JP2007045954A - Pressure-sensitive adhesive, pressure-sensitive adhesive sheet obtained using the same, and manufacturing method of electronic component using pressure-sensitive adhesive sheet - Google Patents
Pressure-sensitive adhesive, pressure-sensitive adhesive sheet obtained using the same, and manufacturing method of electronic component using pressure-sensitive adhesive sheet Download PDFInfo
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- JP2007045954A JP2007045954A JP2005232719A JP2005232719A JP2007045954A JP 2007045954 A JP2007045954 A JP 2007045954A JP 2005232719 A JP2005232719 A JP 2005232719A JP 2005232719 A JP2005232719 A JP 2005232719A JP 2007045954 A JP2007045954 A JP 2007045954A
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- Prior art keywords
- pressure
- sensitive adhesive
- adhesive sheet
- meth
- halogen
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
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- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
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- QLBRROYTTDFLDX-UHFFFAOYSA-N [3-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCCC(CN)C1 QLBRROYTTDFLDX-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
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- 238000004458 analytical method Methods 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 150000001540 azides Chemical class 0.000 description 1
- XOZUGNYVDXMRKW-AATRIKPKSA-N azodicarbonamide Chemical compound NC(=O)\N=N\C(N)=O XOZUGNYVDXMRKW-AATRIKPKSA-N 0.000 description 1
- 235000019399 azodicarbonamide Nutrition 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- STZUMARNGFQGPH-UHFFFAOYSA-N chloromethoxyethene Chemical compound ClCOC=C STZUMARNGFQGPH-UHFFFAOYSA-N 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
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- 235000013985 cinnamic acid Nutrition 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- UMNKXPULIDJLSU-UHFFFAOYSA-N dichlorofluoromethane Chemical compound FC(Cl)Cl UMNKXPULIDJLSU-UHFFFAOYSA-N 0.000 description 1
- 229940099364 dichlorofluoromethane Drugs 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
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- IUNMPGNGSSIWFP-UHFFFAOYSA-N dimethylaminopropylamine Chemical compound CN(C)CCCN IUNMPGNGSSIWFP-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- XJELOQYISYPGDX-UHFFFAOYSA-N ethenyl 2-chloroacetate Chemical compound ClCC(=O)OC=C XJELOQYISYPGDX-UHFFFAOYSA-N 0.000 description 1
- BTOIAAYVFNXNPA-UHFFFAOYSA-N ethenyl 2-chloropropanoate Chemical compound CC(Cl)C(=O)OC=C BTOIAAYVFNXNPA-UHFFFAOYSA-N 0.000 description 1
- MEGHWIAOTJPCHQ-UHFFFAOYSA-N ethenyl butanoate Chemical compound CCCC(=O)OC=C MEGHWIAOTJPCHQ-UHFFFAOYSA-N 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 239000004715 ethylene vinyl alcohol Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- RZXDTJIXPSCHCI-UHFFFAOYSA-N hexa-1,5-diene-2,5-diol Chemical compound OC(=C)CCC(O)=C RZXDTJIXPSCHCI-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 238000004255 ion exchange chromatography Methods 0.000 description 1
- 239000001282 iso-butane Substances 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- GKQPCPXONLDCMU-CCEZHUSRSA-N lacidipine Chemical compound CCOC(=O)C1=C(C)NC(C)=C(C(=O)OCC)C1C1=CC=CC=C1\C=C\C(=O)OC(C)(C)C GKQPCPXONLDCMU-CCEZHUSRSA-N 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ACTNHJDHMQSOGL-UHFFFAOYSA-N n',n'-dibenzylethane-1,2-diamine Chemical compound C=1C=CC=CC=1CN(CCN)CC1=CC=CC=C1 ACTNHJDHMQSOGL-UHFFFAOYSA-N 0.000 description 1
- KYCGURZGBKFEQB-UHFFFAOYSA-N n',n'-dibutylpropane-1,3-diamine Chemical compound CCCCN(CCCC)CCCN KYCGURZGBKFEQB-UHFFFAOYSA-N 0.000 description 1
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 1
- ITZPOSYADVYECJ-UHFFFAOYSA-N n'-cyclohexylpropane-1,3-diamine Chemical compound NCCCNC1CCCCC1 ITZPOSYADVYECJ-UHFFFAOYSA-N 0.000 description 1
- ZETYUTMSJWMKNQ-UHFFFAOYSA-N n,n',n'-trimethylhexane-1,6-diamine Chemical compound CNCCCCCCN(C)C ZETYUTMSJWMKNQ-UHFFFAOYSA-N 0.000 description 1
- JVJUUTKHPUJINE-UHFFFAOYSA-N n-(chloromethyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NCCl JVJUUTKHPUJINE-UHFFFAOYSA-N 0.000 description 1
- LZIWXMFWIBRDAB-UHFFFAOYSA-N n-(chloromethyl)prop-2-enamide Chemical compound ClCNC(=O)C=C LZIWXMFWIBRDAB-UHFFFAOYSA-N 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- HVAMZGADVCBITI-UHFFFAOYSA-M pent-4-enoate Chemical compound [O-]C(=O)CCC=C HVAMZGADVCBITI-UHFFFAOYSA-M 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- VMBJJCDVORDOCF-UHFFFAOYSA-N prop-2-enyl 2-chloroacetate Chemical compound ClCC(=O)OCC=C VMBJJCDVORDOCF-UHFFFAOYSA-N 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- DUIOPKIIICUYRZ-UHFFFAOYSA-N semicarbazide Chemical compound NNC(N)=O DUIOPKIIICUYRZ-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 150000003440 styrenes Chemical group 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- CYRMSUTZVYGINF-UHFFFAOYSA-N trichlorofluoromethane Chemical compound FC(Cl)(Cl)Cl CYRMSUTZVYGINF-UHFFFAOYSA-N 0.000 description 1
- 229940029284 trichlorofluoromethane Drugs 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
本発明は粘着剤、それを用いた粘着シート、及び粘着シートを用いた電子部品製造方法に関する。 The present invention relates to an adhesive, an adhesive sheet using the adhesive, and an electronic component manufacturing method using the adhesive sheet.
各種電子部品の製造方法の一つとして、半導体ウエハ又は回路基板材上等に回路パターンを形成してなる電子部品集合体を粘着シートに固定し、ダイヤモンドなどの砥粒を備えたダイシングブレードで単位チップまたは単位デバイスごとにダイシングする方法が知られている（特許文献１〜３等参照）。 As one of the manufacturing methods of various electronic components, a unit of a dicing blade equipped with abrasive grains such as diamond is fixed to an adhesive sheet by assembling an electronic component formed by forming a circuit pattern on a semiconductor wafer or circuit board material. A method of dicing for each chip or unit device is known (see Patent Documents 1 to 3, etc.).
