JP3536959B2 - Solder supply device and mounter - Google Patents

Solder supply device and mounter

Info

Publication number
JP3536959B2
JP3536959B2 JP33938696A JP33938696A JP3536959B2 JP 3536959 B2 JP3536959 B2 JP 3536959B2 JP 33938696 A JP33938696 A JP 33938696A JP 33938696 A JP33938696 A JP 33938696A JP 3536959 B2 JP3536959 B2 JP 3536959B2
Authority
JP
Japan
Prior art keywords
solder
cutting blade
solder member
lead frame
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP33938696A
Other languages
Japanese (ja)
Other versions
JPH10178029A (en
Inventor
宏 福嶋
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP33938696A priority Critical patent/JP3536959B2/en
Publication of JPH10178029A publication Critical patent/JPH10178029A/en
Application granted granted Critical
Publication of JP3536959B2 publication Critical patent/JP3536959B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PROBLEM TO BE SOLVED: To reduce the quantity and the thickness of solder and also to lessen the irregularity in feeding position of solder by a method wherein a holding block is arranged on the intermediate position of the moving path in vertical direction of a solder material opposing to one surface of the holding block, a cutting blade is horizontally arranged opposing to the holding block on the other side of the solder material, the solder material is cut into pieces in prescribed length, and they are fed by dropping. SOLUTION: The lower end of a solder material 7 to be let out is stopped at the position of the cutting part 16a of a cutting blade 16. A lead frame is positioned at the position of the first aperture part 5a, the solder material 7 is let out in the prescribed length, and the tip part of the solder material 7 is inserted into a cover 5. Besides, when an eccentric cam 19 is rotated by operating a motor 20, a movable piece 16 is reciprocatory moved, the cutting part 16a of the cutting blade 16 is inserted into the recessed part 12b of a movable block 12, and the middle part of the solder material 7 is cut. In the case where the cutting blade 16 is single edged and the upper surface of the cutting part 16a is inclined, the cut solder piece, whose side wall is adhered closely to the movable block 12 and the upper end is closely adhered to the cutting part 16a, is stripped off the movable block 12, dropped and fed to a prescribed position on the lead frame.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は長尺の半田部材を所
定の長さに切断し供給する半田供給装置及びこの半田供
給装置を用いたマウンタに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder supply device for cutting and supplying a long solder member to a predetermined length and a mounter using the solder supply device.

【０００２】[0002]

