JPH02137293A - Multilayer circuit board - Google Patents
Multilayer circuit boardInfo
- Publication number
- JPH02137293A JPH02137293A JP29066488A JP29066488A JPH02137293A JP H02137293 A JPH02137293 A JP H02137293A JP 29066488 A JP29066488 A JP 29066488A JP 29066488 A JP29066488 A JP 29066488A JP H02137293 A JPH02137293 A JP H02137293A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- plates
- films
- external connection
- multilayer circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 21
- 229920005992 thermoplastic resin Polymers 0.000 claims description 17
- 229920005989 resin Polymers 0.000 abstract description 26
- 239000011347 resin Substances 0.000 abstract description 26
- 239000000463 material Substances 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000007769 metal material Substances 0.000 abstract description 3
- 229920001187 thermosetting polymer Polymers 0.000 abstract 2
- 230000000630 rising effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 229920006162 poly(etherimide sulfone) Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、導体パターンやスルホールを形成した複数枚
の熱可塑性樹脂フィルムを熱圧着してなる多層回路基板
の改良に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to an improvement in a multilayer circuit board formed by thermocompression bonding a plurality of thermoplastic resin films each having a conductor pattern or through holes formed therein.
（従来の技術）
周知の如く、電子機器の軽薄短小の流れの中で家電製品
においてもその勢いはとどまることを知らない。ところ
で、そのハード面で基礎となっているのは、いうまでも
なく構成している部品などの小型化である。なかでも電
子回路基板に着目してみると、−船内に多く用いられて
いるガラスエポキシ（ガラエボ）基板があるが、小型化
の流れの中で特に高密度実装を要求される場合は、多層
化あるいはフレキシブル基板やハイブリッドＩＣ等との
併用で対応している。(Prior Art) As is well known, with the trend of electronic devices becoming lighter, thinner, smaller and smaller, there is no sign of slowing down in home appliances. By the way, the basis of this hardware aspect is, needless to say, the miniaturization of the constituent parts. Looking at electronic circuit boards in particular, there are glass epoxy (Glaevo) boards that are often used on board ships, but as the trend toward miniaturization requires particularly high-density mounting, multi-layered boards are needed. Alternatively, it can be used in combination with flexible substrates, hybrid ICs, etc.
しかしながら、最もコストが厳しく問われる民生用の回
路基板事業においては、多層（４層以上）のガラエボ基
板では、スルホールを作製するのに繁雑な工程を必要と
し、著しいコスト高を招く。However, in the consumer circuit board business where cost is the most critical issue, multi-layer (four or more layers) GalaEvo boards require complicated processes to create through-holes, leading to a significant increase in costs.
また、フレキシブル基板においても、耐熱性などを考え
るとやはり高価な材料を使わざるを得ない。Furthermore, even in the case of flexible substrates, expensive materials must be used in consideration of heat resistance and other factors.
こうしたことから、上述した諸問題を解決すべく第４図
及び第５図に示す多層回路基板が提案されている。ここ
で、第４図は多層回路基板の略断面図、第５図は第４図
のＸ部の拡大図である。For these reasons, multilayer circuit boards shown in FIGS. 4 and 5 have been proposed to solve the above-mentioned problems. Here, FIG. 4 is a schematic cross-sectional view of the multilayer circuit board, and FIG. 5 is an enlarged view of the X section in FIG. 4.
第４図において、１は複数枚の熱可塑性樹脂フィルムを
熱圧着してなる樹脂基板である。この樹脂基板１内には
、導体パターン２や、これら導体パターン同志を接続す
るスルホール部の導体層３が形成されている。また、前
記樹脂基板１の表面及び裏面には、樹脂基板１表面（又
は裏面）と面一の外部接続端子部４が形成され、係る外
部接続端子部４は前記導体層３を介して導体パターン２
と接続されている。In FIG. 4, reference numeral 1 denotes a resin substrate formed by thermocompression bonding a plurality of thermoplastic resin films. In this resin substrate 1, conductor patterns 2 and a conductor layer 3 of through-hole portions connecting these conductor patterns are formed. Further, external connection terminal portions 4 are formed on the front and back surfaces of the resin substrate 1 and are flush with the front (or back) surface of the resin substrate 1, and the external connection terminal portions 4 are connected to conductor patterns via the conductor layer 3. 2
is connected to.
