JPH0251246B2 - - Google Patents

Info

Publication number: JPH0251246B2
Authority: JP; Japan
Prior art keywords: resin; lead wire; electronic component; insulating plate; tetrafluoroethylene
Prior art date: 1984-05-18
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP10107084A

Other languages

English (en)

Japanese (ja)

Other versions

JPS60245121A (ja

Inventor

Shigeyoshi Iwamoto

Osakuni Ogino

Kinbun Saeki

Takashi Kuribayashi

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Panasonic Holdings Corp

Original Assignee

Matsushita Electric Industrial Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1984-05-18

Filing date

1984-05-18

Publication date

1990-11-06

1984-05-18 Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd

1984-05-18 Priority to JP10107084A priority Critical patent/JPS60245121A/ja

1985-12-04 Publication of JPS60245121A publication Critical patent/JPS60245121A/ja

1990-11-06 Publication of JPH0251246B2 publication Critical patent/JPH0251246B2/ja

Status Granted legal-status Critical Current

Links

WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 16
229920005989 resin Polymers 0.000 claims description 15
239000011347 resin Substances 0.000 claims description 15
BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 10
229920006026 co-polymeric resin Polymers 0.000 claims description 9
238000007789 sealing Methods 0.000 claims description 6
229920001971 elastomer Polymers 0.000 claims description 4
239000005060 rubber Substances 0.000 claims description 4
229920001187 thermosetting polymer Polymers 0.000 claims description 4
QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims description 3
HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 claims description 3
239000000203 mixture Substances 0.000 claims description 3
125000005010 perfluoroalkyl group Chemical group 0.000 claims description 3
229920003048 styrene butadiene rubber Polymers 0.000 claims description 3
229920001897 terpolymer Polymers 0.000 claims description 3
125000006337 tetrafluoro ethyl group Chemical group 0.000 claims description 2
239000003990 capacitor Substances 0.000 description 20
229910052782 aluminium Inorganic materials 0.000 description 15
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 15
239000011888 foil Substances 0.000 description 10
229910052751 metal Inorganic materials 0.000 description 4
239000002184 metal Substances 0.000 description 4
229910000679 solder Inorganic materials 0.000 description 4
230000006866 deterioration Effects 0.000 description 3
239000003792 electrolyte Substances 0.000 description 3
238000000034 method Methods 0.000 description 3
238000007788 roughening Methods 0.000 description 3
239000000853 adhesive Substances 0.000 description 2
230000001070 adhesive effect Effects 0.000 description 2
238000007743 anodising Methods 0.000 description 2
239000006071 cream Substances 0.000 description 1
230000000694 effects Effects 0.000 description 1
239000000463 material Substances 0.000 description 1
238000000016 photochemical curing Methods 0.000 description 1
239000003566 sealing material Substances 0.000 description 1
238000005476 soldering Methods 0.000 description 1
238000003466 welding Methods 0.000 description 1
238000004804 winding Methods 0.000 description 1

Landscapes

Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

JP10107084A 1984-05-18 1984-05-18 電子部品 Granted JPS60245121A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP10107084A JPS60245121A (ja)	1984-05-18	1984-05-18	電子部品

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP10107084A JPS60245121A (ja)	1984-05-18	1984-05-18	電子部品

Publications (2)

Publication Number	Publication Date
JPS60245121A JPS60245121A (ja)	1985-12-04
JPH0251246B2 true JPH0251246B2 (de)	1990-11-06

Family

ID=14290839

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP10107084A Granted JPS60245121A (ja)	1984-05-18	1984-05-18	電子部品

Country Status (1)

Country	Link
JP (1)	JPS60245121A (de)

1984
- 1984-05-18 JP JP10107084A patent/JPS60245121A/ja active Granted

Also Published As

Publication number	Publication date
JPS60245121A (ja)	1985-12-04

Legal Events

Date	Code	Title	Description
2004-05-18	EXPY	Cancellation because of completion of term

Publication	Publication Date	Title
JPS60245115A (ja)	1985-12-04	アルミ電解コンデンサ
JPS60245116A (ja)	1985-12-04	アルミ電解コンデンサ
JPH0251246B2 (de)	1990-11-06
JPH0230170B2 (ja)	1990-07-04	Denshibuhin
JPH0424845B2 (de)	1992-04-28
JPS6357937B2 (de)	1988-11-14
JPH0257696B2 (de)	1990-12-05
JPH0251245B2 (de)	1990-11-06
JPH0249530B2 (ja)	1990-10-30	Denshibuhin
JPH0251247B2 (de)	1990-11-06
JPH0310220B2 (de)	1991-02-13
JPH0230171B2 (ja)	1990-07-04	Denshibuhin
JPS59211214A (ja)	1984-11-30	電子部品
JPH0244135B2 (ja)	1990-10-02	Chitsupugataarumidenkaikondensa
JPH0256806B2 (de)	1990-12-03
JPH0249531B2 (ja)	1990-10-30	Denshibuhin
JPH0466375B2 (de)	1992-10-23
JPH026213B2 (de)	1990-02-08
JPH0368530B2 (de)	1991-10-28
JPH0544813B2 (de)	1993-07-07
JPH0459767B2 (de)	1992-09-24
JPS6355206B2 (de)	1988-11-01
JPH0249532B2 (ja)	1990-10-30	Denshibuhin
JPH0614504B2 (ja)	1994-02-23	アルミ電解コンデンサ
JPH0378774B2 (de)	1991-12-16