TWM521864U - Rigid-flex circuit board - Google Patents
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- TWM521864U TWM521864U TW104219242U TW104219242U TWM521864U TW M521864 U TWM521864 U TW M521864U TW 104219242 U TW104219242 U TW 104219242U TW 104219242 U TW104219242 U TW 104219242U TW M521864 U TWM521864 U TW M521864U
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Description
本新型創作是有關於一種線路板，且特別是有關於一種軟硬複合線路板。The present invention relates to a circuit board, and in particular to a soft and hard composite circuit board.
就介電層的軟硬性質不同，線路板包括硬性線路板（簡稱硬板）、軟性線路板（簡稱軟板）及軟硬複合線路板（簡稱軟硬板）。一般而言，軟硬板是由軟性線路板以及硬性線路板所組合而成的印刷線路板，其兼具有軟性線路板的可撓性以及硬性線路板的強度。在電子產品的內部空間急遽壓縮的情況下，由於軟硬板提供了零件連接與組裝空間的最大彈性，所以電子產品經常採用軟硬板作為其零件載具。As for the soft and hard properties of the dielectric layer, the circuit board includes a rigid circuit board (referred to as a hard board), a flexible circuit board (referred to as a soft board), and a soft and hard composite circuit board (referred to as a soft and hard board). In general, a soft and hard board is a printed wiring board composed of a flexible circuit board and a rigid wiring board, and has both the flexibility of a flexible wiring board and the strength of a rigid wiring board. In the case of the rapid compression of the internal space of the electronic product, since the soft and hard board provides the maximum flexibility of the parts connection and assembly space, the electronic product often uses the soft and hard board as its part carrier.
在製作方法上，軟硬板是先以具有線路的軟板為核心層，再透過機械撈型（routing）的方式於硬板上形成開槽，之後再將上下兩硬板與軟板壓合在一起，以使硬板的開槽暴露軟板的外露區而形成軟硬複合板。然而，機械撈型的方式不僅生產效率較低且成本也高，甚者，在透過機械撈型的方式形成開槽的製程中會形成廢屑，這些廢屑在之後硬板與軟板壓合時會對軟板造成傷害。再者，在壓合軟硬板的過程中，硬板的半固化膠片易因受壓而變形，導致部分膠材溢入開槽之中而覆蓋住軟板的外露區。如此，由於外露區的面積被溢膠覆蓋而縮小，因而使軟板的可撓性明顯下降。此外，在壓合過程中，覆蓋於外露區的膠材不易被清除，且容易產生溢膠的問題。並且，將軟板及硬板壓合的過程也容易產生對位誤差，因而影響後續製程的良率In the manufacturing method, the soft and hard board is first made of a soft board having a line as a core layer, and then formed into a slot on the hard board by means of mechanical routing, and then the upper and lower hard boards are pressed against the soft board. Together, the hard plate is exposed to expose the exposed area of the soft board to form a soft and hard composite board. However, the method of mechanical fishing is not only low in production efficiency but also high in cost. In addition, waste is formed in the process of forming a groove through the mechanical fishing type, and the waste is pressed into the soft plate after the hard plate. It will cause damage to the soft board. Moreover, in the process of pressing the soft and hard board, the semi-cured film of the hard board is easily deformed by the pressure, so that some of the glue overflows into the slot to cover the exposed area of the soft board. Thus, since the area of the exposed area is shrunk by the overflow of the glue, the flexibility of the soft board is remarkably lowered. In addition, during the pressing process, the rubber covering the exposed area is not easily removed, and the problem of overflowing is easily generated. Moreover, the process of pressing the soft board and the hard board is also prone to the alignment error, thus affecting the yield of the subsequent process.
本新型創作提供一種軟硬複合線路板，其可有效提升軟硬複合線路板的製程效率以及製程良率。The novel creation provides a soft and hard composite circuit board, which can effectively improve the process efficiency and process yield of the soft and hard composite circuit board.
本新型創作的軟硬複合線路板包括一可撓性線路板、多個圖案化感光顯影基材及多個圖案化線路層。可撓性線路板包括多個暴露區、一上表面以及相對上表面的一下表面。暴露區分別位於上表面及下表面。圖案化感光顯影基材分別設置於可撓性基板的上表面及下表面。各圖案化感光顯影基材包括一開口。開口分別暴露暴露區，且各圖案化感光顯影基材的材料包括光敏感材料。圖案化線路層分別設置於圖案化感光顯影基材上，並分別暴露此暴露區。The soft and hard composite circuit board created by the present invention comprises a flexible circuit board, a plurality of patterned photosensitive developing substrates and a plurality of patterned circuit layers. The flexible circuit board includes a plurality of exposed regions, an upper surface, and a lower surface opposite the upper surface. The exposed areas are located on the upper surface and the lower surface, respectively. The patterned photosensitive developing substrates are respectively disposed on the upper surface and the lower surface of the flexible substrate. Each of the patterned photosensitive developing substrates includes an opening. The openings respectively expose the exposed regions, and the materials of each of the patterned photosensitive developing substrates include light sensitive materials. The patterned wiring layers are respectively disposed on the patterned photosensitive developing substrate and respectively expose the exposed regions.