電子部品集合体は、半導体ウエハ又は回路基板材上に回路パターンを形成してなる電子部品集合体だけでなく、例えばエポキシ樹脂で封止された封止樹脂パッケージ、具体的にはボール・グリッド・アレイ（ＢＧＡ）、チップ・サイズ・パッケージ（ＣＳＰ）、スタック・メモリー・モジュール、システム・オン・モジュール等が用いられることがある。 The electronic component assembly is not only an electronic component assembly formed by forming a circuit pattern on a semiconductor wafer or circuit board material, but also, for example, a sealing resin package sealed with an epoxy resin, specifically, a ball grid, Arrays (BGA), chip size packages (CSP), stacked memory modules, system on modules, etc. may be used.
電子部品集合体固定用の粘着シートは、これまでチップ飛び抑制等が重視されていた。近年のチップサイズの微小化により、更なる粘着力の向上と剥離容易性という相反する特性が必要とされてきた。粘着シートには、貼り付けた電子部品集合体をダイシング時の切断した電子部品の飛散を抑えること、ダイシング後に電子部品をする際のピックアップ時の静電気抑制効果が大きい等の特性が要求されてきた。 Up to now, emphasis has been placed on the suppression of chip jumping and the like in the adhesive sheet for fixing the electronic component assembly. Due to the recent miniaturization of the chip size, the contradictory properties of further improvement in adhesive strength and ease of peeling have been required. The adhesive sheet has been required to have properties such as suppressing the scattering of the cut electronic components when dicing the assembled electronic component assembly and having a large static suppression effect during pick-up when the electronic components are diced after dicing. .
粘着力の向上と剥離容易性という相反する特性を備え、ダイシング時の電子部品の飛散を抑え、電子部品をピックアップする際の静電気抑制効果が大きい粘着剤、それを用いた粘着シート、及び粘着シートを用いた電子部品製造方法を提供する。 Adhesive that has conflicting characteristics of improved adhesive strength and ease of peeling, suppresses scattering of electronic components during dicing, and has a large static-suppressing effect when picking up electronic components, an adhesive sheet using the adhesive, and an adhesive sheet An electronic component manufacturing method using the
本発明はハロゲン含有エラストマ及び加熱発泡剤を含有する粘着剤、それを用いた粘着シート、及び粘着シートを用いた電子部品製造方法である。 The present invention is a pressure-sensitive adhesive containing a halogen-containing elastomer and a heating foaming agent, a pressure-sensitive adhesive sheet using the same, and an electronic component manufacturing method using the pressure-sensitive adhesive sheet.
本発明の粘着剤、それを用いた粘着シート、及び粘着シートを用いた電子部品製造方法は、高い粘着力を有し、ダイシング後のピックアップ時の剥離時に生じる静電気発生を抑制する等の効果を奏する。 The pressure-sensitive adhesive of the present invention, the pressure-sensitive adhesive sheet using the pressure-sensitive adhesive, and the electronic component manufacturing method using the pressure-sensitive adhesive sheet have a high pressure-sensitive adhesive force and have effects such as suppressing the generation of static electricity generated at the time of peeling during pick-up after dicing. Play.
本明細書において（メタ）アクリレートとはアクリレート及びメタアクリレートの総称である。（メタ）アクリル酸等の（メタ）を含む化合物等も同様に、名称中に「メタ」を有する化合物と「メタ」を有さない化合物の総称である。（亜）リン酸等も同様である。 In this specification, (meth) acrylate is a general term for acrylate and methacrylate. Similarly, a compound containing (meth) such as (meth) acrylic acid is a general term for a compound having “meta” in the name and a compound not having “meta”. The same applies to (sub) phosphoric acid and the like.
本明細書において、単量体単位とは単量体に由来する構造単位を意味する。本明細書の部及び％は、特に記載がない限り質量基準とする。 In the present specification, the monomer unit means a structural unit derived from a monomer. Unless otherwise indicated, parts and% in this specification are based on mass.
（ハロゲン含有エラストマ）
本発明は、ハロゲン含有エラストマ（以下、単に「エラストマ」ともいう）を用いることを特徴の一つとする。ハロゲン含有エラストマのハロゲン含有単量体としては、例えばエピクロロヒドリン、エピブロモヒドリン、エピヨードヒドリン、β−メチルエピクロロヒドリン、ビニリデンフルオライド、ヘキサフルオロプロピレン、ペンタフルオロプロピレン、クロロトリフルオロエチレン、テトラフルオロエチレン、ビニルフルオライド、パーフルオロメチルビニルエーテル、クロロプレン、及びパーフルオロプロピルビニリデン等が挙げられ、エピハドリンゴム、フッ素ゴムを好適に使用することができる。
(Halogen-containing elastomer)
One feature of the present invention is to use a halogen-containing elastomer (hereinafter also simply referred to as “elastomer”). Examples of the halogen-containing monomer of the halogen-containing elastomer include epichlorohydrin, epibromohydrin, epiiodohydrin, β-methylepichlorohydrin, vinylidene fluoride, hexafluoropropylene, pentafluoropropylene, chlorotrimethyl. Examples thereof include fluoroethylene, tetrafluoroethylene, vinyl fluoride, perfluoromethyl vinyl ether, chloroprene, and perfluoropropylvinylidene, and epihadrin rubber and fluororubber can be preferably used.
その他のハロゲン含有単量体として、(1)ハロアルキル（メタ）アクリレート類、(2)ハロアシロキシアルキル（メタ）アクリレート類、(3)ハロゲン含有（メタ）アクリレート類、(4)不飽和カルボン酸ハロアルキル類、(5)ハロゲン含有不飽和ニトリル類、(6)ハロゲン含有不飽和アミド類、(7)ハロゲン含有飽和カルボン酸の不飽和アルコールエステル類、(8)ハロゲン含有不飽和エーテル類、(9)ハロアルキルアルケニルケトン類、(10)ハロゲン含有芳香族ビニル化合物、(11)ハロゲン化オレフィン類、(12)ハロゲン含有ジエン類等、重合性不飽和基とハロゲン原子とを含有する化合物が挙げられる。これらのハロゲン含有単量体は、単独で使用しても２種類以上を併用してもよい。 Other halogen-containing monomers include (1) haloalkyl (meth) acrylates, (2) haloacyloxyalkyl (meth) acrylates, (3) halogen-containing (meth) acrylates, (4) haloalkyl unsaturated carboxylic acids (5) halogen-containing unsaturated nitriles, (6) halogen-containing unsaturated amides, (7) unsaturated alcohol esters of halogen-containing saturated carboxylic acids, (8) halogen-containing unsaturated ethers, (9) Examples thereof include compounds containing a polymerizable unsaturated group and a halogen atom, such as haloalkylalkenyl ketones, (10) halogen-containing aromatic vinyl compounds, (11) halogenated olefins, and (12) halogen-containing dienes. These halogen-containing monomers may be used alone or in combination of two or more.
