JPH0677192A - Wafer working tape and its usage method - Google Patents
Wafer working tape and its usage methodInfo
- Publication number
- JPH0677192A JPH0677192A JP22862092A JP22862092A JPH0677192A JP H0677192 A JPH0677192 A JP H0677192A JP 22862092 A JP22862092 A JP 22862092A JP 22862092 A JP22862092 A JP 22862092A JP H0677192 A JPH0677192 A JP H0677192A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- wafer
- tape
- wafer processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ウエハ加工用テープに
関するものである。ウエハ加工用テープは半導体集積回
路（以下、ＩＣという）製造工程において使用される。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer processing tape. The wafer processing tape is used in a semiconductor integrated circuit (hereinafter referred to as IC) manufacturing process.
【０００２】[0002]
【従来の技術】ＩＣは、通常高純度シリコン単結晶等を
スライスして半導体ウエハ（以下、単にウエハと略すこ
ともある）とした後、その表面に不純物熱拡散や超微細
加工等の手段で集積回路を組み込み、ダイシングしてチ
ップ化する方法で製造されている。2. Description of the Related Art In general, an IC is obtained by slicing a high-purity silicon single crystal or the like into a semiconductor wafer (hereinafter also simply referred to as a wafer), and then using a means such as impurity thermal diffusion or ultrafine processing on the surface thereof. It is manufactured by a method of incorporating an integrated circuit and dicing it into chips.
【０００３】これらの各工程において、ウエハの表面パ
ターン損傷や破損等を防止するため、ウエハ表面にウエ
ハ加工用テープが用いられている。In each of these steps, a wafer processing tape is used on the surface of the wafer in order to prevent damage or damage to the surface pattern of the wafer.
【０００４】一般に、粘着剤としては、水系エマルジョ
ン粘着剤と溶剤系粘着剤が用いられているが、安全面、
衛生面、コスト面から考えて水系エマルジョン粘着剤の
方が好ましい。Generally, water-based emulsion pressure-sensitive adhesives and solvent-based pressure-sensitive adhesives are used as pressure-sensitive adhesives.
From the viewpoint of hygiene and cost, the water-based emulsion adhesive is preferable.
【０００５】また、ウエハ加工用フィルムをウエハ加工
の用途に供した後、ウエハ表面の付着物を除去するため
に洗浄する際、溶剤系粘着剤を用いたフィルムを使用し
た場合、水洗浄では汚染を除去しきれず、有機溶剤の使
用等で手間がかかり、安全、衛生面からも問題がある。
一方、水系エマルジョン粘着剤を用いたフィルムでは、
水洗浄でも十分に汚染を除去できる。In addition, when the film for wafer processing is used for wafer processing and then cleaned to remove deposits on the wafer surface, when a film using a solvent-based adhesive is used, it is contaminated by water cleaning. Can not be completely removed, and it takes time and labor to use an organic solvent, which is problematic in terms of safety and hygiene.
On the other hand, in the film using the water-based emulsion adhesive,
Contamination can be sufficiently removed by washing with water.
【０００６】しかして、水系エマルジョン粘着剤は溶剤
系粘着剤に比べて耐水性が劣るという欠点があった。こ
の欠点を解消するウエハ加工用テープとして、粘着剤原
料のモノマーにフッ素含有モノマーを加えて重合したア
クリル系樹脂エマルジョン粘着剤を用いたウエハ加工用
テープを開発した。However, the water-based emulsion pressure-sensitive adhesive has a drawback that it is inferior in water resistance as compared with the solvent-based pressure-sensitive adhesive. As a wafer processing tape that overcomes this drawback, we have developed a wafer processing tape that uses an acrylic resin emulsion adhesive prepared by adding fluorine-containing monomer to the adhesive material monomer and polymerizing.
【０００７】しかして、フッ素含有モノマーは、撥水性
があると共に撥油性もあるため、他のモノマーと相溶性
が悪く、これらのモノマーを混合するためには、多量の
界面活性剤を必要とする。重合して得られた粘着剤は、
かえって耐水性が悪くなるとともに、界面活性剤が表面
にブリードし、ウエハに貼付けた後剥離するとウエハの
表面を汚染するという欠点があった。However, since the fluorine-containing monomer has water repellency and oil repellency, it has poor compatibility with other monomers, and a large amount of a surfactant is required to mix these monomers. . The pressure-sensitive adhesive obtained by polymerization is
On the contrary, the water resistance deteriorates, and the surfactant bleeds on the surface and contaminates the surface of the wafer when it is peeled after being attached to the wafer.
【０００８】[0008]
【発明が解決しようとする課題】以上の点に鑑み、本発
明は、ウエハを汚染せず、かつ耐水性に優れたウエハ加
工用テープを提供することを目的とする。SUMMARY OF THE INVENTION In view of the above points, an object of the present invention is to provide a wafer processing tape which does not contaminate the wafer and is excellent in water resistance.
