JPH01143164U - - Google Patents
Info
- Publication number
- JPH01143164U JPH01143164U JP3910488U JP3910488U JPH01143164U JP H01143164 U JPH01143164 U JP H01143164U JP 3910488 U JP3910488 U JP 3910488U JP 3910488 U JP3910488 U JP 3910488U JP H01143164 U JPH01143164 U JP H01143164U
- Authority
- JP
- Japan
- Prior art keywords
- stem
- cap
- semiconductor laser
- laser device
- submount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 1
Description
第１図はこの考案の一実施例による半導体レー
ザ装置を示す断面図、第２図は従来の半導体レー
ザ装置を示す断面図である。
図において、１は半導体レーザ素子、２はサブ
マウント、３は放熱ブロツク、４はステム基体、
５はキヤツプ、６は透光板、７は外部導体、８は
シリコーンコンパウンドを示す。なお、図中、同
一符号は同一、又は相当部分を示す。
FIG. 1 is a sectional view showing a semiconductor laser device according to an embodiment of the invention, and FIG. 2 is a sectional view showing a conventional semiconductor laser device. In the figure, 1 is a semiconductor laser element, 2 is a submount, 3 is a heat dissipation block, 4 is a stem base,
5 is a cap, 6 is a transparent plate, 7 is an outer conductor, and 8 is a silicone compound. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
装着されキヤツプを有する半導体レーザ装置にお
いて、前記ステムの上面及び前記キヤツプ内面に
シリコンパウンドを塗布したことを特徴とする半
導体レーザ装置。 1. A semiconductor laser device having a cap mounted on a stem through a submount and a heat dissipation block, characterized in that a silicone compound is applied to the upper surface of the stem and the inner surface of the cap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3910488U JPH01143164U (en) | 1988-03-23 | 1988-03-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3910488U JPH01143164U (en) | 1988-03-23 | 1988-03-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01143164U true JPH01143164U (en) | 1989-10-02 |
Family
ID=31265631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3910488U Pending JPH01143164U (en) | 1988-03-23 | 1988-03-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01143164U (en) |
-
1988
- 1988-03-23 JP JP3910488U patent/JPH01143164U/ja active Pending