JP2006317693A - Exposure method, exposure mask, and protecting film for mask - Google Patents

Exposure method, exposure mask, and protecting film for mask Download PDF

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JP2006317693A
JP2006317693A JP2005139878A JP2005139878A JP2006317693A JP 2006317693 A JP2006317693 A JP 2006317693A JP 2005139878 A JP2005139878 A JP 2005139878A JP 2005139878 A JP2005139878 A JP 2005139878A JP 2006317693 A JP2006317693 A JP 2006317693A
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mask
protective film
exposure
photosensitive agent
light
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Haruhiro Suzuki
陽博 鈴木
Tadashi Watanabe
正 渡辺
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Kyocera Circuit Solutions Inc
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NEC Toppan Circuit Solutions Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure mask capable of forming a normal pattern, without being affected by foreign matters, even if foreign matters such as very fine dust within a predetermined size range are interposed between the mask and a photosensitive material, in addition to prevention of scratches of the mask body. <P>SOLUTION: In the exposure mask, the protective film 15 is formed on the surface of a photosensitive material 20 side in the mask body 10, and the protective film is provided with a light diffusing function. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明はプリント配線板などを作製する際に適用される露光方法及びそれに使用される露光用マスクに関し、特に密着露光もしくはギャップ露光に適した露光方法及び露光用マスクに関する。   The present invention relates to an exposure method applied when producing a printed wiring board and the like and an exposure mask used therefor, and more particularly to an exposure method and an exposure mask suitable for contact exposure or gap exposure.

通常、プリント配線板の作製は、以下のような工程を含む。基板材料の表面に感光剤を塗布し、この感光剤の表面にフォトマスクの露光用パターンが形成された面を密着、もしくは数十μｍ程度離して感光剤表面とフォトマスクを対向させる。そして、フォトマスクを介して感光剤を露光した後、フォトマスクを剥離して感光剤を現像し、更にエッチング処理、感光剤除去を施すことにより露光用パターンで規定されたパターンを形成する。   Usually, the production of a printed wiring board includes the following steps. A photosensitive agent is applied to the surface of the substrate material, and the surface on which the exposure pattern of the photomask is formed is closely attached to the surface of the photosensitive agent, or the photosensitive agent surface and the photomask are opposed to each other with a distance of about several tens of μm. Then, after exposing the photosensitizer through the photomask, the photomask is peeled off, the photosensitizer is developed, and further, etching treatment and photosensitizer removal are performed to form a pattern defined by the exposure pattern.

上記の工程を図２を参照して説明する。ここでは、コア層３１の表裏両面に銅箔による導体パターン層３２が形成された基材３０の導体パターン層３２を所望のパターンに形成する場合について説明する。図２の左側にはパターン形成の流れを示し、右側には途中のいくつかの工程における基材３０を断面図で示す。   The above process will be described with reference to FIG. Here, the case where the conductor pattern layer 32 of the base material 30 in which the conductor pattern layer 32 made of copper foil is formed on both the front and back surfaces of the core layer 31 is formed in a desired pattern will be described. The flow of pattern formation is shown on the left side of FIG. 2, and the base material 30 in several steps along the way is shown in cross section on the right side.

図２において、基材３０を用意し（ａ）、その表裏の導体パターン層３２に感光剤３３を塗布する（ｂ）。塗布された感光剤３３に所望のパターンを持つフォトマスク３４を密着させてＵＶ光による露光を行い（ｃ，ｃ−１）、感光剤３３の露光された部位を硬化させる（ｃ−２）。   In FIG. 2, a base material 30 is prepared (a), and a photosensitive agent 33 is applied to the conductive pattern layers 32 on the front and back sides (b). A photomask 34 having a desired pattern is brought into intimate contact with the applied photosensitizer 33 and exposed to UV light (c, c-1), and the exposed portion of the photosensitizer 33 is cured (c-2).