【０００９】[0009]
【課題を解決するための手段】本発明者らは、上記目的
を達成する為に、鋭意検討した結果、粘着剤原料のモノ
マーにフッ素含有モノマーを加えて重合する際、反応性
界面活性剤を用いると、エマルジョン粒子との結びつき
が物理的な結合であり、フッ素含有モノマーと他のモノ
マーの分離が起きず、添加量が非反応性界面活性剤より
も少ない量で重合出来、重合して得られたアクリル系樹
脂エマルジョン粘着剤配合液を、基材フィルムに塗布し
てなるウエハ加工用テープは、ウエハを汚染せず、かつ
耐水性に優れていることを見出し、本発明を完成した。Means for Solving the Problems As a result of intensive studies to achieve the above object, the present inventors have found that when a fluorine-containing monomer is added to a monomer of a pressure-sensitive adhesive raw material and polymerized, a reactive surfactant is used. When used, the bond with the emulsion particles is a physical bond, separation of the fluorine-containing monomer and other monomers does not occur, and the addition amount can be polymerized in an amount smaller than that of the non-reactive surfactant, and obtained by polymerization. The present invention has been completed based on the finding that a wafer processing tape obtained by applying the acrylic resin emulsion pressure-sensitive adhesive formulation liquid thus obtained to a substrate film does not contaminate the wafer and is excellent in water resistance.
【００１０】即ち、本発明は、フッ素含有モノマーが
３．０〜２０．０重量％であるモノマー混合物１００重
量部に反応性界面活性剤０．１〜５．０重量部を添加し
て重合し、アクリル系樹脂エマルジョン粘着剤とした
後、該アクリル系樹脂エマルジョン粘着剤を基材フィル
ムに塗布してなることを特徴とするウエハ加工用テープ
である。That is, in the present invention, 0.1 to 5.0 parts by weight of a reactive surfactant is added to 100 parts by weight of a monomer mixture containing a fluorine-containing monomer in an amount of 3.0 to 20.0% by weight and polymerized. The tape for wafer processing is characterized in that after being made into an acrylic resin emulsion pressure-sensitive adhesive, the acrylic resin emulsion pressure-sensitive adhesive is applied to a substrate film.
【００１１】又、本発明は同ウエハ加工用テープを使用
することを特徴とするウエハ裏面研削方法である。The present invention is also a wafer backside grinding method characterized by using the same wafer processing tape.
【００１２】モノマー混合物とは、メタクリル酸メチ
ル、アクリル酸ブチル、アクリル酸−２−エチルヘキシ
ル、アクリル酸エチル等の（メタ）アクリル酸エステル
モノマーと、カルボン酸含有ビニル化合物であるアクリ
ル酸、メタクリル酸、クロトン酸、マレイン酸、フマル
酸、イタコン酸等のモノマーと、フッ素含有モノマーの
混合物である。The monomer mixture is a (meth) acrylic acid ester monomer such as methyl methacrylate, butyl acrylate, 2-ethylhexyl acrylate or ethyl acrylate, and acrylic acid or methacrylic acid, which is a carboxylic acid-containing vinyl compound. It is a mixture of monomers such as crotonic acid, maleic acid, fumaric acid and itaconic acid, and a fluorine-containing monomer.
【００１３】フッ素含有モノマーとはフッ素を含有する
ビニル化合物であり、例示するならば、トリフルオロエ
チルアクリレート、トリフルオロエチルメタクリレー
ト、ヘプタデカフルオロデシルアクリレート、ヘプタデ
カフルオロデシルメタクリレート等が挙げられる。The fluorine-containing monomer is a vinyl compound containing fluorine, and examples thereof include trifluoroethyl acrylate, trifluoroethyl methacrylate, heptadecafluorodecyl acrylate, and heptadecafluorodecyl methacrylate.
【００１４】モノマー混合物中のフッ素含有モノマー
は、３．０〜２０．０重量％である。さらに好ましく
は、５．０〜１０．０重量％である。３．０重量％未満
であると耐水性が向上せず、２０．０重量％を越える
と、他のモノマーとの相溶性が悪く、うまく共重合しな
い。The fluorine-containing monomer in the monomer mixture is 3.0-20.0% by weight. More preferably, it is 5.0 to 10.0% by weight. If it is less than 3.0% by weight, the water resistance will not be improved, and if it exceeds 20.0% by weight, the compatibility with other monomers will be poor and the copolymerization will not be successful.
【００１５】本発明に用いる重合時の反応性界面活性剤
としては、分子中にビニル基をもつものであれば、適宜
選択出来る、好ましくは、ノニオン系界面活性剤、又は
アンモニウム塩であるアニオン系界面活性剤である。The reactive surfactant during polymerization used in the present invention can be appropriately selected as long as it has a vinyl group in the molecule, preferably a nonionic surfactant or an anionic ammonium salt. It is a surfactant.
【００１６】例示するならば、ノニオン系界面活性剤と
しては、ポリオキシエチレンアルキルフェニルエーテル
のベンゼン環にアリル基を付加させた化合物、アニオン
系界面活性剤としては、ポリオキシエチレンアルキルフ
ェニルエーテル硫酸エステル化塩のベンゼン環にアリル
基を付加させた化合物、マレイン酸に高級アルコールと
アリル基を付加させた化合物に硫酸塩を付加させた化合
物等が挙げられる。For example, the nonionic surfactant is a compound obtained by adding an allyl group to the benzene ring of polyoxyethylene alkylphenyl ether, and the anionic surfactant is polyoxyethylene alkylphenyl ether sulfate. Examples thereof include a compound obtained by adding an allyl group to a benzene ring of a compound salt, a compound obtained by adding a sulfate to a compound obtained by adding a higher alcohol and an allyl group to maleic acid, and the like.
【００１７】しかし、ソーダ塩、カリ塩のアニオン系界
面活性剤では粘着剤中に残留したナトリウムイオンやカ
リウムイオンがウエハの腐食をまねく可能性がある。However, with anionic surfactants such as soda salt and potassium salt, sodium ions and potassium ions remaining in the pressure-sensitive adhesive may lead to corrosion of the wafer.