ハロアルキル（メタ）アクリレート類の単量体とは、アクリル酸アルキルエステルのアルキル基の一部をハロゲンで置換した化合物であり、例えばクロロメチル（メタ）アクリレート、１−クロロエチル（メタ）アクリレート、２−クロロエチル（メタ）アクリレート、１，２−ジクロロエチル（メタ）アクリレート、２−クロロプロピル（メタ）アクリレート、３−クロロプロピル（メタ）アクリレート、２，３−ジクロロプロピル（メタ）アクリレート、２−クロロブチル（メタ）アクリレート、３−クロロブチル（メタ）アクリレート、４−クロロブチル（メタ）アクリレート、３，４−ジクロロブチル（メタ）アクリレート等が挙げられる。 A haloalkyl (meth) acrylate monomer is a compound in which a part of the alkyl group of an acrylic acid alkyl ester is substituted with a halogen, such as chloromethyl (meth) acrylate, 1-chloroethyl (meth) acrylate, 2- Chloroethyl (meth) acrylate, 1,2-dichloroethyl (meth) acrylate, 2-chloropropyl (meth) acrylate, 3-chloropropyl (meth) acrylate, 2,3-dichloropropyl (meth) acrylate, 2-chlorobutyl ( Examples include meth) acrylate, 3-chlorobutyl (meth) acrylate, 4-chlorobutyl (meth) acrylate, and 3,4-dichlorobutyl (meth) acrylate.
ハロアシロキシアルキル（メタ）アクリレート類の単量体としては、例えばクロロアセトキシメチル（メタ）アクリレート、２−（クロロアセトキシ）エチル（メタ）アクリレート、３−（クロロアセトキシ）プロピル（メタ）アクリレート、４−（クロロアセトキシ）ブチル（メタ）アクリレート等が挙げられる。 Examples of monomers of haloacyloxyalkyl (meth) acrylates include chloroacetoxymethyl (meth) acrylate, 2- (chloroacetoxy) ethyl (meth) acrylate, 3- (chloroacetoxy) propyl (meth) acrylate, 4- (Chloroacetoxy) butyl (meth) acrylate and the like.
ハロゲン含有（メタ）アクリレート類の単量体としては、例えばクロロアセチルカルバモイルオキシメチル（メタ）アクリレート、２−（クロロアセチルカルバモイルオキシ）エチル（メタ）アクリレート、３−（クロロアセチルカルバモイルオキシ）プロピル（メタ）アクリレート、３−（ヒドロキシシクロヘキシルアセトキシ）プロピル（メタ）アクリレート、４−（ヒドロキシシクロヘキシルアセトキシ）プロピル（メタ）アクリレート等が挙げられる。 Examples of the halogen-containing (meth) acrylate monomers include chloroacetylcarbamoyloxymethyl (meth) acrylate, 2- (chloroacetylcarbamoyloxy) ethyl (meth) acrylate, and 3- (chloroacetylcarbamoyloxy) propyl (meth) ) Acrylate, 3- (hydroxycyclohexylacetoxy) propyl (meth) acrylate, 4- (hydroxycyclohexylacetoxy) propyl (meth) acrylate, and the like.
不飽和カルボン酸ハロアルキル類の単量体としては、例えばエタクリル酸２−クロロエチル、クロトン酸２−クロロエチル、ケイ皮酸２−クロロエチル等が挙げられる。 Examples of monomers of unsaturated carboxylic acid haloalkyls include 2-chloroethyl ethacrylate, 2-chloroethyl crotonic acid, 2-chloroethyl cinnamate, and the like.
ハロゲン含有不飽和ニトリル類の単量体としては、例えばα−クロロアクリルニトリル、α−クロロメチルアクリロニトリル等が挙げられる。 Examples of the halogen-containing unsaturated nitrile monomer include α-chloroacrylonitrile and α-chloromethylacrylonitrile.
ハロゲン含有不飽和アミド類の単量体としては、例えばＮ−クロロメチルアクリルアミド、Ｎ−クロロメチルメタクリルアミド、クロロアセトアミドメチルアクリルアミド、クロロアセトアミドメチルメタクリルアミド等が挙げられる。 Examples of the halogen-containing unsaturated amide monomers include N-chloromethylacrylamide, N-chloromethylmethacrylamide, chloroacetamidomethylacrylamide, chloroacetamidomethylmethacrylamide and the like.
ハロゲン含有飽和カルボン酸の不飽和アルコールエステル類の単量体としては、例えばクロロ酢酸ビニル、２−クロロプロピオン酸ビニル、クロロ酢酸アリル、クロロ酢酸ビニルベンジル等が挙げられる。 Examples of monomers of unsaturated alcohol esters of halogen-containing saturated carboxylic acids include vinyl chloroacetate, vinyl 2-chloropropionate, allyl chloroacetate, vinylbenzyl chloroacetate and the like.
ハロゲン含有不飽和エーテル類の単量体とは、例えばクロロメチルビニルエーテル、２−クロロエチルビニルエーテル、３−クロロプロピルビニルエーテル、２−（ヒドロキシクロロアセトキシ）エチルビニルエーテル、３−（ヒドロキシクロロアセトキシ）プロピルビニルエーテル、クロロメチルアリルエーテル、２−クロロエチルアリルエーテル、３−クロロプロピルアリルエーテル、２−（ヒドロキシクロロアセトキシ）エチルアリルエーテル、３−（ヒドロキシクロロアセトキシ）プロピルアリルエーテル等が挙げられる。 Examples of the halogen-containing unsaturated ether monomers include chloromethyl vinyl ether, 2-chloroethyl vinyl ether, 3-chloropropyl vinyl ether, 2- (hydroxychloroacetoxy) ethyl vinyl ether, 3- (hydroxychloroacetoxy) propyl vinyl ether, Examples include chloromethyl allyl ether, 2-chloroethyl allyl ether, 3-chloropropyl allyl ether, 2- (hydroxychloroacetoxy) ethyl allyl ether, and 3- (hydroxychloroacetoxy) propyl allyl ether.
ハロアルキルアルケニルケトン類の単量体としては、例えば２−クロロエチルビニルケトン、３−クロロプロピルビニルケトン、４−クロロブチルビニルケトン、２−クロロエチルアリルケトン、３−クロロプロピルアリルケトン、４−クロロブチルアリルケトン等が挙げられる。 Examples of monomers of haloalkyl alkenyl ketones include 2-chloroethyl vinyl ketone, 3-chloropropyl vinyl ketone, 4-chlorobutyl vinyl ketone, 2-chloroethyl allyl ketone, 3-chloropropyl allyl ketone, and 4-chloro. Examples include butyl allyl ketone.
ハロゲン含有芳香族ビニル化合物の単量体としては、例えばスチレン又はスチレン誘導体の一部をハロゲンで置換した化合物が挙げられる。具体的には、α−クロロスチレン、ｏ−クロロスチレン、ｍ−クロロスチレン、ｐ−クロロスチレン、ｐ−クロロメチルスチレン、ｏ−クロロメチル−メチルスチレン、ｐ−クロロメチル−メチルスチレン、ｏ−ジ（クロロメチル）スチレン、ｏ−ジ（クロロメチル）スチレン、ビニルベンジルクロライド等が挙げられる。 Examples of the monomer of the halogen-containing aromatic vinyl compound include compounds in which a part of styrene or a styrene derivative is substituted with a halogen. Specifically, α-chlorostyrene, o-chlorostyrene, m-chlorostyrene, p-chlorostyrene, p-chloromethylstyrene, o-chloromethyl-methylstyrene, p-chloromethyl-methylstyrene, o-di (Chloromethyl) styrene, o-di (chloromethyl) styrene, vinylbenzyl chloride and the like can be mentioned.
