JPH0464199B2 - - Google Patents
Info
- Publication number
- JPH0464199B2 JPH0464199B2 JP59171188A JP17118884A JPH0464199B2 JP H0464199 B2 JPH0464199 B2 JP H0464199B2 JP 59171188 A JP59171188 A JP 59171188A JP 17118884 A JP17118884 A JP 17118884A JP H0464199 B2 JPH0464199 B2 JP H0464199B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring boards
- flexible
- flexible wiring
- conductive patterns
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims description 25
- 230000001070 adhesive effect Effects 0.000 claims description 25
- 239000002245 particle Substances 0.000 claims description 13
- 239000002923 metal particle Substances 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は種々の電子機器に使用されるフレキシ
ブル多層配線基板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a flexible multilayer wiring board used in various electronic devices.
従来種々の電子機器に多層配線基板が使用され
ている。斯る従来の多層配線基板に於いては各層
の導電パターンを相互に接続するのにスルーホー
ルを銅めつきすることにより行なつている。
Multilayer wiring boards have conventionally been used in various electronic devices. In such conventional multilayer wiring boards, the conductive patterns in each layer are interconnected by copper plating through holes.
ところでフレキシブル多層配線基板に於いてこ
の各層の導電パターンを相互に接続するのにスル
ーホールを銅めつきして行つたときには、その特
徴であるフレキシビイリテイーを著じるしく損ね
る不都合があり、且つフレキシブル多層配線基板
の構造上表及び裏面に夫々絶縁フイルム（カバー
フイルム）を熱圧着（熱プレス）する際にスルー
ホールの銅めつきを著しく破損する虞れがある不
都合があつた。
However, when copper plating is used to connect the conductive patterns of each layer in a flexible multilayer wiring board, there is an inconvenience that the flexibility, which is a characteristic of the board, is significantly impaired. Furthermore, due to the structure of the flexible multilayer wiring board, there was a problem in that when insulating films (cover films) were thermocompression bonded (hot pressed) to the front and back surfaces of the flexible multilayer wiring board, the copper plating of the through holes could be significantly damaged.
本発明は斯る点に鑑み上述不都合を改善するこ
とを目的とする。 In view of this point, the present invention aims to improve the above-mentioned disadvantages.
本発明フレキシブル多層配線基板は第１図に示
す如くフレキシブル支持体１ａ，２ａ上に夫々所
要の導電パターン１ｂ，２ｂを形成し、更にこの
導電パターン１ｂ，２ｂ上に導電パターン１ｂ，
２ｂの相互接続部に対応する位置にスルーホール
１ｅ，２ｅを有する絶縁フイルム１ｃ，２ｃを設
けた第１及び第２のフレキシブル配線基板１及び
２を設け、この第１及び第２のフレキシブル配線
基板１及び２間に導電性粒子３ａを含有する絶縁
性接着剤３を介してこの第１及び第２のフレキシ
ブル配線基板１及び２を圧着し、この第１及び第
２のフレキシブル配線基板１及び２を接着剤によ
り接着すると共にこの第１及び第２のフレキシブ
ル配線基板１及び２の導電パターン１ｂ及び２ｂ
の相互接続部をこの導電性粒子３ａにより電気的
に接続したものである。
In the flexible multilayer wiring board of the present invention, as shown in FIG. 1, required conductive patterns 1b and 2b are formed on flexible supports 1a and 2a, respectively, and conductive patterns 1b and 2b are formed on these conductive patterns 1b and 2b, respectively.
First and second flexible wiring boards 1 and 2 are provided with insulating films 1c and 2c having through holes 1e and 2e at positions corresponding to the interconnection parts of 2b, and the first and second flexible wiring boards The first and second flexible wiring boards 1 and 2 are crimped together via an insulating adhesive 3 containing conductive particles 3a between the first and second flexible wiring boards 1 and 2. conductive patterns 1b and 2b of the first and second flexible wiring boards 1 and 2.
The interconnection portions of the conductive particles 3a are electrically connected to each other by the conductive particles 3a.
本発明に依れば第１及び第２のフレキシブル配
線基板１及び２の夫々の導電パターン１ｂ及び２
ｂの相互接続部を導電性粒子３ａにより電気的に
接続しているのでフレキシブル多層配線基板の屈
曲性を損ねることがなく屈曲性を必要とする電子
機器の部分に有効に使用できる。また本発明に依
れば第１及び第２のフレキシブル配線基板１及び
２を接着する工程で同時にこの第１及び第２のフ
レキシブル配線基板１及び２の導電パターン１ｂ
及び２ｂの相互接続部を電気的に接続することが
できる。
According to the present invention, the conductive patterns 1b and 2 of the first and second flexible wiring boards 1 and 2, respectively.
