JPH0690077A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH0690077A JPH0690077A JP4609392A JP4609392A JPH0690077A JP H0690077 A JPH0690077 A JP H0690077A JP 4609392 A JP4609392 A JP 4609392A JP 4609392 A JP4609392 A JP 4609392A JP H0690077 A JPH0690077 A JP H0690077A
- Authority
- JP
- Japan
- Prior art keywords
- pad
- wiring board
- printed wiring
- solder
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、表面実装部品を実装
するパッドに凸部を設けた印刷配線板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board having a convex portion on a pad for mounting a surface mount component.
【０００２】[0002]
【従来の技術】従来電子機器等に使用される印刷配線板
には、ＩＣやダイオード、抵抗、コンデンサ、ＬＥＤ等
の電子部品が実装されていて、これら電子部品の間は配
線板に印刷されたパターンにより接続されるようになっ
ている。2. Description of the Related Art Conventionally, printed wiring boards used in electronic equipment or the like are mounted with electronic parts such as ICs, diodes, resistors, capacitors, LEDs, etc., and printed between the electronic parts on the wiring board. It is designed to be connected by a pattern.
【０００３】また近年では、電子機器の小型化により、
電子部品を実装する印刷配線板も高密度化に適したもの
が要求されるようになっており、高密度化を実現するた
め、印刷配線板の半田面にも電子部品を実装している。In recent years, due to miniaturization of electronic equipment,
A printed wiring board on which electronic components are mounted is also required to be suitable for high density, and in order to realize high density, electronic components are also mounted on the solder surface of the printed wiring board.
【０００４】図５が半田面に表面実装部品を実装した従
来の印刷配線板を示すもので、印刷配線板ａの導体パタ
ーンが形成された半田面に、実装すべき表面実装部品ｃ
の端子ｄと同じ配置でパッドｅが形成されている。FIG. 5 shows a conventional printed wiring board in which surface mounting components are mounted on the solder side. The surface mounting component c to be mounted on the solder side of the printed wiring board a on which the conductor pattern is formed.
The pad e is formed in the same arrangement as the terminal d.
【０００５】そして表面実装部品ｃを実装する場合は、
上記各パッドｅの間に接着剤ｆを塗布して、表面実装部
品ｃの端子ｄがパッドｅ面に当接するようにこの接着剤
ｆに表面実装部品ｃを仮付けし、その後半田付け工程で
表面実装部品ｃの端子ｄをパッドｅ面に半田付けするこ
とにより、印刷配線板ａの半田面に表面実装部品ｃを実
装している。When mounting the surface mount component c,
The adhesive f is applied between the pads e, and the surface mount component c is temporarily attached to the adhesive f so that the terminal d of the surface mount component c contacts the surface of the pad e. The surface mount component c is mounted on the solder surface of the printed wiring board a by soldering the terminal d of the surface mount component c to the surface of the pad e.
【０００６】[0006]
【発明が解決しようとする課題】しかし上記従来の印刷
配線板では、表面実装部品ｃの端子ｄをパッドｅ面に半
田付けする際、表面実装部品ｃの実装高さが高いと、半
田付けにより発生したガスが印刷配線板ａと表面実装部
品ｃの間に溜り、表面実装部品ｃの端子ｄとパッドｅ面
の間に侵入しようとする溶融半田を押し返すため、端子
ｄとパッドｅ面の間に半田が侵入できない。However, in the above-mentioned conventional printed wiring board, when the terminal d of the surface mount component c is soldered to the surface of the pad e, if the mounting height of the surface mount component c is high, the The generated gas accumulates between the printed wiring board a and the surface-mounted component c, and pushes back the molten solder that tries to enter between the terminal d and the surface of the pad e of the surface-mounted component c. Solder cannot penetrate into.
【０００７】その結果端子ｄがパッドｅ面に半田付けさ
れない半田不良が発生する欠点があった。As a result, there is a drawback that a solder failure occurs in which the terminal d is not soldered to the surface of the pad e.