【００１８】反応性界面活性剤の添加量としては、モノ
マー混合物１００重量部に対して、０．１〜５．０重量
部であり、さらに好ましくは、０．２〜３．０重量部で
ある。０．１重量部未満であると重合時の安定性が悪
く、凝集物が多く発生し、収率が悪くなる。３．０重量
部を越えると、できた粘着剤の皮膜が吸水し、耐水性が
悪くなる。The amount of the reactive surfactant added is 0.1 to 5.0 parts by weight, and more preferably 0.2 to 3.0 parts by weight, based on 100 parts by weight of the monomer mixture. . If the amount is less than 0.1 parts by weight, the stability during polymerization is poor, many aggregates are generated, and the yield is poor. If it exceeds 3.0 parts by weight, the resulting pressure-sensitive adhesive film absorbs water, resulting in poor water resistance.
【００１９】アクリル系樹脂エマルジョン粘着剤は、モ
ノマー混合物に、反応性界面活性剤、脱イオン水、重合
開始剤を添加し水中でエマルジョン重合した粘着剤であ
り、モノマー組成の選択は必要とする粘着力に応じて適
宜行う事が可能である。こうして重合されたアクリル系
樹脂エマルジョン粘着剤は水以外に通常３０〜６０ｗｔ
％の固形分（アクリル系樹脂）を含有するが、塗布時に
は粘度調整のため更に水で希釈することもできる。The acrylic resin emulsion pressure-sensitive adhesive is a pressure-sensitive adhesive obtained by emulsion polymerization in water by adding a reactive surfactant, deionized water, and a polymerization initiator to a monomer mixture, and it is necessary to select the monomer composition. It can be appropriately performed according to the strength. The acrylic resin emulsion pressure-sensitive adhesive thus polymerized is usually 30 to 60 wt% in addition to water.
% Solid content (acrylic resin), it may be further diluted with water for viscosity adjustment at the time of application.
【００２０】又、必要に応じ上記アクリル系樹脂エマル
ジョン粘着剤へ、例えば、エポキシ系等の架橋剤を添加
することもできる。If necessary, a crosslinking agent such as an epoxy type can be added to the acrylic resin emulsion pressure-sensitive adhesive.
【００２１】本発明で用いる基材フィルムとしては、合
成樹脂あるいは天然、合成ゴム等からなるフィルムを適
宜選択出来る。As the base film used in the present invention, a film made of synthetic resin, natural or synthetic rubber can be appropriately selected.
【００２２】基材フィルムの材質として例示するなら
ば、エチレン−酢酸ビニル共重合体、ポリブタジエン、
軟質塩化ビニル樹脂、ポリオレフィン、ポリエステル、
ポリアミド等熱可塑性エラストマー、及びジエン系、ニ
トリル系、シリコン系、アクリル系等の合成ゴム等であ
る。As an example of the material of the base film, ethylene-vinyl acetate copolymer, polybutadiene,
Soft vinyl chloride resin, polyolefin, polyester,
Thermoplastic elastomers such as polyamide, and synthetic rubbers such as diene-based, nitrile-based, silicon-based, and acrylic-based rubbers.
【００２３】基材フィルムにアクリル系樹脂エマルジョ
ン粘着剤配合液を塗布する方法としては、リバースロー
ルコーター、グラビヤコーター、バーコーター、ダイコ
ーター、コンマコーター等の公知のコーティング方法で
塗布し、通常８０〜１５０℃の熱風で乾燥する事により
可能である。乾燥後の塗布厚みは、通常１μｍ〜１００
μｍぐらいである。As a method for applying the acrylic resin emulsion pressure-sensitive adhesive compounding liquid to the base film, it is applied by a known coating method such as reverse roll coater, gravure coater, bar coater, die coater, comma coater, etc. It is possible by drying with hot air at 150 ° C. The coating thickness after drying is usually 1 μm to 100
It is about μm.
【００２４】又、必要に応じて粘着剤層を保護するため
にセパレーターと称する合成樹脂フィルムを粘着剤層側
に貼付けておくのが好ましい。Further, it is preferable to attach a synthetic resin film called a separator to the pressure-sensitive adhesive layer side in order to protect the pressure-sensitive adhesive layer, if necessary.
【００２５】ウエハの裏面研削方法は、特に制限はな
く、グラインダー等による物理的研削でも、ケミカルエ
ッチング等による化学的研削でも、公知の方法が適宜用
いられる。The method of grinding the back surface of the wafer is not particularly limited, and known methods such as physical grinding using a grinder or chemical grinding such as chemical etching may be appropriately used.
