JPH03218099A - Component mounting method and component feeder - Google Patents
Component mounting method and component feederInfo
- Publication number
- JPH03218099A JPH03218099A JP2014296A JP1429690A JPH03218099A JP H03218099 A JPH03218099 A JP H03218099A JP 2014296 A JP2014296 A JP 2014296A JP 1429690 A JP1429690 A JP 1429690A JP H03218099 A JPH03218099 A JP H03218099A
- Authority
- JP
- Japan
- Prior art keywords
- component
- lead
- main body
- leads
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 13
- 238000005452 bending Methods 0.000 claims abstract description 14
- 229910000679 solder Inorganic materials 0.000 claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims abstract description 9
- 230000001070 adhesive effect Effects 0.000 claims abstract description 9
- 239000006071 cream Substances 0.000 claims abstract description 9
- 230000002776 aggregation Effects 0.000 abstract 1
- 238000004220 aggregation Methods 0.000 abstract 1
- 210000000078 claw Anatomy 0.000 description 5
- 230000001105 regulatory effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電子部品を回路基板上に実装する電子部品実
装装置等に用いられる部品実装方法及びそれに好適に用
いられる部品供給装置に関し、特に本体部の一端面から
垂直方向に複数のリードが突出されている部品を回路基
板の表面上に横向きにして実装する部品実装方法及び部
品供給装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a component mounting method used in an electronic component mounting apparatus for mounting electronic components on a circuit board, and a component supply device suitably used therein. The present invention relates to a component mounting method and component supply device for mounting a component having a plurality of leads vertically protruding from one end surface of the circuit board horizontally on the surface of a circuit board.
従来の技術
電子部品の中に部品の本体部の一端面から垂直方向に複
数のリードを突出されたラジアルリード付部品と呼ばれ
ている部品があり、このようなラジアルリード付部品は
多量かつ安価に市場に出回っている。Conventional technology Among electronic components, there is a component called a radial lead component, which has multiple leads protruding vertically from one end surface of the main body of the component, and such radial lead components are available in large quantities and at low cost. is on the market.
従来、この種の部品を回路基板に実装するための部品実
装装置においては、適当間隔置きに配置した部品のリー
ド先端部をテープで保持したテープ状部品集合体が用い
られ、部品供給装置はテープにて保持された部品を所定
の供給位置に向かって逐次送り出し、供給位置で本体部
を保持した状態でリードを所定長に切断してテープから
分離するように構成されている。そして、供給位置で装
着ヘッドにて部品を保持して回路基板の実装位置に搬送
し、部品のリードを回路基板に形成された挿入穴に挿入
することによって回路基板に部品を装着していた。Conventionally, component mounting equipment for mounting this type of component on a circuit board uses a tape-shaped component assembly in which the lead ends of components arranged at appropriate intervals are held with tape, and the component feeding device uses tape The device is configured to sequentially feed out the parts held at the tape toward a predetermined supply position, and while holding the main body at the supply position, the lead is cut to a predetermined length and separated from the tape. Then, the component is held by a mounting head at the supply position and transported to the mounting position of the circuit board, and the component is mounted on the circuit board by inserting the lead of the component into an insertion hole formed in the circuit board.
発明が解決しようとする課題
このように、従来はラジアルリード付部品を実装するた
めには、チップ型部品やＩＣ部品等を対象として回路基
板の表面に部品を実装するように構成された部品実装装
置とは別に専用の部品実装装置を設備する必要があり、
さらにそのような部品実装装置では部品装着後のリード
の端末処理や半田接合処理等の接合工程も複雑であり、
生産性を低下させるという問題があり、さらに薄い回路
基板に対してはこのような部品を実装することができな
いという問題があった。Problems to be Solved by the Invention As described above, in order to mount components with radial leads, conventional component mounting methods have been used to mount components on the surface of a circuit board, such as chip-type components or IC components. It is necessary to have a dedicated component mounting equipment separate from the equipment.