在本新型創作的一實施例中，上述的可撓性線路板包括一可撓性基材以及一圖案化金屬層。圖案化金屬層設置於可撓性基材的相對兩表面。In an embodiment of the present invention, the flexible circuit board includes a flexible substrate and a patterned metal layer. The patterned metal layer is disposed on opposite surfaces of the flexible substrate.
在本新型創作的一實施例中，上述的可撓性線路板更包括多個第一導通孔，設置於可撓性基材上。第一導通孔電性連接圖案化金屬層，並電性連接可撓性基材的相對兩表面。In an embodiment of the present invention, the flexible circuit board further includes a plurality of first conductive vias disposed on the flexible substrate. The first via hole is electrically connected to the patterned metal layer and electrically connected to opposite surfaces of the flexible substrate.
在本新型創作的一實施例中，上述的各第一導通孔包括導通貫孔、盲孔或埋孔。In an embodiment of the present invention, each of the first via holes includes a through hole, a blind hole or a buried hole.
在本新型創作的一實施例中，上述的圖案化感光顯影基材更包括多個第二導通孔。第二導通孔電性連接圖案化線路層以及圖案化金屬層。In an embodiment of the present invention, the patterned photosensitive developing substrate further includes a plurality of second via holes. The second via is electrically connected to the patterned circuit layer and the patterned metal layer.
在本新型創作的一實施例中，上述的各第二導通孔包括導通貫孔、盲孔或埋孔。In an embodiment of the present invention, each of the second via holes includes a through hole, a blind hole or a buried hole.
在本新型創作的一實施例中，上述的可撓性線路板更包括一保護層，覆蓋可撓性基板以及圖案化金屬層。In an embodiment of the present invention, the flexible circuit board further includes a protective layer covering the flexible substrate and the patterned metal layer.
在本新型創作的一實施例中，上述的軟硬複合線路板更包括多個感光防焊層，分別設置於對應的圖案化線路層以及對應的圖案化感光顯影基材上。各感光防焊層包括一防焊層開口，且其內壁與各開口的一內壁對齊。In an embodiment of the present invention, the soft and hard composite circuit board further includes a plurality of photosensitive solder resist layers respectively disposed on the corresponding patterned circuit layers and the corresponding patterned photosensitive developing substrates. Each of the photosensitive solder resist layers includes a solder resist opening and its inner wall is aligned with an inner wall of each opening.
在本新型創作的一實施例中，上述的感光防焊層包括液態感光（liquid photo-imageable, LPI）防焊層，其暴露暴露區以及至少部分圖案化線路層。In an embodiment of the present invention, the photosensitive solder resist layer comprises a liquid photo-imageable (LPI) solder mask that exposes the exposed regions and at least partially patterned circuit layers.
在本新型創作的一實施例中，上述的軟硬複合線路板更包括多個對位孔，設置於疊構層的一周緣。In an embodiment of the present invention, the soft and hard composite circuit board further includes a plurality of alignment holes disposed at a peripheral edge of the stacked layer.
基於上述，本新型創作的軟硬複合線路板是先將感光顯影基材覆蓋於可撓性線路板上，再利用感光顯影基材的光敏感特性對感光顯影基材的一移除區進行一曝光顯影製程，以移除此移除區而暴露下方的可撓性線路板。如此，即可輕易形成軟硬複合線路板的結構，因此，本新型創作確實可提升軟硬複合線路板的製程效率。並且，本新型創作可避免習知的製程所產生的廢屑對可撓性線路板所造成的傷害，更可避免軟硬板壓合時所產生的溢膠及難以對位的問題。因此，本新型創作亦可提升軟硬複合線路板的製程良率。Based on the above, the soft and hard composite circuit board created by the present invention first covers the photosensitive developing substrate on the flexible circuit board, and then uses a light sensitive property of the photosensitive developing substrate to perform a removal region of the photosensitive developing substrate. The development process is exposed to remove the removed area to expose the underlying flexible circuit board. In this way, the structure of the soft and hard composite circuit board can be easily formed, and therefore, the novel creation can improve the process efficiency of the soft and hard composite circuit board. Moreover, the novel creation can avoid the damage caused by the waste generated by the conventional process to the flexible circuit board, and can avoid the problem of overflowing and hard alignment caused by the pressing of the soft and hard plates. Therefore, the novel creation can also improve the process yield of the soft and hard composite circuit board.
為讓本新型創作的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will become more apparent and understood from the following description.