【０００８】この発明は上記従来の欠点を改善するため
になされたもので、表面実装部品の半田付けが確実に行
なえるようにした印刷配線板を提供することを目的とす
るものである。The present invention has been made to solve the above-mentioned conventional drawbacks, and an object of the present invention is to provide a printed wiring board capable of reliably soldering surface-mounted components.
【０００９】[0009]
【課題を解決するための手段】この発明は上記目的を達
成するために、半田面に回路を形成する導体パターン
と、表面実装部品を半田付けするパッドを形成した印刷
配線板において、上記パッドの外側端に、該パッドより
幅が狭く、かつ面積の小さい凸部を形成したものであ
る。In order to achieve the above object, the present invention provides a printed wiring board having a conductor pattern for forming a circuit on a solder surface and a pad for soldering a surface mount component. A protrusion having a smaller width and a smaller area than the pad is formed at the outer end.
【００１０】[0010]
【作用】上記構成によりパッドより幅及び面積の小さい
凸部に付着した半田が先に凝固して堰を形成し、この堰
によってパッド面と表面実装部品の端子間に侵入した半
田が、半田時発生したガスにより押し返されるのを阻止
するため、パッドと端子の間を確実に半田付けできるよ
うになる。With the above structure, the solder attached to the convex portion having a smaller width and area than the pad solidifies first to form a weir, and this weir prevents the solder from entering between the pad surface and the terminals of the surface-mounted component when soldering. Since it is prevented from being pushed back by the generated gas, it becomes possible to reliably solder between the pad and the terminal.
【００１１】[0011]
【実施例】この発明の一実施例を図１ないし図４に示す
図面を参照して詳述する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail with reference to the drawings shown in FIGS.
【００１２】図１は印刷配線板の半田面に表面実装部品
を実装した状態の斜視図、図２は要部の拡大平面図、図
３は実装部分の断面図、そして図４は表面実装部品が実
装されるまでの工程図である。FIG. 1 is a perspective view showing a state in which surface mount components are mounted on the solder side of a printed wiring board, FIG. 2 is an enlarged plan view of an essential part, FIG. 3 is a sectional view of the mount part, and FIG. 4 is a surface mount component. FIG. 6 is a process drawing until mounting.
【００１３】これら図において１は印刷配線板、２は表
面実装部品、３は導体パターン、４はパッド、５は接着
剤を示す。In these figures, 1 is a printed wiring board, 2 is a surface mount component, 3 is a conductor pattern, 4 is a pad, and 5 is an adhesive.
【００１４】上記印刷配線板１の半田面には、銅張積層
板により必要な銅箔のみを残し、余分な銅箔を除去する
ことにより導体パターン３が形成されていると共に、表
面実装部品２を実装する部分には、表面実装部品２の端
子２ａと同じ配置でパッド４が形成されている。On the solder surface of the printed wiring board 1, only the necessary copper foil is left by the copper clad laminate, and the excess copper foil is removed to form the conductor pattern 3 and the surface mount component 2 The pad 4 is formed in the same portion as the terminal 2a of the surface mount component 2 in the portion where the pad 4 is mounted.
【００１５】上記パッド４の外側端にはパッド４の幅よ
りやや幅の狭い凸部４ａが突設されており、これら凸部
４ａを導体パターン３を形成する際パッド４と一体に形
成されるようになっている。Projections 4a having a width slightly smaller than the width of the pad 4 are provided at the outer end of the pad 4, and these projections 4a are formed integrally with the pad 4 when the conductor pattern 3 is formed. It is like this.
【００１６】また上記印刷配線板１の半田面には、表面
実装部品２等を後から半田付けする部分を除いて全面に
絶縁被膜が形成されている。Further, an insulating coating is formed on the entire solder surface of the printed wiring board 1 except for a portion where the surface mount component 2 and the like are later soldered.
【００１７】次に図４に示す実装工程を参照して表面実
装部品２の実装方法を説明すると、供給された印刷配線
板１の実装面にまずディスクリート品６が自動挿入さ
れ、その後印刷配線板１が反転されて、半田面に形成さ
れたパッド４の間に接着剤５が塗布される。Next, the mounting method of the surface mount component 2 will be described with reference to the mounting process shown in FIG. 4. First, the discrete product 6 is automatically inserted into the mounting surface of the supplied printed wiring board 1, and then the printed wiring board. 1 is inverted and the adhesive 5 is applied between the pads 4 formed on the solder surface.