【００２６】[0026]
【実施例】以下実施例にて本発明を更に具体的に説明す
る。 実施例１ 温度計、還流冷却器、滴下ロート、窒素導入口及び撹拌
機を付けたフラスコに、脱イオン水１５０．０重量部、
反応性界面活性剤としてポリオキシエチレンノニルフェ
ニルエーテル（エチレンオキサイド２０モル）のベンゼ
ン環にアリル基を付加させた化合物３．０重量部を入
れ、窒素雰囲気下で撹拌しながら７０℃まで昇温した
後、過硫酸アンモニウム（重合開始剤）０．５重量部を
添加し溶解させる。 次いで、メタクリル酸メチル２
２．５重量部、アクリル酸−２−エチルヘキシル６３．
５重量部、メタクリル酸グリシジル２．０重量部、メタ
クリル酸２．０重量部、トリフルオロエチルアクリレー
ト１０．０重量部からなるモノマー混合物を４時間で連
続滴下し、滴下終了後も３時間撹拌を続けて重合し、固
形分約４０重量％のアクリル系樹脂エマルジョン粘着剤
を得た。The present invention will be described in more detail with reference to the following examples. Example 1 In a flask equipped with a thermometer, a reflux condenser, a dropping funnel, a nitrogen inlet and a stirrer, 150.0 parts by weight of deionized water,
As a reactive surfactant, 3.0 parts by weight of a compound obtained by adding an allyl group to a benzene ring of polyoxyethylene nonylphenyl ether (20 mol of ethylene oxide) was added, and the temperature was raised to 70 ° C. under stirring in a nitrogen atmosphere. Then, 0.5 part by weight of ammonium persulfate (polymerization initiator) is added and dissolved. Then, methyl methacrylate 2
2.5 parts by weight, 2-ethylhexyl acrylate 63.
A monomer mixture consisting of 5 parts by weight, 2.0 parts by weight of glycidyl methacrylate, 2.0 parts by weight of methacrylic acid and 10.0 parts by weight of trifluoroethyl acrylate was continuously added dropwise over 4 hours, and stirring was continued for 3 hours after the addition was completed. Polymerization was continued to obtain an acrylic resin emulsion adhesive having a solid content of about 40% by weight.
【００２７】この配合液を、Ｔダイ法にて製膜したＥＶ
ＡとＰＰの２層からなる厚さ１１０μｍのフィルムのコ
ロナ処理したＥＶＡ面にロールコーターにて塗布し、９
０℃で乾燥して塗布厚み３０μｍのアクリル系樹脂エマ
ルジョン粘着剤層を有するウエハ加工用テープを得た。An EV prepared by film-forming this compounded liquid by the T-die method
A roll-coater was used to coat the corona-treated EVA surface of a 110 μm-thick film consisting of two layers of A and PP.
It was dried at 0 ° C. to obtain a wafer processing tape having an acrylic resin emulsion pressure-sensitive adhesive layer with a coating thickness of 30 μm.
【００２８】こうして得たウエハ加工用テープをＪＩＳ
Ｂ ０６０１に定められた基準長さ０．８ｍｍにおけ
る最大高さで３０μｍの凹凸をもつＳＵＳ板に貼付け、
水中に浸漬し、耐水性を評価した。この基準長さとは、
被測体表面の粗さを測定する際のサンプルの基準測定長
である。The wafer processing tape obtained in this way is specified by JIS
Attached to a SUS plate having a maximum height of 30 μm at a reference length of 0.8 mm specified in B 0601,
It was immersed in water and evaluated for water resistance. What is this reference length?
It is the reference measurement length of the sample when measuring the roughness of the surface of the measured object.
【００２９】評価の方法は、水中にウエハ加工用テープ
を貼付けたＳＵＳ板を、１０分間浸漬した時点での、水
の浸入面積により評価し、その浸入面積のＳＵＳ板全面
積に対する割合を百分率で示した。尚、ＳＵＳ板の大き
さは巾５ｃｍ、長さ２０ｃｍ、面積１００ である。The evaluation method was as follows. The SUS plate having the wafer processing tape attached thereto was immersed in water for 10 minutes, and the water penetration area was evaluated. The ratio of the penetration area to the total area of the SUS board was expressed as a percentage. Indicated. The size of the SUS plate is 5 cm in width, 20 cm in length, and 100 in area.
【００３０】さらに、該ウエハ加工用テープの粘着剤表
面に水滴を滴下し、その接触角を測定した。撥水性が大
きい程、接触角は大きくなる。Further, water droplets were dropped on the surface of the adhesive of the wafer processing tape, and the contact angle was measured. The greater the water repellency, the greater the contact angle.
【００３１】また、さらに、該ウエハ加工用テープを４
インチ半導体ウエハに自動テープ貼付け機（（株）タカ
トリ製“ＡＴＭ−１０００Ｂ”）を用いて貼付け、１日
間室温で放置した後、自動テープ剥離機（（株）タカト
リ製“ＡＴＲＭ−２０００Ｂ”）を用いてウエハ加工用
テープを剥離し、得られた４インチ半導体ウエハを日立
電子エンジニアリング（株）製表面検査装置ＨＬＤ−３
００Ｂにより０．２μｍ以上の異物が何個存在するかに
より、ウエハの汚染度を測定した。結果は〔表１〕に示
す如く、耐水性は良く、ウエハの汚染もなく良好であっ
た。Further, the wafer processing tape is further
After sticking to an inch semiconductor wafer using an automatic tape sticking machine ("ATM-1000B" manufactured by Takatori Co., Ltd.) and left at room temperature for 1 day, an automatic tape peeling machine ("ATRM-2000B" manufactured by Takatori Co., Ltd.) was used. The wafer processing tape was peeled off using the obtained 4-inch semiconductor wafer, and a surface inspection device HLD-3 manufactured by Hitachi Electronics Engineering Co., Ltd.
The contamination degree of the wafer was measured according to the number of foreign matters having a size of 0.2 μm or more due to 00B. As shown in Table 1, the results showed that the water resistance was good and the wafer was not contaminated.