有關本新型創作之前述及其他技術內容、特點與功效，在以下配合參考圖式之各實施例的詳細說明中，將可清楚的呈現。以下實施例中所提到的方向用語，例如：「上」、「下」、「前」、「後」、「左」、「右」等，僅是參考附加圖式的方向。因此，使用的方向用語是用來說明，而並非用來限制本新型創作。並且，在下列各實施例中，相同或相似的元件將採用相同或相似的標號。The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the embodiments. The directional terms mentioned in the following embodiments, such as "upper", "lower", "front", "back", "left", "right", etc., are only directions referring to the additional schema. Therefore, the directional terminology used is for illustrative purposes and is not intended to limit the novel creation. Also, in the following embodiments, the same or similar elements will be given the same or similar reference numerals.
圖1A至圖1K是依照本新型創作的一實施例的一種軟硬複合線路板的製作方法的流程剖面示意圖。本實施例的軟硬複合線路板的製作方法包括下列步驟。首先，請參照圖1A至圖1E，提供如圖1E所示的一可撓性線路板110，其中，可撓性線路板110包括一可撓性基材112以及一圖案化金屬層116、多個暴露區A1、一上表面S1以及相對上表面S1的一下表面S2，而上述的多個暴露區A1即分別位於可撓性線路板110的上表面S1及下表面S2，圖案化金屬層116則電性連接可撓性基材112的相對兩表面。1A-1K are schematic cross-sectional views showing a method of fabricating a soft and hard composite circuit board according to an embodiment of the present invention. The manufacturing method of the soft and hard composite circuit board of this embodiment includes the following steps. First, referring to FIG. 1A to FIG. 1E, a flexible circuit board 110 as shown in FIG. 1E is provided. The flexible circuit board 110 includes a flexible substrate 112 and a patterned metal layer 116. The exposed area A1, an upper surface S1 and a lower surface S2 of the upper surface S1, and the plurality of exposed areas A1 are respectively located on the upper surface S1 and the lower surface S2 of the flexible wiring board 110, and the patterned metal layer 116 Then, the opposite surfaces of the flexible substrate 112 are electrically connected.
具體而言，提供可撓性線路板110的方法可包括下列步驟。首先，請參照圖1A，提供前述的可撓性基材112。接著，請參照圖1B，可例如各壓合一金屬箔層116a於可撓性基材112的相對兩表面。之後，請再參照圖1C，形成多個第一開孔114a於可撓性基材112上，且各第一開孔114a如圖1C所示分別連通可撓性基材112的相對兩表面。之後，請參照圖1D，再進行一電鍍製程以形成一金屬鍍層116b，此金屬鍍層116b覆蓋可撓性基材112的相對兩表面及第一開孔114a的內壁。接著，再對此金屬鍍層116b進行一蝕刻製程，以形成如圖1E所示的圖案化金屬層116以及多個第一導通孔114，其中，圖案化金屬層116設置於可撓性基材112的相對兩表面。在本實施例中，第一導通孔114可為導通貫孔(Plating Through Hole, PTH)、盲孔(Blind Via Hole, BVH)或埋孔(Buried Via Hole, BVH)，本新型創作並不限制第一導通孔114的形式。Specifically, the method of providing the flexible wiring board 110 may include the following steps. First, referring to FIG. 1A, the aforementioned flexible substrate 112 is provided. Next, referring to FIG. 1B, a metal foil layer 116a may be laminated to the opposite surfaces of the flexible substrate 112, for example. Thereafter, referring to FIG. 1C, a plurality of first openings 114a are formed on the flexible substrate 112, and each of the first openings 114a communicates with opposite surfaces of the flexible substrate 112 as shown in FIG. 1C. Thereafter, referring to FIG. 1D, an electroplating process is performed to form a metal plating layer 116b covering the opposite surfaces of the flexible substrate 112 and the inner wall of the first opening 114a. Then, the metal plating layer 116b is subjected to an etching process to form the patterned metal layer 116 and the plurality of first via holes 114 as shown in FIG. 1E, wherein the patterned metal layer 116 is disposed on the flexible substrate 112. The opposite two surfaces. In this embodiment, the first via hole 114 may be a through hole (PTH), a blind hole (BVH), or a buried hole (BVH). The form of the first via hole 114.
並且，本實施例更可於可撓性基材112以及圖案化金屬層116上形成一保護層（coverlay, CVL）118，以覆蓋圖案化金屬層116並保護圖案化金屬層116免於受到氧化或是外界污染的影響。在本實施例中，形成保護層118的方法例如塗佈或是乾膜貼附。保護層118的材料可包括聚醯亞胺與壓克力膠，以使保護層118具有黏性且具有可撓曲性。當然，本實施例僅用以說明，本新型創作並不限制於保護層118的材料與種類。Moreover, the present embodiment further forms a coverlay (CVL) 118 on the flexible substrate 112 and the patterned metal layer 116 to cover the patterned metal layer 116 and protect the patterned metal layer 116 from oxidation. Or the impact of external pollution. In the present embodiment, the method of forming the protective layer 118 is, for example, coating or dry film attachment. The material of the protective layer 118 may include polyimide and acrylic to make the protective layer 118 viscous and flexible. Of course, this embodiment is for illustrative purposes only, and the novel creation is not limited to the material and type of the protective layer 118.
