JPH02244700A - Mounting of electronic component - Google Patents
Mounting of electronic componentInfo
- Publication number
- JPH02244700A JPH02244700A JP1064885A JP6488589A JPH02244700A JP H02244700 A JPH02244700 A JP H02244700A JP 1064885 A JP1064885 A JP 1064885A JP 6488589 A JP6488589 A JP 6488589A JP H02244700 A JPH02244700 A JP H02244700A
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- series
- electronic component
- lead wires
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 9
- 238000005452 bending Methods 0.000 abstract description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 13
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920000742 Cotton Polymers 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- OWNRRUFOJXFKCU-UHFFFAOYSA-N Bromadiolone Chemical compound C=1C=C(C=2C=CC(Br)=CC=2)C=CC=1C(O)CC(C=1C(OC2=CC=CC=C2C=1O)=O)C1=CC=CC=C1 OWNRRUFOJXFKCU-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、電子部品のプリント基板への実装方法に関
し、特に電子部品を各種のプリン１−５板に効率的に実
装する手段に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for mounting electronic components onto a printed circuit board, and particularly to a means for efficiently mounting electronic components onto various printed circuit boards 1-5.
一般にプリント基板に電子部品を実装置る場合、特に自
動実装する場合は、先ず、紙等からなる帯状の基体部に
複数の電子部品を一定の間隔で配置するとともに、基体
部と電子部品のリード線とを粘着テープ等で固定した１
、いわゆるテーピングと呼ばれる電子部品連を形成する
。次いで、この電子部品連をリール等を介して一連に供
給するとともに、リード線の一部を切断して、電子部品
本体を電子部品連から分離させ、個々の電子部品をプリ
ント基板に連続的に搭載して半田付けを施している。Generally, when mounting electronic components on a printed circuit board, especially when mounting them automatically, first, multiple electronic components are arranged at regular intervals on a strip-shaped base made of paper, etc., and leads between the base and the electronic components are placed. 1. Fixed the wire with adhesive tape etc.
, forming a series of electronic components called taping. Next, this series of electronic components is supplied in series via a reel, etc., and a part of the lead wire is cut to separate the electronic component body from the series of electronic components, and the individual electronic components are successively attached to a printed circuit board. It is installed and soldered.
あるいは、スルーホールが形成されていないプリント基
板に実装するいわゆる表面実装の場合、個別の電子部品
には突出するリード線がないため、前記のような電子部
品連を形成することはできない。そのため一般には、電
子部品を収納する凹部が一定の間隔で形成された、合成
樹脂等からなる帯状の基体部に電子部品を収納し、凹部
開口部を樹脂テープで覆って電子部品連を形成している
。Alternatively, in the case of so-called surface mounting in which electronic components are mounted on a printed circuit board without through-holes, it is not possible to form a series of electronic components as described above because individual electronic components do not have protruding lead wires. Therefore, in general, electronic components are housed in a band-shaped base made of synthetic resin, etc., in which recesses for storing electronic components are formed at regular intervals, and the openings of the recesses are covered with resin tape to form a series of electronic components. ing.
このような電子部品連を利用してプリントｇ板に実装す
る場合は、電子部品連の凹部開口部を覆っている樹脂テ
ープを剥離し２、電子部品を吸引ノズル等により把持し
て移送し−（いる。When mounting such an electronic component chain on a printed G board, peel off the resin tape covering the recessed opening of the electronic component chain 2, and transfer the electronic component by gripping it with a suction nozzle or the like. (There is.
従来の実装方法では、２多くの場合、電子部品庫体を各
種のプリント基板あるいはその配線ピンチに適合させる
ため、電子部品のリー ド線を“ｒめ加工し、この電子
部品を帯状の基体部に配置し２て前記の電子部品連とし
ていた。In conventional mounting methods, in many cases the lead wires of the electronic components are rounded and the electronic components are mounted on a strip-shaped base in order to make the electronic component storage body compatible with various printed circuit boards or their wiring pinches. 2 and the above-mentioned electronic parts series.
あるいは、表面実装する場合は、表向実装に適合する電
子部品を予め製造し７、ごの電子部品による電ｆ一部品
連・全形成する必要：があ−、、 ノ：：。Alternatively, in the case of surface mounting, it is necessary to manufacture electronic components compatible with surface mounting in advance, and then to form one part and all parts using each electronic component.