ハロゲン化オレフィン類の単量体としては、例えば塩化ビニル、塩化ビニリデン、１，２−ジクロロエチレン等が挙げられる。 Examples of the halogenated olefin monomers include vinyl chloride, vinylidene chloride, 1,2-dichloroethylene, and the like.
ハロゲン含有ジエン類の単量体としては、例えば２−クロロ−１，３−ブタジエン、１，２−ジクロロ−１，３−ブタジエン、２，３−ジクロロ−１，３−ブタジエン等が挙げられる。 Examples of the halogen-containing diene monomer include 2-chloro-1,3-butadiene, 1,2-dichloro-1,3-butadiene, 2,3-dichloro-1,3-butadiene, and the like.
ハロゲン含有単量体に使用可能なハロゲン元素としては、フッ素、塩素、臭素、及びヨウ素が挙げられる。分子量的に軽く、活性度が高いため反応性が良いことから、塩素及び／又はフッ素が好ましく、化合物の入手が容易な塩素が好適に用いられる。 Examples of the halogen element that can be used for the halogen-containing monomer include fluorine, chlorine, bromine, and iodine. Chlorine and / or fluorine are preferred because of their low molecular weight and high reactivity, so that chlorine and / or fluorine are preferred, and chlorine, which is easily available as a compound, is suitably used.
エラストマはハロゲン含有単量体単位以外に、ハロゲンを含まない単量体単位を有してもよい。エラストマは、これらのハロゲン非含有単量体単位を１種以上含んでも良い。例えばテトラフルオロエチレン−プロピレン共重合体、ヘキサフルオロプロピレン−エチレン共重合体が挙げられる。 The elastomer may have a monomer unit containing no halogen other than the halogen-containing monomer unit. The elastomer may contain one or more of these halogen-free monomer units. Examples thereof include a tetrafluoroethylene-propylene copolymer and a hexafluoropropylene-ethylene copolymer.
ハロゲン非含有単量体としては、例えば（メタ）アクリル酸エステル、アルキレンオキサイド系、及びその他のハロゲン非含有単量体等が挙げられる。 Examples of halogen-free monomers include (meth) acrylic acid esters, alkylene oxides, and other halogen-free monomers.
（（メタ）アクリル酸エステル単量体）
（メタ）アクリル酸エステル単量体としては、例えばメチル（メタ）アクリレート、エチル（メタ）アクリレート、ブチル（メタ）アクリレート、２−ブチル（メタ）アクリレート、ｔ−ブチル（メタ）アクリレート、ペンチル（メタ）アクリレート、オクチル（メタ）アクリレート、２−エチルヘキシル（メタ）アクリレート、ノニル（メタ）アクリレート、デシル（メタ）アクリレート、ラウリル（メタ）アクリレート、メチル（メタ）アクリレート、エチル（メタ）アクリレート、イソプロピル（メタ）アクリレート、トリデシル（メタ）アクリレート、ミリスチル（メタ）アクリレート、セチル（メタ）アクリレート、ステアリル（メタ）アクリレート、シクロヘキシル（メタ）アクリレート、ベンジル（メタ）アクリレート等が挙げられる。
((Meth) acrylic acid ester monomer)
Examples of the (meth) acrylic acid ester monomer include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-butyl (meth) acrylate, t-butyl (meth) acrylate, and pentyl (meth) ) Acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) ) Acrylate, tridecyl (meth) acrylate, myristyl (meth) acrylate, cetyl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, etc. It is.
アルキレンオキサイド系単量体としては、例えばエチレンオキシド、プロピレンオキシド、１，２−エポキシブタン、１，２−エポキシ−イソ−ブタン、２，３−エポキシブタン、１，２−エポキシへキサン、１，２−エポキシオクタン、１，２−エポキシデカン、１，２−エポキシテトラデカン、１，２−エポキシヘキサデカン、１，２−エポキシオクタデカン、１，２−エポキシエイコサン、１，２−エポキシシクロペンタン、１，２−エポキシシクロへキサン、１，２−エポキシシクロドデカン、１，２−エポキシ−イソブタン、２，３−エポキシ−イソブタン、２，３−エポキシ−３−クロロペンタンが挙げられる。 Examples of the alkylene oxide monomer include ethylene oxide, propylene oxide, 1,2-epoxybutane, 1,2-epoxy-iso-butane, 2,3-epoxybutane, 1,2-epoxyhexane, 1,2 -Epoxyoctane, 1,2-epoxydecane, 1,2-epoxytetradecane, 1,2-epoxyhexadecane, 1,2-epoxyoctadecane, 1,2-epoxyeicosane, 1,2-epoxycyclopentane, 1, Examples include 2-epoxycyclohexane, 1,2-epoxycyclododecane, 1,2-epoxy-isobutane, 2,3-epoxy-isobutane, and 2,3-epoxy-3-chloropentane.
その他のハロゲン非含有単量体としては、例えばスチレン、ビニルトルエン、酢酸アリル、（メタ）アクリロニトリル、酢酸ビニル、プロピオン酸ビニル、酪酸ビニル、バーサテイク酸ビニル、ビニルエチルエーテル、ビニルプロピルエーテル、ビニルイソブチルエーテル等が挙げられる。 Examples of other halogen-free monomers include styrene, vinyl toluene, allyl acetate, (meth) acrylonitrile, vinyl acetate, vinyl propionate, vinyl butyrate, vinyl versatate, vinyl ethyl ether, vinyl propyl ether, vinyl isobutyl ether. Etc.
ハロゲン非含有単量体として、（メタ）アクリル酸エステル、プロピレン、エチレン、ジエン類等を用いると、粘着剤の粘着力の向上と剥離容易性のバランスが良く好ましい。フッ素系単量体と（メタ）アクリル酸エステル単量体からなるエラストマが諸物性のバランスが良く、好適に用いられる。 When a (meth) acrylic acid ester, propylene, ethylene, dienes, or the like is used as the halogen-free monomer, a good balance between the adhesive strength of the pressure-sensitive adhesive and the ease of peeling is preferable. An elastomer composed of a fluorinated monomer and a (meth) acrylic acid ester monomer has a good balance of physical properties and is preferably used.
エラストマがヒドロキシル基、カルボキシル基、エポキシ基、アミド基、アミノ基、メチロール基、スルホン酸基、スルファミン酸基、及び（亜）リン酸エステル基からなる群から選ばれる官能基を１種以上有する単量体単位を有する、ダイシング後の加熱処理により電子部品の剥離が更に容易となるため好ましい。 A single elastomer having at least one functional group selected from the group consisting of a hydroxyl group, a carboxyl group, an epoxy group, an amide group, an amino group, a methylol group, a sulfonic acid group, a sulfamic acid group, and a (phosphite) group. It is preferable since the electronic component can be more easily peeled off by the heat treatment after dicing, which has a monomer unit.