フォトマスク３４を剥離して現像を行い、硬化した部位以外の感光剤３３を除去する（ｄ）。続いて、感光剤３３より露出した部分の銅箔を除去するエッチング処理を行う（ｅ）。更に、硬化している感光剤３３の除去（ｆ）、検査、洗浄等を行う（ｇ）ことで、プリント配線板が得られる。なお、必要に応じて積層を行う（ｈ）ことで多層プリント配線板（図示せず）が得られる。   The photomask 34 is peeled off and developed, and the photosensitive agent 33 other than the cured part is removed (d). Subsequently, an etching process is performed to remove the exposed copper foil from the photosensitive agent 33 (e). Furthermore, the printed wiring board is obtained by performing the removal (f), inspection, washing, and the like (g) of the cured photosensitive agent 33. In addition, a multilayer printed wiring board (not shown) is obtained by performing lamination | stacking (h) as needed.

ところで、フォトマスクの一例として、透明な基材上に露光用パターンが形成された乳剤層を有し、感光剤の付着を防止するためもしくは乳剤層を保護するために、乳剤層上（感光剤側の面上）に数μｍ厚の透明の保護フィルムを貼り合わせたものが知られている（例えば、特許文献１参照）。   By the way, as an example of a photomask, an emulsion layer having an exposure pattern formed on a transparent substrate is used. In order to prevent adhesion of the photosensitive agent or to protect the emulsion layer (photosensitive agent). On the side surface), a transparent protective film having a thickness of several μm is bonded (for example, see Patent Document 1).

あるいはまた、フォトマスク用の保護フィルムとして、ポリエステル基材の片面にフォトマスクに貼着するための粘着剤を有し、反対面には感光剤からの剥離を容易にするための離型層を有するものが知られている（例えば、特許文献２参照）。   Alternatively, as a protective film for a photomask, it has an adhesive for adhering to a photomask on one side of a polyester substrate, and a release layer for facilitating peeling from the photosensitive agent on the opposite side. What has it is known (for example, refer patent document 2).

ところが、上記のような各種の保護フィルムを貼着したフォトマスクを使用した場合であっても、図３に示すように、マスク本体４０を保護している保護フィルム４１の表面あるいは感光剤４２の表面に微細なごみ等の異物が存在すると、以下のような問題点が発生する。つまり、保護フィルム４１と感光剤４２との間に存在する異物が実質上平行光であるＵＶ光を遮ってしまい、影となることによってその部分の感光剤４２は反応しない。感光剤４２が反応しなかった部位はその後の工程（図２で言えば、工程ｄ〜ｆ）で反応してしまうため、フォトマスクで規定された正常なパターンが形成できない。勿論、上記のような工程で対象となる異物というのは、数十μｍ程度以下の微小な大きさの塵埃の類いである。   However, even when a photomask with various protective films as described above is used, as shown in FIG. 3, the surface of the protective film 41 protecting the mask body 40 or the photosensitive agent 42 is used. When foreign matter such as fine dust is present on the surface, the following problems occur. That is, the foreign substance existing between the protective film 41 and the photosensitive agent 42 blocks the UV light which is substantially parallel light, and becomes a shadow, so that the photosensitive agent 42 in that portion does not react. Since the part where the photosensitive agent 42 has not reacted reacts in the subsequent steps (steps df in FIG. 2), a normal pattern defined by the photomask cannot be formed. Of course, the foreign matter that is the target in the above-described process is a kind of minute dust of about several tens of μm or less.

特開２００２−２７８０４７号公報JP 2002-278047 A 特開平９−２３０５８０号公報Japanese Patent Laid-Open No. 9-230580

本発明の課題は、マスク本体への傷つき防止に加えて、万一、マスクと感光剤との間に微小なごみ等の異物が介在した場合でも所定範囲内の大きさであれば異物の影響を受けることなく正常なパターンを形成できるような露光方法及び露光用マスクを提供することにある。   In addition to preventing damage to the mask body, the object of the present invention is to prevent the influence of foreign matter if the size is within a predetermined range even if foreign matter such as fine dust is present between the mask and the photosensitive agent. An object of the present invention is to provide an exposure method and an exposure mask that can form a normal pattern without receiving the pattern.

本発明はまた、上記の露光用マスクに適した保護フィルムを提供することにある。   The present invention also provides a protective film suitable for the above-described exposure mask.

本発明による露光方法は、所定のパターンを持つ露光用のマスクを通して感光剤に露光を行うに際し、マスクと感光剤との間に光拡散機能を持つ部材を介在させることを特徴とする。   The exposure method according to the present invention is characterized in that a member having a light diffusion function is interposed between the mask and the photosensitive agent when the photosensitive agent is exposed through an exposure mask having a predetermined pattern.