そのため、一連の電子部品連には、リード線間の距離、
形状等が全て同一・に加工された電−ｆ’、、、、 ０
３品が配置されることになる。したがって、例えばリー
ド線間の距離が一定のプリン１−５扱等に人Ｖに実装す
るには適当だが、同一のプリント基板」、−でリード線
間距離が異なる場合は、別の電子部品連を用意する必要
があり実装工程が煩雑になってｊ７まう。Therefore, for a series of electronic components, the distance between the lead wires,
Electron-f', processed to have the same shape, etc.,...0
Three items will be placed. Therefore, for example, it is suitable for mounting on a PC board 1-5 where the distance between the lead wires is constant, but if the distance between the lead wires on the same printed circuit board is different, This makes the mounting process complicated and complicated.
また、電子部品を表面実装する場合は、電子部品自体を
表向実装に適合する形状にする必要がある。そのために
、特殊な形態の電子部品を製造することが必要になると
ともに、１１〕記のような合成樹脂等からなる特殊なテ
ーピングが必要となり、電子部品自体の製造″ｚストお
よびチー・ピングコストの増大を招くほか、電子部品連
の四部開Ｌ１部を覆っている樹脂う−−ブを引き剥がず
ための特殊な実装装置１．工程等を必要とし７ている。Furthermore, when surface mounting electronic components, the electronic components themselves need to be shaped to be suitable for surface mounting. For this purpose, it is necessary to manufacture electronic components with a special shape, and special taping made of synthetic resin, etc. as described in 11) is also required, which reduces the cost and cost of manufacturing the electronic components themselves. In addition to this, a special mounting device and process are required to prevent the resin web covering the four-part opening L1 of the electronic component series from being peeled off.
この発明の目的は、電−ｒ部品を、一連の電子部品連で
連ｖｔ的Ｑ；−供給し７−リつ各種のプリン１基板乙、
二対応させることにある。The purpose of this invention is to supply electrical parts in a series of electronic parts to various types of printed circuit boards,
There are two things to do.
（課題を解決するためのＦ段〕
この発明は、４帯状の基体部に電子部品のリード線を載
置して、複数の電子部品を−・定の間隔で配置するとと
もに、基体部およびリード線に帯状の粘着テープを貼着
しまた電子部品連を連続的に供給し この電子部品連の
−または一以上の電子部品本体を固持した状態で、リー
ド線を切断するとともに所望の形状に加］−シ、そのの
ぢこの電子部品を所望のプリント基板乙こ実装すること
を１、〜（牧としている。(Step F for solving the problem) This invention places lead wires of electronic components on a four-band-shaped base, arranges a plurality of electronic components at regular intervals, and A band-shaped adhesive tape is attached to the wire, and a string of electronic components is continuously supplied, and the lead wire is cut and shaped into a desired shape while one or more electronic component bodies of the string of electronic components are held firmly. 1. ~(Maki) is to mount the electronic components on the desired printed circuit board.
〔作 用］
図面に示したように、各電子部品１のリート線６は、こ
のリード線６を切断して電ｔ一部品１を電子部品連２か
ら分離する際に、所望のプリンｌ−５仮１１．１３の配
線パターン乙こ適合するように加工゛されるため、電子
部品連２を形成Ｖる隙に；：Ｌ、ｔめリー１°線６を力
叶〕二する必要がなくなる。[Function] As shown in the drawings, when the lead wire 6 of each electronic component 1 is cut to separate the electronic component 1 from the electronic component series 2, a desired print l- 5. Since it is processed to fit the wiring pattern B of 11.13, there is no need to force the wire 6 of the L and t lines during the formation of the electronic component series 2. .
また、電子部品連２庖供給する際には、電子部品１が実
装されるプリント）ｖ板１１．、１３のスルーホール１
２間の距離、形状１．形成等Ｏごかかτ）り苫く連の電
子部品連２を連続的に供給するごとができるようになる
。In addition, when supplying two sets of electronic components, the printed V board 11 on which the electronic components 1 are mounted. , 13 through holes 1
Distance between 2, shape 1. This makes it possible to continuously supply a series of electronic components 2 that have been formed, etc. for a long time.