Furthermore, in such component mounting equipment, the bonding processes such as lead terminal processing and solder bonding processing after component mounting are complicated.
There is a problem that productivity is reduced, and there is also a problem that such components cannot be mounted on a thin circuit board.
本発明は上記従来の問題点に鑑み、ラジアルリード付部
品を回路基板に表面実装することができる部品実装方法
及びそれに適した形態でラジアルリード付部品を供給す
ることができる部品供給装置を提供することを目的とす
る。In view of the above conventional problems, the present invention provides a component mounting method that can surface-mount components with radial leads on a circuit board, and a component supply device that can supply components with radial leads in a form suitable for the method. The purpose is to
課題を解決するための手段
本発明の部品実装方法は上記目的を達成するため、部品
の本体部から一方向に延出されたリードを保持したテー
プよりリードをＬ字状に成形して切断する第１工程と、
基板の所定位置に接着剤及びクリーム半田を塗布する第
２工程と、第１工程でリードを切断された部品を、本体
部が基板上の接着剤とリードが基板上のクリーム半田と
接する位置に載置する第３工程からなることを特徴とす
る。Means for Solving the Problems In order to achieve the above object, the component mounting method of the present invention involves forming leads into an L-shape and cutting them from a tape holding leads extending in one direction from the main body of the component. The first step,
The second step is to apply adhesive and cream solder to predetermined positions on the board, and the parts whose leads have been cut in the first step are placed in a position where the main body part contacts the adhesive on the board and the leads contact the cream solder on the board. It is characterized by comprising a third step of placing.
又、本発明の部品供給装置はテープ状部品集合体の送出
経路の所定位置の両側に、部品の本体部を一側方に略直
角に倒伏させるようにＬ字状にリードを曲げるための当
金部と倒伏した本体部が嵌合保持される凹部とリード切
断用の固定刃部とを有する固定工具と、当金部上に向か
って移動することによってリードを曲げ加工する押し曲
げ部と固定刃部との間でリードを切断する可動刃部とを
有する可動工具とを配設したことを特徴とする。Furthermore, the component supply device of the present invention has devices on both sides of a predetermined position of the feeding path of the tape-shaped component assembly for bending the lead into an L shape so that the main body of the component lies down at a substantially right angle to one side. A fixed tool having a recess in which a metal part and a collapsed main body part are fitted and held, a fixed blade part for cutting a lead, and a pressing and bending part that bends a lead by moving toward the top of the contact part, and a fixed tool. The present invention is characterized in that a movable tool having a movable blade portion that cuts the lead between the movable blade portion and the blade portion is provided.
作用
本発明の部品実装方法によれば、ラジアルリード付部品
についても、そのリードをＬ字状に成形することによっ
て基板に形成した挿入穴にリードを挿入して実装するの
ではなく、基板の表面に実装することができる。Effects According to the component mounting method of the present invention, components with radial leads are not mounted by inserting the leads into insertion holes formed in the board by forming the leads into an L shape, but by mounting them on the surface of the board. can be implemented in
又、部品供給装置の上記構成によれば、テープ状部品集
合体を送出経路に沿って逐次送り出して部品を固定工具
と可動工具の対向部に位置させた後、可動工具を固定工
具に向かって移動させると、固定工具の当金部と可動工
具の押し曲げ部とによりリードがＬ字状に曲げられ、本
体部が一側方に略直角に倒伏して凹部内に嵌合保持され
、その後固定刃部と可動刃部とによりリードが切断され
、その結果本体部が横向姿勢とされかつその一端面から
下向きにＬ字状にリードが突出された形態で部品を供給
できる。Further, according to the above-mentioned configuration of the parts supply device, after the tape-shaped parts assembly is sequentially fed out along the feeding path and the parts are positioned at the opposing portion of the fixed tool and the movable tool, the movable tool is moved toward the fixed tool. When it is moved, the lead is bent into an L-shape by the abutment part of the fixed tool and the pushing bending part of the movable tool, and the main body falls down to one side at a substantially right angle and is fitted and held in the recess. The fixed blade portion and the movable blade portion cut the lead, and as a result, the main body portion is placed in a horizontal position, and parts can be supplied with the lead protruding downward from one end surface in an L-shape.