請參照圖1F至圖1H，接著，可各設置如圖1H所示一疊構層120於可撓性基板110的上表面S1及下表面S2，其中，各疊構層120可包括一感光顯影（photo-imageable）基材122a以及一金屬層124a。各個感光顯影基材122a位於可撓性基板110與對應的金屬層124a之間，其中，感光顯影基材122a包括光敏感材料。在本實施例中，感光顯影基材122a可為正光阻或是負光阻，若感光顯影基材122a為負光阻，則感光顯影基材122a經曝光後會固化而無法溶於顯影液中，相反地，若感光顯影基材122a為正光阻，則感光顯影基材122a經曝光後會產生裂解而極易溶於顯影液中。Referring to FIG. 1F to FIG. 1H, a stack of layers 120 as shown in FIG. 1H may be disposed on the upper surface S1 and the lower surface S2 of the flexible substrate 110, wherein each of the stacked layers 120 may include a photosensitive development. A substrate 122a and a metal layer 124a are photo-imageable. Each of the photosensitive developing substrates 122a is located between the flexible substrate 110 and the corresponding metal layer 124a, wherein the photosensitive developing substrate 122a includes a light sensitive material. In the embodiment, the photosensitive developing substrate 122a may be a positive photoresist or a negative photoresist. If the photosensitive developing substrate 122a is a negative photoresist, the photosensitive developing substrate 122a is cured after exposure and cannot be dissolved in the developing solution. On the contrary, if the photosensitive developing substrate 122a is a positive photoresist, the photosensitive developing substrate 122a is cracked after being exposed and is extremely soluble in the developing solution.
詳細而言，形成如圖1H所示的疊構層120的方法可包括下列步驟。首先，各設置如圖1F所示感光顯影基材122a於可撓性基板110的上表面S1及下表面S2，接著，對各個感光顯影基材122a進行一盲孔曝光顯影製程，以形成如圖1G所示的多個第二開孔126a於各感光顯影基材122a上。也就是說，本實施例係利用感光顯影基材122a的正光阻或是負光阻的特性來透過曝光顯影形成第二開孔126a。此外，前述的保護層118可具有對應此第二開孔126a的開口，以對應暴露下方的圖案化金屬層116。接著，對感光顯影基材122a進行一電鍍製程，以形成如圖1H所示的各金屬層124a於各感光顯影基材122a上，且金屬層124a分別覆蓋第二開孔126a的一內壁而形成多個第二導通孔126。如此，第二導通孔126電性連接金屬層124a並與可撓性線路板110的圖案化金屬層116形成電性連接。在本實施例中，第二導通孔126可為導通貫孔(Plating Through Hole, PTH)、盲孔(Blind Via Hole, BVH)或埋孔(Buried Via Hole, BVH)，本新型創作並不限制第二導通孔126的形式。In detail, the method of forming the stacked layer 120 as shown in FIG. 1H may include the following steps. First, the photosensitive developing substrate 122a is disposed on the upper surface S1 and the lower surface S2 of the flexible substrate 110 as shown in FIG. 1F, and then a blind hole exposure developing process is performed on each of the photosensitive developing substrates 122a to form a pattern. A plurality of second openings 126a shown in 1G are on the respective photosensitive developing substrates 122a. That is, in the present embodiment, the second opening 126a is formed by exposure development using the characteristics of the positive or negative photoresist of the photosensitive developing substrate 122a. In addition, the foregoing protective layer 118 may have an opening corresponding to the second opening 126a to correspondingly expose the underlying patterned metal layer 116. Next, an electroplating process is performed on the photosensitive developing substrate 122a to form respective metal layers 124a as shown in FIG. 1H on the respective photosensitive developing substrates 122a, and the metal layers 124a respectively cover an inner wall of the second opening 126a. A plurality of second via holes 126 are formed. As such, the second via 126 is electrically connected to the metal layer 124 a and electrically connected to the patterned metal layer 116 of the flexible wiring board 110 . In this embodiment, the second via hole 126 may be a through hole (PTH), a blind hole (BVH), or a buried hole (BVH). The form of the second via 126.