ヒドロキシル基を有する単量体としては、例えば、２−ヒドロキシエチル（メタ）アクリレート、２−ヒドロキシプロピル（メタ）アクリレート、２−ヒドロキシブチル（メタ）アクリレート等が挙げられる。 Examples of the monomer having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and the like.
カルボキシル基を有する単量体としては、例えば、（メタ）アクリル酸、クロトン酸、マレイン酸、無水マレイン酸、イタコン酸、フマール酸、アクリルアミドＮ−グリコール酸、ケイ皮酸等が挙げられる。 Examples of the monomer having a carboxyl group include (meth) acrylic acid, crotonic acid, maleic acid, maleic anhydride, itaconic acid, fumaric acid, acrylamide N-glycolic acid, and cinnamic acid.
エポキシ基を有する単量体としては、例えば、アリルグリシジルエーテル、（メタ）アクリル酸グリシジルエーテル等が挙げられる。 Examples of the monomer having an epoxy group include allyl glycidyl ether and (meth) acrylic acid glycidyl ether.
アミド基を有する単量体としては、例えば、（メタ）アクリルアミドなどがある。アミノ基を有する単量体としては、例えば、Ｎ，Ｎ−ジメチルアミノエチル（メタ）アクリレートなどがある。 Examples of the monomer having an amide group include (meth) acrylamide. Examples of the monomer having an amino group include N, N-dimethylaminoethyl (meth) acrylate.
メチロール基を有する単量体としては、例えば、Ｎ−メチロールアクリルアミド等が挙げられる。 Examples of the monomer having a methylol group include N-methylolacrylamide.
エラストマ全体に占めるハロゲン含有単量体単位の含有率は特に限定されないが、エラストマ全体のうちの０．１〜５５質量％とすることが好ましい。ハロゲン含有単量体の含有率が低いと架橋による凝集力の向上が望めず、ダイシング時に粘着剤の掻き上げが生じてしまうと共に、粘着剤の表面抵抗率が高くなる傾向にある。ハロゲン含有単量体の含有率が高いとハロゲン成分が被着体に付着することがある。ハロゲン含有単量体の含有率のより好ましい下限は３質量％であり、より好ましい上限は３０質量％である。 Although the content rate of the halogen-containing monomer unit in the entire elastomer is not particularly limited, it is preferably 0.1 to 55% by mass in the entire elastomer. If the content of the halogen-containing monomer is low, an improvement in cohesive force due to crosslinking cannot be expected, and the adhesive is scraped up during dicing, and the surface resistivity of the adhesive tends to increase. If the content of the halogen-containing monomer is high, the halogen component may adhere to the adherend. The minimum with more preferable content rate of a halogen-containing monomer is 3 mass%, and a more preferable upper limit is 30 mass%.
エラストマは、１種又は２種以上使用してもよく、ハロゲンを含有しないゴム状樹脂等との混合物として併用してもよい。 The elastomer may be used alone or in combination of two or more, and may be used in combination as a mixture with a halogen-free rubber-like resin or the like.
（加熱発泡剤）
加熱発泡剤はダイシング後の熱処理による加熱発泡剤の膨脹又は発泡するものである。加熱発泡により粘着シートの粘着力が低下又は消失し、電子部品を容易に回収することができる。
(Heating foaming agent)
A heating foaming agent expands or foams the heating foaming agent by the heat processing after dicing. The adhesive force of the pressure-sensitive adhesive sheet decreases or disappears due to heat foaming, and the electronic component can be easily recovered.
加熱発泡剤は熱膨張性微粒子、水、無機系又は有機系の加熱発泡剤等が挙げられる。 Examples of the heating foaming agent include thermally expandable fine particles, water, an inorganic or organic heating foaming agent, and the like.
熱膨張性微粒子は、不活性ガス等の熱膨張性を有する物質をゴム等でマイクロカプセル化したものである。混合操作が容易である等の長所があり、好適に用いられる。熱膨張性微粒子は、例えばマイクロスフェア（商品名：松本油脂社製）等がある。 The thermally expandable fine particles are obtained by microencapsulating a material having thermal expandability such as an inert gas with rubber or the like. It has advantages such as easy mixing operation and is preferably used. Examples of the thermally expandable fine particles include microspheres (trade name: manufactured by Matsumoto Yushi Co., Ltd.).
無機系の加熱発泡剤としては、例えば炭酸アンモニウム、炭酸水素アンモニウム、炭酸水素ナトリウム、亜硝酸アンモニウム、水素化ホウ素ナトリウム、アジト類等が挙げられる。 Examples of the inorganic heating foaming agent include ammonium carbonate, ammonium hydrogen carbonate, sodium hydrogen carbonate, ammonium nitrite, sodium borohydride, azides and the like.
有機系の加熱発泡剤としては、例えばフッ化アルカン系、アゾ系、ヒドラジン系、セミカルバジド系、トリアゾール系、Ｎ−ニトロソ系等が挙げるられる。具体的には、下記の化合物が挙げられる。
１．フッ化アルカン：トリクロロモノフルオロメタン、ジクロロモノフルオロメタン等。
２．アゾ系：アゾビスイソブチロニトリルやアゾジカルボンアミド、バリウムアゾジカルボキシレート等。
３．ヒドラジン系：パラトルエンスルホニルヒドラジド、ジフェニルスルホン−３，３’−ジスルホニルヒドラジド、４，４’−オキシビス（ベンゼンスルホニルヒドラジド）、アリルビス（スルホニルヒドラジド）等。
４．セミカルバジド系化合物：ρ−トルイレンスルホニルセミカルバジド、４，４’−オキシビス（ベンゼンスルホニルセミカルバジド）等。
５．トリアゾール系化合物：５−モルホリル−１，２，３，４−チアトリアゾール等。
６．Ｎ−ニトロソ系化合物：Ｎ，Ｎ’−ジニトロソペンタメチレンテトラミン、Ｎ，Ｎ’−ジメチル−Ｎ，Ｎ’−ジニトロソテレフタルアミド等。
Examples of the organic heating foaming agent include fluorinated alkanes, azos, hydrazines, semicarbazides, triazoles, N-nitrosos, and the like. Specific examples include the following compounds.
1. Fluorinated alkanes: trichloromonofluoromethane, dichloromonofluoromethane, etc.
2. Azo series: azobisisobutyronitrile, azodicarbonamide, barium azodicarboxylate, and the like.
3. Hydrazine series: p-toluenesulfonyl hydrazide, diphenylsulfone-3,3′-disulfonyl hydrazide, 4,4′-oxybis (benzenesulfonyl hydrazide), allyl bis (sulfonyl hydrazide) and the like.
4). Semicarbazide compounds: ρ-toluylenesulfonyl semicarbazide, 4,4′-oxybis (benzenesulfonyl semicarbazide) and the like.
5. Triazole compounds: 5-morpholyl-1,2,3,4-thiatriazole and the like.
6). N-nitroso compounds: N, N′-dinitrosopentamethylenetetramine, N, N′-dimethyl-N, N′-dinitrosotephthalamide and the like.