実施例
以下、本発明の一実施例を第１図〜第６図を参照しなが
ら説明する。EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIGS. 1 to 6.
まず、第６図により部品の装着状態とそのための部品形
状を説明する。回路基ｔｔＩｉ６−トの部品１を装着す
べき位置に接着剤７が塗布されるとともに、その側部に
設けられた電極上にクリーム半田８が塗布されており、
部品ｌはその本体部２を横向きにして接着剤７にて固定
され、かつその一端面から下向きＬ字状に突出されたり
一ド３の先端が電極上のクリーム半田８内に貫入して電
極に接している。First, with reference to FIG. 6, the mounting state of parts and the shape of the parts will be explained. An adhesive 7 is applied to the position where the component 1 of the circuit board ttIi6-to is to be attached, and cream solder 8 is applied to the electrode provided on the side thereof.
The component 1 is fixed with an adhesive 7 with its main body 2 facing sideways, and is protruded downward in an L-shape from one end surface, and the tip of the lead 3 penetrates into the cream solder 8 on the electrode to form an electrode. is in contact with
なお、このような状態で部品１を装着する部品装着装置
に対して、部品１は、第１図に示すように、本体部２の
一端面から垂直方向に突出されたリード３の先端部をテ
ー１４で保持したテープ状部品集合体５の形態で供給さ
れる。In addition, for a component mounting device that mounts the component 1 in such a state, the component 1 is attached with the tip of the lead 3 protruding vertically from one end surface of the main body 2, as shown in FIG. It is supplied in the form of a tape-shaped component assembly 5 held by a tape 14.
次に、テープ状部品集合体５の部品１を第６図に示すよ
うな形状にして供給する部品供給装置の構成を第１図、
第２図に基づいて説明する。Next, FIG. 1 shows the configuration of a component supply device that supplies the component 1 of the tape-shaped component assembly 5 in the shape shown in FIG. 6.
This will be explained based on FIG.
第１図、第２図において、９はテープ状部品集合体５を
垂直姿勢で案内する送出経路で、テープ４に所定間隔置
きに形成された送り穴に係合する図示しない送り機構に
て各部品ｌの配置間隔に等しい送りピンチでテープ状部
品集合体５を間歇的に送出するように構成されている。In FIGS. 1 and 2, reference numeral 9 denotes a feeding path that guides the tape-like component assembly 5 in a vertical position, and a feed mechanism (not shown) that engages with feed holes formed in the tape 4 at predetermined intervals is used to guide each tape-shaped component assembly 5 in a vertical position. It is configured to intermittently send out the tape-shaped parts assembly 5 with a feed pinch equal to the arrangement interval of the parts 1.
送出経路９のテープ状部品集合体送出方向前端部の部品
停止位置が供給位置とされ、その一例には固定工具１０
が配設され、他側には可動工具１ｌが配設されている。The component stopping position at the front end of the tape-like component assembly in the feeding direction of the feeding path 9 is the feeding position, and an example of this is the feeding position where the fixed tool 10
is arranged, and a movable tool 1l is arranged on the other side.