接著，對如圖1H所示的金屬層124a進行一圖案化製程，以形成如圖1I所示的多個圖案化線路層124，並且，圖案化線路層124分別暴露上述的暴露區A1。詳細而言，上述的圖案化製程可包括下列步驟。首先，各形成一圖案化乾膜層於金屬層124a上，其中各圖案化乾膜層暴露部分的金屬層124a。接著，進行一蝕刻製程以移除被圖案化乾膜層所暴露的部分金屬層124a而形成如圖1I所示的圖案化線路層124。如此，第二導通孔126即可電性連接圖案化線路層124與可撓性線路板110的圖案化金屬層116。Next, a patterning process is performed on the metal layer 124a as shown in FIG. 1H to form a plurality of patterned wiring layers 124 as shown in FIG. 1I, and the patterned wiring layer 124 exposes the exposed regions A1, respectively. In detail, the above-described patterning process may include the following steps. First, a patterned dry film layer is formed on each of the metal layers 124a, wherein each of the patterned dry film layers exposes a portion of the metal layer 124a. Next, an etching process is performed to remove a portion of the metal layer 124a exposed by the patterned dry film layer to form the patterned wiring layer 124 as shown in FIG. As such, the second via 126 can electrically connect the patterned wiring layer 124 and the patterned metal layer 116 of the flexible wiring board 110.
接著，可利用感光顯影基材122a的光敏感特性對感光顯影基材122a進行如圖1J所示的一曝光顯影製程，以形成如圖1K所示的多個圖案化基材122，其中，各圖案化基材122包括一開口OP，且開口OP分別暴露可撓性線路板110的暴露區A1。如此，軟硬複合線路板100的製作方法即大致完成。Then, the photosensitive developing substrate 122a can be subjected to an exposure and development process as shown in FIG. 1J by using the light sensitive property of the photosensitive developing substrate 122a to form a plurality of patterned substrates 122 as shown in FIG. 1K, wherein each The patterned substrate 122 includes an opening OP, and the opening OP exposes the exposed area A1 of the flexible wiring board 110, respectively. Thus, the manufacturing method of the soft and hard composite wiring board 100 is substantially completed.
就結構而言，依上述製作方法所形成的軟硬複合線路板100包括可撓性線路板110、多個圖案化感光顯影基材122及多個圖案化線路層124。可撓性線路板110包括多個暴露區A1、一上表面S1以及相對上表面S1的一下表面S2。暴露區A1分別位於上表面S1及下表面S1。圖案化感光顯影基材122分別設置於可撓性基板110的上表面S1及下表面S2。各圖案化感光顯影基材122包括一開口OP。開口OP分別暴露上述的暴露區A1，且各圖案化感光顯影基材122的材料包括光敏感材料。圖案化線路層124分別設置於圖案化感光顯影基材122上，並分別暴露此暴露區A1。In terms of structure, the soft and hard composite wiring board 100 formed by the above manufacturing method includes a flexible wiring board 110, a plurality of patterned photosensitive developing substrates 122, and a plurality of patterned wiring layers 124. The flexible wiring board 110 includes a plurality of exposed areas A1, an upper surface S1, and a lower surface S2 opposite to the upper surface S1. The exposed areas A1 are located on the upper surface S1 and the lower surface S1, respectively. The patterned photosensitive developing substrates 122 are respectively disposed on the upper surface S1 and the lower surface S2 of the flexible substrate 110. Each of the patterned photosensitive developing substrates 122 includes an opening OP. The openings OP respectively expose the exposed regions A1 described above, and the materials of the patterned photosensitive developing substrates 122 include light sensitive materials. The patterned wiring layers 124 are respectively disposed on the patterned photosensitive developing substrate 122 and respectively expose the exposed regions A1.
詳細來說，在本實施例中，前述的感光顯影基材122a為負光阻，也就是說，感光顯影基材122a經曝光後會固化而無法溶於顯影液中。如此，前述的曝光顯影製程可包括下列步驟。首先，如圖1J所示之各形成一圖案化乾膜層130於各個感光顯影基材122a上，其中，各圖案化乾膜層130覆蓋各感光顯影基材122a的一移除區R1。在本實施例中，移除區R1為暴露區A1在感光顯影基材122a上的一正投影區域。之後，再進行例如紫外線的曝光製程，以對未被圖案化乾膜層130所覆蓋的部分感光顯影基材122a進行曝光。也就是說，感光顯影基材122a中除了移除區R1以外的區域會受到紫外光的照射而產生質變，使感光顯影基材122a中除了移除區R1以外的區域固化而變成無法溶於顯影液中。之後，再進行一顯影製程，由於移除區R1被圖案化乾膜層130所覆蓋而未受到紫外光照射，故移除區R1會溶於顯影製程中的顯影液，因而可移除被圖案化乾膜層130所覆蓋的移除區R1而形成如圖1K所示的具有開口OP的圖案化基材122。In detail, in the present embodiment, the aforementioned photosensitive developing substrate 122a is a negative photoresist, that is, the photosensitive developing substrate 122a is cured after exposure and is insoluble in the developing solution. As such, the aforementioned exposure development process can include the following steps. First, a patterned dry film layer 130 is formed on each photosensitive developing substrate 122a as shown in FIG. 1J, wherein each patterned dry film layer 130 covers a removed region R1 of each photosensitive developing substrate 122a. In the present embodiment, the removal region R1 is an orthographic projection area of the exposed region A1 on the photosensitive developing substrate 122a. Thereafter, an exposure process such as ultraviolet light is further performed to expose a portion of the photosensitive developing substrate 122a not covered by the patterned dry film layer 130. That is, the region other than the removal region R1 in the photosensitive developing substrate 122a is subjected to ultraviolet light to cause a qualitative change, and the region other than the removal region R1 in the photosensitive developing substrate 122a is cured to become insoluble in development. In the liquid. Thereafter, a developing process is further performed. Since the removal region R1 is covered by the patterned dry film layer 130 and is not irradiated with ultraviolet light, the removal region R1 is dissolved in the developing solution in the developing process, thereby removing the patterned pattern. The removal region R1 covered by the dry film layer 130 forms a patterned substrate 122 having an opening OP as shown in FIG. 1K.