熱膨張性微粒子の粒径は特に限定されないが、メジアン粒径２０〜８０μｍ程度のものが入手可能であり、４０〜６０μｍのものが粒径のバラツキが少なく、粘着剤層表面の凹凸を小さくできるため好ましい。 The particle size of the heat-expandable fine particles is not particularly limited, but those having a median particle size of about 20 to 80 μm are available, those having a median particle size of 40 to 60 μm have little variation in particle size, and the unevenness of the pressure-sensitive adhesive layer surface can be reduced. Therefore, it is preferable.
加熱発泡剤の配合量は特に限定されないが、エラストマ１００質量部に対して１〜２００質量部が好ましく、１０〜１５０質量部がより好ましい。加熱発泡剤の配合量が過剰だと粘着力が低下し、チップ飛びが発生することがある。加熱発泡剤の配合量が少ないと発泡性が悪く、粘着力が低下するため、加熱による電子部品の回収がしにくい場合がある。 Although the compounding quantity of a heating foaming agent is not specifically limited, 1-200 mass parts is preferable with respect to 100 mass parts of elastomers, and 10-150 mass parts is more preferable. If the blending amount of the heating foaming agent is excessive, the adhesive strength is reduced and chip skipping may occur. If the blending amount of the heating foaming agent is small, the foamability is poor and the adhesive strength is lowered, so that it may be difficult to recover the electronic component by heating.
（アミノ基を２個以上有する化合物を含有するアミン硬化剤）
アミノ基を２個以上有する化合物を含有するアミン硬化剤（以下、単に「アミン硬化剤」という）は、分子内に少なくともアミノ基を２個以上有することを特徴とする。粘着剤にアミン硬化剤を添加することにより、自体の凝集性、粘着剤表面の表面抵抗率の低下、及び粘着力の向上等の効果が得られる。
(Amine curing agent containing a compound having two or more amino groups)
An amine curing agent containing a compound having two or more amino groups (hereinafter simply referred to as “amine curing agent”) is characterized by having at least two amino groups in the molecule. By adding an amine curing agent to the pressure-sensitive adhesive, effects such as cohesion of itself, a decrease in the surface resistivity of the pressure-sensitive adhesive surface, and an improvement in adhesive strength can be obtained.
アミン硬化剤の添加量は、エラストマ１００質量部に対して０．０５〜３０質量部が好ましい。アミン硬化剤の添加量が少ないと、架橋による凝集力の向上が望めずダイシング時に粘着剤の掻き上げが生じるとともに、粘着剤表面抵抗率の低下する場合がある。アミン硬化剤の添加量が過剰の場合は粘着力が低下しチップ飛びが発生する傾向にある。 The addition amount of the amine curing agent is preferably 0.05 to 30 parts by mass with respect to 100 parts by mass of the elastomer. If the addition amount of the amine curing agent is small, an improvement in cohesive force due to crosslinking cannot be expected, and the adhesive is scraped up during dicing, and the adhesive surface resistivity may decrease. When the addition amount of the amine curing agent is excessive, the adhesive strength is lowered and chip jumping tends to occur.
アミン硬化剤は、例えばジエチレントリアミン、３−Ｎ，Ｎ−ジメチルアミノプロピルアミン（ジメチルアミノプロピルアミン）、テトラエチレンペンタミン、ジエチルアミノプロピルアミン、ジブチルアミノプロピルアミン、ヘキサメチレンジアミン、トリメチルヘキサメチレンジアミン、３−アミノ−１−シクロヘキシルアミノプロパン、３，３’−ジメチル４，４’−ジアミノジシクロヘキシルメタン、４，４’−ジアミノジシクロヘキシルメタン、１，３−ビス（アミノメチル）シクロヘキサン、４，４’−ジアミノジフェニルメタン、４，４’−ジアミノジフェニルエーテル、ジアミノジフェニルスルホン、ｍ−フェニレンジアミン、２，４−トルイレンジアミン、ｍ−トルイレンジアミン、Ｏ−トルイレンジアミン、メタキシシリレンジアミン、キシリレンジアミン、Ｎ−ベンジルエチレンジアミン、Ｎ，Ｎ−ジベンジルエチレンジアミン、ジプロピレントリアミン、トリエチレントリアミン、イソホロンジアミン、ジシアンジアミド、ポリオキシプロピレンジアミン、Ｎ−アミノエチルピペラジン、ビス−アミノプロピルピペラジン等が挙げられる。 Examples of the amine curing agent include diethylenetriamine, 3-N, N-dimethylaminopropylamine (dimethylaminopropylamine), tetraethylenepentamine, diethylaminopropylamine, dibutylaminopropylamine, hexamethylenediamine, trimethylhexamethylenediamine, 3- Amino-1-cyclohexylaminopropane, 3,3′-dimethyl 4,4′-diaminodicyclohexylmethane, 4,4′-diaminodicyclohexylmethane, 1,3-bis (aminomethyl) cyclohexane, 4,4′-diaminodiphenylmethane 4,4'-diaminodiphenyl ether, diaminodiphenyl sulfone, m-phenylenediamine, 2,4-toluylenediamine, m-toluylenediamine, O-toluylenediamine, metaxisi Range amine, xylylenediamine, N-benzylethylenediamine, N, N-dibenzylethylenediamine, dipropylenetriamine, triethylenetriamine, isophoronediamine, dicyandiamide, polyoxypropylenediamine, N-aminoethylpiperazine, bis-aminopropylpiperazine, etc. Is mentioned.
粘着剤には、例えば、粘着付与剤、軟化剤、老化防止剤、充填剤等の公知の添加剤を適宜選択して添加してもよい。 For example, known additives such as a tackifier, a softener, an anti-aging agent, and a filler may be appropriately selected and added to the adhesive.
（粘着シートの製造）
粘着シートは、樹脂等からなる基材に粘着剤を塗布、噴霧、又は印刷等によって製造する。粘着剤は原液、又は有機溶剤に溶解して基材に塗布、噴霧、又は印刷することができる。
(Manufacture of adhesive sheet)
The pressure-sensitive adhesive sheet is produced by applying, spraying, or printing a pressure-sensitive adhesive on a base material made of resin or the like. The pressure-sensitive adhesive can be dissolved in an undiluted solution or an organic solvent and applied to a substrate, sprayed, or printed.
粘着シートの基材の厚みは、用途に応じて適宜選択できる。基材には公知の合成樹脂を適宜使用できる。基材に適した樹脂は、例えばポリ塩化ビニル、ポリエチレン、ポリプロピレン、ポリエステル、エチレンビニルアルコール、ポリエチレンレテフタレート等が挙げられる。これらの樹脂の単層シート又は積層したシートを用いてもよい。発泡剤を添加して適度に発泡させたシートを基材としてもよい。 The thickness of the base material of an adhesive sheet can be suitably selected according to a use. A known synthetic resin can be appropriately used for the substrate. Examples of the resin suitable for the substrate include polyvinyl chloride, polyethylene, polypropylene, polyester, ethylene vinyl alcohol, and polyethylene terephthalate. A single layer sheet or a laminated sheet of these resins may be used. A sheet that is appropriately foamed by adding a foaming agent may be used as the base material.
