、Ｆｅ−Ｎｉ合金、綱のいずれか１つから
成る請求項１又は２に記載のダイヤモンド単結晶半田付
け工具。3. The tool base material is SiC, Si 3 N 4 , Mo,
The diamond single crystal soldering tool according to claim 1 or 2, comprising any one of W, cemented carbide, Fe-Ni alloy, and steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4029505A JPH05228625A (en) | 1992-02-17 | 1992-02-17 | Soldering tool of diamond single crystal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4029505A JPH05228625A (en) | 1992-02-17 | 1992-02-17 | Soldering tool of diamond single crystal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05228625A true JPH05228625A (en) | 1993-09-07 |
Family
ID=12277952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4029505A Pending JPH05228625A (en) | 1992-02-17 | 1992-02-17 | Soldering tool of diamond single crystal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05228625A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107385439A (en) * | 2017-06-02 | 2017-11-24 | 泉州众志金刚石工具有限公司 | A kind of Cu Ag Ti diamond brazing coating and its preparation method |
| CN116352210A (en) * | 2023-04-28 | 2023-06-30 | 哈尔滨工业大学 | Diamond electric iron and preparation method thereof |
-
1992
- 1992-02-17 JP JP4029505A patent/JPH05228625A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107385439A (en) * | 2017-06-02 | 2017-11-24 | 泉州众志金刚石工具有限公司 | A kind of Cu Ag Ti diamond brazing coating and its preparation method |
| CN107385439B (en) * | 2017-06-02 | 2023-10-17 | 泉州众志金刚石工具有限公司 | Cu-Ag-Ti diamond brazing coating and preparation method thereof |
| CN116352210A (en) * | 2023-04-28 | 2023-06-30 | 哈尔滨工业大学 | Diamond electric iron and preparation method thereof |
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