本発明によればまた、露光用のマスクにおけるマスク本体の感光剤側の面に保護フィルムを設け、該保護フィルムに光拡散機能を持たせたことを特徴とする露光用マスクが提供される。   According to the present invention, there is also provided an exposure mask characterized in that a protective film is provided on the surface of the mask body on the photosensitive agent side of the exposure mask, and the protective film has a light diffusion function.

本発明によれば更に、露光用のマスクにおける感光剤側の面に設けられる保護フィルムであって、光拡散機能を持たせたことを特徴とする保護フィルムが提供される。   According to the present invention, there is further provided a protective film provided on the surface on the photosensitive agent side of the exposure mask, which is provided with a light diffusion function.

なお、前記保護フィルムとしては、すりガラス、または透明樹脂に、光拡散機能を付与するための微粒子を分散させたフィルムを用いることができる。   In addition, as said protective film, the film which disperse | distributed the fine particle for providing a light-diffusion function to ground glass or transparent resin can be used.

前記保護フィルムは、接着剤あるいは粘着剤層を介してマスク本体に貼り合わされたもので良い。前記保護フィルムのうち、特に前記透明樹脂に、光拡散機能を付与するための微粒子を分散させて成る保護フィルムの場合は、マスク本体にコーティングにより一体化形成されたものであっても良い。   The protective film may be bonded to the mask body through an adhesive or a pressure-sensitive adhesive layer. Among the protective films, particularly in the case of a protective film in which fine particles for imparting a light diffusing function are dispersed in the transparent resin, the protective film may be integrally formed by coating on the mask body.

本発明によれば、マスク本体と感光剤との間に光拡散機能を有する保護フィルムを介在させるようにしたことにより、マスク本体の傷付き防止、マスク本体への感光剤の付着防止に加えて、保護フィルムと感光剤との間に、あるサイズ以下の異物が介在した場合に発生していた異常パターンの形成を防止することができる。   According to the present invention, by providing a protective film having a light diffusion function between the mask body and the photosensitive agent, in addition to preventing damage to the mask body and preventing adhesion of the photosensitive agent to the mask body. Further, it is possible to prevent the formation of an abnormal pattern that has occurred when a foreign material of a certain size or less is interposed between the protective film and the photosensitive agent.

図１を参照して本発明による露光用マスクの好ましい実施の形態について説明する。   A preferred embodiment of an exposure mask according to the present invention will be described with reference to FIG.

図１において、露光用マスク１は、マスク本体１０と保護フィルム１５とから成る。保護フィルム１５は、マスク本体１０の感光剤２０に面する側、ここでは下面に設けられ、光拡散機能、ここではＵＶ光の拡散機能を有する。   In FIG. 1, the exposure mask 1 includes a mask body 10 and a protective film 15. The protective film 15 is provided on the side of the mask body 10 facing the photosensitive agent 20, that is, the lower surface here, and has a light diffusion function, here, a UV light diffusion function.

光拡散機能を有する保護フィルム１５を持つ露光用マスク１を使用することにより、万一、ＵＶ光の通過域に微小な異物が存在していた場合であっても、保護フィルム１５内で拡散したＵＶ光が異物の下側に位置する感光剤２０にも届くことにより、異物による影は異物のサイズよりも十分に小さな無視できる大きさとなり、感光剤２０に結像することは無い。なお、保護フィルム１５の厚さを従来の保護フィルムの厚さより大きくすることで異物の下側にＵＶ光が届き易くなり、光拡散効果を増大させることができる。   By using the exposure mask 1 having the protective film 15 having a light diffusing function, even if a minute foreign matter is present in the UV light passage region, it diffuses in the protective film 15. When the UV light reaches the photosensitive agent 20 positioned below the foreign matter, the shadow due to the foreign matter becomes a negligible size sufficiently smaller than the size of the foreign matter and does not form an image on the photosensitive agent 20. In addition, by making the thickness of the protective film 15 larger than the thickness of the conventional protective film, the UV light can easily reach the lower side of the foreign matter, and the light diffusion effect can be increased.

