JPH02244793A - Curing furnace - Google Patents
Curing furnaceInfo
- Publication number
- JPH02244793A JPH02244793A JP6372889A JP6372889A JPH02244793A JP H02244793 A JPH02244793 A JP H02244793A JP 6372889 A JP6372889 A JP 6372889A JP 6372889 A JP6372889 A JP 6372889A JP H02244793 A JPH02244793 A JP H02244793A
- Authority
- JP
- Japan
- Prior art keywords
- conveyer
- printed circuit
- circuit board
- curing furnace
- furnace
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005856 abnormality Effects 0.000 claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 230000002159 abnormal effect Effects 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、プリント基板に電子部品を固定するために、
接着剤またはペースト半田を硬化させる硬化炉に関する
。[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a method for fixing electronic components to a printed circuit board.
This invention relates to a curing furnace for curing adhesive or paste solder.
従来の装置は、プリント基板の焼損のおそれがある場合
における、プリント基板の硬化炉外への緊急搬出手段を
有していなかったに
の種の公知例としては、特開昭６０−１６５７９１号公
報に記載のものなどがある。A conventional device does not have a means for urgently transporting the printed circuit board out of the curing furnace when there is a risk of the printed circuit board being burnt out. These include those listed in .
前記従来装置は、次工程での異常、搬送コンベアの異常
等による硬化炉内でのプリント基板の滞留や、硬化炉内
温度の異常上昇によるプリント基板の焼損については配
慮がさ九でおらず、安全上問題があった。The above-mentioned conventional equipment does not pay much attention to the problem of the printed circuit board staying in the curing furnace due to an abnormality in the next process, abnormality of the conveyor, etc., or burnout of the printed circuit board due to an abnormal rise in the temperature inside the curing furnace. There was a safety issue.
本発明は上記問題点を解決し、安全な硬化炉を提供する
ことを目的とする。The present invention aims to solve the above problems and provide a safe curing furnace.
ＶｔＵを解決するための手段〕
上記目的を達成するために、プリント基板を焼損すると
思われる前記のような異常時には硬化炉内のプリント基
板を硬化炉外に緊急搬出する機能を付加したものである
。Means for solving VtU] In order to achieve the above purpose, a function has been added to emergencyly transport the printed circuit board inside the curing furnace out of the curing furnace in the event of an abnormality such as the one described above that is thought to cause the printed circuit board to burn out. .
プリント基板の左右端部下ｉｆｉを支持して搬送する一
対の搬送コンベアは、前記のようなプリント基板の焼損
のおそれの場合には、前記一対の搬送コンベアが退避し
、前記搬送コンベアの支持をはずれた前記プリント基板
は落下し、硬化炉外に搬出される。このためプリント基
板は焼損することがない。The pair of transport conveyors that support and transport the left and right end lower ifi of the printed circuit board are retracted and removed from the support of the transport conveyor in the case where there is a risk of burnout of the printed circuit board as described above. The printed circuit board falls and is carried out of the curing furnace. Therefore, the printed circuit board will not be burnt out.
以ド、本発明の実施例を図により説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
プリント基板への電子部品は装着は第４図ａ。The electronic components are attached to the printed circuit board as shown in Figure 4a.
ｂに示すような表面実装が主流となっている０表面実装
とは、第４図ａに示すようにプリント基板］Ｏに設けら
れた電極パターン１２にペースト半田１：３を塗布し、
その上に電子部品１１を装着した後加熱し、固定する。0 Surface mounting, in which surface mounting as shown in FIG. 4B is the mainstream, is as shown in FIG.
After mounting the electronic component 11 thereon, it is heated and fixed.