【００３２】実施例２ メタクリル酸メチル２２．５重量部、アクリル酸−２−
エチルヘキシル７０．５重量部、メタクリル酸グリシジ
ル２．０重量部、メタクリル酸２．０重量部、ヘプタデ
カフルオロデシルアクリレート３．０重量部からなるモ
ノマー混合物を添加し、反応性界面活性剤としてポリオ
キシエチレンノニルフェニルエーテル硫酸エステルのア
ンモニウム塩（エチレンオキサイド１０モル）のベンゼ
ン環にアリル基を付加させた化合物０．１重量部用いた
以外、実施例１と同様にした。この配合液を用い、実施
例１と同様にしてウエハ加工用テープを得た。こうして
得たウエハ加工用テープを実施例１と同様に評価した。
結果は〔表１〕に示す如く良好であった。Example 2 22.5 parts by weight of methyl methacrylate, acrylic acid-2-
A monomer mixture consisting of 70.5 parts by weight of ethylhexyl, 2.0 parts by weight of glycidyl methacrylate, 2.0 parts by weight of methacrylic acid, and 3.0 parts by weight of heptadecafluorodecyl acrylate was added, and polyoxy was used as a reactive surfactant. Example 1 was repeated except that 0.1 part by weight of a compound obtained by adding an allyl group to a benzene ring of an ammonium salt of ethylene nonylphenyl ether sulfate (10 mol of ethylene oxide) was used. Using this blended solution, a tape for wafer processing was obtained in the same manner as in Example 1. The tape for wafer processing thus obtained was evaluated in the same manner as in Example 1.
The results were good as shown in [Table 1].
【００３３】実施例３ メタクリル酸メチル２２．５重量部、アクリル酸−２−
エチルヘキシル５３．５重量部、メタクリル酸グリシジ
ル２．０重量部、メタクリル酸２．０重量部、ヘプタデ
カフルオロデシルメタクリレート２０．０重量部からな
るモノマー混合物１００重量部を添加し、反応性界面活
性剤としてポリオキシエチレンノニルフェニルエーテル
硫酸エステルのアンモニウム塩（エチレンオキサイド１
０モル）のベンゼン環にアリル基を付加させた化合物
５．０重量部用いた以外、実施例１と同様にした。この
配合液を用い、実施例１と同様にしてウエハ加工用テー
プを得た。こうして得たウエハ加工用テープを実施例１
と同様に評価した。結果は〔表１〕に示す如く良好であ
った。Example 3 22.5 parts by weight of methyl methacrylate, acrylic acid-2-
100 parts by weight of a monomer mixture consisting of 53.5 parts by weight of ethylhexyl, 2.0 parts by weight of glycidyl methacrylate, 2.0 parts by weight of methacrylic acid and 20.0 parts by weight of heptadecafluorodecylmethacrylate were added, and a reactive surfactant was added. As an ammonium salt of polyoxyethylene nonylphenyl ether sulfate (ethylene oxide 1
The same procedure as in Example 1 was carried out except that 5.0 parts by weight of a compound obtained by adding an allyl group to a benzene ring (0 mol) was used. Using this blended solution, a tape for wafer processing was obtained in the same manner as in Example 1. The wafer processing tape thus obtained was used in Example 1.
It evaluated similarly to. The results were good as shown in [Table 1].
【００３４】比較例１ メタクリル酸メチル２２．５重量部、アクリル酸−２−
エチルヘキシル７３．５重量部、メタクリル酸グリシジ
ル２．０重量部、メタクリル酸２．０重量部からなるモ
ノマー混合物１００重量部を用い、反応性界面活性剤と
してポリオキシエチレンノニルフェニルエーテル硫酸エ
ステルのアンモニウム塩（エチレンオキサイド１０モ
ル）のベンゼン環にアリル基を付加させた化合物３．０
重量部用いた以外、実施例１と同様にした。この配合液
を用い、実施例１と同様にしてウエハ加工用テープを得
た。こうして得たウエハ加工用テープを実施例１と同様
に評価した。結果は〔表１〕に示す如く耐水性が悪かっ
た。Comparative Example 1 22.5 parts by weight of methyl methacrylate, acrylic acid-2-
Using 100 parts by weight of a monomer mixture consisting of 73.5 parts by weight of ethylhexyl, 2.0 parts by weight of glycidyl methacrylate and 2.0 parts by weight of methacrylic acid, an ammonium salt of polyoxyethylene nonylphenyl ether sulfate as a reactive surfactant. Compound 3.0 in which an allyl group is added to the benzene ring of (ethylene oxide 10 mol)
Same as Example 1 except that parts by weight were used. Using this blended solution, a tape for wafer processing was obtained in the same manner as in Example 1. The tape for wafer processing thus obtained was evaluated in the same manner as in Example 1. As a result, as shown in [Table 1], the water resistance was poor.