なお、図１、図３では、便宜上、保護フィルムと感光剤との間にスペースが存在するように描いているが、密着露光の場合、実際にはスペースはほとんど無い。一方、ギャップ露光の場合は保護フィルムと感光剤との間に数十μｍ程度のスペースがある。   In FIG. 1 and FIG. 3, for the sake of convenience, the space is drawn between the protective film and the photosensitive agent. However, in the case of contact exposure, there is actually little space. On the other hand, in the case of gap exposure, there is a space of about several tens of μm between the protective film and the photosensitive agent.

上記のような光拡散機能を有する保護フィルム１５による異物の結像防止効果の一例は以下の通りである。   An example of the foreign matter image formation preventing effect by the protective film 15 having the light diffusion function as described above is as follows.

図３で説明したような光拡散機能を持たない保護フィルムの場合、異物のサイズが例えば３０μｍ程度より小さければその影が感光剤に結像することは無いが、３０μｍ程度を超えると影が感光剤に結像する。   In the case of the protective film having no light diffusion function as described in FIG. 3, if the size of the foreign material is smaller than about 30 μm, for example, the shadow will not form an image on the photosensitive agent. Imaging on the agent.

これに対し、本形態のような光拡散機能を有する保護フィルム１５を使用した場合、上記と同様、異物のサイズが３０μｍ程度より小さければその影が感光剤に結像することは無い。そして、異物のサイズが４０μｍ程度までは光拡散機能により異物の影が感光剤に結像することを防止できる。   On the other hand, when the protective film 15 having the light diffusion function as in the present embodiment is used, if the size of the foreign matter is smaller than about 30 μm, the shadow does not form an image on the photosensitive agent. Further, when the size of the foreign matter is up to about 40 μm, the light diffusion function can prevent the shadow of the foreign matter from being imaged on the photosensitive agent.

なお、図１では図示を省略しているが、保護フィルム１５におけるマスク本体１０側の面にはマスク本体１０へ貼り合わせるための粘着剤層あるいは接着剤層が設けられ、保護フィルム１５における感光剤２０側の面には感光剤２０からの剥離を容易にするための離型層が設けられる。つまり、保護フィルム１５の一方の面に粘着剤層あるいは接着剤層と剥離紙とが積層され、他方の面には離型剤が塗布される。   Although not shown in FIG. 1, an adhesive layer or an adhesive layer for bonding to the mask main body 10 is provided on the surface of the protective film 15 on the mask main body 10 side, and the photosensitive agent in the protective film 15 is provided. A release layer for facilitating peeling from the photosensitive agent 20 is provided on the surface on the 20 side. That is, the pressure-sensitive adhesive layer or adhesive layer and the release paper are laminated on one surface of the protective film 15, and the release agent is applied to the other surface.

次に、上記の光拡散機能を有する保護フィルムを実現するための幾つかの例を説明する。   Next, some examples for realizing the protective film having the light diffusion function will be described.

光拡散機能を有する保護フィルムの最も簡単な例は、すりガラスで実現することができる。   The simplest example of a protective film having a light diffusing function can be realized with ground glass.

光拡散機能を有する保護フィルムの第２の例は、透明樹脂に光拡散機能を付与するための微粒子を分散させることで実現される。透明樹脂材料としては、ＵＶ光の透過率の高い材料、例えばアクリル樹脂、エポキシ樹脂、ポリエステル樹脂、シリコーン樹脂、ポリイミド樹脂、ポリエチレン（ＰＥ）、ポリプロピレン（ＰＰ）、ポリエチレンテレフタレート（ＰＥＴ）等を使用することができる。一方、光拡散機能を付与するための微粒子としては、その結晶が光学的等方性を有する材料、特に非晶質材料、例えばシリカ、ポリ４フッ化エチレン、ポリエーテルサルフォン、ポリイミド、ポリジビニルベンゼン等を使用することができる。あるいはまた、上記の各微粒子材料は表面処理が施されたものであっても良く、形状も任意形状で良い。   The 2nd example of the protective film which has a light-diffusion function is implement | achieved by disperse | distributing the microparticles | fine-particles for providing a light-diffusion function to transparent resin. As the transparent resin material, a material having a high UV light transmittance, for example, an acrylic resin, an epoxy resin, a polyester resin, a silicone resin, a polyimide resin, polyethylene (PE), polypropylene (PP), polyethylene terephthalate (PET), or the like is used. be able to. On the other hand, fine particles for imparting a light diffusion function include materials whose crystals are optically isotropic, particularly amorphous materials such as silica, polytetrafluoroethylene, polyethersulfone, polyimide, and polydivinyl. Benzene and the like can be used. Alternatively, each fine particle material described above may be subjected to surface treatment, and the shape may be arbitrary.