【従来の技術】半導体装置などの電子部品は、一般的に
電子部品本体をマウントするマウント部と複数本一組の
リードとを一体化しこれを基本単位として複数組連結一
体化したリードフレームを用いて製造される。この電子
部品が大電流を取り扱うものであって内部の電圧降下が
問題となるものや発熱をともなうものでは、電子部品本
体とリードフレームとを接続する接着材として電気抵抗
が小さく熱伝導性の良好な金属や半田が用いられる。図
７は電子部品本体をリードフレームにマウントするマウ
ンタの一例を示す。図において、１はリードフレーム
で、例えば図８に示すように、放熱板を兼ねるマウント
部２の一端に複数本、図示例では３本一組のリード３を
平行配置し、中央のリード３ａをマウント部２に電気
的、機械的に接続し、他のリード３ｂ、３ｃの一端をマ
ウント部２に近接配置している。４はリードフレーム１
をガイドするガイドレールで、図示省略するが、搬送装
置と加熱手段とが付設され、リードフレーム１を加熱し
つつ所定のピッチで移動させる。５はガイドレール４を
覆ったカバーで、ガイドレール４の始端と終端及びガイ
ドレール上の所定部分（図示例では２個所）で開口して
いる。このカバー５内には不活性ガスや不活性ガスと還
元性ガスとを混合した混合ガスが供給され、加熱された
リードフレーム１の表面が酸化されないようにしてい
る。６は長尺のテープ状あるいはワイヤ状の半田部材７
をガイドしその先端より所定長さ突出させて、カバー５
上の第１開口部５ａ上で上下動してカバー５内に挿入さ
れ、加熱されたリードフレーム１上に所定量の半田を供
給する半田供給ノズル、８は下端に半導体ペレットなど
の電子部品本体９を吸着した吸着コレットで、カバー５
の第２開口部５ｂ上で上下動してカバー５内に挿入さ
れ、リードフレーム１上の溶融半田７ａ上に電子部品本
体９を供給する。この装置によって、電子部品本体９が
マウントされたリードフレーム１はワイヤボンディング
装置に供給され電子部品本体９上の電極とリード３ｂ、
３ｃとが電気的に接続された後、さらに電子部品本体９
を含む主要部分が樹脂被覆されて樹脂から露出したリー
ドフレーム１の連結部分を切断して、各リード３を独立
させ、個々の電子部品が得られる。この種電子部品は電
子部品本体９の発熱が著しい場合には、その熱を速やか
にリードフレーム１に伝達し外部に放散させる必要があ
る。そのために熱伝導性の良好な半田が接着材として用
いられるが、この電子部品を頻繁にオンオフ動作させる
と、電子部品本体９、半田７ａ、放熱板２のそれぞれの
熱膨張係数の差によりそれぞれの接合界面に膨張、収縮
によるストレスを生じる。この膨張、収縮によるストレ
スが繰り返されると接合界面が剥離し、剥離部分での熱
伝導性が低下すると電子部品本体９がさらに温度上昇
し、剥離を助長させ最終的に電子部品を短期間で不良に
する。これに対して、適正な熱膨張率の半田部材７を用
い、半田の厚さも適正に設定することにより熱ストレス
を緩和して長寿命化を図っている。図７装置では、半田
供給ノズル６から所定長さ突出させた半田部材７の先端
を加熱されたリードフレーム１に接触させ、溶融させつ
つ半田供給ノズル６を所定距離降下させ所定量の半田を
溶融させ供給するようにしている。2. Description of the Related Art In general, an electronic component such as a semiconductor device uses a lead frame in which a mounting portion for mounting an electronic component body and a set of plural leads are integrated, and a plurality of sets are connected and integrated as a basic unit. Manufactured. If this electronic component handles large currents and causes a problem of internal voltage drop or generates heat, it has low electrical resistance and good thermal conductivity as an adhesive connecting the electronic component body and the lead frame. Metal and solder are used. FIG. 7 shows an example of a mounter for mounting the electronic component body on a lead frame. In the drawing, reference numeral 1 denotes a lead frame, for example, as shown in FIG. 8, a plurality of, in the illustrated example, a set of three leads 3 are arranged in parallel at one end of a mount portion 2 also serving as a heat radiating plate, and a central lead 3a is attached. The lead is electrically and mechanically connected to the mount 2, and one end of each of the other leads 3 b, 3 c is arranged close to the mount 2. 4 is the lead frame 1
Although not shown, a conveying device and a heating means are additionally provided to move the lead frame 1 at a predetermined pitch while heating. Reference numeral 5 denotes a cover that covers the guide rail 4 and is opened at the start and end of the guide rail 4 and at predetermined portions (two locations in the illustrated example) on the guide rail. An inert gas or a mixed gas of an inert gas and a reducing gas is supplied into the cover 5 to prevent the heated surface of the lead frame 1 from being oxidized. 6 is a long tape-shaped or wire-shaped solder member 7
And projecting it from the tip by a predetermined length to cover 5
A solder supply nozzle which moves up and down on the upper first opening 5a, is inserted into the cover 5, and supplies a predetermined amount of solder onto the heated lead frame 1. Reference numeral 8 denotes an electronic component body such as a semiconductor pellet at a lower end. The cover 5 is made of an adsorption collet that has absorbed the
The electronic component main body 9 is supplied on the molten solder 7 a on the lead frame 1 by being moved up and down on the second opening 5 b and inserted into the cover 5. With this device, the lead frame 1 on which the electronic component body 9 is mounted is supplied to a wire bonding device, and the electrodes and the leads 3b on the electronic component body 9 are provided.
3c, the electronic component body 9 is further connected.
By cutting the connecting portion of the lead frame 1 exposed from the resin by covering the main part including the resin, the leads 3 are made independent to obtain individual electronic components. In the case of this kind of electronic component, when the heat of the electronic component body 9 is remarkable, it is necessary to quickly transmit the heat to the lead frame 1 and dissipate it to the outside. For this purpose, a solder having good thermal conductivity is used as an adhesive. However, if this electronic component is frequently turned on and off, a difference in the thermal expansion coefficients of the electronic component body 9, the solder 7a, and the radiator plate 2 causes the respective components to change. Stress occurs due to expansion and contraction at the joint interface. When the stress due to the expansion and contraction is repeated, the bonding interface peels off, and when the thermal conductivity at the peeling part decreases, the temperature of the electronic component body 9 further rises, promoting the peeling and finally causing the electronic component to fail in a short period of time. To On the other hand, by using the solder member 7 having an appropriate coefficient of thermal expansion and by appropriately setting the thickness of the solder, thermal stress is reduced to extend the life. In the apparatus shown in FIG. 7, the tip of the solder member 7 protruding from the solder supply nozzle 6 by a predetermined length is brought into contact with the heated lead frame 1 to lower the solder supply nozzle 6 by a predetermined distance while melting, thereby melting a predetermined amount of solder. It is made to supply.

【０００３】[0003]

【発明が解決しようとする課題】しかしながら、溶融半
田７ａに接触した半田部材７は熱伝導により高温になり
融点部分が特定できないため、半田供給ノズル６を所定
高さに降下させたとしても半田の分離位置がばらつき、
半田量即ち半田の厚みのばらつきを抑えることができな
かった。その結果、オンオフを繰り返すような動作で用
いられる電子部品の寿命のばらつきを抑えることができ
なかった。半田供給装置は、図７に示すように半田供給
ノズル６を鉛直方向に上下させるものの他に、半田供給
ノズルを傾斜配置し半田部材７を所定長さ繰り出して供
給するものや、テープ状半田部材を水平方向に繰り出
し、先端部分を所定長さに切断してこの切断された半田
片を吸着コレットにより供給するものなどがあるが、前
者は図７装置と同様の問題があり、後者は半田量は半田
片の長さで設定でき半田供給位置も正確に設定できる
が、半田片の取り出しと供給の位置が水平及び高さの異
なる位置でなされるため、吸着コレットの駆動機構が複
雑になるという問題があった。また、カバー５内に出入
りする供給ノズルは温度上昇し、吸着した半田片が吸着
コレットに付着して分離できないことがあり、高速動作
させると、半田供給不良を生じることがあった。However, since the temperature of the solder member 7 in contact with the molten solder 7a becomes high due to heat conduction and the melting point cannot be specified, even if the solder supply nozzle 6 is lowered to a predetermined height, the solder member 7 is heated. The separation position varies,
The variation in the amount of solder, that is, the thickness of the solder could not be suppressed. As a result, it has not been possible to suppress variations in the life of electronic components used in operations that repeatedly turn on and off. As shown in FIG. 7, the solder supply device moves the solder supply nozzle 6 up and down in the vertical direction. The solder supply device also includes an inclined arrangement of the solder supply nozzle and feeds out the solder member 7 by a predetermined length. , The tip is cut to a predetermined length, and the cut solder piece is supplied by a suction collet. The former has the same problem as that of the apparatus shown in FIG. Can be set by the length of the solder piece and the solder supply position can be set accurately, but since the position of picking up and supplying the solder piece is done at different horizontal and height positions, the driving mechanism of the suction collet is complicated There was a problem. In addition, the temperature of the supply nozzle that enters and exits the cover 5 rises, and the adsorbed solder pieces may adhere to the adsorbing collet and cannot be separated. When operated at high speed, solder supply failure may occur.