【００３５】比較例２ メタクリル酸メチル２２．５重量部、アクリル酸−２−
エチルヘキシル６８．５重量部、メタクリル酸グリシジ
ル２．０重量部、メタクリル酸２．０重量部、トリフル
オロデシルアクリレート５．０重量部からなるモノマー
混合物を添加し、界面活性剤としてポリオキシエチレン
ノニルフェニルエーテル（エチレンオキサイド１０モ
ル）５．０重量部用いた以外、実施例１と同様にして重
合したが、モノマーの相溶性が悪く、重合出来なかっ
た。 比較例３ メタクリル酸メチル２２．５重量部、アクリル酸−２−
エチルヘキシル６８．５重量部、メタクリル酸グリシジ
ル２．０重量部、メタクリル酸２．０重量部、ヘプタデ
カフルオロデシルアクリレート５．０重量部からなるモ
ノマー混合物を添加し、界面活性剤としてポリオキシエ
チレンノニルフェニルエーテル硫酸エステルのアンモニ
ウム塩（エチレンオキサイド１０モル）１０．０重量部
用いた以外、実施例１と同様にした。この配合液を用
い、実施例１と同様にしてウエハ加工用テープを得た。
こうして得たウエハ加工用テープを実施例１と同様に評
価した。結果は〔表１〕に示す如く耐水性が悪かった。Comparative Example 2 22.5 parts by weight of methyl methacrylate, acrylic acid-2-
A monomer mixture consisting of 68.5 parts by weight of ethylhexyl, 2.0 parts by weight of glycidyl methacrylate, 2.0 parts by weight of methacrylic acid and 5.0 parts by weight of trifluorodecyl acrylate was added, and polyoxyethylene nonylphenyl was used as a surfactant. Polymerization was carried out in the same manner as in Example 1 except that 5.0 parts by weight of ether (ethylene oxide 10 mol) was used, but the compatibility of the monomers was poor and the polymerization could not be carried out. Comparative Example 3 22.5 parts by weight of methyl methacrylate, acrylic acid-2-
A monomer mixture consisting of 68.5 parts by weight of ethylhexyl, 2.0 parts by weight of glycidyl methacrylate, 2.0 parts by weight of methacrylic acid and 5.0 parts by weight of heptadecafluorodecyl acrylate was added, and polyoxyethylene nonyl was used as a surfactant. Example 1 was repeated except that 10.0 parts by weight of ammonium salt of phenyl ether sulfate (10 mol of ethylene oxide) was used. Using this blended solution, a tape for wafer processing was obtained in the same manner as in Example 1.
The tape for wafer processing thus obtained was evaluated in the same manner as in Example 1. As a result, as shown in [Table 1], the water resistance was poor.
【００３６】比較例４ メタクリル酸メチル２２．５重量部、アクリル酸−２−
エチルヘキシル４３．５重量部、メタクリル酸グリシジ
ル２．０重量部、メタクリル酸２．０重量部、ヘプタデ
カフルオロデシルメタクリレート３０．０重量部からな
るモノマー混合物を添加し、反応性界面活性剤としてポ
リオキシエチレンノニルフェニルエーテル（エチレンオ
キサイド２０モル）のベンゼン環にアリル基を付加させ
た化合物５．０重量部用いた以外、実施例１と同様にし
て重合したが、モノマーの相溶性が悪く、重合出来なか
った。Comparative Example 4 22.5 parts by weight of methyl methacrylate, acrylic acid-2-
A monomer mixture consisting of 43.5 parts by weight of ethylhexyl, 2.0 parts by weight of glycidyl methacrylate, 2.0 parts by weight of methacrylic acid, and 30.0 parts by weight of heptadecafluorodecyl methacrylate was added, and polyoxy was used as a reactive surfactant. Polymerization was conducted in the same manner as in Example 1 except that 5.0 parts by weight of a compound obtained by adding an allyl group to a benzene ring of ethylene nonylphenyl ether (20 mol of ethylene oxide) was used. There wasn't.
【００３７】比較例５ メタクリル酸メチル２２．５重量部、アクリル酸−２−
エチルヘキシル７０．５重量部、メタクリル酸グリシジ
ル２．０重量部、メタクリル酸２．０重量部、ヘプタデ
カフルオロデシルメタクリレート３．０重量部からなる
モノマー混合物を添加し、反応性界面活性剤としてポリ
オキシエチレンノニルフェニルエーテル硫酸エステルの
アンモニウム塩（エチレンオキサイド１０モル）のベン
ゼン環にアリル基を付加させた化合物０．０５重量部用
いた以外、実施例１と同様にして重合したが、モノマー
の相溶性が悪く、重合出来なかった。Comparative Example 5 Methyl methacrylate 22.5 parts by weight, acrylic acid-2-
A monomer mixture consisting of 70.5 parts by weight of ethylhexyl, 2.0 parts by weight of glycidyl methacrylate, 2.0 parts by weight of methacrylic acid and 3.0 parts by weight of heptadecafluorodecyl methacrylate was added, and polyoxy was used as a reactive surfactant. Polymerization was conducted in the same manner as in Example 1 except that 0.05 part by weight of a compound obtained by adding an allyl group to a benzene ring of an ammonium salt of ethylene nonylphenyl ether sulfate (10 mol of ethylene oxide) was used. Was bad and could not be polymerized.
【００３８】比較例６ メタクリル酸メチル２２．５重量部、アクリル酸−２−
エチルヘキシル６３．５重量部、メタクリル酸グリシジ
ル２．０重量部、メタクリル酸２．０重量部、ヘプタデ
カフルオロデシルアクリレート１０．０重量部からなる
モノマー混合物を添加し、反応性界面活性剤としてポリ
オキシエチレンノニルフェニルエーテル（エチレンオキ
サイド２０モル）のベンゼン環にアリル基を付加させた
化合物１０．０重量部用いた以外、実施例１と同様にし
た。この配合液を用い、実施例１と同様にしてウエハ加
工用テープを得た。こうして得たウエハ加工用テープを
実施例１と同様に評価した。結果は〔表１〕に示す如く
耐水性が悪かった。Comparative Example 6 22.5 parts by weight of methyl methacrylate, acrylic acid-2-
A monomer mixture consisting of 63.5 parts by weight of ethylhexyl, 2.0 parts by weight of glycidyl methacrylate, 2.0 parts by weight of methacrylic acid, and 10.0 parts by weight of heptadecafluorodecyl acrylate was added, and polyoxy was used as a reactive surfactant. Example 1 was repeated except that 10.0 parts by weight of a compound obtained by adding an allyl group to a benzene ring of ethylene nonylphenyl ether (20 mol of ethylene oxide) was used. Using this blended solution, a tape for wafer processing was obtained in the same manner as in Example 1. The tape for wafer processing thus obtained was evaluated in the same manner as in Example 1. As a result, as shown in [Table 1], the water resistance was poor.