【００１８】そしてこの接着剤５に表面実装部品２が仮
付けされて接着剤５が乾燥され、さらに自動挿入できな
かったディスクリート部品７が手差し挿入される。Then, the surface mount component 2 is temporarily attached to the adhesive 5, the adhesive 5 is dried, and the discrete component 7 which could not be automatically inserted is manually inserted.
【００１９】その後半田工程へ送られて仮付けされた表
面実装部品２の端子２ａとパッド４が次のように半田付
けされる。After that, the terminals 2a and the pads 4 of the surface-mounted component 2 which has been sent to the soldering process and temporarily attached are soldered as follows.
【００２０】まず溶融した半田がパッド４及び凸部４ａ
の表面に付着すると、パッド４の幅より凸部４ａの幅が
狭く形成され、かつ面積も小さいため、凸部４ａの温度
がパッド４面に比べて急激に上昇する。First, the molten solder is applied to the pad 4 and the convex portion 4a.
When it is attached to the surface of the pad 4, the width of the convex portion 4a is formed to be narrower than the width of the pad 4 and the area thereof is small, so that the temperature of the convex portion 4a rises more rapidly than the surface of the pad 4.
【００２１】これによって凸部４ａの方がパッド４面よ
り半田の付きも良い。As a result, the convex portion 4a has better soldering than the pad 4 surface.
【００２２】その後印刷配線板１が半田槽より引き上げ
られると、パッド４より幅が狭くかつ面積の小さい凸部
４ａの半田が先に凝固して盛り上がり、堰を形成する。Then, when the printed wiring board 1 is pulled up from the solder bath, the solder of the convex portion 4a having a smaller width and smaller area than the pad 4 is first solidified and rises to form a weir.
【００２３】これによって半田付け時発生したガスが印
刷配線板１と表面実装部品２の間に溜ってこのガスがパ
ッド４面と表面実装部品２の端子２ａ間に侵入した溶融
半田を押し返そうとしても、凸部４ａに形成された堰が
溶融半田の流出を阻止するため、ガスによって半田が排
除されることなく、パッド４と端子２ａの間を確実に半
田付けすることができるようになる。As a result, the gas generated during soldering collects between the printed wiring board 1 and the surface mount component 2, and this gas will push back the molten solder that has entered between the surface of the pad 4 and the terminal 2a of the surface mount component 2. Also, since the weir formed on the convex portion 4a prevents the molten solder from flowing out, the solder can be reliably soldered between the pad 4 and the terminal 2a without the solder being removed by the gas. .
【００２４】なおパッド４に形成する凸部４ａは、余り
長くしてもよい結果は得られない。The convex portion 4a formed on the pad 4 cannot be made too long, and the result cannot be obtained.
【００２５】実施例では幅を０．５ｍｍ、長さを１．０
ｍｍとしている。In the embodiment, the width is 0.5 mm and the length is 1.0.
mm.
【００２６】また幅及び長さを変えて実験したところ下
記のような結果が得られた。Further, when the experiment was conducted by changing the width and the length, the following results were obtained.
【００２７】[0027]
【表１】 この表から明らかなように、幅は０．３ｍｍ〜１．０ｍ
ｍ、長さを０．５ｍｍ〜１．５ｍｍの範囲でよい結果が
得られた。[Table 1] As is clear from this table, the width is 0.3 mm to 1.0 m
Good results were obtained in the range of m and length of 0.5 mm to 1.5 mm.