【０００４】[0004]

【課題を解決するための手段】本発明は上記課題の解決
を目的として提案されたもので、ほぼ鉛直方向に所定の
ピッチで繰り出される長尺の半田部材の移動経路中間位
置で半田部材の一面と対向配置された受けブロックと、
半田部材の他の面側に配置されて受けブロックと対向し
切断部がほぼ水平配置された切断刃とを備え、受けブロ
ックと切断刃とを相対的に近接離隔させ半田部材を所定
の長さに切断し、切断された半田片を落下供給するよう
にしたことを特徴とする半田供給装置を提供する。また
本発明は、部品本体が半田付け固定されるマウント部を
有するリードフレームを加熱しつつガイドして移動させ
るガイドレールと、ガイドレールのリードフレーム移動
経路を覆い移動経路上の所定位置で位置決めされたリー
ドフレーム上の要部と対向する位置に開口部を設けたカ
バーと、ほぼ鉛直方向に所定のピッチでテープ状半田部
材を繰り出し、先端部をカバーの開口部よりその内部に
送り込む半田部材送り装置と、カバーの開口部近傍で半
田部材の一主面と対向配置させた受けブロックと、半田
部材の他の主面側に配置されて受けブロックと対向し切
断部がほぼ水平配置されて、受けブロックに対して相対
的に近接離隔して半田部材を所定の長さに切断する切断
刃とを備え、切断された半田片を加熱されたリードフレ
ーム上に落下させ供給するようにしたことを特徴とする
マウンタを提供する。SUMMARY OF THE INVENTION The present invention has been proposed for the purpose of solving the above-mentioned problems, and one surface of a solder member is disposed at an intermediate position of a moving path of a long solder member which is fed out at a predetermined pitch in a substantially vertical direction. A receiving block disposed opposite to the
A cutting blade disposed on the other surface side of the solder member, facing the receiving block, and having a cutting portion disposed substantially horizontally, and the receiving block and the cutting blade are relatively closely separated from each other so that the solder member has a predetermined length. And the cut solder pieces are supplied in a falling manner. Further, according to the present invention, a guide rail for guiding and moving a lead frame having a mount portion to which a component body is fixed by soldering while heating is provided, and the lead frame covers a lead frame moving path of the guide rail and is positioned at a predetermined position on the moving path. A cover with an opening at a position facing the main part of the lead frame, and a solder member feeder that feeds out a tape-like solder member at a predetermined pitch in a substantially vertical direction, and feeds the tip portion into the inside from the opening of the cover. The device, a receiving block disposed opposite to one main surface of the solder member near the opening of the cover, and a cut portion disposed on the other main surface side of the solder member and opposed to the receiving block is disposed substantially horizontally, A cutting blade that cuts the solder member to a predetermined length relatively close to the receiving block and drops the cut solder piece onto a heated lead frame. It was to not supply provides a mounter according to claim.

【０００５】[0005]