ずなわら、一連の電子部品連２内４Ｃお；・Ｊる個々の
電子部品１の仕様は実質的に一様ではなくなり、プリン
ト基板１１．１．３に対応した電−を部品１を個別に供
給することができる。したがって、同一プリント基板１
１．１３上での仕様の異なる実装条件２こ対しても、同
一・の電ｆ一部品連２を利用して連’ｆｇｊＣ的６、′
対応させることができるようなる。However, the specifications of the individual electronic components 1 in the series of electronic components 2 are no longer substantially uniform, and the components 1 are individually can be supplied to Therefore, the same printed circuit board 1
Even for two mounting conditions with different specifications on 1.13, the same electric f1 part series 2 can be used to create a series 'fgjC6,'
You will be able to make it compatible.
〔実施例］ 次いでこの発明の実施例を図面にしたがい説明す−る。〔Example] Next, embodiments of the invention will be described with reference to the drawings.
第１しＪ （ａ）、（ｂ）および（Ｃ）は、この発明の
第１の実施例による実装」１程を説明する丁ｌ程説明図
、第２図は、第１の実施例により電子部品をプリント基
板に実装する状態を説明する部分断面図である。また第
３図は、この発明の第２の実施例により電で部品をプリ
ント）５板に実装する状態を示す部分断面図である。1. (a), (b), and (C) are explanatory diagrams for explaining step 1 of the implementation according to the first embodiment of the present invention, and FIG. FIG. 3 is a partial cross-sectional view illustrating a state in which electronic components are mounted on a printed circuit board. Further, FIG. 3 is a partial sectional view showing a state in which parts are electronically mounted on a printed board according to a second embodiment of the present invention.
電子部品１、例えば電解コンデンサは、第１図（ａ）に
ポしたように、同一の端面に複数のリード線６を具備し
ている。この電子部品１を紙等からなる帯状の基体部３
にリード線６をｉｌ ｊｉｆｆさせて一定の間隔で複数
個載置Ｖる。更に、基体部３およびリード綿６上６ご、
基体部３よりも幅の狭い粘着テープ４を貼付して電ｒ一
部品１を２．夕体部３に同前し、電子部品連２を得る。The electronic component 1, for example, an electrolytic capacitor, has a plurality of lead wires 6 on the same end surface, as shown in FIG. 1(a). This electronic component 1 is connected to a strip-shaped base portion 3 made of paper or the like.
A plurality of lead wires 6 are jiffed and placed at regular intervals. Furthermore, the base portion 3 and the upper lead cotton 6,
An adhesive tape 4 having a width narrower than the base portion 3 is pasted to electrically connect the parts 1 and 2. At the same time as the evening body part 3, I got the electronic parts series 2.
この電子部品連２は、例えば、図示しないリール等にを
回することができ、プリン［・ｗ仮１１△、の実装丁、
稈シこ一体として搬ｊＡする。This electronic component chain 2 can be rotated, for example, on a reel (not shown), and the mounting plate of the pudding [・w temporary 11△,
The culm is transported as a whole.
実装工程においては、リール等から供給される電子部品
連２４：、送り孔５を介ξ７て順次移送する。In the mounting process, the electronic component series 24 supplied from a reel or the like are sequentially transferred through the feed hole 5 through ξ7.
そして、第１図（ｌ”））に示すように、１個もし２く
は２個以上−の電子部品ｊをチャック７等で把持イ゛る
とともに、Ａ、Ａ“間ごリード線（ｊを切断して電子部
品連２から個々の電子部品１を分離させる。Then, as shown in FIG. The individual electronic components 1 are separated from the electronic component series 2 by cutting.
次いで、電子部品連２から独立した個々の電４′・部品
１を、第１図（Ｃ）に示すように、前記」−ヤンク７等
で引き続き固持したまま９、折曲げ治具８により、リー
ド線６に折曲げ加工を施−４゜どの折曲げ加工では、冶
ｊ！８ａが−１一方向に移動してリード綿６をりノ、げ
、次いご治具８１）が横方向（、こ移動してリート線６
間の距離を決定値−る。このリード線（１間の距離は、
第２図に示しまたこの電子部品１が実装されるプリント
基板１１のスルーホール１２間の距離に適合させている
。Next, as shown in FIG. 1(C), the individual electrical components 4' and components 1 that are independent of the electronic component series 2 are held in place by the yank 7, etc. 9, and bent using the bending jig 8. The lead wire 6 is bent by 4 degrees. 8a moves in the -1 direction and pulls the lead wire 6, then the jig 81) moves in the lateral direction (and moves the lead wire 6
Determine the distance between. The distance between this lead wire (1) is
It is shown in FIG. 2 and is adapted to the distance between through holes 12 of a printed circuit board 11 on which this electronic component 1 is mounted.