【００２８】[0028]
【発明の効果】この発明は以上詳述したように、印刷配
線板の半田面に形成されたパッドにパッドより幅が狭く
かつ面積の小さい凸部を設けて、この凸部に付着した半
田がパッド面より先に凝固するようにしたことから、半
田付け時発生したガスによりパッド面と表面実装部品の
端子間の半田が押し返されることがなく、パッドと端子
の間を確実に半田付けできるようになる。As described above in detail, according to the present invention, the pad formed on the solder surface of the printed wiring board is provided with the convex portion having a smaller width and a smaller area than the pad, and the solder attached to the convex portion is Since it solidifies before the pad surface, the gas generated during soldering does not push back the solder between the pad surface and the terminals of the surface mount component, and the solder can be reliably soldered between the pads and terminals. Like
【００２９】これによって半田付け面に実装される表面
実装部品の半田付けに対する信頼性が一段と向上すると
共に、パッドに凸部を形成するだけでよいことから、容
易かつ安価に実施することが可能である。As a result, the reliability of the surface-mounted component mounted on the soldering surface with respect to soldering is further improved, and since it is only necessary to form the convex portion on the pad, it is possible to carry out the process easily and inexpensively. is there.
【図１】この発明の一実施例になる印刷配線板に表面実
装部品を実装した状態の斜視図である。FIG. 1 is a perspective view showing a state in which surface mount components are mounted on a printed wiring board according to an embodiment of the present invention.
【図２】表面実装部品を半田付けするパッドの平面図で
ある。FIG. 2 is a plan view of a pad for soldering a surface mount component.
【図３】実装部分の断面図である。FIG. 3 is a sectional view of a mounting portion.
【図４】表面実装部品が実装されるまでの工程図であ
る。FIG. 4 is a process drawing until surface mounting components are mounted.
【図５】従来の印刷配線板に表面実装部品をした状態の
斜視図である。FIG. 5 is a perspective view of a conventional printed wiring board with surface-mounted components.
【図６】従来のパッドの平面図である。FIG. 6 is a plan view of a conventional pad.
【図７】従来の実装部分の断面図である。FIG. 7 is a cross-sectional view of a conventional mounting portion.
１ 印刷配線板 ２ 表面実装部品 ２ａ 端子 ３ 導体パターン ４ パッド ４ａ 凸部 1 printed wiring board 2 surface mount component 2a terminal 3 conductor pattern 4 pad 4a convex portion
Claims (2)
表面実装部品を半田付けするパッドを形成した印刷配線
板において、上記パッドの外側端に、該パッドより幅が
狭く、かつ面積の小さい凸部を形成してなる印刷配線
板。1. A conductor pattern for forming a circuit on a solder surface,
What is claimed is: 1. A printed wiring board having a pad for soldering a surface mount component, wherein a convex portion having a smaller width and a smaller area than the pad is formed at an outer end of the pad.
を０．８ｍｍ〜１．５ｍｍの範囲としてなる請求項１記
載の印刷配線板。2. The printed wiring board according to claim 1, wherein the convex portion has a width of 0.3 mm to 1.0 mm and a length of 0.8 mm to 1.5 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4609392A JPH0690077A (en) | 1992-01-31 | 1992-01-31 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4609392A JPH0690077A (en) | 1992-01-31 | 1992-01-31 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0690077A true JPH0690077A (en) | 1994-03-29 |
Family
ID=12737378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4609392A Pending JPH0690077A (en) | 1992-01-31 | 1992-01-31 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0690077A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0971569A1 (en) * | 1998-06-08 | 2000-01-12 | Ford Motor Company | Enhanced mounting pads for printed circuit boards |
| KR100606221B1 (en) * | 2003-12-22 | 2006-07-31 | 가부시끼가이샤 도시바 | Printed circuit board |
| AT515446A1 (en) * | 2014-03-07 | 2015-09-15 | Zkw Elektronik Gmbh | Structuring the solder mask of printed circuit boards to improve the soldering results |
-
1992
- 1992-01-31 JP JP4609392A patent/JPH0690077A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0971569A1 (en) * | 1998-06-08 | 2000-01-12 | Ford Motor Company | Enhanced mounting pads for printed circuit boards |
| KR100606221B1 (en) * | 2003-12-22 | 2006-07-31 | 가부시끼가이샤 도시바 | Printed circuit board |
| AT515446A1 (en) * | 2014-03-07 | 2015-09-15 | Zkw Elektronik Gmbh | Structuring the solder mask of printed circuit boards to improve the soldering results |
| AT515446B1 (en) * | 2014-03-07 | 2019-12-15 | Zkw Group Gmbh | Structuring the solder mask of printed circuit boards to improve the soldering results |
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