Since the interconnection parts b are electrically connected by the conductive particles 3a, the flexibility of the flexible multilayer wiring board is not impaired and it can be effectively used in parts of electronic equipment that require flexibility. Further, according to the present invention, in the step of bonding the first and second flexible wiring boards 1 and 2, the conductive patterns 1b of the first and second flexible wiring boards 1 and 2 are bonded together.
and 2b can be electrically connected.
以下第１図及び第２図を参照しながら本発明フ
レキシブル多層配線基板の一実施例につき説明し
よう。
Hereinafter, one embodiment of the flexible multilayer wiring board of the present invention will be described with reference to FIGS. 1 and 2.
第１図及び第２図に於いて１及び２は夫々フレ
キシブル配線基板を示し、このフレキシブル配線
基板１，２はポリイミド、ポリエステル等の厚さ
が例えば25μmのフレキシブル支持体１ａ，２ａ
上に厚さが例えば18μm又は35μmの銅箔を接着剤
１ｄ，２ｄ（この接着剤１ｄ，２ｄの層は10μm程
度）により被着し、これにパターン印刷及びエツ
チング等を行い所要の導電パターン１ｂ，２ｂを
形成し、更にこの導電パターン１ｂ，２ｂ上にこ
の導電パターン１ｂ，２ｂの相互接続部に対応す
る部分にスルーホール１ｅ，２ｅを有するポリイ
ミド、ポリエステル等の厚さが例えば25μmの絶
縁フイルム１ｃ，２ｃを接着剤１ｆ，２ｆ（この
接着剤１ｆ，２ｆの層は10μm程度）により被着
したものである。この場合フレキシブル支持体１
ａ，２ａにはランド部、端子部、部品取付部等の
導電パターン１ｂ，２ｂの露出部が従来同様に形
成される。 In FIGS. 1 and 2, 1 and 2 indicate flexible wiring boards, respectively, and these flexible wiring boards 1 and 2 are made of flexible supports 1a and 2a made of polyimide, polyester, etc. and having a thickness of, for example, 25 μm.
A copper foil having a thickness of, for example, 18 μm or 35 μm is adhered thereon using adhesives 1d and 2d (the layers of adhesives 1d and 2d are approximately 10 μm), and pattern printing and etching are performed on this to form the required conductive pattern 1b. , 2b, and further has through holes 1e, 2e on the conductive patterns 1b, 2b at portions corresponding to the interconnections of the conductive patterns 1b, 2b. 1c and 2c are adhered with adhesives 1f and 2f (layers of adhesives 1f and 2f have a thickness of about 10 μm). In this case flexible support 1
Exposed portions of conductive patterns 1b and 2b such as land portions, terminal portions, and component mounting portions are formed on a and 2a in the same manner as in the conventional art.
本例に於いてはこのフレキシブル配線基板１及
び２の夫々の所定位置にスルーホール１ｅ及び２
ｅを有する絶縁フイルム１ｃ及び２ｃ側を互に対
向させ、半田金属粒子３ａを有する接着シートＳ
を介して熱圧着してこのフレキシブル配線基板１
及び２を接着する。 In this example, through holes 1e and 2 are provided at predetermined positions in the flexible wiring boards 1 and 2, respectively.
The adhesive sheet S has solder metal particles 3a with the insulating films 1c and 2c sides facing each other and having solder metal particles 3a.
This flexible wiring board 1 is bonded by thermocompression through
and 2 are glued together.
この接着シートＳとして次に述べるものを使用
した。即ちこの接着シートＳの絶縁性接着剤３の
組成を次の組成とした。 The adhesive sheet S described below was used. That is, the composition of the insulating adhesive 3 of this adhesive sheet S was as follows.