固定工具１０には、部品１の本体部２を一側方に略直角
に倒伏させるようにＬ字状にリート３を曲げるための当
金部１２を有し、かつその上面には倒伏した本体部２が
嵌合保持される四部１３が形成され、又当金部１２の下
端縁部にリード切断用の固定刃部ｌ４が形成されている
。又、可動工具ｌ１は適宜往復駆動千段１５にて送出経
路９の他側から送出経路９を横断して一側の固定工只１
０側に移動可能に構成されるとともに、当金部１２上面
よりリード径だけ上方位置を当金部１２上に移動するこ
とによって当金部ｌ２との間でリート３を曲げ加工する
押し曲げ部ｌ６と、固定刃部１４との間でリード３を切
断する可動刃部１７とを有している。なお、これら押し
曲げ部ｌ６と固定刃部１７とは、押し曲げ部１６により
りード３を曲げ加工した後に可動工具１１の移動端の直
前にリード３を切断ずるように形成されている。The fixing tool 10 has a stopper part 12 for bending the reel 3 into an L-shape so that the main body part 2 of the component 1 lies down at a substantially right angle to one side, and has a resting part 12 on the upper surface thereof. Four parts 13 are formed into which the part 2 is fitted and held, and a fixed blade part 14 for cutting the lead is formed at the lower edge of the abutment part 12. Also, the movable tool l1 is moved from the other side of the delivery route 9 to the fixed work tool 1 on one side by appropriately reciprocating the thousand steps 15.
A pushing bending part that is configured to be movable toward the 0 side and bends the REET 3 between the contact part 12 and the contact part 12 by moving the position above the contact part 12 by the lead diameter above the contact part 12. 16 and a movable blade part 17 that cuts the lead 3 between the fixed blade part 14 and the fixed blade part 14. The push bending portion l6 and the fixed blade portion 17 are formed so as to cut the lead 3 immediately before the moving end of the movable tool 11 after the lead 3 is bent by the push bending portion 16.
又、凹部１３の底部には部品１の本体部２が嵌合された
ことを検出するセンサ１８が配設されている。Further, a sensor 18 is disposed at the bottom of the recess 13 to detect that the main body 2 of the component 1 is fitted.
又、固定工具１０には、供給位置からさらに送出方向前
方位置にテープ切断用固定刃ｌ９が取付けられ、送出経
路を間に挾んでこのテープ切断用固定刃１９に対向する
ように配設されたテープ切断用可動刃２０が可動工具１
１に連結部材２１にて連結されている。Further, a tape cutting fixed blade 19 is attached to the fixed tool 10 at a position further forward in the feeding direction from the supply position, and is arranged to face the tape cutting fixed blade 19 with the feeding path in between. The movable blade 20 for tape cutting is the movable tool 1
1 by a connecting member 21.
部品装着装置の装着ヘッド２２は、第１図に仮想線で示
すように、凹部１３の上方位置に位置決めされた後下降
して部品１の本体部２を吸着して保持する吸着ノズル２
３と、吸着した部品ｌの位置規正を行う位置規正手段２
４とを備えている。As shown by the imaginary line in FIG. 1, the mounting head 22 of the component mounting device is positioned above the recess 13 and then lowered to attract and hold the main body 2 of the component 1.
3, and a position regulating means 2 for regulating the position of the picked-up component l.
4.
この位置規正千段２４は、第４図に示すように、本体部
２をリード３の突出方向両側から扶持して位置規正する
一対の第１の位置規正爪２５ａ、２５ｂと、第５図に示
すように、本体部２を径方向両側から扶持して位置規正
する一対の第２の位置規正爪２６ａ、２６ｂにて構成さ
れている。なお、第１の規正爪２５ａ、２５ｂは複数の
りード３、３間に嵌入し得る幅を有し、本体部２をその
軸心位置で扶持するように構成されている。As shown in FIG. 4, this positioning stage 24 includes a pair of first positioning claws 25a and 25b that support the main body 2 from both sides in the protruding direction of the lead 3 and adjust its position, and as shown in FIG. As shown, it is comprised of a pair of second position adjustment claws 26a and 26b that support and position the main body part 2 from both sides in the radial direction. The first regulating claws 25a, 25b have a width that allows them to fit between the plurality of leads 3, 3, and are configured to support the main body 2 at its axial center position.
次に、部品を基板に実装する動作を説明する。Next, the operation of mounting components on the board will be explained.
