JPS6384767A - Reflow furnace - Google Patents
Reflow furnaceInfo
- Publication number
- JPS6384767A JPS6384767A JP23263786A JP23263786A JPS6384767A JP S6384767 A JPS6384767 A JP S6384767A JP 23263786 A JP23263786 A JP 23263786A JP 23263786 A JP23263786 A JP 23263786A JP S6384767 A JPS6384767 A JP S6384767A
- Authority
- JP
- Japan
- Prior art keywords
- endless
- belt
- preheating
- main heating
- transfer belt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 40
- 238000001816 cooling Methods 0.000 claims abstract description 12
- 238000005476 soldering Methods 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 229910000679 solder Inorganic materials 0.000 description 14
- 230000007704 transition Effects 0.000 description 7
- 230000005496 eutectics Effects 0.000 description 6
- 239000003292 glue Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Tunnel Furnaces (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（イ）産業上の利用分野
この発明は、ワーク（例えば、プリント基板上面にハン
ダペーストを介してＩＣチップ部品を載置した被ハンダ
付は部材）を無端ベルトにより搬送し、この移送途中に
おいてワークを予備加熱した後に本加熱し、ハンダを溶
融して冷却固化することで基板に部品を実装するりフロ
ー炉に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Industrial application field This invention is a method for transporting a workpiece (for example, a member to be soldered, in which an IC chip component is placed on the top surface of a printed circuit board via solder paste) using an endless belt. However, during this transfer, the workpiece is preheated and then main heated, and the solder is melted and cooled and solidified to mount the components on the board.
（ロ）従来の技術
第６図は、従来使用されているリフロー炉の概略を示す
正面図である。(b) Prior Art FIG. 6 is a front view schematically showing a conventionally used reflow oven.
このリフロー炉は、炉台の前・後部に一対のローラ８１
．８１が配備され、この一対のローラ間に無端ベルト８
２が捲回張設されている。そして、この無端ベルト８２
の上方には往路方向、つまり下流方向へ、順次予備加熱
ヒータ８３、本加熱ヒータ８４及び冷却ファン８５がそ
れぞれ配備されている。This reflow oven has a pair of rollers 81 at the front and rear of the oven stand.
．． An endless belt 81 is provided between the pair of rollers.
2 is wound and stretched. And this endless belt 82
A preheating heater 83, a main heater 84, and a cooling fan 85 are arranged in order in the forward direction, that is, in the downstream direction.
部品のハンダ付けに際しては、伝導手段を介してモータ
に連繋されている後部ローラ（後部回転軸）を回転させ
、無端ベルトを作動させる。そして、ワーク（上面に予
めハンダペーストを配備したプリント基板にＩＣチップ
等の部品を載置したもの）を無端ベルトに配置する。ワ
ークは、無端ベルトにより移送される途中、予備加熱ヒ
ータによって予備加熱、つまりハンダ共晶点（例えば、
スズが６３％では１８２℃）以下の温度で加熱される。When soldering parts, a rear roller (rear rotating shaft) connected to a motor via a transmission means is rotated to operate the endless belt. Then, a workpiece (a printed circuit board on which solder paste has been placed in advance and parts such as an IC chip mounted thereon) is placed on the endless belt. While being transported by the endless belt, the workpiece is preheated by a preheating heater, that is, the workpiece is heated to the solder eutectic point (for example,
When the tin content is 63%, it is heated at a temperature below 182°C.
この予備加熱により、実装される部品の熱毀損が防止さ
れる。続いて、本加熱ヒータによりハンダが共晶点以上
に加熱されて溶融する。その後、冷却ファンによりハン
ダが固化して部品が基板に実装され、ベルト下流側で取
出される。This preheating prevents heat damage to the components to be mounted. Subsequently, the solder is heated to a temperature higher than the eutectic point by the main heater and melted. Thereafter, the solder is solidified by a cooling fan, the component is mounted on the board, and is taken out on the downstream side of the belt.