【発明の実施の形態】本発明による半田供給装置は、ほ
ぼ鉛直方向に所定のピッチで繰り出される長尺の半田部
材の移動経路中間位置で半田部材の一面と対向配置され
た受けブロックと、半田部材の他の面側に配置されて受
けブロックと対向し切断部がほぼ水平配置された切断刃
とを相対的に近接離隔させ半田部材を所定の長さに切断
し、切断された半田片を落下供給するようにしたことを
特徴とするが、受けブロックの切断刃先端と対向する壁
面を、その上方を切断刃に近接させ、下方を切断刃より
離隔するように傾斜させて切断された半田片を傾斜させ
て落下させ、半田片の供給位置のずれを抑えることがで
きる。この場合、半田部材を切断後、受けブロックを上
昇させることにより、受けブロックに付着した半田片を
切断刃により確実に分離して落下させることができる。
また本発明によるマウンタは、部品本体が半田付け固定
されるマウント部を有するリードフレームを加熱しつつ
ガイドして移動させるガイドレールと、ガイドレールの
リードフレーム移動経路を覆い移動経路上の所定位置で
位置決めされたリードフレーム上の要部と対向する位置
に開口部を設けたカバーと、ほぼ鉛直方向に所定のピッ
チでテープ状半田部材を繰り出し、先端部をカバーの開
口部よりその内部に送り込む半田部材送り装置と、カバ
ーの開口部近傍で半田部材の一主面と対向配置させた受
けブロックと、半田部材の他の主面側に配置されて受け
ブロックと対向し切断部がほぼ水平配置されて、受けブ
ロックに対して相対的に近接離隔して半田部材を所定の
長さに切断する切断刃とを備え、切断された半田片を加
熱されたリードフレーム上に落下させ供給する。この装
置では、カバーの開口部及びその周縁と受けブロック及
び切断刃との間に半田部材を挿通する貫通部を有する遮
熱部材を配置することにより、半田部材の温度上昇を防
止し切断性を良好に保つことができる。また、切断され
た半田片をリードフレーム上に供給した後、リードフレ
ーム上の次のマウント部が開口部位置に来るまで半田部
材の下端をカバーの開口部外に待機させることにより切
断前の半田部材の温度上昇を抑えることができる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A solder supply device according to the present invention comprises a receiving block disposed opposite to one surface of a solder member at an intermediate position along a movement path of a long solder member which is fed out at a predetermined pitch in a substantially vertical direction; Cutting the solder member to a predetermined length by relatively closely separating the cutting blade arranged on the other surface side of the member and facing the receiving block and the cutting portion is arranged substantially horizontally, and cutting the solder piece to a predetermined length. It is characterized in that it is supplied by dropping, but the solder cut by tilting the wall surface facing the cutting blade tip of the receiving block so that its upper part is close to the cutting blade and the lower part is separated from the cutting blade The pieces can be tilted and dropped, and the displacement of the supply position of the solder pieces can be suppressed. In this case, by raising the receiving block after cutting the solder member, the solder pieces attached to the receiving block can be reliably separated and dropped by the cutting blade.
In addition, the mounter according to the present invention includes a guide rail that guides and moves a lead frame having a mount portion to which a component body is fixed by soldering while heating, and a guide rail that covers a lead frame moving path of the guide rail and moves at a predetermined position on the moving path. A cover having an opening at a position facing the main part of the positioned lead frame, and a solder that feeds out a tape-like solder member at a predetermined pitch in a substantially vertical direction, and feeds a tip portion into the inside from the opening of the cover. A member feeder, a receiving block disposed opposite to one main surface of the solder member in the vicinity of the opening of the cover, and a cutting portion disposed on the other main surface side of the solder member to face the receiving block and the cutting portion is disposed substantially horizontally. A cutting blade that cuts the solder member to a predetermined length relatively close to and away from the receiving block, and the cut solder piece is And supplies were dropped on the over-time. In this device, a heat shielding member having a penetrating portion through which the solder member is inserted is disposed between the opening of the cover and the peripheral edge thereof, the receiving block, and the cutting blade, thereby preventing the temperature of the solder member from rising and improving the cutting performance. Can be kept good. Also, after supplying the cut solder pieces to the lead frame, the lower end of the solder member waits outside the cover until the next mount on the lead frame comes to the opening position. The temperature rise of the member can be suppressed.

【０００６】[0006]