送出経路９に案内されたテープ状部品集合体５が送り機
構にて送り出され、部品１が供給位置で停止すると、可
動工具ｌ１が往復駆動手段にて送出経路９を横断して固
定工具１０側に移動駆動される。すると、部品ｌのリ一
ド３の当金部ｌ２より上方部分が押し曲げ部１６にて押
され、リード３が当金部ｌ２の上面に沿って曲げられ、
第３図に仮想線で示す状態から実線で示すように本体部
２が一側方に倒伏し、本体部２が凹部１３内に嵌合保持
される。その後、可動工具１１の移動端の直前に当金部
ｌ２の下端縁の固定刃部１４と可動刃部１７の間でリー
ト３が切断されることによって、部品１はその本体部２
が凹部１３に保持された状態でテープ４から分離され、
その後可動工具１ｌは元の位置に復帰する。The tape-shaped parts assembly 5 guided to the delivery path 9 is sent out by the feeding mechanism, and when the part 1 stops at the supply position, the movable tool l1 crosses the delivery path 9 by the reciprocating drive means and moves to the fixed tool 10 side. be driven to move. Then, the upper part of the lead 3 of the part 1 than the abutting part l2 is pressed by the pressing bending part 16, and the lead 3 is bent along the upper surface of the abutting part l2.
From the state shown by the imaginary line in FIG. 3, the main body 2 collapses to one side as shown by the solid line, and the main body 2 is fitted and held in the recess 13. After that, the reel 3 is cut between the fixed blade part 14 and the movable blade part 17 on the lower edge of the abutment part l2 immediately before the moving end of the movable tool 11, so that the part 1 is cut into its main body part 2.
is separated from the tape 4 while being held in the recess 13,
Thereafter, the movable tool 1l returns to its original position.
次に、装着ヘソド２２が凹部ｌ３内の部品１の木体部２
上に位置決めされて下降し、本体部２を吸着ノズル２３
にて吸着保持して上昇するとともに、第４図に示すよう
に第１の規正爪２５ａ、２５ｂにて本体部２を扶持して
リード３突出方向の位置規正を行い、又第５図に示すよ
うに第２の規正爪２６ａ、２６ｂにて本体部２を扶持し
て径方向の位置規正を行う。次に、装着ヘソド２２が回
路基板５の所定の部品装着位置の上方に位置決めされた
後回路基板５上に向かって下降することによって第６図
に示すように部品１をその本体部２を横向きにした状態
でかつり一ド３の先端が確実に電極上に位置するように
位置決めして装着される。Next, the mounting head 22 is inserted into the wooden part 2 of the component 1 in the recess l3.
It is positioned above and lowered, and the main body part 2 is sucked into the suction nozzle 23.
At the same time, as shown in FIG. 4, the main body part 2 is supported by the first regulating claws 25a and 25b to regulate the position of the lead 3 in the protruding direction, and as shown in FIG. In this manner, the main body portion 2 is supported by the second regulating claws 26a and 26b to regulate the position in the radial direction. Next, after the mounting head 22 is positioned above a predetermined component mounting position on the circuit board 5, it is lowered toward the circuit board 5 to place the component 1 with its main body 2 turned sideways, as shown in FIG. In this state, the tip of the hook 3 is positioned so that it is reliably positioned on the electrode.
発明の効果
本発明の部品実装方法によれば、ラジアルリード付部品
についてもそのリードを１一字状に成形し本体部を横向
きにして実装することによって、基板の表面に実装する
ことができ、実装能率が向上するとともに特殊な装置を
設備しなくても済み、また薄い回路基板に対してもラジ
アルリード付部品を実装できる等の効果を発揮する。Effects of the Invention According to the component mounting method of the present invention, components with radial leads can also be mounted on the surface of a board by forming the leads into a 11-character shape and mounting the components with the main body facing sideways. This improves mounting efficiency, eliminates the need for special equipment, and allows components with radial leads to be mounted even on thin circuit boards.