上記第２の例の変形例として、ＵＶ光の透過率の高い透明樹脂にメタクリル系樹脂を使用し、微粒子として平均粒径０．１〜２０μｍ以下の無機微粒子、例えば酸化チタンあるいは硫酸バリウム等を分散させることで保護フィルムが実現される。   As a modification of the second example, a methacrylic resin is used as a transparent resin having a high UV light transmittance, and inorganic fine particles having an average particle size of 0.1 to 20 μm or less, such as titanium oxide or barium sulfate, are used as fine particles. A protective film is realized by dispersing.

上記第２の例及びその変形例の場合、保護フィルム１５は、例えばスピンコーティング法、つまり溶剤とともに上記微粒子を分散させた樹脂材料を回転体に滴下させてフィルムを得るようにして作製される。また、保護フィルム１５を粘着剤層あるいは接着剤層と剥離紙との積層体によりマスク本体１０から取り外し可能にしているが、マスク本体１０に一体化するように形成されても良い。この場合、溶剤とともに上記微粒子を分散させた樹脂材料を、ロールコーティング法、バーコーティング法、スプレーコーティング法、エアナイフコーティング法、ディップコーティング法等の公知の方法によりマスク本体１０に塗布、乾燥、硬化させる。   In the case of the second example and the modification thereof, the protective film 15 is produced by, for example, spin coating, that is, a resin material in which the fine particles are dispersed together with a solvent is dropped onto a rotating body to obtain a film. Further, although the protective film 15 is removable from the mask body 10 by a laminate of an adhesive layer or an adhesive layer and release paper, it may be formed so as to be integrated with the mask body 10. In this case, the resin material in which the fine particles are dispersed together with the solvent is applied to the mask body 10 by a known method such as a roll coating method, a bar coating method, a spray coating method, an air knife coating method, or a dip coating method, and is dried and cured. .

なお、ＵＶ光は、ＵＶランプ等の光源からの光をミラー等の光学系を通して平行光成分のみを取り出すため実質上平行光であるが、保護フィルム１５の光散乱機能により、前述したサイズよりも小さい異物であれば、その下側にＵＶ光が入り込んで影の結像を小さくする。一方、この光拡散機能によれば、露光用マスク１のパターンで規定される結像の幅や長さに影響が出るが、この影響はあらかじめ知ることができるので、露光用マスク１のパターン設計時に、幅や長さについてこの影響を考慮したパターン設計が行われることは言うまでも無い。   The UV light is substantially parallel light because light from a light source such as a UV lamp is extracted only through a parallel light component through an optical system such as a mirror. However, the light scattering function of the protective film 15 causes the light to exceed the size described above. If it is a small foreign substance, UV light will enter underneath it to make the shadow image smaller. On the other hand, this light diffusion function affects the width and length of image formation defined by the pattern of the exposure mask 1, but this influence can be known in advance, so the pattern design of the exposure mask 1 Of course, it is needless to say that pattern design is performed in consideration of this influence on the width and length.

いずれにしても、マスク本体１０の厚さのサイズは１７５μｍ程度であり、保護フィルム１５の厚さのサイズは８〜２０μｍ程度が好ましい。   In any case, the thickness of the mask body 10 is preferably about 175 μm, and the thickness of the protective film 15 is preferably about 8 to 20 μm.

上述した保護フィルムの構成材料やサイズは一例にすぎず、特に微粒子は光拡散機能を付与することができる材料であれば周知の如何なる材料が用いられても良い。   The constituent materials and sizes of the protective film described above are merely examples, and any known material may be used as long as the fine particles can impart a light diffusion function.

本発明は、密着露光もしくはギャップ露光用であればどのような形式の露光方法及び露光用マスクにも適用可能である。   The present invention can be applied to any type of exposure method and exposure mask as long as it is for contact exposure or gap exposure.