【実施例】以下に本発明の実施例を図７に示すマウンタ
に適用しその半田供給装置の要部を図１及び図２から説
明する。図７と同一物には同一符号を付し重複する説明
を省略する。図中相違するのは、カバー５の第１開口部
５ａ位置に配置された半田供給装置１０のみである。こ
の半田供給装置１０の具体的な構造を説明する。１１は
有底枠体で、底部１１ａにカバー５の第１開口部５ａと
連通する貫通孔１１ｂを形成している。１２は枠体１１
内でスライド可能に配置され、枠体１１との間に第１の
スプリング１３が挿入された可動ブロック（受けブロッ
ク）で、一側壁１２ａが貫通孔１１ｂを横切るように配
置され、この部分に凹部１２ｂを形成している。１４は
可動ブロック１２と対向し一側壁１４ａが貫通孔１１ｂ
を横切るように配置され固定された固定ブロックで、他
の側壁１４ｂに切欠き１４ｃを形成し、さらに上面の切
欠き１４ｃと凹部１２ｂとの間に溝１４ｄを形成してい
る。１５は切欠き１４ｃ内に挿入されスライドする可動
片、１６は可動片１５にねじ１７により固定された切断
刃で、切断部１６ａが固定ブロック１２の凹部１２ｂに
対向している。１８は固定ブロック１４と可動片１５の
間に挿入された第２のスプリングで、通常は可動片１８
を外方に押し出すように弾性力が付勢され、切断刃１６
の切断部１６ａを凹部１２ｂから離隔させている。１９
は周面が可動片１５に当接した偏芯カムで、回転により
可動片１５を往復動させる。２０は枠体１１を橋絡した
支持プレート２１に支持され、回転軸２０ａが偏芯カム
１９に連結され回転制御するモータを示す。この装置で
は半田部材７は凹部１２ａから貫通孔１１ｂ、第１開口
部５ａを通りカバー５内に挿入される。半田部材７は例
えば巾１．５ｍｍ、厚さ０．２ｍｍ（２００μｍ）のも
のを用いた場合、半導体ペレットの寸法と溶融半田の厚
みによって半田片の長さが設定されるが、切断刃１６か
らカバー５内に挿入される半田部材７の先端までの長さ
を３ｍｍとする場合、この先端からリードフレームまで
の間隔が１ｍｍ程度となるように、半田切断装置１０の
切断部の高さ位置が設定される。以下にこの装置に動作
を説明する。先ず上方から繰り出された半田部材７の下
端を切断刃１６の切断部１６ａ位置で停止させる。カバ
ー５内には非酸化性ガスが供給されているため凹部１２
ｂから加熱されたガスが吹き出しているが、半田部材７
は低温の外気にさらされており放熱されるため半田部材
７先端部の温度上昇が抑えられ酸化が抑えられる。次
に、第１開口部５ａ位置にリードフレーム（図示せず）
が位置すると、半田部材７を所定長さ繰り出し、先端部
をカバー５内に挿入する。さらにモータ２０を動作さ
せ、偏芯カム１９を一回転させると可動片１６が往復動
して切断刃１６の切断部１６ａを可動ブロック１２の凹
部１２ｂに挿入させ、半田部材７の中間部を切断する。
このとき、切断刃１６ａが可動ブロック１２に当接して
押圧するように相互の位置関係を設定しておくと、半田
部材７は切断刃１６によって完全に切断される。切断刃
１６が底面が平坦で上面が傾斜した片刃の場合、切断さ
れる半田部材７には図３に示すようにそれぞれの面方向
の力Ｆ１、Ｆ２と傾斜面に直交する力Ｆ３が作用する。
切断刃１の進行方向の力Ｆ１と傾斜面に沿う力Ｆ２は半
田部材７を可動ブロック１２に押圧するように作用し、
傾斜面と直交する力Ｆ３は半田片に対して可動ブロック
１２の壁面に沿う上方へ向かう力を与えるため、切断刃
１６ａの先端部では半田片の上端は持ち上げられ切断刃
１６ａの下面に押しつけられる。そのため、切断が完了
した半田片は側壁が可動ブロック１２に、上端が切断刃
１６ａにそれぞれ密着している。そして切断刃１６ａが
後退すると切断刃１６ａ密着した半田片は可動ブロック
１２から引き剥がされ、さらに自重により落下するが、
引き剥がし時に傾斜するため、傾斜状態を保って落下し
リードフレーム上に供給される。落下しリードフレーム
上で最初に接触した半田片はその位置を中心に回転して
伏せた状態でリードフレーム上に供給されるため、正確
な量の半田をリードフレーム上の定位置に供給でき、半
田の溶融領域のばらつきを抑えることができ、溶融半田
の厚みを一定にできる。このように所定量で所定厚さに
設定された半田によって電子部品本体がマウントされる
ため、オンオフを繰り返すような動作で用いられる電子
部品の寿命を延長できる。また、カバー５内に入り込む
のは半田部材のうち供給予定部分のみであるから、半田
部材の不必要な温度上昇がなく、切断刃による切断や分
離も安定し、高速動作も可能である。以下に本発明の他
の実施例の要部を図４から説明する。図において、図１
と同一部分には同一符号を付し重複する説明を省略す
る。この実施例では、可動ブロック１２の切断刃１６ａ
先端と対向する壁面を、その上方を切断刃１６ａに近接
させ、下方を切断刃１６ａより離隔するように傾斜さ
せ、この傾斜面１２ｃに切断刃１６ａが当接するように
配置されている。この装置では、可動ブロック１２の凹
部１２ｂ内で上下に延びる半田部材７は傾斜面１２ｃ部
分で空隙が形成されており、図５に示すように切断刃１
６ａが半田部材７の図示Ａ部分に当接して押圧すると半
田部材７は凹部１２ｂの屈曲部分Ｂで折れ曲がり湾曲す
る。これにより、半田部材７は湾曲して、切断刃１６ａ
の水平動とともに半田部材７の図示Ａ部分は湾曲して上
方位置の図示Ｃに移動する。一方、切断刃１６ａの先端
は半田部材７が傾斜面１２ｃに当接するまで半田部材７
の側壁上を滑り図示Ｃより下方位置の位置Ｄ半田部材７
に食い込む。これより先は、半田部材７は移動できない
ため切断刃１６ａが半田部材７に食い込み切断する。こ
の時、切断刃の先端には図示した力Ｆ１、Ｆ２、Ｆ３が
作用するが、力Ｆ１、Ｆ２による力は傾斜面１２ｃに沿
って下方向に向き、半田片を分離しやすくしている。そ
のため、傾斜面１２ｃに沿って傾斜した半田片は切断さ
れた後、切断刃１６ａ及び傾斜面１２ｃから容易に分離
され落下する。このように傾斜して落下した半田片は、
図１実施例と同様にリードフレーム上の定位置に所定の
厚さで供給され、長寿命の電子部品を実現できる。この
可動ブロック１２は切断刃１６ａの突出を吸収するため
に水平方向に可動としているが、切断刃１６ａが半田部
材７を切断後、図示省略するが傾斜面１２ｃを上昇させ
るようにしてもよい。これにより、半田片は切断刃１６
ａにより上昇が阻止された状態で、可動ブロック１２の
傾斜面１２ｃから分離され、その際に半田片がねじられ
てその上端が切断刃１６ａから分離されるから、傾斜し
た状態で落下させることができる。図６は図１に示す半
田供給装置をマウンタに適用したもので、図１、図７と
同一符号は同一物を示し重複する説明を省略する。この
装置の半田供給用の第１の開口部５ａは、半田部材７を
通すことができるだけの最小限の開口面積に設定でき、
第１開口部５ａからカバー５内への外気の侵入を防止で
き、外気に触れる半田部材７も先端部が開口部５ａに対
向しているだけであるから輻射熱による温度上昇も少な
く、リードフレーム上の次のマウント部が開口部位置に
来るまで半田部材の下端をカバーの開口部外に待機させ
るようにしているから半田片供給前の酸化が抑えられ
る。従って、リードフレーム１上に定量の半田を定位置
に供給でき、しかも溶融した半田表面の清浄で、電子部
品本体９とリードフレーム１の接続を確実にでき、熱伝
導性の良好な高信頼性の電子部品を実現できる。この装
置では切断刃１６は半田部材７を切断後、半田部材７か
ら離隔するようにしているが、半田部材７を切断後、そ
の位置を保つようにすれば、切断刃１６がカバー５の第
１開口部５ａから漏れる加熱雰囲気が直接半田部材７と
接触するのを防止できる。また、遮熱を目的とする遮蔽
板を開口部５ａ部分に設けてもよい。尚、上記実施例で
は受けブロック（可動ブロック）に切断刃を近接させた
が、受けブロックを切断刃に近接するように駆動しても
よい。また受けブロックは必ずしも可動である必要はな
く固定してもよい。また受けブロック又は切断刃を駆動
する駆動源としてモータとカムの組み合わせの他、シリ
ンダ機構やリンク機構などを採用することもできる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention is applied to a mounter shown in FIG. 7 and a main part of a solder supply device will be described with reference to FIGS. The same components as those in FIG. 7 are denoted by the same reference numerals, and redundant description will be omitted. The only difference in the figure is the solder supply device 10 arranged at the position of the first opening 5a of the cover 5. A specific structure of the solder supply device 10 will be described. Reference numeral 11 denotes a bottomed frame, and a through hole 11b communicating with the first opening 5a of the cover 5 is formed in the bottom 11a. 12 is a frame 11
A movable block (receiving block) in which the first spring 13 is inserted between the movable block and the frame body 11, the one side wall 12a is disposed so as to cross the through hole 11b, and a concave portion is formed in this portion. 12b. 14 is opposed to the movable block 12, and one side wall 14a has a through hole 11b.
A notch 14c is formed in the other side wall 14b, and a groove 14d is formed between the notch 14c on the upper surface and the recess 12b. Reference numeral 15 denotes a movable piece which is inserted into the notch 14c and slides. Reference numeral 16 denotes a cutting blade fixed to the movable piece 15 by screws 17, and a cutting portion 16a faces the concave portion 12b of the fixed block 12. Reference numeral 18 denotes a second spring inserted between the fixed block 14 and the movable piece 15.
Elastic force is applied to push the cutting blade 16 outward.
Is separated from the recess 12b. 19
Is an eccentric cam whose peripheral surface is in contact with the movable piece 15, and reciprocates the movable piece 15 by rotation. Reference numeral 20 denotes a motor that is supported by a support plate 21 bridging the frame body 11, has a rotating shaft 20 a connected to the eccentric cam 19, and controls rotation. In this device, the solder member 7 is inserted into the cover 5 from the recess 12a through the through hole 11b and the first opening 5a. When the solder member 7 has, for example, a width of 1.5 mm and a thickness of 0.2 mm (200 μm), the length of the solder piece is set according to the size of the semiconductor pellet and the thickness of the molten solder. When the length from the tip of the solder member 7 to be inserted into the cover 5 is 3 mm, the height of the cutting portion of the solder cutting device 10 is set so that the distance from the tip to the lead frame is about 1 mm. Is set. The operation of this device will be described below. First, the lower end of the solder member 7 fed out from above is stopped at the position of the cutting portion 16 a of the cutting blade 16. Since a non-oxidizing gas is supplied into the cover 5, the concave portion 12
b, the heated gas is blown from the solder member 7
Is exposed to low-temperature outside air and radiates heat, so that the temperature rise at the tip of the solder member 7 is suppressed and oxidation is suppressed. Next, a lead frame (not shown) is placed at the position of the first opening 5a.
Is located, the solder member 7 is extended for a predetermined length, and the tip end is inserted into the cover 5. Further, when the motor 20 is operated to rotate the eccentric cam 19 once, the movable piece 16 reciprocates to insert the cutting portion 16a of the cutting blade 16 into the concave portion 12b of the movable block 12, and cut the intermediate portion of the solder member 7. I do.