更に、第２図に示したよ・）に、リード線６を加工した
電子部品１をチャック７等により移送し、プリント基板
１１に搭載し”で、リード線６をスルーホール１２に挿
通させるとともに半「）］付１する。Furthermore, as shown in FIG. ``)] Add 1.
この実施例の場合、電子部品１のリー ド線〔；は、こ
の電子部品１をプリンｌ−基板１１に実装する直１１（
■に、スルーホール１２に適合づる、１、う加工される
。In the case of this embodiment, the lead wires of the electronic component 1 [; are the direct wires 11 (;
(1) Processing is performed to fit the through hole 12.
そのため、例えばプリン）５板１１上に異なる距離のス
ルーホール１２がある場合でも、電子部品１を分離（，
７だ後にリード線６を加１−゛することができるので、
電子部品連２全体を別の電子部品連と交換する必要がな
い。Therefore, even if there are through holes 12 of different distances on the board 11, for example, the electronic component 1 can be separated (,
Since the lead wire 6 can be added after 7,
There is no need to replace the entire electronic component series 2 with another electronic component series.
なお、個々の電子部品１の移送手段としてのチャ、り７
のほか、折曲げ治具８等は、公知の力青去、装置をぞの
まま流用Ｊることができる。また、移送］−段としては
、吸着ノズル等を利用することもできる。Note that the carriage 7 serves as a means of transporting the individual electronic components 1.
In addition, the bending jig 8, etc., can be used as is with known bending equipment. Furthermore, a suction nozzle or the like may be used as the transfer stage.
次いでこの発明の第２の実施例について説明する。第３
図は、この発明の第２の実施例により電子部品をプリン
ト基板に実装する状態を示す部分断面図である。Next, a second embodiment of the invention will be described. Third
The figure is a partial sectional view showing a state in which electronic components are mounted on a printed circuit board according to a second embodiment of the present invention.
電子部品連２は、第１図に示した第１の実施例と同様、
紙等からなる帯状の基体部３に、端面からり−・ド線１
０が突出している電子部品９を、一定の間隔で均数配万
Ｊ”るととも乙こ、基体部ｊ３４゛勇１びＪ−Ｆ線１０
を粘着テープ４で固着しで形成し７ている。そして、こ
の電！一部品連２をリール等に巻回し７て実装］二枚に
移送する。The electronic component series 2 is similar to the first embodiment shown in FIG.
A strip-shaped base portion 3 made of paper or the like is provided with a wire 1 from the end surface.
Electronic components 9 with protruding numbers 0 are evenly distributed at regular intervals.
is fixed with adhesive tape 4 and formed 7. And this electricity! One part series 2 is wound onto a reel or the like and transferred to two sheets.
次いで、リール等から電子部品連２とし７て供給された
電子部品９を、第１の実施例と同様、チャック７等で把
持するとともに、リード線１０を切［す１して電子部品
連２から分離させる。更にこの電子部品９を、１１１１
記チャック７等ご把持した状態のままリード線１０を折
り曲げ、第（３図に小し５たよ・）な電子部品９を１：
ｉる。この実施例においてり−１・゛線１０は、その−
８’ｔｌＫを電子部品１〕の端１ｆｆｉｊの一部とほぼ
平行になるように摺り曲げている。Next, the electronic components 9 supplied from a reel or the like as the electronic component series 2 are gripped by the chuck 7 or the like, and the lead wires 10 are cut off and the electronic component series 2 is held. Separate from. Furthermore, this electronic component 9 is 1111
Bend the lead wire 10 while holding the chuck 7, etc., and attach the electronic component 9 shown in Fig. 3.
iru. In this example, the −1·′ line 10 is
8'tlK is bent so as to be almost parallel to a part of the end 1ffij of the electronic component 1].