こうした構成の樹脂基板は、第６図の如く熱プレス機の
定盤５ａ、５ｂ間に導体パターン２やスルホール６を形
成した複数枚の熱可塑性樹脂フィルム７１，７２，７３
．７４を配置した後、前記定盤５ａ、５ｂを用いて加熱
後一定圧力で圧着することにより、多層回路基板８を形
成する。A resin substrate having such a structure is made of a plurality of thermoplastic resin films 71, 72, 73 with conductive patterns 2 and through holes 6 formed between the surface plates 5a and 5b of a heat press machine, as shown in FIG.
．． After arranging the circuit board 74, the multilayer circuit board 8 is formed by heating using the surface plates 5a and 5b and then pressing under a constant pressure.
しかしながら、第６図の多層回路基板によれば、定盤５
ａ、５ｂによる圧力が樹脂フィルム７１７４の接触面に
一様にかかるため、外部接続端子４の上面と樹脂フィル
ム７、（又は７４）の露出面とが而−に形成される。従
って、同じような構造の多層回路基板同志を外部接続端
子部分で直接接続したり、あるいは電極下面が平坦な半
導体素子を直接接続することができない。従って、露出
する外部接続端子に予め接合用導電材として低温硬化型
の銀ペーストを印刷したり、フリップチップのように金
属バンプを接着などで設けるなどの処理を行っている。However, according to the multilayer circuit board shown in FIG.
Since the pressure from a and 5b is uniformly applied to the contact surface of the resin film 7174, the upper surface of the external connection terminal 4 and the exposed surface of the resin film 7 (or 74) are formed in a similar manner. Therefore, it is not possible to directly connect multilayer circuit boards having similar structures through the external connection terminal portions, or to directly connect semiconductor elements whose electrode bottom surfaces are flat. Therefore, processes such as printing a low-temperature curing silver paste as a conductive material for bonding in advance on the exposed external connection terminals, or providing metal bumps with adhesive or the like like a flip chip are performed.
本発明は上記事情に鑑みてなされたもので、外部接続端
子を樹脂基板表面よりも盛上げて形成することにより、
外部接続端子に銀ペーストの印刷や金属バンプの接着等
の特別な処理をする必要のない多層回路基板を提供する
ことを目的とする。The present invention has been made in view of the above circumstances, and by forming the external connection terminals to be higher than the surface of the resin substrate,
The purpose of the present invention is to provide a multilayer circuit board that does not require special processing such as printing silver paste or adhering metal bumps to external connection terminals.
［発明の構成コ
（課題を解決するための手段）
本発明は、導体パターンやスルホールを形成した熱可塑
性樹脂フィルムを複数枚熱圧着してなり、かつ主面に他
の部分に対して盛り上がった外部接続用端子を有した多
層回路基板において、前記外部接続用端子が熱可塑性樹
脂フィルムを熱圧着するときの機械的な変形により形成
されることを特徴とする多層回路基板である。[Structure of the Invention (Means for Solving the Problems) The present invention is made by thermo-compression bonding a plurality of thermoplastic resin films each having a conductor pattern or through holes formed therein, and has a main surface that is raised relative to other parts. A multilayer circuit board having external connection terminals, characterized in that the external connection terminals are formed by mechanical deformation when a thermoplastic resin film is bonded by thermocompression.
本発明において、熱可塑性樹脂基板の材料である熱可塑
性樹脂としては、ポリカーボネイト、ポリイミド、ポリ
エーテルエーテルケトン、ポリエーテルイミド、ポリス
ルホン等いわゆる高性能エンプラと呼ばれるものが挙げ
られる。In the present invention, the thermoplastic resin that is the material of the thermoplastic resin substrate includes so-called high-performance engineering plastics such as polycarbonate, polyimide, polyetheretherketone, polyetherimide, and polysulfone.
本発明において、外部接続端子部の盛上がりは、複数枚
の熱可塑性樹脂フィルムを熱圧着する際、定盤と熱可塑
性樹脂フィルムとの間に外部接続端子形成予定部に対応
した部分が開口した例えば金属板等のスペーサを介在さ
せることにより形成することができる。In the present invention, the protrusion of the external connection terminal portion is an example of an opening between the surface plate and the thermoplastic resin film at a portion corresponding to the portion where the external connection terminal is to be formed when a plurality of thermoplastic resin films are thermocompression bonded. It can be formed by interposing a spacer such as a metal plate.