At this time, if the mutual positional relationship is set so that the cutting blade 16a contacts and presses the movable block 12, the solder member 7 is completely cut by the cutting blade 16. When the cutting blade 16 is a single blade having a flat bottom surface and an inclined upper surface, forces F1 and F2 in respective surface directions and a force F3 orthogonal to the inclined surface act on the solder member 7 to be cut as shown in FIG. .
The force F1 in the traveling direction of the cutting blade 1 and the force F2 along the inclined surface act so as to press the solder member 7 against the movable block 12,
Since the force F3 perpendicular to the inclined surface applies an upward force to the solder piece along the wall surface of the movable block 12, the upper end of the solder piece is lifted at the tip of the cutting blade 16a and pressed against the lower surface of the cutting blade 16a. . Therefore, the cut solder pieces are in close contact with the movable block 12 on the side wall and the cutting blade 16a on the upper end. When the cutting blade 16a retreats, the solder piece adhered to the cutting blade 16a is peeled off from the movable block 12, and further falls under its own weight.
Since it is inclined at the time of peeling, it falls while maintaining the inclined state and is supplied onto the lead frame. Since the solder piece that falls and first contacts on the lead frame is supplied on the lead frame while rotating around that position and lying down, the correct amount of solder can be supplied to the fixed position on the lead frame, Variations in the molten area of the solder can be suppressed, and the thickness of the molten solder can be made constant. As described above, the electronic component body is mounted by the solder having the predetermined amount and the predetermined thickness, so that the life of the electronic component used in the operation of repeatedly turning on and off can be extended. Further, since only the portion of the solder member to be supplied enters the cover 5, unnecessary temperature rise of the solder member does not occur, cutting and separation by the cutting blade are stable, and high-speed operation is possible. The main part of another embodiment of the present invention will be described below with reference to FIG. In the figure, FIG.
The same parts as those described above are denoted by the same reference numerals, and redundant description will be omitted. In this embodiment, the cutting blade 16a of the movable block 12
The wall surface facing the front end is inclined such that its upper part is close to the cutting blade 16a and its lower part is separated from the cutting blade 16a, and the cutting blade 16a is arranged to abut this inclined surface 12c. In this device, the solder member 7 extending vertically in the concave portion 12b of the movable block 12 has a gap formed on the inclined surface 12c, and as shown in FIG.
When the solder member 6a comes into contact with the portion A in the drawing of the solder member 7 and presses, the solder member 7 bends and curves at the bent portion B of the concave portion 12b. Thereby, the solder member 7 is curved, and the cutting blade 16a
A portion of the solder member 7 shown in FIG. On the other hand, the tip of the cutting blade 16a is connected to the solder member 7 until the solder member 7 contacts the inclined surface 12c.
D on the side wall of FIG.
Bite into. Thereafter, the cutting member 16a cuts into the solder member 7 because the solder member 7 cannot move. At this time, although the illustrated forces F1, F2, and F3 act on the tip of the cutting blade, the forces of the forces F1 and F2 are directed downward along the inclined surface 12c to facilitate the separation of the solder pieces. Therefore, after the solder piece inclined along the inclined surface 12c is cut, it is easily separated from the cutting blade 16a and the inclined surface 12c and falls. The solder pieces that have fallen in such an inclined manner
As in the case of the embodiment shown in FIG. 1, the electronic component is supplied at a predetermined thickness to a fixed position on the lead frame, thereby realizing a long-life electronic component. The movable block 12 is horizontally movable to absorb the protrusion of the cutting blade 16a. However, after the cutting blade 16a cuts the solder member 7, the inclined surface 12c may be raised (not shown). As a result, the solder pieces become the cutting blades 16.
In the state where the ascending is prevented by a, the movable block 12 is separated from the inclined surface 12c, and at this time, the solder piece is twisted and its upper end is separated from the cutting blade 16a. it can. FIG. 6 shows a case where the solder supply device shown in FIG. 1 is applied to a mounter. The same reference numerals as those in FIGS. The first opening 5a for supplying solder of this device can be set to a minimum opening area that allows the solder member 7 to pass therethrough,
The outside air can be prevented from entering the inside of the cover 5 from the first opening 5a, and the solder member 7 that comes into contact with the outside air also has only a front end portion facing the opening 5a, so that the temperature rise due to radiant heat is small, and the lead frame Since the lower end of the solder member is made to wait outside the opening of the cover until the next mount comes to the opening position, the oxidation before the supply of the solder pieces is suppressed. Therefore, a fixed amount of solder can be supplied onto the lead frame 1 at a fixed position, and the molten solder surface is clean and the connection between the electronic component body 9 and the lead frame 1 can be reliably performed. Electronic components can be realized. In this apparatus, the cutting blade 16 is separated from the solder member 7 after cutting the solder member 7. However, if the position is maintained after cutting the solder member 7, the cutting blade 16 The heating atmosphere leaking from the opening 5a can be prevented from directly contacting the solder member 7. Further, a shielding plate for heat shielding may be provided in the opening 5a. In the above embodiment, the cutting blade is brought close to the receiving block (movable block). However, the receiving block may be driven so as to come close to the cutting blade. The receiving block does not necessarily have to be movable but may be fixed. As a driving source for driving the receiving block or the cutting blade, a cylinder mechanism, a link mechanism, or the like may be employed in addition to the combination of the motor and the cam.