（ハ）発明が解決しようとする問題点
リフロー炉は、通常、第５図に示すように予備加熱段階
において、約１５０℃乃至１６０℃の温度（ハンダ共晶
点以上）を約６０秒作用させ、本加熱段階においては約
２２０℃乃至２４０℃を上限として、約２００℃程度の
高温（ハンダ共晶点以上）を約１０秒乃至２０秒程度作
用させるように、無端ベルトの移行速度及びヒータ温度
が設定されている。(c) Problems to be Solved by the Invention Reflow ovens normally apply a temperature of about 150°C to 160°C (above the solder eutectic point) for about 60 seconds in the preheating stage, as shown in FIG. In the main heating stage, the transition speed of the endless belt and the heater temperature are set so that a high temperature of about 200°C (above the solder eutectic point) is applied for about 10 to 20 seconds, with an upper limit of about 220°C to 240°C. is set.
ところで、プリント基板に対し実装される部品（ハンダ
付けされる部品）には、例えばセラミックコンデンサ、
セラミックリードレスチップＩＣ等、種々のものがある
。これら実装されるリフロ一部品は、いずれも熱容量が
異なる。By the way, the components mounted on the printed circuit board (components to be soldered) include, for example, ceramic capacitors,
There are various types such as ceramic leadless chip ICs. These reflow parts to be mounted all have different heat capacities.
このため、実装部品のハンダ付けに際しては、各部品の
熱容量に対応して、通常設定の加熱条件を変更する必要
がある。一般に、予備加熱段階では加熱時間が長く、且
つ加熱温度の幅（範囲）に余裕があるため、リフロ一部
品（実装部品）の熱容量に相違があっても、予備加熱の
温度プロファイルは殆ど変化がなく、再設定の必要は少
ない。Therefore, when soldering mounted components, it is necessary to change the normally set heating conditions in accordance with the heat capacity of each component. Generally, in the preheating stage, the heating time is long and the heating temperature has a margin (range), so even if there is a difference in the heat capacity of the reflow parts (mounted parts), the temperature profile of the preheating will hardly change. There is little need for reconfiguration.
しかし、本加熱は、可能な限り短時間の中に作業を終了
する必要がある関係上、リフロ一部品の熱容量によって
本加熱の温度プロファイルが大幅に相違する為、頻繁に
再設定する必要がある。However, since the main heating needs to be completed in the shortest possible time, the temperature profile of the main heating differs greatly depending on the heat capacity of the reflow parts, so it is necessary to reset the settings frequently. .
ところが、従来のりフロー炉では、１本の無端ベルトに
対し予備加熱ヒータと本加熱ヒータとを直列状に配置し
てあり、予備加熱部と本加熱部とを、ワークが等速移行
する構造となっている。従って、実装部品の熱容量に対
応して加熱設定温度を変更調整することが困難である。However, in conventional glue flow furnaces, a preheating heater and a main heating heater are arranged in series with respect to one endless belt, and the workpiece is transferred between the preheating section and the main heating section at a constant speed. It has become. Therefore, it is difficult to change and adjust the heating set temperature in accordance with the heat capacity of the mounted components.
仮に本加熱部の設定条件を満たすために、本加熱部の再
設定を行う時は、本来不要である筈の予備加熱部も再設
定する必要が生じ、この再設定作業に長時間を要し、作
業能率が低下する等の不利があった。If the main heating section is reset in order to meet the setting conditions for the main heating section, it will also be necessary to reset the preheating section, which is originally unnecessary, and this resetting work will take a long time. , there were disadvantages such as decreased work efficiency.
この発明は、従来のものが持つ、以上のような問題点を
解消させ、実装部品の熱容量に応じて簡易に加熱温度の
再設定が実行できるリフロー炉を提供することを目的と
する。It is an object of the present invention to provide a reflow oven that solves the above-mentioned problems of the conventional oven and allows the heating temperature to be easily reset according to the heat capacity of the mounted components.
（ニ）問題点を解決するための手段及び作用この目的を
達成させるために、この発明のりフロー炉は、次のよう
な構成としている。(d) Means and operation for solving the problem In order to achieve this object, the glue flow furnace of the present invention has the following configuration.
リフロー炉は、予備加熱手段を備えた第１の無端搬送帯
と、この第１の無端搬送帯の往路下流側に配置され、本
加熱手段及び冷却手段を備えた第２の無端搬送帯とから
構成されている。The reflow oven includes a first endless conveyance belt equipped with a preheating means, and a second endless conveyance belt disposed downstream of the first endless conveyance belt on the forward path and equipped with a main heating means and a cooling means. It is configured.