また第４図すに示すように、電極パターン１２を避けた
位置に接着剤１４を塗布した後、電子部品１１を装着し
、前記接着剤１４を加熱硬化した後、別工程で半田付す
る技術である。また、表面実装によれば、従来のように
プリント基板を部品面と半田面に区別する必要がなく１
両面実装が可能となるため、プリント基板１０の搬送コ
ンベアも第２図に示すように、基準側コンベア１、移動
側コンベア２の一対で構成し、プリント基板ＩＯの端部
下面を支持して搬送するコンベアが多く用いられている
。Further, as shown in FIG. 4, a technique in which the adhesive 14 is applied to a position avoiding the electrode pattern 12, the electronic component 11 is mounted, the adhesive 14 is heated and hardened, and then soldered in a separate process. It is. In addition, with surface mounting, there is no need to distinguish between the component side and the solder side of the printed circuit board as in the past.
Since double-sided mounting is possible, the conveyor for carrying the printed circuit board 10 is also composed of a pair of reference side conveyor 1 and moving side conveyor 2, as shown in FIG. 2, to support and convey the lower surface of the end of the printed circuit board IO. conveyors are often used.
本硬化炉の搬送コンベアは第１図に示すようにプリント
基板１０の搬送基準となる基準側コンベア１と、プリン
ト基板１０の幅にあわせて調整’ｉｊｌ能な移動側コン
ベア２の一対により構成され、第２図ａに示すようにプ
リント基板１ｏの端部下面を支持して搬送している。ま
た硬化炉内には航記一対の搬送コンベアの上Ｆにヒータ
（図示せず）が設けてあり、これによりプリント基板１
ｏに塗布したペースト半田、または接着剤を加熱硬化さ
せ、電子部品を固定する。ここで、次工程でのトラブル
や、搬送コンベアの異常により、硬化炉内にプリント基
板１０が滞留した場、ヒータの電源を切っても装置の熱
容泄が大きく、硬化炉内の温度はなかなか下がらないた
めプリント基板１ｏの焼損のおそれがある。また、硬化
炉内の熱気を硬化炉外に放出するのは安全上問題がある
。そこで本発明による硬化炉では、前記のような異常を
検知した場合、第２図すに示すように移動側コンベア２
が基準側コンベア１から遠ざかる方向に移動する。これ
により、基準側コンベア１、移動側コンベア２の支持か
らはずれたプリント基板１０は、基準側コンベア１、移
動側コンベア２の下部に設けられた基板搬出スロープ３
上に落下し、基板搬出スロープ３をったって硬化炉外に
搬出される。As shown in FIG. 1, the conveyor of this curing furnace is composed of a pair of reference side conveyor 1, which serves as a reference for conveying the printed circuit board 10, and a moving side conveyor 2, which can be adjusted according to the width of the printed circuit board 10. , as shown in FIG. 2a, the printed circuit board 1o is transported while supporting the lower surface of the end thereof. In addition, a heater (not shown) is provided in the curing furnace above the pair of transport conveyors, which allows the printed circuit boards to
Heat and harden the paste solder or adhesive applied to o to fix the electronic component. Here, if the printed circuit board 10 remains in the curing furnace due to a trouble in the next process or an abnormality in the conveyor, the temperature inside the curing furnace will be low even if the heater power is turned off because the heat loss from the equipment will be large. Since it does not go down, there is a risk of burning out the printed circuit board 1o. Furthermore, there is a safety problem in releasing the hot air inside the curing furnace to the outside of the curing furnace. Therefore, in the curing furnace according to the present invention, when the above-mentioned abnormality is detected, as shown in FIG.
moves in the direction away from the reference side conveyor 1. As a result, the printed circuit board 10 that has been removed from the support of the reference conveyor 1 and the moving conveyor 2 is moved to the board unloading slope 3 provided at the bottom of the reference conveyor 1 and the moving conveyor 2.
The substrate falls to the top and is carried out of the curing furnace up the substrate carrying-out slope 3.
プリント基板１０の支持をはずす他の方法としては、第
３図ａに示すように、通常の運転時には。Another way to unsupport the printed circuit board 10 is during normal operation, as shown in FIG. 3a.