（作用）
本発明によれば、定盤と複数枚の熱可塑性樹脂フィルム
との間に、外部接続端子形成予定部に対応した部分が開
口した金属板を介在させた状態で熱圧着することにより
、熱可塑性樹脂フィルムに形成された導体パターンやス
ルホール用金属材料が溶出するが、特に外側よりの前記
樹脂基板から形成材料がスルホールより上記金属板の開
口部の方向に押しだされ、その結果樹脂基板主面よりも
盛上がった外部接続端子が形成される。(Function) According to the present invention, by thermocompression bonding between the surface plate and the plurality of thermoplastic resin films with a metal plate having an opening corresponding to the portion where the external connection terminal is to be formed interposed. , the conductor pattern formed on the thermoplastic resin film and the metal material for the through-holes are eluted, but the forming material is pushed out from the resin substrate from the outside in the direction of the opening of the metal plate through the through-holes, and as a result, the resin External connection terminals are formed that are raised higher than the main surface of the substrate.
（実施例）
以下、本発明の一実施例を第１図〜第３図を参照して説
明する。ここで、第１図は本実施例に係る多層回路基板
の略断面図、第２図は第１図のＸ部の拡大図、第３図は
熱圧着前の状態を示す説明図である。(Example) An example of the present invention will be described below with reference to FIGS. 1 to 3. Here, FIG. 1 is a schematic sectional view of the multilayer circuit board according to this embodiment, FIG. 2 is an enlarged view of the X section in FIG. 1, and FIG. 3 is an explanatory diagram showing the state before thermocompression bonding.
第１図において、１１は複数枚の例えばポリカーボネイ
トからなる熱可塑性樹脂フィルムを熱圧着してなる樹脂
基板である。この樹脂基板１１内には、導体パターンＩ
２や、これら導体パターン同志を接続するスルホール部
の導体層１３が形成されている。In FIG. 1, reference numeral 11 is a resin substrate formed by thermocompression bonding a plurality of thermoplastic resin films made of, for example, polycarbonate. Inside this resin substrate 11, a conductive pattern I
2 and a conductor layer 13 of a through-hole portion connecting these conductor patterns.
また、前記樹脂基板１１の表面及び裏面には、樹脂基板
１１表面（又は裏面）に比べて例えば５０ｆｉ程度盛上
がった外部接続端子部１４が形成され、係る外部接続端
子部１４は前記導体層１３を介して導体パターン１２と
接続されている。Further, external connection terminal portions 14 are formed on the front and back surfaces of the resin substrate 11, and are raised by, for example, about 50 fi compared to the front (or back) surface of the resin substrate 11. It is connected to the conductor pattern 12 via.
こうした構成の樹脂基板は、第３図のようにして形成さ
れる。A resin substrate having such a structure is formed as shown in FIG.
即ち、まず熱プレス機の定盤２１ａ 、 ２１ｂの内側
に外部接続端子形成予定部に対応した部分に開口部２２
を有した金属板２３ａ 、 ２３ｂを配置し、更にこれ
ら金属板２３ａ 、 ２３ｂ間に導体パターン１２やス
ルホール２４を形成した複数枚の熱可塑性樹脂フィルム
２５． 、２５２ 、２５３．２５４を配置した後、前
記定盤２１ａ 、 ２１ｂ及び金属板２３ａ 、 ２３
ｂを用いて加熱後一定圧力で圧着する。ここで、熱圧着
により熱可塑性フィルム２５１ 、２５２ 、２５３
、２５．ｓに形成された導体パターン１２やスルホール
用金属材料が溶融するが、特に外側よりの前記フィルム
からの形成材料が流動状態でスルホール２５より金属板
２３ａ。That is, first, openings 22 are formed inside the surface plates 21a and 21b of the heat press machine at portions corresponding to the portions where external connection terminals are to be formed.
A plurality of thermoplastic resin films 25. are arranged with metal plates 23a and 23b having conductive patterns 12 and through holes 24 between these metal plates 23a and 23b. , 252, 253, 254, the surface plates 21a, 21b and the metal plates 23a, 23
After heating using b, crimping is performed at a constant pressure. Here, thermoplastic films 251, 252, 253 are formed by thermocompression bonding.
, 25. The conductor pattern 12 and the metal material for the through holes formed in the through holes 25 are melted, but especially the forming material from the film from the outside is flowing through the through holes 25 to the metal plate 23a.
