JPH03219967A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPH03219967A JPH03219967A JP1685690A JP1685690A JPH03219967A JP H03219967 A JPH03219967 A JP H03219967A JP 1685690 A JP1685690 A JP 1685690A JP 1685690 A JP1685690 A JP 1685690A JP H03219967 A JPH03219967 A JP H03219967A
- Authority
- JP
- Japan
- Prior art keywords
- wear
- layer
- resistant layer
- heating resistor
- resistant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 27
- 238000010438 heat treatment Methods 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 238000000206 photolithography Methods 0.000 abstract description 3
- 230000006866 deterioration Effects 0.000 abstract description 2
- 238000001312 dry etching Methods 0.000 abstract description 2
- 238000000059 patterning Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はサーマルヘッドに関し、特に絶縁性基板上の耐
摩耗層の構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thermal head, and more particularly to the structure of a wear-resistant layer on an insulating substrate.
ご従来の技術〕
層２を形成し、この表面に発熱抵抗体層３．導体層４の
順に積層し、第３図に示すようにフォトリソグラフィー
技術により発熱抵抗体７及び導体配線８のパターンを形
成し、その上部に第１の耐摩耗層５１及び第２の耐摩耗
層６を形成した構造を有している。Conventional technology] A layer 2 is formed, and a heating resistor layer 3 is formed on the surface of the layer 2. The conductor layer 4 is laminated in this order, and as shown in FIG. 3, a pattern of a heating resistor 7 and a conductor wiring 8 is formed by photolithography, and a first wear-resistant layer 51 and a second wear-resistant layer are formed on top of the pattern. It has a structure in which 6 is formed.
ここで発熱抵抗体パターンは、まず導体配線パターン形
成時に発熱抵抗体層３と導体層４をエツチングして導体
配線パターンを形成した後、発熱抵抗体パターン部に該
当する導体層を除去して発熱抵抗体を形成する。Here, the heat generating resistor pattern is first formed by etching the heat generating resistor layer 3 and conductor layer 4 when forming the conductor wiring pattern to form a conductor wiring pattern, and then removing the conductor layer corresponding to the heat generating resistor pattern section to generate heat. Form a resistor.
上述した従来のサーマルヘッドは、通常約１μｍ厚の導
体層を形成するため、発熱抵抗体と導体配線の接続部で
約１μｍの段差が生じる。In the conventional thermal head described above, since a conductor layer is usually formed with a thickness of about 1 μm, a step difference of about 1 μm occurs at the connection between the heating resistor and the conductor wiring.
この発熱抵抗体と導体配線の上部に数μｍの保護膜とし
ての耐摩耗層が形成された後も、導体配線の段差の影響
により耐摩耗層でも約１μｍの段差が現われる。Even after the wear-resistant layer as a protective film of several micrometers is formed on the heating resistor and the conductor wiring, a step of about 1 μm still appears in the wear-resistant layer due to the influence of the step of the conductor wiring.
この段差部における耐摩耗層は、他の部分の耐摩耗層よ
り強く印字紙とこすれ合うため、耐摩耗層の消耗が激し
く、耐摩耗層の欠陥及びハガレが発生し、印字不良を引
き起こすという欠点があった。The wear-resistant layer in this stepped part rubs against the printing paper more strongly than the wear-resistant layers in other parts, so the wear-resistant layer is severely worn out, causing defects and peeling of the wear-resistant layer, resulting in poor printing. was there.
本発明の目的は、耐摩耗層の品質のよいサーマルヘッド
を提供することにある。An object of the present invention is to provide a thermal head with a high quality wear-resistant layer.