粘着シートの被着体である電子部品集合体とは、通常ワークと呼ばれるものであり、半導体ウエハ又は絶縁物基板上に回路パターンを配したものである。電子部品集合体はエポキシ樹脂で封止された封止樹脂パッケージ、具体的にはボール・グリッド・アレイ（ＢＧＡ）、チップ・サイズ・パッケージ（ＣＳＰ）、スタック・メモリー・モジュール、システム・オン・モジュール等であってもよい。 The electronic component assembly that is the adherend of the pressure-sensitive adhesive sheet is usually called a workpiece, and is a circuit pattern arranged on a semiconductor wafer or an insulating substrate. Electronic component assembly is a sealed resin package sealed with epoxy resin, specifically, ball grid array (BGA), chip size package (CSP), stack memory module, system on module Etc.
半導体ウエハとしては例えばシリコンウエハ、ガリウム−砒素等が挙げられる。絶縁物基板としては、ＢＧＡ（ボール・グリッド・アレイ）基板、ガラス基板、エポキシ基板、高分子液晶基板、セラミック基板等が挙げられる。 Examples of the semiconductor wafer include a silicon wafer and gallium-arsenide. Examples of the insulator substrate include a BGA (ball grid array) substrate, a glass substrate, an epoxy substrate, a polymer liquid crystal substrate, and a ceramic substrate.
電子部品製造方法は特に限定されないが、粘着シートに貼り付けた電子部品集合体をチップ状にダイシング後に加熱し、電子部品をピックアップする方法が挙げられる。粘着シート上に半導体ウエハ又は絶縁物基板を貼り付けた後、必要に応じてエッチング、樹脂封止、又は研磨等の加工を施しても良い。 Although the electronic component manufacturing method is not particularly limited, a method of picking up the electronic component by heating the electronic component assembly attached to the adhesive sheet after dicing into chips is cited. After a semiconductor wafer or an insulating substrate is attached to the adhesive sheet, processing such as etching, resin sealing, or polishing may be performed as necessary.
実施例１に係る粘着シートは以下の処方で製造した。 The pressure-sensitive adhesive sheet according to Example 1 was manufactured with the following formulation.
（使用材料）
エラストマＡ：エピクロロヒドリン単位５質量％、エチレンオキシド単位９０質量％、アクリル酸メチル単位５質量％からなる共重合体（ハロゲン含有単量体量５質量％）。
エラストマＢ：エピフルオロヒドリン単位５質量％、エチレンオキシド単位質量９０質量％、アクリル酸メチル単位５質量％からなる共重合体（ハロゲン含有単量体量５質量％）。
エラストマＣ：エピブロモヒドリン単位５質量％、エチレンオキシド単位質量９０質量％、アクリル酸メチル単位５質量％からなる共重合体（ハロゲン含有単量体量５質量％）。
(Materials used)
Elastomer A: A copolymer comprising 5% by mass of epichlorohydrin units, 90% by mass of ethylene oxide units, and 5% by mass of methyl acrylate units (halogen-containing monomer amount 5% by mass).
Elastomer B: a copolymer comprising 5% by mass of epifluorohydrin units, 90% by mass of ethylene oxide units, and 5% by mass of methyl acrylate units (halogen-containing monomer content 5% by mass).
Elastomer C: copolymer comprising 5% by mass of epibromohydrin units, 90% by mass of ethylene oxide units, and 5% by mass of methyl acrylate units (halogen-containing monomer content 5% by mass).
加熱発泡剤 ：マイクロスフエアー、Ｆ−３０Ｄ。
アミン硬化剤：Ｎ−ベンジルエチレンジアミン、市販品。
基材 ：ポリエステル製シート、厚さ１５０μm、市販品。
Heating foaming agent: Microsphere, F-30D.
Amine curing agent: N-benzylethylenediamine, commercially available product.
Base material: Polyester sheet, thickness 150 μm, commercially available.
（粘着剤）
粘着剤は、エラストマ１００質量部、加熱発泡剤１０質量部、及びアミン硬化剤５質量部を混合して製造した。
(Adhesive)
The pressure-sensitive adhesive was produced by mixing 100 parts by mass of an elastomer, 10 parts by mass of a heating foaming agent, and 5 parts by mass of an amine curing agent.
（粘着シート）
粘着シートは、基材の片面に厚さ４０μｍの粘着剤の原液を塗布して粘着剤層を形成し、粘着シートとした。
(Adhesive sheet)
The pressure-sensitive adhesive sheet was formed as a pressure-sensitive adhesive sheet by applying a stock solution of a pressure-sensitive adhesive having a thickness of 40 μm to one side of the substrate to form a pressure-sensitive adhesive layer.
実施例２〜９及び比較例１に係る粘着シートは、下記の処方で製造した。
実施例２は、実施例１のエラストマＡの代わりにエラストマＢを用いた。
実施例３は、実施例１のエラストマＡの代わりにエラストマＣを用いた。
実施例４は実施例１におけるアミン硬化剤をエラストマＡ１００質量部に対して０．０１質量部に変更した。
実施例５は実施例１におけるアミン硬化剤をエラストマＡ１００質量部に対して３５質量部に変更した。
実施例６は実施例１におけるエラストマＡ中のハロゲン含有単量体の含有率を０．０５質量％に変更した。
実施例７は実施例１におけるエラストマＡ中のハロゲン含有単量体の含有率を６０質量％に変更した。
実施例８は実施例１の加熱発泡剤をエラストマＡ１００質量部に対して０．５質量部に変更した。
実施例９は実施例１の加熱発泡剤をエラストマＡ１００質量部に対して２３０質量部に変更した。
比較例１は実施例１におけるエラストマの代わりにエピヒドリン単位５％、エチレンオキシド単位９０質量％、アクリル酸メチル単位５質量％からなる共重合体を使用した。
The pressure-sensitive adhesive sheets according to Examples 2 to 9 and Comparative Example 1 were produced with the following formulation.
In Example 2, elastomer B was used in place of elastomer A of Example 1.
In Example 3, elastomer C was used in place of elastomer A in Example 1.
In Example 4, the amine curing agent in Example 1 was changed to 0.01 parts by mass with respect to 100 parts by mass of elastomer A.
In Example 5, the amine curing agent in Example 1 was changed to 35 parts by mass with respect to 100 parts by mass of elastomer A.
In Example 6, the content of the halogen-containing monomer in the elastomer A in Example 1 was changed to 0.05% by mass.
In Example 7, the content of the halogen-containing monomer in the elastomer A in Example 1 was changed to 60% by mass.
In Example 8, the heating foaming agent of Example 1 was changed to 0.5 parts by mass with respect to 100 parts by mass of elastomer A.
In Example 9, the heating foaming agent of Example 1 was changed to 230 parts by mass with respect to 100 parts by mass of elastomer A.
In Comparative Example 1, instead of the elastomer in Example 1, a copolymer comprising 5% epihydrin units, 90% by mass of ethylene oxide units, and 5% by mass of methyl acrylate units was used.