【００３９】比較例７ メタクリル酸メチル２２．５重量部、アクリル酸−２−
エチルヘキシル７２．５重量部、メタクリル酸グリシジ
ル２．０重量部、メタクリル酸２．０重量部、ヘプタデ
カフルオロデシルアクリレート１．０重量部からなるモ
ノマー混合物を添加し、反応性界面活性剤としてポリオ
キシエチレンノニルフェニルエーテル硫酸エステルのア
ンモニウム塩（エチレンオキサイド１０モル）のベンゼ
ン環にアリル基を付加させた化合物０．５重量部用いた
以外、実施例１と同様にした。この配合液を用い、実施
例１と同様にしてウエハ加工用テープを得た。こうして
得たウエハ加工用テープを実施例１と同様に評価した。
結果は〔表１〕に示す如く耐水性が悪かった。Comparative Example 7 Methyl methacrylate 22.5 parts by weight, acrylic acid-2-
A monomer mixture consisting of 72.5 parts by weight of ethylhexyl, 2.0 parts by weight of glycidyl methacrylate, 2.0 parts by weight of methacrylic acid and 1.0 part by weight of heptadecafluorodecyl acrylate was added, and polyoxy was used as a reactive surfactant. Example 1 was repeated except that 0.5 part by weight of a compound obtained by adding an allyl group to a benzene ring of an ammonium salt of ethylene nonylphenyl ether sulfate (10 mol of ethylene oxide) was used. Using this blended solution, a tape for wafer processing was obtained in the same manner as in Example 1. The tape for wafer processing thus obtained was evaluated in the same manner as in Example 1.
As a result, as shown in [Table 1], the water resistance was poor.
【００４０】[0040]
【表１】 [Table 1]
【００４１】[0041]
【発明の効果】フッ素含有モノマーを含むモノマー混合
物を反応性界面活性剤を用いて重合したアクリル系樹脂
エマルジョン粘着剤を用いることにより、ウエハ加工用
テープの耐水性が優れ、ウエハを汚染しない。By using an acrylic resin emulsion pressure-sensitive adhesive obtained by polymerizing a monomer mixture containing a fluorine-containing monomer with a reactive surfactant, the wafer processing tape has excellent water resistance and does not contaminate the wafer.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 武内 洋子 愛知県名古屋市南区丹後通２丁目１番地 三井東圧化学株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yoko Takeuchi 2-1, Tangodori, Minami-ku, Aichi Prefecture Nagoya City Mitsui Toatsu Chemicals, Inc.
Claims (2)
重量％であるモノマー混合物１００重量部に反応性界面
活性剤０．１〜５．０重量部を添加して重合し、アクリ
ル系樹脂エマルジョン粘着剤とした後、該アクリル系樹
脂エマルジョン粘着剤を基材フィルムに塗布してなるこ
とを特徴とするウエハ加工用テープ。1. The fluorine-containing monomer is 3.0 to 20.0.
After adding 0.1 to 5.0 parts by weight of a reactive surfactant to 100 parts by weight of a monomer mixture (weight%), polymerization is carried out to obtain an acrylic resin emulsion pressure-sensitive adhesive, and the acrylic resin emulsion pressure-sensitive adhesive is used as a base. A wafer processing tape characterized by being applied to a material film.
用することを特徴とするウエハ裏面研削方法。2. A wafer backside grinding method, wherein the wafer processing tape according to claim 1 is used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22862092A JP3290471B2 (en) | 1992-08-27 | 1992-08-27 | Wafer processing tape and method of using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22862092A JP3290471B2 (en) | 1992-08-27 | 1992-08-27 | Wafer processing tape and method of using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0677192A true JPH0677192A (en) | 1994-03-18 |
| JP3290471B2 JP3290471B2 (en) | 2002-06-10 |
Family
ID=16879201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22862092A Expired - Lifetime JP3290471B2 (en) | 1992-08-27 | 1992-08-27 | Wafer processing tape and method of using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3290471B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6235387B1 (en) | 1998-03-30 | 2001-05-22 | 3M Innovative Properties Company | Semiconductor wafer processing tapes |
| JP2006225634A (en) * | 2005-01-24 | 2006-08-31 | Denki Kagaku Kogyo Kk | Pressure-sensitive adhesive, pressure-sensitive adhesive sheet using the same and method for producing electronic part using pressure-sensitive adhesive sheet |
| JP2007045954A (en) * | 2005-08-11 | 2007-02-22 | Denki Kagaku Kogyo Kk | Pressure-sensitive adhesive, pressure-sensitive adhesive sheet obtained using the same, and manufacturing method of electronic component using pressure-sensitive adhesive sheet |
| JP2007045955A (en) * | 2005-08-11 | 2007-02-22 | Denki Kagaku Kogyo Kk | Pressure-sensitive adhesive, pressure-sensitive adhesive sheet obtained using the same, and manufacturing method of electronic component using pressure-sensitive adhesive sheet |
| US7201969B2 (en) | 2002-03-27 | 2007-04-10 | Mitsui Chemicals, Inc. | Pressure-sensitive adhesive film for the surface protection of semiconductor wafers and method for protection of semiconductor wafers with the film |
| JP2011009425A (en) * | 2009-06-25 | 2011-01-13 | Sumitomo Bakelite Co Ltd | Method for manufacturing semiconductor element and method for manufacturing semiconductor device |
| CN102585739A (en) * | 2012-01-11 | 2012-07-18 | 合肥工业大学 | Adhesive for bonding fluoroplastics and metals and preparation method of adhesive |
-
1992
- 1992-08-27 JP JP22862092A patent/JP3290471B2/en not_active Expired - Lifetime
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6235387B1 (en) | 1998-03-30 | 2001-05-22 | 3M Innovative Properties Company | Semiconductor wafer processing tapes |