基準側コンベア１、および移動側コンベアＰ２の張力を
、張力調整プーリ４を介しエアシリンダ７で保ち、異常
時には、第３図すに示すように、前記エアシリンダ７に
より保持していた張力を解除し、基準側コンベア１、お
よび移動側コンベア２をたるませる。これにより第２図
Ｃに示すように、プリント基板１０の支持がはずれ、プ
リント基板１０は落下し、基板搬出スロープ３をったっ
て硬化炉外に搬出する、といったものがある。The tension of the reference side conveyor 1 and the moving side conveyor P2 is maintained by the air cylinder 7 via the tension adjustment pulley 4, and in the event of an abnormality, the tension held by the air cylinder 7 is released as shown in Fig. 3. Then, the reference side conveyor 1 and the moving side conveyor 2 are slackened. As a result, as shown in FIG. 2C, the support for the printed circuit board 10 is removed, the printed circuit board 10 falls, and is carried up the board carrying-out slope 3 and out of the curing furnace.
本発明によれば、次工程のトラブルや搬送コンベアの異
常等により、硬化炉内にプリント基板が滞留したり、硬
化炉が異常加熱した場合でも、プリント基板を焼損する
ことがなく、安全上有効である。According to the present invention, even if the printed circuit board stays in the curing furnace or the curing furnace becomes abnormally heated due to trouble in the next process or abnormality in the conveyor, the printed circuit board will not be burnt out and is effective for safety. It is.
第１図は本発明の実施例の搬送コンベアの全体図、第２
図は２本発明の実施例のコンベアの基板搬送方向から見
た断面図、第３図は１本発明の実施例のコンベアの、基
板搬送方向横側から見た断面図、第４図は、表面実装に
よる、プリント基板への電子部品装着方法の説明図であ
る。
１・・・基準側コンベア、２・・・移動側コンベア、３
・・・基板搬出スロープ、４・・・張力調整プーリ、５
・・・プーリ、６・・・駆動プーリ、７・・・エアシリ
ンダ、１０・・・プリント基板、１１・・・電子部品、
１２・・・電極パターン、１３・・・ペースト半田、１
４・・・接着剤。Fig. 1 is an overall view of a conveyor according to an embodiment of the present invention;
Figure 2 is a cross-sectional view of a conveyor according to an embodiment of the present invention viewed from the substrate conveyance direction, Figure 3 is a cross-sectional view of a conveyor according to an embodiment of the present invention viewed from the side in the substrate conveyance direction, and Figure 4 is: FIG. 2 is an explanatory diagram of a method for mounting electronic components on a printed circuit board by surface mounting. 1... Reference side conveyor, 2... Moving side conveyor, 3
... Board unloading slope, 4... Tension adjustment pulley, 5
... Pulley, 6... Drive pulley, 7... Air cylinder, 10... Printed circuit board, 11... Electronic component,
12... Electrode pattern, 13... Paste solder, 1
4...Adhesive.
Claims (1)
子部品を装着したプリント基板を、一対の搬送コンベア
により搬送しながら加熱し、前記接着剤またはペースト
半田を硬化させる硬化炉において、前記プリント基板の
搬送異常や炉内の異常加熱などの異常時に、前記搬送コ
ンベアを退避させ、前記プリント基板を炉外に搬出する
ことを特徴とする硬化炉。1. A printed circuit board to which an adhesive or paste solder has been applied in advance and electronic components mounted thereon is heated while being transported by a pair of conveyors, and the adhesive or paste solder is cured in a curing furnace. A curing furnace characterized in that, in the event of an abnormality such as abnormal heating inside the curing furnace, the conveyor is evacuated and the printed circuit board is carried out of the furnace.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6372889A JPH02244793A (en) | 1989-03-17 | 1989-03-17 | Curing furnace |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6372889A JPH02244793A (en) | 1989-03-17 | 1989-03-17 | Curing furnace |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02244793A true JPH02244793A (en) | 1990-09-28 |
Family
ID=13237753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6372889A Pending JPH02244793A (en) | 1989-03-17 | 1989-03-17 | Curing furnace |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02244793A (en) |
-
1989
- 1989-03-17 JP JP6372889A patent/JPH02244793A/en active Pending
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