史に、この電子部品９を引き続きチャ、り７で移送し、
第３図にボし、たような、スルーポールのないプリント
基板１３乙こ表向実装する。Historically, this electronic component 9 was subsequently transferred by car 7,
A printed circuit board 13 without through poles, as shown in FIG. 3, is mounted face-up.
この実施例ごば、電子部品９のり〜ド線１０を、その一
部が電ｆ一部品ｆ］の端ｔＩＩＩとほぼ平行Ｑごなるよ
うに折り曲げ１．プリン１一基板１３・＼の表面実装を
ｉ”Ｔ能にしている。ずなわら、表向実装に対応−ｒる
電子部品９を、電子部品連２の基体部３から分離したの
らのリード綿１０の加工で得ていることになる。In this embodiment, the electronic component 9 and the wire 10 are bent so that a part thereof is approximately parallel to the end tIII of the electronic component 9.1. The surface mounting of the printed circuit board 1-substrate 13 is made into an i''T function.In addition, the electronic component 9, which is compatible with surface mounting, is separated from the base portion 3 of the electronic component group 2. This is obtained by processing 10 pieces of lead cotton.
したがって、表面実装に対応する電子部品９を、帯状の
基体部３に電子部品９のリーヘド線１０を固定した、通
常の電子部品連２として供給４−′ることができるよう
になる。Therefore, electronic components 9 compatible with surface mounting can be supplied 4-' as a normal electronic component series 2 in which the lead wires 10 of the electronic components 9 are fixed to the strip-shaped base portion 3.
そのため、従来のように、四部が形成された基体部６二
個々の電子部品を収納し２、その開１１１部を樹脂テー
プで覆う等の特殊な電子部品連を必要としなくなる。、
また、配線パターンによっては、表面実装と通常のスル
ー、ｈ−ルを利用した実装とを混在させることも「ｉＪ
能になる。Therefore, unlike in the past, there is no need for a special series of electronic components such as accommodating the individual electronic components in the base portion 62 formed with four parts 2 and covering the open portion 111 with resin tape. ,
Also, depending on the wiring pattern, it may be possible to mix surface mounting, normal through-hole mounting, and mounting using h-ru.
become capable.
（発明の効果）
以」−のよう乙ここの発明は１．帯状の基体部に電Ｙ−
部品のリード線を載置して、複数の電子部品を一定の間
隔で配置するとともに、基体部およびリード線に帯状の
粘着テープを貼着した電子部品連を連続的に供給し、こ
の電ｒ一部品連の−または二基」二の電を一部品本体を
固持した状態で、リード線を切断するとともに所望の形
状にｌＪ［Ｉ ｖシ、そののちこの電子部品を所望のプ
リント基板に実装することを特徴としているので、電ｆ
一部品連を形成する際には、予めリード線を加工する必
要がなくなり、製造工程が簡便になる。(Effect of the invention) This invention is as follows: 1. Electric Y- is attached to the band-shaped base part.
The lead wires of the components are placed, a plurality of electronic components are arranged at regular intervals, and a series of electronic components with strips of adhesive tape attached to the base and the lead wires is continuously supplied, and the electrical current is While holding the component body firmly, cut the lead wire and shape it into the desired shape, then mount this electronic component on the desired printed circuit board. Since it is characterized by
When forming a series of parts, there is no need to process the lead wires in advance, which simplifies the manufacturing process.
また、電子部品連を供給する際には、電子部品が実装さ
れるプリント基板のリード線間距離、形状、形式等にか
かわりなく、一連の電子部品連を連続的に供給すること
ができる。すなわち、電子部品のリード線は、電子部品
が電子部品連から離脱してプリント基板に実装される直
前に成形されるため、一連の電子部品連における（（Ｕ
々の電子部品の仕様は実質的に一様ではないことになり
、プリント基板に対応した電子部品を個別に供給するこ
とが容易になる。Moreover, when supplying a series of electronic components, it is possible to continuously supply a series of electronic components regardless of the distance between lead wires, shape, type, etc. of the printed circuit board on which the electronic components are mounted. That is, the lead wires of electronic components are formed immediately before the electronic components are separated from the electronic component series and mounted on the printed circuit board, so the lead wires of the electronic component series ((U
Since the specifications of each electronic component are not substantially uniform, it becomes easy to individually supply electronic components compatible with the printed circuit board.