| US6478918B2 (en) | 1998-03-30 | 2002-11-12 | 3M Innovative Properties Company | Semiconductor wafer processing tapes |
| US7201969B2 (en) | 2002-03-27 | 2007-04-10 | Mitsui Chemicals, Inc. | Pressure-sensitive adhesive film for the surface protection of semiconductor wafers and method for protection of semiconductor wafers with the film |
| JP2006225634A (en) * | 2005-01-24 | 2006-08-31 | Denki Kagaku Kogyo Kk | Pressure-sensitive adhesive, pressure-sensitive adhesive sheet using the same and method for producing electronic part using pressure-sensitive adhesive sheet |
| JP4676297B2 (en) * | 2005-01-24 | 2011-04-27 | 電気化学工業株式会社 | An adhesive, an adhesive sheet using the adhesive, and an electronic component manufacturing method using the adhesive sheet. |
| JP2007045954A (en) * | 2005-08-11 | 2007-02-22 | Denki Kagaku Kogyo Kk | Pressure-sensitive adhesive, pressure-sensitive adhesive sheet obtained using the same, and manufacturing method of electronic component using pressure-sensitive adhesive sheet |
| JP2007045955A (en) * | 2005-08-11 | 2007-02-22 | Denki Kagaku Kogyo Kk | Pressure-sensitive adhesive, pressure-sensitive adhesive sheet obtained using the same, and manufacturing method of electronic component using pressure-sensitive adhesive sheet |
| JP4640966B2 (en) * | 2005-08-11 | 2011-03-02 | 電気化学工業株式会社 | An adhesive, an adhesive sheet using the adhesive, and an electronic component manufacturing method using the adhesive sheet. |
| JP4680717B2 (en) * | 2005-08-11 | 2011-05-11 | 電気化学工業株式会社 | An adhesive, an adhesive sheet using the adhesive, and an electronic component manufacturing method using the adhesive sheet. |
| JP2011009425A (en) * | 2009-06-25 | 2011-01-13 | Sumitomo Bakelite Co Ltd | Method for manufacturing semiconductor element and method for manufacturing semiconductor device |
| CN102585739A (en) * | 2012-01-11 | 2012-07-18 | 合肥工业大学 | Adhesive for bonding fluoroplastics and metals and preparation method of adhesive |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3290471B2 (en) | 2002-06-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0859403B1 (en) | Pressure sensitive adhesive composition for the polishing of the back of a wafer | |
| JP3862489B2 (en) | Re-peeling adhesive sheet | |
| KR101322522B1 (en) | Adhesive composition and adhesive film | |
| JP3288476B2 (en) | Removable adhesive and its adhesive member | |
| JP2004091563A (en) | Aqueous dispersion-type acrylic pressure-sensitive adhesive composition for repeeling and pressure-sensitive adhesive sheet | |
| JPH1161090A (en) | Energy-ray-curable hydrophilic pressure-sensitive adhesive composition and use thereof | |
| JPH0673347A (en) | Tape for processing wafer and method of using the same | |
| JP3290471B2 (en) | Wafer processing tape and method of using the same | |
| JP2000234079A (en) | Sheet for processing semiconductor wafer | |
| JPH0677193A (en) | Wafer working tape and its usage method | |
| JP2968879B2 (en) | Semiconductor wafer processing film | |
| JPH05198542A (en) | Grinding method for rear of semiconductor wafer and adhesive tape used in the method | |
| JPH0677194A (en) | Wafer working tape and its usage method | |
| JP2919601B2 (en) | Wafer processing film | |
| JPH05171117A (en) | Tape for processing wafer | |
| JP4663081B2 (en) | Adhesive film for semiconductor wafer back grinding and semiconductor wafer back grinding method using the same | |
| JP2000328023A (en) | Pressure-sensitive adhesive sheet | |
| JPH097981A (en) | Adhesive film for grinding of semiconductor wafer back surface | |
| JPH05136260A (en) | Wafer processing tape | |
| JPH10265741A (en) | Tacky film for grinding back of semiconductor wafer and grinding back of semiconductor wafer | |
| JPS6143677A (en) | Film for ic processing | |
| JPH06177098A (en) | Tape for grinding rear of wafer and usage thereof | |
| JPH11315259A (en) | Pressure-sensitive adhesive film for grinding backside of semiconductor wafer and method for grinding backside of semiconductor wafer therewith | |
| JPH09199453A (en) | Method for processing semiconductor wafer | |
| JP4309671B2 (en) | Adhesive film for semiconductor wafer back surface grinding and semiconductor wafer back surface grinding method using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090322 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100322 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110322 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120322 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120322 Year of fee payment: 10 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130322 Year of fee payment: 11 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130322 Year of fee payment: 11 |