圖2是依照本新型創作的另一實施例的一種軟硬複合線路板的製作方法的部分流程剖面示意圖。在此須說明的是，在本實施例中，感光顯影基材122a為正光阻，也就是說，感光顯影基材122a經曝光後會裂解而變成極易溶解於顯影液中。如此，前述的曝光顯影製程可包括下列步驟。如圖2所示之各形成一圖案化乾膜層140於各個感光顯影基材122a上，其中，各圖案化乾膜層140暴露各感光顯影基材122a的移除區R1。之後，再進行例如紫外線的曝光製程，以對感光顯影基材122a的移除區R1進行曝光。也就是說，感光顯影基材122a的移除區R1會受到紫外光的照射而產生質變，使感光顯影基材122a的移除區R1產生裂解而變成極易溶解於顯影液中。之後，再進行一顯影製程，由於移除區R1受到紫外光照射而產生質變，故移除區R1會溶於顯影製程中的顯影液，因而可移除被圖案化乾膜層140所暴露的移除區R1而形成如圖1K所示的具有開口OP的圖案化基材122。2 is a partial cross-sectional view showing a method of fabricating a soft and hard composite circuit board in accordance with another embodiment of the present invention. It should be noted that in the present embodiment, the photosensitive developing substrate 122a is a positive photoresist, that is, the photosensitive developing substrate 122a is cleaved after exposure to become extremely soluble in the developing solution. As such, the aforementioned exposure development process can include the following steps. Each of the patterned dry film layers 140 is formed on each of the photosensitive developing substrates 122a as shown in FIG. 2, wherein each of the patterned dry film layers 140 exposes the removed regions R1 of the respective photosensitive developing substrates 122a. Thereafter, an exposure process such as ultraviolet rays is further performed to expose the removal region R1 of the photosensitive developing substrate 122a. That is, the removal region R1 of the photosensitive developing substrate 122a is subjected to ultraviolet light irradiation to cause a qualitative change, and the removal region R1 of the photosensitive developing substrate 122a is cracked to become extremely soluble in the developing solution. Thereafter, a developing process is further performed. Since the removal region R1 is subjected to ultraviolet light to cause a qualitative change, the removal region R1 is dissolved in the developing solution in the developing process, thereby removing the exposed portion of the patterned dry film layer 140. The region R1 is removed to form a patterned substrate 122 having an opening OP as shown in FIG. 1K.
圖3A至圖3C是依照本新型創作的另一實施例的一種軟硬複合線路板的製作方法的部分流程剖面示意圖。圖3A以及圖3C所示的製作流程可例如接續在圖1I之後執行，也就是說，在形成如圖1I所示的圖案化線路層124之後，可形成如圖3A所示之多個感光防焊層150，其中，感光防焊層150覆蓋圖案化線路層124以及感光顯影基材122a。在本實施例中，感光防焊層150可為液態感光（liquid photo-imageable, LPI）防焊層，並且，感光防焊層150以及感光顯影基材122a皆為正光阻，也就是說，感光防焊層150以及感光顯影基材122a經曝光後皆會裂解而變成極易溶解於顯影液中。3A-3C are partial cross-sectional schematic views showing a method of fabricating a soft and hard composite circuit board according to another embodiment of the present invention. The fabrication flow shown in FIG. 3A and FIG. 3C can be performed, for example, subsequent to FIG. 1I, that is, after forming the patterned wiring layer 124 as shown in FIG. 1I, a plurality of photosensitive images as shown in FIG. 3A can be formed. The solder layer 150, wherein the photosensitive solder resist layer 150 covers the patterned wiring layer 124 and the photosensitive developing substrate 122a. In this embodiment, the photosensitive solder resist layer 150 may be a liquid photo-imageable (LPI) solder resist layer, and the photosensitive solder resist layer 150 and the photosensitive developing substrate 122a are both positive photoresists, that is, photosensitive. The solder resist layer 150 and the photosensitive developing substrate 122a are cracked after exposure to become extremely soluble in the developer.