【０００７】[0007]

【発明の効果】以上のように本発明によれば、供給され
る半田の量、厚み、供給位置のばらつきが小さく、オン
オフを繰り返すような動作で用いられる電子部品を長寿
命化できる。また本発明による半田供給装置は、機構が
簡単で安定に高速動作させることができる。As described above, according to the present invention, the variation in the amount, thickness, and supply position of the supplied solder is small, and the life of an electronic component used in an operation of repeating on and off can be extended. The solder supply device according to the present invention has a simple mechanism and can be operated stably at high speed.

【図面の簡単な説明】[Brief description of the drawings]

【図１】 本発明の実施例を示す半田供給装置の側断面
図FIG. 1 is a side sectional view of a solder supply device according to an embodiment of the present invention.

【図２】 図１装置の平面図FIG. 2 is a plan view of the apparatus in FIG. 1;

【図３】 図１装置の半田の切断状態を説明する側断面
図FIG. 3 is a side sectional view illustrating a state of cutting solder in the apparatus of FIG. 1;

【図４】 本発明の他の実施例を示す要部側断面図FIG. 4 is a sectional side view of a main part showing another embodiment of the present invention.

【図５】 図４装置の動作を説明する要部側断面図FIG. 5 is a sectional side view of an essential part for explaining the operation of the apparatus in FIG. 4;

【図６】 図１装置を用いたマウンタの側断面図FIG. 6 is a side sectional view of a mounter using the apparatus of FIG. 1;

【図７】 マウンタの従来例を示す側断面図FIG. 7 is a side sectional view showing a conventional example of a mounter.