アクリルゴム（帝国化学社製、テイサンゴム
＃5001） …45重量部
エポキシ樹脂（日本チバガイギー社製、
GY260） …50重量部
ポリビニルフエノール（丸善石油社製、レジン
Ｍ） …4.5重量部
ウンデシイミダゾール（四国フアインケミカル
社） …0.5重量部
MEK …100重量部
トルエン …100重量部
エタノール …50重量部
この接着シートＳはこの絶縁性接着剤３の固形
分100容量部に対し、平均粒子径が40μmの半田金
属粒子３ａ（Pb−Sn合金、融点230℃）を12容量
部混合分散したものを所定の厚さ例えば乾燥後に
於ける絶縁接着剤３の厚さが30μmとなる如きシ
ート状にしたものである。この場合この接着シー
トＳの絶縁性接着剤３は加熱することにより融解
するものである。 Acrylic rubber (manufactured by Teikoku Kagaku Co., Ltd., Teisan Rubber #5001)...45 parts by weight Epoxy resin (manufactured by Nippon Ciba Geigy Co., Ltd.,
GY260)...50 parts by weight Polyvinylphenol (manufactured by Maruzen Oil Co., Ltd., Resin M)...4.5 parts by weight Undeciimidazole (Shikoku Huain Chemical Co., Ltd.)...0.5 parts by weight MEK...100 parts by weight Toluene...100 parts by weight Ethanol...50 parts by weight This adhesive sheet S is prepared by mixing and dispersing 12 parts by volume of solder metal particles 3a (Pb-Sn alloy, melting point 230°C) with an average particle size of 40 μm to 100 parts by volume of the solid content of the insulating adhesive 3. For example, the thickness of the insulating adhesive 3 after drying is 30 μm. In this case, the insulating adhesive 3 of the adhesive sheet S is melted by heating.
このフレキシブル配線基板１及び２をこの接着
シートＳを介して所定温度（少なくとも絶縁性接
着剤３が融解する温度以上）に加熱して所定圧力
（少なくとも、この温度条件で半田金属粒子３ａ
を変形させるのに必要な圧力以上）により押圧し
たときには絶縁フイルム１ｃ及び２ｃ間の半田金
属粒子３ａは平たく変形すると共にこの絶縁フイ
ルム１ｃ及び２ｃの導電パターン１ｂ及び２ｂの
相互接続部に対応したスルーホール１ｅ及び２ｅ
に存する半田金属粒子３ａはその上方及び下方が
絶縁性接着剤３を排除して直接にフレキシブル配
線基板１及び２の導電パターン１ｂ及び２ｂの相
互接続部に当接し、この導電パターン１ｂ及び２
ｂの相互接続部が電気的に接続され、その他の部
分は絶縁性接着剤３に接着される。 The flexible wiring boards 1 and 2 are heated to a predetermined temperature (at least the temperature at which the insulating adhesive 3 melts or higher) via the adhesive sheet S, and a predetermined pressure is applied (at least under this temperature condition, the solder metal particles 3a
When the solder metal particles 3a between the insulating films 1c and 2c are pressed with a pressure greater than the pressure necessary to deform the insulating films 1c and 2c, the solder metal particles 3a between the insulating films 1c and 2c are flattened and formed through holes corresponding to the interconnections of the conductive patterns 1b and 2b of the insulating films 1c and 2c. Halls 1e and 2e
The upper and lower parts of the solder metal particles 3a present in the conductive patterns 1b and 2 contact directly with the interconnection portions of the conductive patterns 1b and 2b of the flexible wiring boards 1 and 2, excluding the insulating adhesive 3.
The interconnection portion b is electrically connected, and the other portions are bonded to an insulating adhesive 3.
本例に依ればフレキシブル配線基板１及び２の
夫々の導電パターン１ｂ及び２ｂの相互接続部を
半田金属粒子３ａにより電気的に接続しているの
でフレキシブル多層配線基板の屈曲性を損ねるこ
とがなくフレキシブル多層配線基板本来の特性
（屈曲性）を十分満足した多層配線基板が得られ、
屈曲性を必要とする電子機器の部分に有効に使用
できる。また本例に依ればこの２つのフレキシブ
ル配線基板１及び２を接着する工程で同時にこの
フレキシブル配線基板１及び２の導電パターン１
ｂ及び２ｂの相互接続部が電気的に接続されるの
で製造工程がそれだけ簡単となる利益がある。ま
た本例に於いては導電パターン１ｂ及び２ｂの相
互接続部を電気的に接続するのにスルーホール１
ｅ及び２ｅ内を使用しているので従来のスルーホ
ール内周部のめつきに依るものに比較し同一スペ
ースで導通部の有効面積が広く取れるのでそれだ
けこの電気的接続の信頼性が向上する利益があ
る。 According to this example, since the interconnection portions of the conductive patterns 1b and 2b of the flexible wiring boards 1 and 2 are electrically connected by the solder metal particles 3a, the flexibility of the flexible multilayer wiring board is not impaired. A multilayer wiring board that satisfies the original characteristics (flexibility) of a flexible multilayer wiring board can be obtained.
It can be effectively used in parts of electronic equipment that require flexibility. Further, according to this example, in the process of bonding these two flexible wiring boards 1 and 2, the conductive patterns 1 of these flexible wiring boards 1 and 2 are bonded together.
Since the interconnections b and 2b are electrically connected, there is the advantage that the manufacturing process is simpler. Further, in this example, the through hole 1 is used to electrically connect the interconnection portions of the conductive patterns 1b and 2b.