このような構成を有するリフロー炉では、予備加熱搬送
帯と本加熱搬送帯とが別機構となっている。従って、予
備加熱側の無端ベルトと本加熱側の無端ベルトとは、そ
れぞれ別個に独立して移送速度を調整し得る。In a reflow oven having such a configuration, the preheating conveyance zone and the main heating conveyance zone are separate mechanisms. Therefore, the transfer speeds of the endless belt on the preheating side and the endless belt on the main heating side can be adjusted separately and independently.
このため、通常の加熱条件に設定しであるリフロー炉を
、実装部品（リフロ一部品）の熱容量に応じて加熱条件
を再設定する場合は、仮に、予備加熱部において再設定
の必要がないとすると、第１の無端搬送帯は通常状態の
ままとし、第２の無端搬送帯（移行速度）及び本加熱手
段の調整をする簡易な作業で、実装部品の熱容量に応じ
た加熱条件を再設定し得る。Therefore, when resetting the heating conditions of a reflow oven that has been set to normal heating conditions according to the heat capacity of the mounted component (reflow part), it is assumed that there is no need to reset the preheating section. Then, by simply adjusting the second endless conveyance belt (transition speed) and the main heating means while leaving the first endless conveyance belt in its normal state, the heating conditions according to the heat capacity of the mounted components can be reset. It is possible.
（ホ）実施例
第１図は、この発明に係るリフロー炉の概略を示す正面
図である。(E) Embodiment FIG. 1 is a front view schematically showing a reflow oven according to the present invention.
リフロー炉１は、鋼材等により枠組みされた炉台中へ予
備加熱手段４を備えた第１の無端搬送帯２と、この第１
の無端搬送帯２の往路下流側に配置され、本加熱手段５
及び冷却手段６を備えた第２の無端搬送帯３とから成る
。The reflow furnace 1 includes a first endless conveyor belt 2 equipped with a preheating means 4 into the furnace frame made of steel or the like;
The main heating means 5
and a second endless conveyor belt 3 equipped with cooling means 6.
第１の無端搬送帯２は、炉台の前部及びほぼ長さ中央部
へ配備した一対のローラ２２．２２間に無端ベルト２１
が捲回張設されて構成されている。The first endless conveyor belt 2 has an endless belt 21 between a pair of rollers 22 and 22 disposed at the front and approximately mid-length of the furnace stand.
It is constructed by winding and stretching.
この一対のローラ２２のうち、例えば後部ローラの回転
軸は、チェノ、ギヤ等の伝導手段を介して駆動モータに
連繋しく図示せず）、無端ベルト２１の移行速度を任意
に調整できるように設定されている。Among this pair of rollers 22, for example, the rotation axis of the rear roller is connected to a drive motor via a transmission means such as a chino, gears, etc. (not shown), and is set so that the moving speed of the endless belt 21 can be adjusted as desired. has been done.
また、無端ベルト２１の上・下部、つまりベルト往路の
上・下部には、予備加熱手段４．４ａが配備しである。Furthermore, preheating means 4.4a are provided above and below the endless belt 21, that is, above and below the forward path of the belt.
予備加熱手段４．４ａは、実施例では赤外線ヒータが使
用され、ワーク（基板７）に対し下方のヒータが伝導に
より、上方のヒータが対流と放射により熱伝達されるよ
うになっている。この予備加熱は、通常はハンダの共晶
点以下、つまり１５０℃乃至１６０℃程度の温度が約６
０程度度作用するように設定しである。As the preheating means 4.4a, an infrared heater is used in the embodiment, and the lower heater transfers heat to the workpiece (substrate 7) by conduction, and the upper heater transfers heat by convection and radiation. This preheating is usually performed at a temperature below the eutectic point of the solder, that is, about 150°C to 160°C.
It is set so that it acts about 0 degrees.
前記第２の無端搬送帯３は、第１の無端搬送帯２より長
さの短い無端ベルト３１が一対のローラ３２．３２間に
捲回張設して構成されている。この第２の無端搬送帯３
は、前記第１の無端搬送帯２の下流側に配備され、無端
ベルト３１が前記無端ベルト２１に対し直線状となるよ
うに、はぼ間断な（接近して配置されている。この第２
の無端搬送帯３は、前記第１の無端搬送帯２と同様に、
後部回転軸（後部ローラ３２）がチェノ、ギヤ等の伝導
手段を介して駆動モータに連繋してあり、移行速度が任
意に変更できるように設定しである。The second endless conveyance belt 3 is constructed by winding an endless belt 31 shorter than the first endless conveyance belt 2 between a pair of rollers 32 and 32. This second endless conveyor belt 3
is disposed on the downstream side of the first endless conveyor belt 2, and is arranged in close proximity to the endless belt 31 so that the endless belt 31 is in a straight line with respect to the endless belt 21.