【図８】 リードフレームの一例を示す要部平面図FIG. 8 is a plan view of a main part showing an example of a lead frame.

【符号の説明】[Explanation of symbols]

７ 半田部材 １２ 受けブロック（可動ブロック） １６ 切断刃 7 Solder members 12 Receiving block (movable block) 16 Cutting blade

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】ほぼ鉛直方向に所定のピッチで繰り出され
る長尺の半田部材の移動経路中間位置で半田部材の一面
と対向配置された受けブロックと、半田部材の他の面側
に配置されて受けブロックと対向し切断部がほぼ水平配
置された切断刃とを備え、受けブロックと切断刃とを相
対的に近接離隔させ半田部材を所定の長さに切断し、切
断された半田片を落下供給するようにした半田供給装置
であって、 前記の 受けブロックの切断刃先端と対向する壁面を、そ
の上方を切断刃に近接させ、下方を切断刃より離隔する
ように傾斜させた傾斜面とし、切断された半田片が傾斜
して落下するようにしたことを特徴とする半田供給装
置。1. An apparatus which is fed out at a predetermined pitch in a substantially vertical direction.
One side of the solder member at the middle position of the movement path of the long solder member
And a receiving block disposed opposite to the other side of the solder member
And the cut section is almost horizontally arranged facing the receiving block.
And a receiving blade and a cutting blade.
Cut the solder member to a predetermined length
Solder supply device that drops and supplies broken solder pieces
A is, the cutting blade tips and the opposing wall surface of the receiving block, to close the upper on the cutting blade, an inclined surface which is inclined so as to be separated from the cutting blade downward, cut solder pieces inclined Handa feeder characterized in that so as to fall in. 【請求項２】半田部材を所定の長さに切断後、前記の受
けブロックの少なくとも傾斜面を上昇させるようにした
ことを特徴とする請求項１に記載の半田供給装置。2. After cutting the solder member to a predetermined length, solder supply apparatus according to claim 1, characterized in that so as to increase the least inclined surface of said receiving <br/> only block. 【請求項３】部品本体が半田付け固定されるマウント部
を有するリードフレームを加熱しつつガイドして移動さ
せるガイドレールと、ガイドレールのリードフレーム移
動経路を覆い移動経路上の所定位置で位置決めされたリ
ードフレーム上の要部と対向する位置に開口部を設けた
カバーと、ほぼ鉛直方向に所定のピッチでテープ状半田
部材を繰り出し、先端部をカバーの開口部よりその内部
に送り込む半田部材送り装置と、カバーの開口部近傍で
半田部材の一主面と対向配置させた受けブロックと、半
田部材の他の主面側に配置されて受けブロックと対向し
切断部がほぼ水平配置されて、受けブロックに対して相
対的に近接離隔して半田部材を所定の長さに切断する切
断刃とを備え、切断された半田片を加熱されたリードフ
レーム上に落下させ供給するようにした半田供給装置を
備えたマウンタであって、前記の受けブロックの切断刃先端と対向する壁面を、そ
の上方を切断刃に近接させ、下方を切断刃より離隔する
ように傾斜させた傾斜面とし、切断された半田片が傾斜
して落下するようにしたことを特徴とする半田供給装置
を備えたマウンタ 。3. A guide rail which guides and moves a lead frame having a mount portion to which a component body is fixed by soldering while heating the guide frame, and covers a lead frame moving path of the guide rail and is positioned at a predetermined position on the moving path. A cover with an opening at a position facing the main part of the lead frame, and a solder member feeder that feeds out a tape-like solder member at a predetermined pitch in a substantially vertical direction, and feeds the tip portion into the inside from the opening of the cover. The device, a receiving block disposed opposite to one main surface of the solder member near the opening of the cover, and a cut portion disposed on the other main surface side of the solder member and opposed to the receiving block is disposed substantially horizontally, A cutting blade for cutting the solder member to a predetermined length relatively close to and away from the receiving block, and dropping the cut solder piece onto a heated lead frame. It was to supply solder supply apparatus
A mounter equipped with a cutting blade tip facing the wall of the receiving block, its
The upper part is close to the cutting blade, and the lower part is separated from the cutting blade.
So that the cut solder pieces are inclined
Solder supply device characterized in that it falls by falling
Mounter with .
JP33938696A 1996-12-19 1996-12-19 Solder supply device and mounter Expired - Fee Related JP3536959B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33938696A JP3536959B2 (en) 1996-12-19 1996-12-19 Solder supply device and mounter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33938696A JP3536959B2 (en) 1996-12-19 1996-12-19 Solder supply device and mounter

Publications (2)

Publication Number Publication Date
JPH10178029A JPH10178029A (en) 1998-06-30
JP3536959B2 true JP3536959B2 (en) 2004-06-14

Family

ID=18326985

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33938696A Expired - Fee Related JP3536959B2 (en) 1996-12-19 1996-12-19 Solder supply device and mounter

Country Status (1)

Country Link
JP (1) JP3536959B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006352058A (en) * 2005-05-20 2006-12-28 Hitachi Chem Co Ltd Method for fixing anisotropic conductive adhesive film, and fixing device

Also Published As

Publication number Publication date
JPH10178029A (en) 1998-06-30

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