接著，形成如圖3B所示的圖案化乾膜層160於感光防焊層150上，且圖案化乾膜層160暴露感光顯影基材122a及感光防焊層150的一移除區R2。在本實施例中，移除區R2為可撓性線路板110的暴露區A1在感光顯影基材122a及感光防焊層150上的一正投影區域。之後，再進行曝光製程，以對被暴露的移除區R2內的感光防焊層150進行曝光。如此，移除區R2內的感光防焊層150會產生裂解而變成極易溶解於顯影液中。之後，再進行顯影製程，以移除被圖案化乾膜層160所暴露的移除區R2內的感光防焊層150而形成如圖3C所示的多個圖案化感光防焊層152。接著，在重複上述曝光顯影的製程，對被圖案化乾膜層160及感光防焊層150所暴露的移除區R2的感光顯影基材122a進行曝光及顯影製程，以移除位在移除區R2的感光顯影基材122a，而形成如圖3C所示的具有開口OP的圖案化基材122。如此，感光防焊層150如圖3C所示包括一防焊層開口，且各防焊層開口的一內壁與各開口OP的一內壁對齊。Next, a patterned dry film layer 160 as shown in FIG. 3B is formed on the photosensitive solder resist layer 150, and the patterned dry film layer 160 exposes a removed region R2 of the photosensitive developing substrate 122a and the photosensitive solder resist layer 150. In the present embodiment, the removal region R2 is an orthographic projection area of the exposed area A1 of the flexible wiring board 110 on the photosensitive developing substrate 122a and the photosensitive solder resist layer 150. Thereafter, an exposure process is performed to expose the photosensitive solder resist layer 150 in the exposed removal region R2. Thus, the photosensitive solder resist layer 150 in the removal region R2 is cracked and becomes extremely soluble in the developer. Thereafter, a developing process is performed to remove the photosensitive solder resist layer 150 in the removed region R2 exposed by the patterned dry film layer 160 to form a plurality of patterned photosensitive solder resist layers 152 as shown in FIG. 3C. Then, in the process of repeating the above exposure and development, the photosensitive developing substrate 122a of the removed region R2 exposed by the patterned dry film layer 160 and the photosensitive solder resist layer 150 is subjected to an exposure and development process to remove the removed portion. The photosensitive developing substrate 122a of the region R2 forms a patterned substrate 122 having an opening OP as shown in Fig. 3C. Thus, the photosensitive solder resist layer 150 includes a solder resist opening as shown in FIG. 3C, and an inner wall of each solder resist opening is aligned with an inner wall of each opening OP.
此外，在本實施例中，軟硬複合線路板的製作方法更可包括形成多個對位孔於疊構層120上，且對位孔可例如位於疊構層120的一周緣，以作為軟硬複合線路板100的疊構對位之用。並且，在本實施例中，軟硬複合線路板100僅繪示上下兩個疊構層120，然而，在其他實施例中，軟硬複合線路板更可分別於其上下相對兩側再堆疊多個疊構層，而前述的對位孔即可作為多個疊構層之間的彼此對位之用。In addition, in this embodiment, the method for fabricating the soft and hard composite circuit board may further include forming a plurality of alignment holes on the stacked layer 120, and the alignment holes may be located, for example, at a peripheral edge of the stacked layer 120 to serve as a soft The stacking of the hard composite circuit board 100 is used for alignment. Moreover, in the present embodiment, the soft and hard composite circuit board 100 only shows the upper and lower two layers 120. However, in other embodiments, the soft and hard composite circuit boards can be stacked on the upper and lower sides thereof. The stacked layers, and the aforementioned alignment holes can be used as a mutual alignment between the plurality of stacked layers.
綜上所述，本新型創作的軟硬複合線路板的製作方法是先將感光顯影基材覆蓋於可撓性線路板上，再利用感光顯影基材的光敏感特性對感光顯影基材的一移除區進行一曝光顯影製程，以移除此移除區而暴露下方的可撓性線路板。如此，即可輕易形成軟硬複合線路板的結構，因此，本新型創作確實可提升軟硬複合線路板的製程效率。並且，本新型創作所提出的軟硬複合線路板可避免習知的製程所產生的廢屑對可撓性線路板所造成的傷害，更可避免軟硬板壓合時所產生的溢膠及難以對位的問題。因此，本新型創作可提升軟硬複合線路板的製程良率。In summary, the soft and hard composite circuit board produced by the present invention is prepared by first covering the photosensitive developing substrate on the flexible circuit board, and then using the light sensitive property of the photosensitive developing substrate to the photosensitive developing substrate. The removal zone is subjected to an exposure development process to remove the removal zone to expose the underlying flexible circuit board. In this way, the structure of the soft and hard composite circuit board can be easily formed, and therefore, the novel creation can improve the process efficiency of the soft and hard composite circuit board. Moreover, the soft and hard composite circuit board proposed by the novel creation can avoid the damage caused by the waste generated by the conventional process to the flexible circuit board, and can avoid the overflow glue generated when the soft and hard board is pressed together. It is difficult to match the problem. Therefore, the novel creation can improve the process yield of the soft and hard composite circuit board.