２３ｂの開口部２２から押しだされ、樹脂基板主面より
も盛上がった外部接続端子１４が簡単に形成される。こ
の後、金属板２３ａ 、 ２３ｂを樹脂基板１１から剥
がし、第１図に示すように他の面に対して５０１程度盛
上がった外部接続端子１４を有した多層回路基板２７を
得ることができる。しかるに、外部接続端子１４の盛り
上がりの高さ、形状の均一性、更には面倒な印刷工程が
ないことから、多層回路基板の特徴である簡単な製造プ
ロセスを十分に生かすことができる。The external connection terminal 14 is easily formed by being pushed out from the opening 22 of the resin substrate 23b and protruding from the main surface of the resin substrate. Thereafter, the metal plates 23a and 23b are peeled off from the resin substrate 11, and as shown in FIG. 1, a multilayer circuit board 27 having external connection terminals 14 raised by about 501 points from the other surface can be obtained. However, since the height of the external connection terminal 14 is high, the shape is uniform, and there is no complicated printing process, the simple manufacturing process that is a feature of the multilayer circuit board can be fully utilized.
しかして、上記実施例に係る多層回路基板は、内部に導
体パターン１２やこれら導体パ′ターン同士を接続する
スルホール部の導体層１３が形成された樹脂基板１１の
表面及び裏面に、樹脂基板１１表面（又は裏面）に比べ
て若干盛上がった外部接続端子１４を形成した構成とな
っているため、同じような構造の多層回路基板同志を外
部接続端子部分で接続したり、あるいは電極裏面が平坦
な半導体端子を外部接続端子１４に接続する際、従来の
ように外部接続端子上に銀ペーストの塗布や金属バンブ
の形成等の特別な処理を施すことなく簡単にしかも十分
な接続ができる。事実、従来及び本発明に係る多層回路
基板について、多層回路基板２枚を、外部接続端子を対
向させかつ間に接着剤を介して張合わせたときの、接着
剤の膜厚と端子間抵抗を調べたところ、第７図に示す結
果が得られた。同図より外部接続端子に盛り上がりがな
いと、十分な接続がとれないことが判明した。Thus, in the multilayer circuit board according to the above embodiment, the resin substrate 11 is formed on the front and back surfaces of the resin substrate 11 in which the conductor patterns 12 and the conductor layer 13 of the through-hole portion connecting these conductor patterns are formed. Since the external connection terminal 14 is slightly raised compared to the front surface (or back surface), it is possible to connect multilayer circuit boards with similar structures at the external connection terminal portion, or when the back surface of the electrode is flat. When connecting a semiconductor terminal to the external connection terminal 14, it is possible to easily and sufficiently connect the external connection terminal without applying special processing such as applying silver paste or forming a metal bump on the external connection terminal as in the conventional case. In fact, regarding the conventional multilayer circuit boards and the present invention, when two multilayer circuit boards are bonded together with the external connection terminals facing each other with an adhesive in between, the adhesive film thickness and the resistance between the terminals are calculated. Upon investigation, the results shown in FIG. 7 were obtained. From the figure, it was found that if there was no protrusion on the external connection terminal, a sufficient connection could not be made.
なお、上記実施例では、外部接続端子の盛上がり高さを
５０−程度としたが、これに限定されず、任意の厚みに
すればよい。In the above embodiment, the external connection terminal has a raised height of approximately 50 mm, but is not limited to this and may have any thickness.
また、上記実施例では、熱可塑性樹脂として耐熱性に優
れたポリカーボネイトを用いた場合について述べたが、
これに限らず、例えばポリイミド。In addition, in the above example, a case was described in which polycarbonate, which has excellent heat resistance, was used as the thermoplastic resin.
Not limited to this, for example, polyimide.
ポリスルホン等を用いてもよい。Polysulfone or the like may also be used.
更に、上記実施例では定盤間に開口部を有した金属板を
用いた場合について述べたが、これに限らず、熱可塑性
樹脂フィルムと離型性のよい材料であればなんでもよい
。Further, in the above embodiment, a metal plate having an opening between the surface plates was used, but the metal plate is not limited to this, and any material may be used as long as it has good mold releasability from the thermoplastic resin film.