したがって、例えば同一プリントｉ板上で実装条件を異
ならせた場合でも、別の電子部品連で供給することなく
、同じ電子部品連から連続的に電子部品を供給すること
ができ、より多様な実装ができる。Therefore, even if the mounting conditions are different on the same printed I-board, for example, electronic components can be continuously supplied from the same electronic component series without having to be supplied from another electronic component series, allowing for more diverse mounting. I can do it.
また、特に表面実装に対応する電子部品を供給する場合
、従来のように、帯状の基体部に四部を設けた特殊な電
子部品連を形成する必要がなく、スルーホールを有する
プリント基板に実装する通常の電子部品連と同様のテー
ピングで電子部品を供給することができる。したがって
、表面実装用の特殊な実装装置を介することなく、また
電子部品連から樹脂テープ等を剥離することなく、単に
リード線の加工治具を変更するごとにより多様な実装形
態に対応させることができ、実装上程が簡略になる。In addition, when supplying electronic components that are particularly compatible with surface mounting, there is no need to form a special series of electronic components with four parts on a strip-shaped base as in the past, and it is possible to mount them on a printed circuit board with through holes. Electronic components can be supplied using the same taping as for regular electronic component series. Therefore, it is possible to adapt to a variety of mounting formats by simply changing the lead wire processing jig without using special mounting equipment for surface mounting or without peeling off resin tape etc. from the electronic component chain. This simplifies the implementation process.
第１図（ａ）、（ｂ）および（Ｃ）は、この発明の第１
の実施例による実装工程全説明する工程説明図、第２図
は、第１の実施例により電子部品をプリント基板に実装
する状態を説明する部分断面図である。
また第３図は、この発明の第２の実施例により電子部品
をプリント基板に実装する状態を示す部分断面図である
。
１．９・・・電子部品、 ２・・・電子部品連、
・・・基体部、
・・・送り孔、
・・・チャック、
・・・プリント基板、
４・・・粘着テープ、
６．１０・・・リード線、。
８・・・折曲げ治具、
１２・・・スルーホール。
第１図FIGS. 1(a), (b) and (C) show the first embodiment of the present invention.
FIG. 2 is a partial sectional view illustrating a state in which an electronic component is mounted on a printed circuit board according to the first embodiment. Further, FIG. 3 is a partial sectional view showing a state in which electronic components are mounted on a printed circuit board according to a second embodiment of the present invention. 1.9...Electronic parts, 2...Electronic parts series,
...Base part, ...Spread hole, ...Chuck, ...Printed circuit board, 4.Adhesive tape, 6.10.Lead wire. 8...Bending jig, 12...Through hole. Figure 1
Claims (1)
、複数の電子部品を一定の間隔で配置するとともに、基
体部およびリード線に帯状の粘着テープを貼着した電子
部品連を一定の間隔で供給し、この電子部品連の一また
は二以上の電子部品本体を固持した状態で、リード線を
切断するとともに所望の形状に加工し、そののちこの電
子部品を所望のプリント基板に実装することを特徴とす
る電子部品の実装方法。(1) Lead wires of electronic components are placed on a strip-shaped base, a plurality of electronic components are arranged at regular intervals, and a series of electronic components is made by attaching strip-shaped adhesive tape to the base and the lead wires. The series of electronic components is supplied at regular intervals, and while one or more electronic component bodies are held firmly in place, the lead wires are cut and processed into the desired shape, and then the electronic components are attached to the desired printed circuit board. A method for mounting electronic components, characterized by mounting them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1064885A JPH02244700A (en) | 1989-03-16 | 1989-03-16 | Mounting of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1064885A JPH02244700A (en) | 1989-03-16 | 1989-03-16 | Mounting of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02244700A true JPH02244700A (en) | 1990-09-28 |
Family
ID=13271002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1064885A Pending JPH02244700A (en) | 1989-03-16 | 1989-03-16 | Mounting of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02244700A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06140255A (en) * | 1992-10-29 | 1994-05-20 | Sanyo Electric Co Ltd | Flyback transformer manufacturing device |
-
1989
- 1989-03-16 JP JP1064885A patent/JPH02244700A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06140255A (en) * | 1992-10-29 | 1994-05-20 | Sanyo Electric Co Ltd | Flyback transformer manufacturing device |
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