雖然本新型創作已以實施例揭露如上，然其並非用以限定本新型創作，任何所屬技術領域中具有通常知識者，在不脫離本新型創作的精神和範圍內，當可作些許的更動與潤飾，故本新型創作的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the novel creation, and any person skilled in the art can make some changes without departing from the spirit and scope of the novel creation. Retouching, the scope of protection of this new creation is subject to the definition of the scope of the patent application attached.
100‧‧‧軟硬複合線路板
110‧‧‧可撓性線路板
112‧‧‧可撓性基材
114‧‧‧第一導通孔
116‧‧‧圖案化金屬層
118‧‧‧保護層
120‧‧‧疊構層
122‧‧‧圖案化基材
122a‧‧‧感光顯影基材
124‧‧‧圖案化線路層
124a‧‧‧金屬層
126‧‧‧第二導通孔
126a‧‧‧開孔
130、140、160‧‧‧圖案化乾膜層
150‧‧‧感光防焊層
A1‧‧‧暴露區
OP‧‧‧開口
R1、R2‧‧‧移除區
S1‧‧‧上表面
S2‧‧‧下表面100‧‧‧Soft and hard composite circuit boards
110‧‧‧Flexible circuit board
112‧‧‧Flexible substrate
114‧‧‧First via
116‧‧‧ patterned metal layer
118‧‧‧Protective layer
120‧‧ ‧ stacking layer
122‧‧‧ patterned substrate
122a‧‧‧Photosensitive substrate
124‧‧‧ patterned circuit layer
124a‧‧‧metal layer
126‧‧‧Second via
126a‧‧‧Opening
130, 140, 160‧‧‧ patterned dry film
150‧‧‧Photosensitive solder mask
A1‧‧‧ exposed area
OP‧‧‧ openings
R1, R2‧‧‧ removal area
S1‧‧‧ upper surface
S2‧‧‧ lower surface
圖1A至圖1K是依照本新型創作的一實施例的一種軟硬複合線路板的製作方法的流程剖面示意圖。 圖2是依照本新型創作的另一實施例的一種軟硬複合線路板的製作方法的部分流程剖面示意圖。 圖3A至圖3C是依照本新型創作的另一實施例的一種軟硬複合線路板的製作方法的部分流程剖面示意圖。1A-1K are schematic cross-sectional views showing a method of fabricating a soft and hard composite circuit board according to an embodiment of the present invention. 2 is a partial cross-sectional view showing a method of fabricating a soft and hard composite circuit board in accordance with another embodiment of the present invention. 3A-3C are partial cross-sectional schematic views showing a method of fabricating a soft and hard composite circuit board according to another embodiment of the present invention.
100‧‧‧軟硬複合線路板 100‧‧‧Soft and hard composite circuit boards
110‧‧‧可撓性線路板 110‧‧‧Flexible circuit board
122‧‧‧圖案化基材 122‧‧‧ patterned substrate
124‧‧‧圖案化線路層 124‧‧‧ patterned circuit layer
126‧‧‧第二導通孔 126‧‧‧Second via
A1‧‧‧暴露區 A1‧‧‧ exposed area
OP‧‧‧開口 OP‧‧‧ openings
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104219242U TWM521864U (en) | 2015-12-01 | 2015-12-01 | Rigid-flex circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104219242U TWM521864U (en) | 2015-12-01 | 2015-12-01 | Rigid-flex circuit board |
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| Publication Number | Publication Date |
|---|---|
| TWM521864U true TWM521864U (en) | 2016-05-11 |
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| TW104219242U TWM521864U (en) | 2015-12-01 | 2015-12-01 | Rigid-flex circuit board |
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| TW (1) | TWM521864U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI577251B (en) * | 2015-12-01 | 2017-04-01 | 同泰電子科技股份有限公司 | Rigid-flex circuit board and manufacturing method thereof |
| CN107666771A (en) * | 2016-07-29 | 2018-02-06 | 同扬光电（江苏）有限公司 | Circuit board structure |
-
2015
- 2015-12-01 TW TW104219242U patent/TWM521864U/en unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI577251B (en) * | 2015-12-01 | 2017-04-01 | 同泰電子科技股份有限公司 | Rigid-flex circuit board and manufacturing method thereof |
| US9844131B2 (en) | 2015-12-01 | 2017-12-12 | Uniflex Technology Inc. | Rigid-flex circuit board and manufacturing method thereof |
| CN107666771A (en) * | 2016-07-29 | 2018-02-06 | 同扬光电（江苏）有限公司 | Circuit board structure |
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