（評価方法）
ダイシング性（チップ飛び）：粘着シートを、縦２０ｍｍ、横２５ｍｍのセラミックシートに気泡が入らないよう貼り付け、１０分放置後に１ｍｍ□にダイシングし、５００個のチップとした。この作業を５回繰り返してチップを製造した際の、チップ総数に対するチップ飛び割合である。
(Evaluation methods)
Dicing property (chip skipping): An adhesive sheet was attached to a ceramic sheet having a length of 20 mm and a width of 25 mm so as not to contain air bubbles, and was allowed to stand for 10 minutes and then diced to 1 mm □ to obtain 500 chips. This is the chip skip ratio with respect to the total number of chips when the chip is manufactured by repeating this operation five times.
粘着力：粘着シートを、セラミックシートに気泡が入らないよう貼り付け、ＪＩＳ Ｚ ０２３７に準じて測定した。 Adhesive strength: The pressure-sensitive adhesive sheet was affixed to the ceramic sheet so as not to contain air bubbles, and measured according to JIS Z 0237.
粘着剤掻き上げ：粘着シートを、セラミックシートに気泡が入らないよう貼り付け、１０分放置後に１ｍｍ□にダイシングし、この作業を５回繰り返し、チップ総数に対するチップ側面に粘着剤の付着が確認された割合である。 Adhesive scraping: Adhesive sheet is affixed to the ceramic sheet so that no air bubbles enter, then left for 10 minutes, then dimmed to 1 mm □, and this operation is repeated 5 times. It is a ratio.
加熱処理後の剥離性：粘着シートを、セラミックシートに気泡が入らないよう貼り付け、１０分放置後に１ｍｍ□にダイシングし、粘着シートを１５０℃で１分間加熱し、粘着剤層を発泡させた。粘着シートを反転し、落下しなかったチップの個数を測定した。 Peelability after heat treatment: The pressure-sensitive adhesive sheet was affixed to the ceramic sheet so that no air bubbles entered, and was left for 10 minutes, then diced to 1 mm □, and the pressure-sensitive adhesive sheet was heated at 150 ° C. for 1 minute to foam the pressure-sensitive adhesive layer. . The adhesive sheet was inverted, and the number of chips that did not fall was measured.
表面抵抗率（粘着剤表面抵抗率）：粘着シートを、温度２３℃、湿度５５％の雰囲気下で表面抵抗測定器（アドバンテスト社Ｒ８３４０Ａ）を用い、粘着剤表面の抵抗率を測定した。 Surface resistivity (pressure-sensitive adhesive surface resistivity): The pressure-sensitive adhesive sheet was measured for the pressure-sensitive adhesive surface resistivity using a surface resistance measuring instrument (Advantest R8340A) in an atmosphere at a temperature of 23 ° C. and a humidity of 55%.
ハロゲン元素抽出量：粘着シート１００ｃｍ２をコニカルビーカーに入れ、超純水１００ｍｌに浸漬し、ホットプレートを用いて１００℃で２時間抽出し、イオンクロマトグラフィー（ＤＩＯＮＥＸ社ＤＸ−ＡＱ）にてハロゲンイオン量の分析を行った。０．１ｐｐｍ未満を○（良）、０．１ｐｐｍ以上のものを×（不可）とした。 Halogen element extraction amount: Adhesive sheet 100 cm 2 was put in a conical beaker, immersed in 100 ml of ultrapure water, extracted at 100 ° C. for 2 hours using a hot plate, and halogen ions were extracted by ion chromatography (DIONEX DX-AQ). Quantity analysis was performed. Less than 0.1 ppm was evaluated as ◯ (good), and 0.1 ppm or more was evaluated as x (impossible).
（評価結果）
実施例１における粘着シートは、チップ飛びがなく、粘着剤の掻き上げは確認されず、表面抵抗率が８．３×１０１１Ω／□、ハロゲンイオン抽出量が０．１ｐｐｍ未満であり、良好であった。
実施例２：実施例１より表面低効率が良好であった。
実施例３：実施例１よりも粘着力が高くなった。
実施例４：チップ飛びはないものの、粘着剤の掻き上げ、および粘着剤表面抵抗率が悪かった。
実施例５：粘着剤の掻き上げはなく、粘着剤表面抵抗率は良好なものの、粘着力が低く、チップ飛びが多くみられた。
実施例６：ハロゲンイオン抽出量は少ないものの、粘着剤表面抵抗率が悪かった。
実施例７：粘着剤の掻き上げはないものの、ハロゲンイオン抽出量が多く、チップ飛びも多くみられた。
実施例８：粘着剤の掻き上げはないものの、加熱処理後の剥離性が悪かった。
実施例９：チップ飛びが多かった。
比較例１は、ハロゲンイオン抽出量は少ないものの、粘着剤表面抵抗率が非常に悪かった。
(Evaluation results)
The pressure-sensitive adhesive sheet in Example 1 has no chip skipping, no scraping of the pressure-sensitive adhesive is confirmed, the surface resistivity is 8.3 × 10 11 Ω / □, and the halogen ion extraction amount is less than 0.1 ppm. Met.
Example 2: The low surface efficiency was better than that of Example 1.
Example 3: The adhesive strength was higher than that of Example 1.
Example 4: Although there was no chip skipping, the adhesive was scraped up and the adhesive surface resistivity was poor.
Example 5: The adhesive was not scraped up and the adhesive surface resistivity was good, but the adhesive force was low and chip fly was observed.
Example 6: Although the amount of halogen ion extraction was small, the adhesive surface resistivity was poor.
Example 7: Although the adhesive was not scraped up, the halogen ion extraction amount was large and chip jumping was also observed.
Example 8: Although the adhesive was not scraped up, the peelability after the heat treatment was poor.
Example 9: There were many chip jumps.
In Comparative Example 1, although the halogen ion extraction amount was small, the pressure-sensitive adhesive surface resistivity was very poor.
粘着シートは、一枚の板に複数の電子部品を複数個作成してなる電子部品集合体をダイシングして分割し、電子部品とする際に、当該板の背面に貼り付けられる粘着シートに好適に使用される。
The pressure-sensitive adhesive sheet is suitable for a pressure-sensitive adhesive sheet that is affixed to the back of the board when dicing and dividing an electronic component assembly formed by creating a plurality of electronic components on a single plate. Used for.
Claims (8)
The electronic component manufacturing method using the adhesive sheet of Claim 6 or Claim 7.
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| CN105017975A (en) * | 2015-06-26 | 2015-11-04 | 蚌埠市鸿安精密机械有限公司 | Micro-foamed wood adhesive |
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| JP2000248240A (en) * | 1999-03-01 | 2000-09-12 | Nitto Denko Corp | Heat-releasable adhesive sheet |
| JP2003306657A (en) * | 2002-02-07 | 2003-10-31 | Sumitomo Chem Co Ltd | Adhesive resin composition and adhesive film |
| JP2004043642A (en) * | 2002-07-11 | 2004-02-12 | Sekisui Chem Co Ltd | Adhesive substance, one-sided self-adhesive tape and double-sided self-adhesive tape |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105017975A (en) * | 2015-06-26 | 2015-11-04 | 蚌埠市鸿安精密机械有限公司 | Micro-foamed wood adhesive |
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