The endless conveyance belt 3 is similar to the first endless conveyance belt 2,
The rear rotating shaft (rear roller 32) is connected to a drive motor via transmission means such as a chino, gears, etc., and is set so that the transition speed can be changed arbitrarily.
つまり、各搬送帯２．３がそれぞれ別個独立して移行速
度を変位可能とし、且つそれぞれの搬送帯２．３の往路
側が、同一方向へ移行するように設定されている。In other words, each conveyance belt 2.3 is configured to be able to change the transfer speed independently, and the outbound side of each conveyance belt 2.3 is set to move in the same direction.
この第２の無端搬送帯３の上方には、往路側へ本加熱手
段５及び冷却手段６が順次配備されている。本加熱手段
５は、実施例では、ハロゲン化金属ランプ５１と熱風フ
プン５２とを使用している。Above this second endless conveyance belt 3, a main heating means 5 and a cooling means 6 are sequentially arranged on the forward path side. In this embodiment, the heating means 5 uses a metal halide lamp 51 and a hot air futon 52.
この本加熱は、通常は２２０℃乃至２４０℃を上限とし
て、約２００℃程度の温度（ハンダの共晶点以上）を約
１０秒乃至２０秒程度作用させるように設定されている
。また、前記冷却ファン６は設定風量が変更可能に配備
されている。This main heating is usually set to apply a temperature of about 200°C (above the eutectic point of the solder) for about 10 to 20 seconds, with an upper limit of 220°C to 240°C. Further, the cooling fan 6 is arranged so that the set air volume can be changed.
このような構成を有するリフロー炉により、ハンダ付け
を行う場合は、第２図に示すように、第１の無端搬送帯
２に複数のワーク、つまりプリント基板７が適当間隔を
開いて載置される（第２図参照）。When soldering is performed using a reflow oven having such a configuration, as shown in FIG. (See Figure 2).
基板７の配線パターン７１には、第３図の拡大平面図及
び第４図の側面図で示すように、予めＩＣチップ７２を
載せる部分にハンダペースト７３が配備してあり、この
ハンダペースト７３を介して基板配線パターン７１にＩ
Ｃチップ７２が配置しである。As shown in the enlarged plan view of FIG. 3 and the side view of FIG. 4, the wiring pattern 71 of the board 7 is provided with solder paste 73 in advance at the portion on which the IC chip 72 is to be placed. I to the board wiring pattern 71 through
A C chip 72 is arranged.
今、第１の無端搬送帯２及び第２の無＠搬送帯３を駆動
し、共に同一方向へ移行動作させ、且つ予備加熱手段（
赤外線ヒータ）４及び本加熱手段（ハロゲンランプ）５
に電源を印加する。通常は、第５図に示すように、予備
加熱が１５０℃乃至１６０℃を６０秒間作用させ、本加
熱が２２０℃乃至２４０℃を上限として約２００℃程度
の温度を１０秒乃至２０秒間作用させるように、加熱手
段４．５及び無端ベルト２１．３１が設定されている。Now, the first endless conveyance belt 2 and the second endless conveyance belt 3 are driven so that they both move in the same direction, and the preheating means (
infrared heater) 4 and main heating means (halogen lamp) 5
Apply power to. Usually, as shown in Figure 5, preheating is performed at 150°C to 160°C for 60 seconds, and main heating is performed at a temperature of approximately 200°C for 10 seconds to 20 seconds, with an upper limit of 220°C to 240°C. The heating means 4.5 and the endless belt 21.31 are set up as follows.
ハンダ付けに際し、上流側から基板７を無端ベルト２１
に順次、載置する。基板７は、無端ベルト２１により第
２無＠搬送帯３方向（往路側下流方向）へ移送され、こ
の移送途中で赤外線ヒータ４．４ａにより予備加熱され
る。これにより、基板に実装されるコンデンサ、ＩＣチ
ップ等の部品の熱毀損が防止され、且つ基板（アルミナ
セラミック基板）７におけるリフローハンダの良好な流
れ性が確保される。When soldering, the board 7 is connected to the endless belt 21 from the upstream side.
will be placed in sequence. The substrate 7 is transferred by the endless belt 21 in the direction of the second non-conveying belt 3 (downstream direction on the outward path side), and is preheated by the infrared heater 4.4a during this transfer. This prevents heat damage to components such as capacitors and IC chips mounted on the board, and ensures good flowability of reflow solder on the board (alumina ceramic board) 7.