又、本発明の部品供給装置によれば、本体部の一端面か
ら垂直方向に複数のりートを突出された部品をテープ状
部品集合体の形態にして送出経路に沿って送り出し、各
部品を固定工具と可動工具の対向部に位置させた後、可
動工具を固定工具に向かって移動させることによって、
固定工具の当金部と可動工具の押し曲げ部とでリードを
Ｌ字状に曲げるとともに固定刃部と可動刃部とでリード
を切断することができ、本体部が横向姿勢とされ４
かつその一端面から下向きＬ字状にリードが突出された
形態で部品を供給でき、コンパクトで比較的簡単な構成
の供給装置を用いるだけで上記実装方法を実施できると
いう効果を発揮する。Further, according to the component supply device of the present invention, the components having a plurality of channels vertically protruding from one end surface of the main body are formed into a tape-shaped component assembly and are sent out along the delivery route, and each component is fed out along the delivery path. By locating the stationary tool and the movable tool in opposing positions, and then moving the movable tool toward the stationary tool,
The lead can be bent into an L-shape by the contact part of the fixed tool and the pressing and bending part of the movable tool, and the lead can be cut by the fixed blade part and the movable blade part, and the main body part is in a horizontal position. The components can be supplied in a form in which the leads protrude downward in an L-shape from one end surface, and the above-mentioned mounting method can be carried out simply by using a supply device having a compact and relatively simple configuration.
第１図は本発明の一実施例における部品供給装置の縦断
正面図、第２図は同部分断面平面図、第３図は動作状態
を示す要部の拡大断面図、第４図は装着ノズルで保持し
た部品の位置規正工程を示す正面図、第５図は同側面図
、第６図は回路基板に対する部品の装着状態を示す正面
図である。
部品
本体部
リード
テープ
テープ状部品集合体
回路基板
接着剤
クリーム半田
送出経路
固定工具
可動工具
当金部
凹部
固定刃部
押し曲げ部
可動刃部。Fig. 1 is a longitudinal sectional front view of a component supply device according to an embodiment of the present invention, Fig. 2 is a partial cross-sectional plan view of the same, Fig. 3 is an enlarged sectional view of main parts showing the operating state, and Fig. 4 is a mounting nozzle. FIG. 5 is a side view of the same, and FIG. 6 is a front view showing the mounting state of the components on the circuit board. Component main body Lead tape Tape-like component assembly Circuit board Adhesive cream Solder delivery route Fixed tool Movable tool Recessed part Recessed part Fixed blade part Pressing and bending part Movable blade part.
Claims (2)
持したテープよりリードをＬ字状に成形して切断する第
１工程と、基板の所定位置に接着剤及びクリーム半田を
塗布する第２工程と、第１工程でリードを切断された部
品を、本体部が基板上の接着剤とリードが基板上のクリ
ーム半田と接する位置に載置する第３工程からなること
を特徴とする部品実装方法。(1) The first step of forming and cutting the leads into an L-shape from a tape holding the leads extending in one direction from the main body of the component, and applying adhesive and cream solder to predetermined positions on the board. The method is characterized by comprising a second step and a third step in which the component whose leads have been cut in the first step is placed at a position where the main body part contacts the adhesive on the board and the leads contact cream solder on the board. Component mounting method.