［発明の効果］
以上詳述した如く本発明によれば、外部接続端子を樹脂
板表面よりも盛上げて形成することにより、外部接続端
子上に銀ペーストの印刷や金属バンプの形成等の特別な
処理をする必要がなく、簡単な製造プロセスで製作可能
な多層回路基板を提供できる。[Effects of the Invention] As detailed above, according to the present invention, the external connection terminals are formed to be raised higher than the surface of the resin plate, thereby making it possible to perform special operations such as printing silver paste or forming metal bumps on the external connection terminals. It is possible to provide a multilayer circuit board that does not require any processing and can be manufactured through a simple manufacturing process.
第１図は本発明の一実施例に係る多層回路基板の略断面
図、第２図は第１図のＸ部の拡大図、第３図は同回路基
板の熱圧着の説明図、第４図は従来の多層回路基板の略
断面図、第５図は第４図のＸ部の拡大図、第６図は同回
路基板の熱圧着の説明図、第７図は従来及び本発明に係
る多層回路基板における接着剤の膜厚と端子間抵抗との
関係を示す特性図である。
＋ｔ・・・樹脂基板本体、１２・・・導体パターン、１
３・・・導体層、１４・・・外部接続端子、２１ａ 、
２１ｂ・・・定盤、２２・・・開口部、２３ａ 、
２３ｂ・・・金属板、２４・・・スルホール、２５１〜
２５４・・・熱可塑性フィルム、２６・・・多層回路基
数。FIG. 1 is a schematic cross-sectional view of a multilayer circuit board according to an embodiment of the present invention, FIG. 2 is an enlarged view of the X section in FIG. 1, FIG. 3 is an explanatory diagram of thermocompression bonding of the circuit board, and FIG. The figure is a schematic cross-sectional view of a conventional multilayer circuit board, FIG. 5 is an enlarged view of the X section in FIG. 4, FIG. 6 is an explanatory diagram of thermocompression bonding of the same circuit board, and FIG. FIG. 3 is a characteristic diagram showing the relationship between adhesive film thickness and inter-terminal resistance in a multilayer circuit board. +t...Resin board body, 12...Conductor pattern, 1
3... Conductor layer, 14... External connection terminal, 21a,
21b...surface plate, 22...opening, 23a,
23b...Metal plate, 24...Through hole, 251~
254...Thermoplastic film, 26...Multilayer circuit board number.
Claims (1)
ィルムを複数枚熱圧着してなり、かつ主面に他の部分に
対して盛り上がった外部接続用端子を有した多層回路基
板において、前記外部接続用端子が熱可塑性樹脂フィル
ムを熱圧着するときの機械的な変形により形成されるこ
とを特徴とする多層回路基板。In a multilayer circuit board, which is made by thermocompression bonding of a plurality of thermoplastic resin films each having a conductor pattern or through holes, and has an external connection terminal on its main surface that is raised relative to other parts, the external connection terminal is A multilayer circuit board characterized in that it is formed by mechanical deformation during thermocompression bonding of a thermoplastic resin film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29066488A JPH02137293A (en) | 1988-11-17 | 1988-11-17 | Multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29066488A JPH02137293A (en) | 1988-11-17 | 1988-11-17 | Multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02137293A true JPH02137293A (en) | 1990-05-25 |
Family
ID=17758897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29066488A Pending JPH02137293A (en) | 1988-11-17 | 1988-11-17 | Multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02137293A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05243741A (en) * | 1992-02-27 | 1993-09-21 | Sharp Corp | Multilayer flexible printed wiring board |
| JPH0621649A (en) * | 1992-04-03 | 1994-01-28 | Internatl Business Mach Corp <Ibm> | Multilayer ultrasmall electronic-circuit module and its formation method |
| WO1994029897A1 (en) * | 1993-06-08 | 1994-12-22 | Minnesota Mining And Manufacturing Company | Method for providing electrical interconnections between adjacent circuit board layers of a multi-layer circuit board |
-
1988
- 1988-11-17 JP JP29066488A patent/JPH02137293A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05243741A (en) * | 1992-02-27 | 1993-09-21 | Sharp Corp | Multilayer flexible printed wiring board |
| JPH0621649A (en) * | 1992-04-03 | 1994-01-28 | Internatl Business Mach Corp <Ibm> | Multilayer ultrasmall electronic-circuit module and its formation method |
| WO1994029897A1 (en) * | 1993-06-08 | 1994-12-22 | Minnesota Mining And Manufacturing Company | Method for providing electrical interconnections between adjacent circuit board layers of a multi-layer circuit board |
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