予備加熱を終了した基板７は、無端ベルト２１と直線状
に殆ど間断なく配置された第２の無端搬送帯３（無端ベ
ルト３１）に移行し、この無端ベル）３１上を往路側へ
移行する。この移行途中で、基板７はハロゲンランプ５
１及び熱風ファン５２による放熱線を受け、基板７上の
ハンダ７３が溶融する。そして、この状態で移行する基
板７が冷却ファン６によって急冷され、ハンダ７３が固
化して基板７に部品（ＩＣチップ）７２が実装される。After the preheating, the substrate 7 moves to the second endless conveyance belt 3 (endless belt 31), which is arranged almost continuously in a straight line with the endless belt 21, and moves on this endless belt 31 to the outward path side. . During this transition, the board 7 is connected to the halogen lamp 5.
The solder 73 on the board 7 is melted by the heat radiation from the hot air fan 1 and the hot air fan 52. Then, the board 7 transferred in this state is rapidly cooled by the cooling fan 6, the solder 73 is solidified, and the component (IC chip) 72 is mounted on the board 7.
仮に、実装される部品７２の熱容量、殊に本加熱におけ
る熱容量が特異なものである時は、通常の加熱設定条件
を変更する必要がある。この時、仮に予備加熱部におけ
る予備加熱条件の再設定が必要でないとすれば、第１の
無端搬送帯２は、通常設定を保持し、第２の無端搬送帯
３の無端ベルト３１移行速度のみを変更させる。これに
より、本加熱の通常設定条件を、部品７２の熱容量に対
応した加熱設定条件に変更（再設定）することができる
。尚、実装される部品によっては、予備加熱条件も再設
定する必要がある場合もある。この場合においても、予
備加熱の第１の無端搬送帯と、本加熱の第２の無端搬送
帯とが別個独立して移行速度を変更し得るから、相互に
再調整の影響を受けず、簡易迅速に再調整作業が達成で
きる。If the heat capacity of the component 72 to be mounted, especially the heat capacity during main heating, is unique, it is necessary to change the normal heating setting conditions. At this time, if it is not necessary to reset the preheating conditions in the preheating section, the first endless conveyance belt 2 will maintain the normal setting, and only the endless belt 31 transition speed of the second endless conveyance belt 3 will be maintained. change. Thereby, the normal setting conditions for main heating can be changed (reset) to heating setting conditions corresponding to the heat capacity of the component 72. Note that, depending on the components to be mounted, the preheating conditions may also need to be reset. In this case as well, the transition speeds of the first endless conveyor belt for preheating and the second endless conveyor belt for main heating can be changed separately and independently, so that they are not affected by readjustment of each other and can be easily Readjustment work can be accomplished quickly.
（へ）発明の効果
この発明では、以上のように、ワークを搬送する搬送機
構を予備加熱用の第１の無端搬送帯と、本加熱用の第２
の無端搬送帯とに分断し、各無端搬送帯の移行速度を別
個独立して調整可能に配備することとした。(f) Effects of the Invention In this invention, as described above, the transport mechanism for transporting the workpiece includes a first endless transport belt for preheating and a second endless transport belt for main heating.
The system is divided into two endless conveyance belts, and the transfer speed of each endless conveyance belt can be adjusted separately and independently.
この発明によれば、予備加熱は第１の無端搬送帯で実行
され、本加熱は第２の無端搬送帯で行われる。従って、
実装部品の熱容量に応じて通常設定の加熱条件を変更す
る場合には、第１の無端搬送帯と第２の無端搬送帯の移
行速度を、それぞれ別個独立して変更し得、両無端搬送
帯の変更が相互に影響することがない。このため、極め
て合理的且つ迅速に設定条件の変更がなし得、高品質の
製品を効率よく量産できる等、発明目的を達成した優れ
た効果を有する。According to the invention, preheating is performed in the first endless conveyor belt, and main heating is performed in the second endless conveyor belt. Therefore,
When changing the normally set heating conditions according to the heat capacity of the mounted components, the transition speeds of the first endless conveyance belt and the second endless conveyance belt can be changed separately and independently, and both endless conveyance belts changes do not affect each other. Therefore, the setting conditions can be changed extremely rationally and quickly, and high-quality products can be efficiently mass-produced, which is an excellent effect of achieving the purpose of the invention.