本発明による露光用マスクの好ましい実施の形態を説明するための断面図である。It is sectional drawing for demonstrating preferable embodiment of the mask for exposure by this invention. 本発明が適用されるプリント配線板の製造工程を一部を説明するための図である。It is a figure for demonstrating a part of manufacturing process of the printed wiring board to which this invention is applied. 従来の露光用マスクを説明するための断面図である。It is sectional drawing for demonstrating the conventional mask for exposure.

符号の説明Explanation of symbols

１ 露光用マスク
１０、４０ マスク本体
１５、４１ 保護フィルム
２０、３３、４２ 感光剤
３０ 基材
３１ コア層
３２ 導体パターン層
３４ フォトマスク DESCRIPTION OF SYMBOLS 1 Exposure mask 10, 40 Mask main body 15, 41 Protective film 20, 33, 42 Photosensitive agent 30 Base material 31 Core layer 32 Conductive pattern layer 34 Photomask

Claims (6)

所定のパターンを持つ露光用のマスクを通して感光剤に露光を行うに際し、マスクと感光剤との間に光拡散機能を持つ部材を介在させることを特徴とする露光方法。   An exposure method characterized by interposing a member having a light diffusion function between a mask and a photosensitive agent when exposing the photosensitive agent through an exposure mask having a predetermined pattern. 前記光拡散機能を持つ部材として、すりガラス、または透明樹脂に、光拡散機能を付与するための微粒子を分散させた部材を用いることを特徴とする請求項１に記載の露光方法。   2. The exposure method according to claim 1, wherein the member having the light diffusion function uses a member in which fine particles for imparting a light diffusion function are dispersed in ground glass or a transparent resin. 露光用のマスクにおけるマスク本体の感光剤側の面に保護フィルムを設け、該保護フィルムに光拡散機能を持たせたことを特徴とする露光用マスク。   An exposure mask comprising a protective film provided on a surface of the mask body of the exposure mask on the side of the photosensitive agent, and the protective film having a light diffusion function. 前記保護フィルムとして、すりガラス、または透明樹脂に、光拡散機能を付与するための微粒子を分散させたフィルムを用いることを特徴とする請求項３に記載の露光用マスク。   The exposure mask according to claim 3, wherein a film in which fine particles for imparting a light diffusing function are dispersed in ground glass or a transparent resin is used as the protective film. 露光用のマスクにおける感光剤側の面に設けられる保護フィルムであって、光拡散機能を持たせたことを特徴とする保護フィルム。   A protective film provided on a surface on the photosensitive agent side of an exposure mask, which has a light diffusion function. すりガラス、または透明樹脂に、光拡散機能を付与するための微粒子を分散させたフィルムから成ることを特徴とする請求項５に記載の保護フィルム。
The protective film according to claim 5, comprising a film in which fine particles for imparting a light diffusion function are dispersed in ground glass or a transparent resin.
JP2005139878A 2005-05-12 2005-05-12 Exposure method, exposure mask, and protecting film for mask Pending JP2006317693A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009004777A (en) * 2007-06-19 2009-01-08 Asml Netherlands Bv Lithography device with portion whereto coated film is attached

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0456189A (en) * 1990-06-21 1992-02-24 Mitsubishi Electric Corp Manufacture of printed-wiring board
JPH05191015A (en) * 1992-01-17 1993-07-30 Hitachi Chem Co Ltd Manufacture of printed wiring board and jig used therein
JPH0619106A (en) * 1992-07-01 1994-01-28 Toppan Printing Co Ltd Image exposure method and image exposure device
JP2003066615A (en) * 2001-08-30 2003-03-05 Nec Toppan Circuit Solutions Inc Method for patternwise exposure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0456189A (en) * 1990-06-21 1992-02-24 Mitsubishi Electric Corp Manufacture of printed-wiring board
JPH05191015A (en) * 1992-01-17 1993-07-30 Hitachi Chem Co Ltd Manufacture of printed wiring board and jig used therein
JPH0619106A (en) * 1992-07-01 1994-01-28 Toppan Printing Co Ltd Image exposure method and image exposure device
JP2003066615A (en) * 2001-08-30 2003-03-05 Nec Toppan Circuit Solutions Inc Method for patternwise exposure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009004777A (en) * 2007-06-19 2009-01-08 Asml Netherlands Bv Lithography device with portion whereto coated film is attached
JP2011146738A (en) * 2007-06-19 2011-07-28 Asml Netherlands Bv Lithography device with portion whereto coated film is attached

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