出された部品を適当間隔置きにテープで保持したテープ
状部品集合体を用いた部品供給装置であって、テープ状
部品集合体の送出経路の所定位置の両側に、部品の本体
部を一側方に略直角に倒伏させるようにＬ字状にリード
を曲げるための当金部と倒伏した本体部が嵌合保持され
る凹部とリード切断用の固定刃部とを有する固定工具と
、当金部上に向かって移動することによってリードを曲
げ加工する押し曲げ部と固定刃部との間でリードを切断
する可動刃部とを有する可動工具とを配設したことを特
徴とする部品供給装置。(2) A component supply device using a tape-shaped component assembly in which components having a plurality of leads protruding vertically from one end surface of the main body are held with tape at appropriate intervals, On both sides of the predetermined position of the delivery route, there are abutment parts for bending the lead into an L shape so as to make the main body part of the component lie down at a substantially right angle to one side, and a recessed part in which the fallen main body part is fitted and held. A fixed tool having a fixed blade section for cutting the lead, and a movable blade section that cuts the lead between the fixed blade section and the pressing bending section that bends the lead by moving above the contact part. A parts supply device characterized in that a movable tool having a movable tool is disposed therein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014296A JPH03218099A (en) | 1990-01-23 | 1990-01-23 | Component mounting method and component feeder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014296A JPH03218099A (en) | 1990-01-23 | 1990-01-23 | Component mounting method and component feeder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03218099A true JPH03218099A (en) | 1991-09-25 |
Family
ID=11857134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014296A Pending JPH03218099A (en) | 1990-01-23 | 1990-01-23 | Component mounting method and component feeder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03218099A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015136600A1 (en) * | 2014-03-10 | 2015-09-17 | 富士機械製造株式会社 | Tape feeder |
| JP2015211214A (en) * | 2014-04-29 | 2015-11-24 | Juki株式会社 | Lead processing mechanism, component supply device, component mounting device, and lead processing method |
| US11122720B2 (en) | 2015-07-24 | 2021-09-14 | Fuji Corporation | Component feeder |
-
1990
- 1990-01-23 JP JP2014296A patent/JPH03218099A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015136600A1 (en) * | 2014-03-10 | 2015-09-17 | 富士機械製造株式会社 | Tape feeder |
| JPWO2015136600A1 (en) * | 2014-03-10 | 2017-04-06 | 富士機械製造株式会社 | Tape feeder |
| US11395447B2 (en) | 2014-03-10 | 2022-07-19 | Fuji Corporation | Tape feeder |
| JP2015211214A (en) * | 2014-04-29 | 2015-11-24 | Juki株式会社 | Lead processing mechanism, component supply device, component mounting device, and lead processing method |
| US11122720B2 (en) | 2015-07-24 | 2021-09-14 | Fuji Corporation | Component feeder |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR0145211B1 (en) | Apparatus and method of mounting electronic components | |
| US6334641B1 (en) | Gripper for a surface mounting apparatus | |
| JPH03218099A (en) | Component mounting method and component feeder | |
| US5443391A (en) | Electric wire-connecting terminal | |
| JPH10242685A (en) | Supplying equipment of taping component | |
| JPH104294A (en) | Electronic part insertion equipment | |
| JPH10163684A (en) | Parts supply device | |
| JPH1022688A (en) | Stick tube for electronic component supplying device and electronic component supplying device with it | |
| JPH0344437B2 (en) | ||
| JPH0724356B2 (en) | Lead wire cutting device for electronic parts | |
| JP2999984B2 (en) | Pin driving device | |
| WO2022107342A1 (en) | Method for connecting both sides of tape ends of two carrier tapes using connection tape, cutting apparatus, and carrier tape connecting method | |
| JPS60175315A (en) | Automatic welding machine for ribbon cable | |
| JPH1083941A (en) | Lead cutting device for chip electrolytic capacitor | |
| SU1228331A1 (en) | Device for mounting wires on board | |
| JP2961584B2 (en) | Electronic part base holding device | |
| JPS59229900A (en) | Electronic part inserting machine | |
| JP3233137B2 (en) | Electronic component mounting apparatus and electronic component mounting method | |
| JPH03217089A (en) | Cutting and separating method for ic component | |
| JP3536959B2 (en) | Solder supply device and mounter | |
| JP2697027B2 (en) | Screw tightening method | |
| JPH0118598B2 (en) | ||
| JPS62269400A (en) | Taped parts feeder | |
| JPH0684971A (en) | Method for positioning lead frame | |
| JPH04192434A (en) | Tab component inserting device |