第１図は、実施例リフロー炉の概略を示す正面図、第２
図は、無端搬送帯にワークを載置した状態を示す平面図
、第３図は、ワークの拡大平面図、第４図は、ワークの
断面図、第５図は、リフロー炉の加熱設定温度曲線を示
すグラフ、第６図は、従来のりフロー炉の概略を示す正
面図である。
１：リフロー炉、 ２：第１無端搬送帯、３：第２無
端搬送帯、４・４ａ：予備加熱手段、５８本加熱手段、
６：冷却ファン。
特許出願人 株式会社島津製作所代理人
弁理士 中 村 茂 信第２図
第３図
第４１！１
第５図
Ｘルト將勧時間Fig. 1 is a front view schematically showing the reflow oven of the embodiment;
The figure is a plan view showing the workpiece placed on the endless conveyor belt, Figure 3 is an enlarged plan view of the workpiece, Figure 4 is a sectional view of the workpiece, and Figure 5 is the heating setting temperature of the reflow oven. The graph showing the curve, FIG. 6, is a front view schematically showing a conventional glue flow furnace. 1: Reflow oven, 2: First endless conveyance belt, 3: Second endless conveyance belt, 4/4a: Preheating means, 58 heating means,
6: Cooling fan. Patent applicant: Shimadzu Corporation Agent
Patent Attorney Shigeru Nakamura Figure 2 Figure 3 Figure 41!1 Figure 5
Claims (1)
第１の無端搬送帯の往路下流側に配置され、本加熱手段
及び冷却手段を備えた第２の無端搬送帯とから成るリフ
ロー炉。(1) Consisting of a first endless conveyance belt equipped with a preheating means, and a second endless conveyance belt disposed on the downstream side of the first endless conveyance belt on the outgoing path and equipped with a main heating means and a cooling means. Reflow furnace.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23263786A JPS6384767A (en) | 1986-09-29 | 1986-09-29 | Reflow furnace |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23263786A JPS6384767A (en) | 1986-09-29 | 1986-09-29 | Reflow furnace |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6384767A true JPS6384767A (en) | 1988-04-15 |
Family
ID=16942419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23263786A Pending JPS6384767A (en) | 1986-09-29 | 1986-09-29 | Reflow furnace |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6384767A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02263569A (en) * | 1989-04-03 | 1990-10-26 | Hitachi Ltd | Heating furnace |
| JPH038564A (en) * | 1989-06-03 | 1991-01-16 | Eiteitsuku Tekutoron Kk | Method and device for reflow soldering |
| JPH0335869A (en) * | 1989-07-04 | 1991-02-15 | Furukawa Electric Co Ltd:The | Reflow furnace |
| CN112589308A (en) * | 2020-12-18 | 2021-04-02 | 芜湖德纳美半导体有限公司 | Diode vacuum welding device |
| CN114083080A (en) * | 2022-01-20 | 2022-02-25 | 江苏华讯电子技术有限公司 | Reflow soldering device for smt |
-
1986
- 1986-09-29 JP JP23263786A patent/JPS6384767A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02263569A (en) * | 1989-04-03 | 1990-10-26 | Hitachi Ltd | Heating furnace |
| JPH038564A (en) * | 1989-06-03 | 1991-01-16 | Eiteitsuku Tekutoron Kk | Method and device for reflow soldering |
| JPH0335869A (en) * | 1989-07-04 | 1991-02-15 | Furukawa Electric Co Ltd:The | Reflow furnace |
| CN112589308A (en) * | 2020-12-18 | 2021-04-02 | 芜湖德纳美半导体有限公司 | Diode vacuum welding device |
| CN114083080A (en) * | 2022-01-20 | 2022-02-25 | 江苏华讯电子技术有限公司 | Reflow soldering device for smt |
| CN114083080B (en) * | 2022-01-20 | 2022-03-29 | 江苏华讯电子技术有限公司 | Reflow soldering device for smt |
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