本発明のサーマルヘッドは、絶縁性基板表面に形成され
た円弧状のグレーズ層ム該グレーズ層上に形成された発
熱抵抗体層ム前記グレーズ層の頂部以外の前記発熱抵抗
体層表面に形成された導体層ム前記頂部に対応する発熱
抵抗体層表面に形成された第１の耐摩耗層ム該第１の耐
摩耗層及び前記導体層の表面に形成された第２の耐摩耗
層とを有して構成されている。The thermal head of the present invention includes an arc-shaped glaze layer formed on the surface of an insulating substrate, and a heating resistor layer formed on the glaze layer on the surface of the heating resistor layer other than the top of the glaze layer. a first wear-resistant layer formed on the surface of the heating resistor layer corresponding to the top of the conductor layer; and a second wear-resistant layer formed on the surface of the first wear-resistant layer and the conductor layer. It is configured with
次に本発明について、図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例の断面図である。FIG. 1 is a sectional view of an embodiment of the present invention.
絶縁性基板１上に設けられた円弧状のグレーズ層２の表
面に発熱抵抗体層３及び約１μｍ厚の導体層４を積層し
、フォトリソグラフィーによりグレーズ層上
の表面に第１の耐摩耗層５を形成する。A heating resistor layer 3 and a conductor layer 4 with a thickness of about 1 μm are laminated on the surface of an arc-shaped glaze layer 2 provided on an insulating substrate 1, and a first wear-resistant layer is formed on the surface of the glaze layer by photolithography. form 5.
さらに、導体配線８のパターン部に対応する第１の耐摩
耗層５をドライエツチング等により除去し、発熱抵抗体
７のパターン部にのみ対応して第１の耐摩耗層５を所定
の形状に残す。Furthermore, the first wear-resistant layer 5 corresponding to the pattern portion of the conductor wiring 8 is removed by dry etching or the like, and the first wear-resistant layer 5 is shaped into a predetermined shape corresponding only to the pattern portion of the heating resistor 7. leave.
しかる後、第１の耐摩耗層５及び導体層４の表面に第２
の耐摩耗層６を形成し、サーマルヘッドを構成する。After that, a second layer is applied to the surfaces of the first wear-resistant layer 5 and the conductor layer 4.
A wear-resistant layer 6 is formed to constitute a thermal head.
次に、本実施例のサーマルヘッド及び従来のサーマルヘ
ッドとを用いて印字寿命の試験を行った。Next, a printing life test was conducted using the thermal head of this example and a conventional thermal head.
第１表は本発明において、第１の耐摩耗層の厚さｄを１
．０μｍと０．５μｍに形成した場合ム従来のサーマル
ヘッドの場合を比較した結果である。Table 1 shows that in the present invention, the thickness d of the first wear-resistant layer is 1
．． These are the results of a comparison between conventional thermal heads formed to a thickness of 0 μm and 0.5 μm.
なお、第１の耐摩耗層には５１０２膜を、第２の耐摩耗
層には約４μｍ厚のＴ、２０５膜を用いた・第１表 本
実施例と従来例の比較
ここで、第１の耐摩耗層の厚さが０，５μｍ未満では、
導体層の膜厚が約１μｍ厚のため導体層と第１の耐摩耗
層との段差が大きく、この上部の第２の耐摩耗層におけ
る段差も大きくなるため、印字寿命は従来例と同程度で
あった。Note that 5102 film was used as the first wear-resistant layer, and T205 film with a thickness of approximately 4 μm was used as the second wear-resistant layer. When the thickness of the wear-resistant layer is less than 0.5 μm,
Since the thickness of the conductor layer is approximately 1 μm, the difference in level between the conductor layer and the first wear-resistant layer is large, and the difference in level in the second wear-resistant layer above this layer is also large, so the printing life is about the same as that of the conventional example. Met.
以上のことから第１の耐摩耗層を０．５μｍ〜１．０μ
ｍの厚さで形成した後、不要な第１の耐摩耗層を除去後
、第２の耐摩耗層を形成すれば、耐摩耗層形成後の発熱
抵抗体両端における耐摩耗層の段差は、従来構造のサー
マルヘッドに比べて実質上縮小することができるため、
印字紙とこすれ合う耐摩耗層の摩耗部を従来よりな給ら
かにすることができ、耐摩耗層ハガレや耐摩耗層の欠陥
等を低減し摩耗層の寿命を伸ばすことができる。From the above, the first wear-resistant layer should be 0.5 μm to 1.0 μm.