Since the inside of e and 2e is used, the effective area of the conductive part can be made larger in the same space compared to the conventional one that relies on plating on the inner circumference of the through hole, which has the advantage of improving the reliability of this electrical connection. There is.
第３図は本発明の他の実施例を示す。この第３
図例は第１図及び第２図例に於けるフレキシブル
配線基板１又は２のどちらか一方第３図例ではフ
レキシブル配線基板１の導電パターン１ｂ上の絶
縁フイルム１ｃを除去したもので、この場合に於
いても導電パターン１ｂ及び２ｂ間の所要部分の
絶縁は絶縁フイルム２ｃに依りなされ、この導通
パターン１ｂ及び２ｂの相互接続部の電気的接続
はスルーホール２ｅを介してなされる。その他は
第１図、第２図と同様に構成する。 FIG. 3 shows another embodiment of the invention. This third
The example shown is one in which the insulating film 1c on the conductive pattern 1b of the flexible wiring board 1 in the example shown in FIG. 3 has been removed from either the flexible wiring board 1 or 2 in the example shown in FIGS. 1 and 2. In this case, insulation between the conductive patterns 1b and 2b is provided by an insulating film 2c, and electrical connection between the conductive patterns 1b and 2b is made via a through hole 2e. The rest of the structure is the same as in FIGS. 1 and 2.
斯る第３図に於いても第１図、第２図と同様作
用効果が得られると共に絶縁フイルム１ｃを除去
できる利益がある。 In FIG. 3 as well, the same effects as in FIGS. 1 and 2 can be obtained, and there is also the advantage that the insulating film 1c can be removed.
尚上述実施例に於いてはフレキシブル配線基板
を２層設けた例につき述べたが、同様にして３
層、４層…の複数層を設けることができることは
容易に理解できよう。また上述例では半田金属粒
子３ａを含有する絶縁性接着剤を使用したが、こ
の半田金属粒子３ａの代りにニツケル粒子、銀粒
子、またはニツケル、金などをメツキしたプラス
チツク粒子等の導電性粒子が使用できることは勿
論である。なお、半田金属粒子３ａ、その他の導
電性粒子の平均粒径は、絶縁性接着剤３の厚さよ
りも大きい場合はもちろん、同一または小さい場
合においても上述実施例と同様な効果が得られ
る。また本発明は上述実施例に限らず本発明の要
旨を逸脱することなくその他種々の構成が取り得
ることは勿論である。 In the above embodiment, an example in which two layers of flexible wiring boards were provided was described, but three layers were similarly provided.
It is easily understood that multiple layers, such as four layers, etc., can be provided. Further, in the above example, an insulating adhesive containing solder metal particles 3a was used, but instead of the solder metal particles 3a, conductive particles such as nickel particles, silver particles, or plastic particles plated with nickel or gold may be used. Of course, it can be used. Note that the same effect as in the above embodiment can be obtained not only when the average particle size of the solder metal particles 3a and other conductive particles is larger than the thickness of the insulating adhesive 3, but also when it is the same or smaller than the thickness of the insulating adhesive 3. Furthermore, it goes without saying that the present invention is not limited to the above-described embodiments, and can take various other configurations without departing from the gist of the present invention.
本発明に依ればフレキシブル配線基板１及び２
の夫々の導電パターン１ｂ及び２ｂの相互接続部
を半田金属粒子３ａにより電気的に接続している
のでフレキシブル多層配線基板の屈曲性を損ねる
ことがなくフレキシブル多層配線基板本来の特性
（屈曲性）を十分に満足した多層配線基板が得ら
れ、屈曲性を必要とする部分の電子回路に有効に
使用できる。また本発明に依れば複数のフレキシ
ブル配線基板を接着する工程で同時にこのフレキ
シブル配線基板の導電パターンの相互接続部が電
気的に接続されるので製造工程がそれだけ簡単と
なり製造が容易なる利益がある。
According to the present invention, flexible wiring boards 1 and 2
Since the interconnection parts of the respective conductive patterns 1b and 2b are electrically connected by the solder metal particles 3a, the original characteristics (flexibility) of the flexible multilayer wiring board can be maintained without impairing the flexibility of the flexible multilayer wiring board. A fully satisfactory multilayer wiring board can be obtained and can be effectively used in electronic circuits that require flexibility. Further, according to the present invention, the interconnection parts of the conductive patterns of the flexible wiring boards are electrically connected at the same time in the process of bonding a plurality of flexible wiring boards, so that the manufacturing process is simplified and there is an advantage that the manufacturing process is facilitated. .