If the second wear-resistant layer is formed after removing the unnecessary first wear-resistant layer after forming the heat-generating resistor with a thickness of Since it can be substantially reduced in size compared to conventionally structured thermal heads,
The wear portion of the wear-resistant layer that rubs against the printed paper can be made more smooth than before, and peeling of the wear-resistant layer and defects in the wear-resistant layer can be reduced, and the life of the wear-resistant layer can be extended.
以上説明したように本発明は、絶縁性基板上に設けられ
たグレーズ層上の発熱抵抗体パターン及び導体配線パタ
ーン上部に形成された第１の耐摩耗層において、導体配
線パターン部に対応する第１の耐摩耗層部分を除去後、
第２の耐摩耗層を形成することによって発熱抵抗体と導
体配線のパターンニングによる段差を縮小でき、かつ、
印字紙とのこすれによる耐摩耗層の劣化を低減でき、サ
ーマルヘッドの印字寿命を伸ばすことができる効果があ
る。As explained above, the present invention provides a heating resistor pattern on a glaze layer provided on an insulating substrate and a first wear-resistant layer formed on the conductor wiring pattern. After removing the wear-resistant layer part 1,
By forming the second wear-resistant layer, it is possible to reduce the level difference caused by the patterning of the heating resistor and the conductor wiring, and
This has the effect of reducing deterioration of the wear-resistant layer due to rubbing with printing paper and extending the printing life of the thermal head.
第１図は本発明の一実施例の断面図、第２図は従来のサ
ーマルヘッドの一例の断面図、第３図はサーマルヘッド
の平面図である。
１・・・・・・絶縁性基板、２・・・・・・グレーズ層
、３・・・・・・発熱抵抗体層、４・・・・・・導体層
、５・・・・・・第１の耐摩耗層、６・・・・・・第２
の耐摩耗層、７・・・・・・発熱抵抗体、８・・・・・
・導体配線。FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is a sectional view of an example of a conventional thermal head, and FIG. 3 is a plan view of the thermal head. DESCRIPTION OF SYMBOLS 1...Insulating substrate, 2...Glaze layer, 3...Heating resistor layer, 4...Conductor layer, 5... first wear-resistant layer, 6...second
wear-resistant layer, 7...heating resistor, 8...
・Conductor wiring.
Claims (1)
該グレーズ層上に形成された発熱抵抗体層と、前記グレ
ーズ層の頂部以外の前記発熱抵抗体層表面に形成された
導体層と、前記頂部に対応する発熱抵抗体層表面に形成
された第１の耐摩耗層ム該第１の耐摩耗層及び前記導体
層の表面に形成された第２の耐摩耗層とを有することを
特徴とするサーマルヘッド。An arc-shaped glaze layer formed on the surface of an insulating substrate,
A heating resistor layer formed on the glaze layer, a conductor layer formed on the surface of the heating resistor layer other than the top of the glaze layer, and a conductor layer formed on the surface of the heating resistor layer corresponding to the top. A thermal head comprising: a first wear-resistant layer; and a second wear-resistant layer formed on a surface of the conductor layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1685690A JPH03219967A (en) | 1990-01-25 | 1990-01-25 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1685690A JPH03219967A (en) | 1990-01-25 | 1990-01-25 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03219967A true JPH03219967A (en) | 1991-09-27 |
Family
ID=11927863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1685690A Pending JPH03219967A (en) | 1990-01-25 | 1990-01-25 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03219967A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010179551A (en) * | 2009-02-05 | 2010-08-19 | Toshiba Hokuto Electronics Corp | Thermal head and method for manufacturing the same |
| JP2015009471A (en) * | 2013-06-28 | 2015-01-19 | ローム株式会社 | Thermal print head, and thermal printer |
-
1990
- 1990-01-25 JP JP1685690A patent/JPH03219967A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010179551A (en) * | 2009-02-05 | 2010-08-19 | Toshiba Hokuto Electronics Corp | Thermal head and method for manufacturing the same |
| JP2015009471A (en) * | 2013-06-28 | 2015-01-19 | ローム株式会社 | Thermal print head, and thermal printer |
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