第１図は本発明フレキシブル多層配線基板の一
実施例を示す断面図、第２図は第１図の分解断面
図、第３図は本発明の他の実施例を示す分解断面
図である。
１及び２は夫々フレキシブル配線基板、１ａ及
び２ａは夫々フレキシブル支持体、１ｂ及び２ｂ
は夫々導電パターン、１ｃ及び２ｃは夫々絶縁フ
イルム、１ｅ及び２ｅは夫々スルーホール、３は
絶縁性接着剤、３ａは半田金属粒子、Ｓは接着シ
ートである。
FIG. 1 is a sectional view showing one embodiment of the flexible multilayer wiring board of the present invention, FIG. 2 is an exploded sectional view of FIG. 1, and FIG. 3 is an exploded sectional view showing another embodiment of the invention. 1 and 2 are flexible wiring boards, 1a and 2a are flexible supports, 1b and 2b, respectively.
1c and 2c are insulating films, 1e and 2e are through holes, 3 is an insulating adhesive, 3a is a solder metal particle, and S is an adhesive sheet.
Claims (1)
ーンを形成した第１及び第２のフレキシブル配線
基板を設けると共に、該第１及び第２のフレキシ
ブル配線基板の導電パターンの相互接続部に対応
する位置にスルーホールを設けた絶縁フイルムを
少くとも上記第１及び第２のフレキシブル配線基
板の一方に設け、上記第１及び第２のフレキシブ
ル配線基板間に導電性粒子を含有する絶縁性接着
剤を介して上記第１及び第２のフレキシブル配線
基板全体を圧着し、上記第１及び第２のフレキシ
ブル配線基板を接着剤により接着すると共に上記
第１及び第２のフレキシブル配線基板の導電パタ
ーンの相互接続部を上記導電性粒子により電気的
に接続したことを特徴とするフレキシルブ多層配
線基板。1. First and second flexible wiring boards each having a required conductive pattern formed thereon are provided on a flexible support, and a through-hole is provided at a position corresponding to the interconnection portion of the conductive pattern of the first and second flexible wiring boards. An insulating film provided with a hole is provided on at least one of the first and second flexible wiring boards, and an insulating adhesive containing conductive particles is interposed between the first and second flexible wiring boards. The entire first and second flexible wiring boards are crimped, and the first and second flexible wiring boards are bonded together with an adhesive, and the interconnection portions of the conductive patterns of the first and second flexible wiring boards are bonded together. A flexible multilayer wiring board characterized by electrical connection using conductive particles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17118884A JPS6149499A (en) | 1984-08-17 | 1984-08-17 | Flexible multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17118884A JPS6149499A (en) | 1984-08-17 | 1984-08-17 | Flexible multilayer circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6149499A JPS6149499A (en) | 1986-03-11 |
| JPH0464199B2 true JPH0464199B2 (en) | 1992-10-14 |
Family
ID=15918631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17118884A Granted JPS6149499A (en) | 1984-08-17 | 1984-08-17 | Flexible multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6149499A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5502889A (en) * | 1988-06-10 | 1996-04-02 | Sheldahl, Inc. | Method for electrically and mechanically connecting at least two conductive layers |
| US5727310A (en) * | 1993-01-08 | 1998-03-17 | Sheldahl, Inc. | Method of manufacturing a multilayer electronic circuit |
| US5428190A (en) * | 1993-07-02 | 1995-06-27 | Sheldahl, Inc. | Rigid-flex board with anisotropic interconnect and method of manufacture |
| US5719749A (en) * | 1994-09-26 | 1998-02-17 | Sheldahl, Inc. | Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51109936A (en) * | 1975-03-25 | 1976-09-29 | Suwa Seikosha Kk | Dodenihoseiomotsu setsuchakuzai |
| JPS51119732A (en) * | 1975-04-15 | 1976-10-20 | Seiko Epson Corp | Adhesive with anisotropy in the direction of conducting path |
| JPS5241648A (en) * | 1975-09-30 | 1977-03-31 | Seikosha Co Ltd | Conductive adhesives |
-
1984
- 1984-08-17 JP JP17118884A patent/JPS6149499A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51109936A (en) * | 1975-03-25 | 1976-09-29 | Suwa Seikosha Kk | Dodenihoseiomotsu setsuchakuzai |
| JPS51119732A (en) * | 1975-04-15 | 1976-10-20 | Seiko Epson Corp | Adhesive with anisotropy in the direction of conducting path |
| JPS5241648A (en) * | 1975-09-30 | 1977-03-31 | Seikosha Co Ltd | Conductive adhesives |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6149499A (en) | 1986-03-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |