JP7432947B2 - 物体検知センサ - Google Patents
物体検知センサ Download PDFInfo
- Publication number
- JP7432947B2 JP7432947B2 JP2021543357A JP2021543357A JP7432947B2 JP 7432947 B2 JP7432947 B2 JP 7432947B2 JP 2021543357 A JP2021543357 A JP 2021543357A JP 2021543357 A JP2021543357 A JP 2021543357A JP 7432947 B2 JP7432947 B2 JP 7432947B2
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- Japan
- Prior art keywords
- heat transfer
- object detection
- detection sensor
- heat
- sensor
- Prior art date
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- 238000001514 detection method Methods 0.000 title claims description 68
- 238000010521 absorption reaction Methods 0.000 claims description 58
- 230000005855 radiation Effects 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 3
- 239000002966 varnish Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000004381 surface treatment Methods 0.000 claims description 2
- 238000001816 cooling Methods 0.000 description 26
- 230000003287 optical effect Effects 0.000 description 10
- 239000012530 fluid Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- 230000003014 reinforcing effect Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000006096 absorbing agent Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4811—Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
- G01S7/4813—Housing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0204—Mounting supporting structures on the outside of casings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Studio Devices (AREA)
Description
12 冷却デバイス
14 多部品ハウジング
16 保持要素
18 送信要素
20 受信要素
22 主回路基板
24 光送信システム
26 光受信システム
28 軸受要素
30 伝熱要素
32 吸熱要素
34 ねじ切り開口部
36 補強構造体
38 ねじ切り開口部
40 伝熱面
42 吸熱面
43 中間空間
44 リブ
44a 凹部
46 リブ
48 伝熱底面
50 吸熱底面
52 自由空間
D 距離
R 方向
Claims (7)
- 物体検知センサ(10)であって、
センサ側の伝熱要素(30)と、
センサから遠位側の吸熱要素(32)と
を備え、
前記センサ側の伝熱要素(30)及び前記センサから遠位側の吸熱要素(32)は、相互に対向して配置され、
前記センサ側の伝熱要素(30)の伝熱面(40)及び前記センサから遠位側の吸熱要素(32)の吸熱面(42)は、中間空間(43)によって相互から離隔されるように設計され、
前記物体検知センサ(10)は、前記伝熱要素(30)と前記吸熱要素(32)との間に相対移動を与えるように設計され、該相対移動は旋回移動であり、
前記物体検知センサ(10)が、視野を環境に最適に適合させるために前記物体検知センサ(10)の視領域を水平に配列可能なように、軸受要素(28)を介して保持要素(16)に対して前記旋回移動が可能なように配置され、
前記旋回移動の旋回軸が前記軸受要素(28)を貫通して延在しており、
前記伝熱要素(30)及び前記吸熱要素(32)は、リブ(44,46)を有し、
前記伝熱要素(30)の前記リブ(44)及び対向する前記吸熱要素(32)の前記リブ(46)が、前記旋回軸に垂直な方向に延在し、前記伝熱要素(30)及び前記吸熱要素(32)のうち一方の要素の2つのリブ間に他方の要素の1つのリブが配置される、物体検知センサ(10)。 - 前記伝熱要素(30)は、前記物体検知センサ(10)のセンサハウジングによって構成され、又は前記物体検知センサ(10)のセンサハウジングに接続されたことを特徴とする請求項1に記載の物体検知センサ(10)。
- 前記吸熱要素(32)は、保持要素(16)によって構成され、又は保持要素(16)に接続されたことを特徴とする請求項1又は2に記載の物体検知センサ(10)。
- 前記伝熱要素(30)及び前記吸熱要素(32)は、その間に当接が起こらないように各相対位置において相互に距離(D)を有することを特徴とする請求項1から3のいずれか一項に記載の物体検知センサ(10)。
- 前記伝熱要素(30)又は吸熱要素(32)の2つの隣り合うリブ(44;46)間に、対向する前記伝熱要素(30)又は吸熱要素(32)のリブ(44;46)が介在する自由空間(52)が形成されたことを特徴とする請求項1から4のいずれか一項に記載の物体検知センサ(10)。
- 前記伝熱要素(30)が前記物体検知センサの回路基板(22)及び/又はチップ(18、20)に当接していることを特徴とする請求項1から5のいずれか一項に記載の物体検知センサ(10)。
- 前記伝熱面(40)は放射に対して最適化された面を有し、及び/又は前記センサから遠位側の吸熱面(42)は吸収に対して最適化された面を有し、前記最適化された面は、コーティング、ワニス又は表面処理によって提供されることを特徴とする請求項1から6のいずれか一項に記載の物体検知センサ(10)。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102019201031.8A DE102019201031A1 (de) | 2019-01-28 | 2019-01-28 | Kühlvorrichtung für einen Objekterkennungssensor |
DE102019201031.8 | 2019-01-28 | ||
PCT/EP2020/051926 WO2020157005A1 (de) | 2019-01-28 | 2020-01-27 | Kühlvorrichtung für einen objekterkennungssensor |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022518558A JP2022518558A (ja) | 2022-03-15 |
JP7432947B2 true JP7432947B2 (ja) | 2024-02-19 |
Family
ID=69326533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021543357A Active JP7432947B2 (ja) | 2019-01-28 | 2020-01-27 | 物体検知センサ |
Country Status (7)
Country | Link |
---|---|
US (1) | US20220151105A1 (ja) |
EP (1) | EP3918366A1 (ja) |
JP (1) | JP7432947B2 (ja) |
KR (1) | KR102637236B1 (ja) |
CN (1) | CN113348376B (ja) |
DE (1) | DE102019201031A1 (ja) |
WO (1) | WO2020157005A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102022210550A1 (de) | 2022-10-06 | 2024-04-11 | Vitesco Technologies GmbH | Gehäuse für eine Leistungselektronikkomponente |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004092931A (ja) | 2002-08-29 | 2004-03-25 | Aisan Ind Co Ltd | 熱交換器 |
US20160178289A1 (en) | 2013-08-21 | 2016-06-23 | CoolChip Technologies, Inc. | Kinetic heat-sink with interdigitated heat-transfer fins |
US20170217382A1 (en) | 2016-01-29 | 2017-08-03 | Autoliv Asp, Inc. | Apparatuses For Mounting Camera Arrangements On Motor Vehicles |
JP2018050247A (ja) | 2016-09-23 | 2018-03-29 | パナソニックIpマネジメント株式会社 | 監視カメラ |
US20180109061A1 (en) | 2016-10-17 | 2018-04-19 | Waymo Llc | Thermal Rotary Link |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3844341A (en) * | 1972-05-22 | 1974-10-29 | Us Navy | Rotatable finned heat transfer device |
DE102011052738A1 (de) * | 2011-08-16 | 2013-02-21 | Leica Microsystems Cms Gmbh | Detektorvorrichtung |
US9343851B2 (en) * | 2014-08-29 | 2016-05-17 | Tyco Electronics Corporation | Pluggable connector configured to transfer thermal energy away from internal electronics of the pluggable connector |
EP3168641B1 (de) | 2015-11-11 | 2020-06-03 | Ibeo Automotive Systems GmbH | Verfahren und vorrichtung zur optischen distanzmessung |
US11486968B2 (en) * | 2017-11-15 | 2022-11-01 | Magna Electronics Inc. | Vehicle Lidar sensing system with sensor module |
US11500068B2 (en) * | 2018-01-09 | 2022-11-15 | Lg Electronics Inc. | Lidar apparatus for vehicle |
US10845465B2 (en) * | 2018-03-12 | 2020-11-24 | Ford Global Technologies, Llc | Vehicle object-detection sensor assembly |
US11638362B2 (en) * | 2018-10-29 | 2023-04-25 | Magna Electronics Inc. | Vehicular radar sensor with enhanced housing and PCB construction |
-
2019
- 2019-01-28 DE DE102019201031.8A patent/DE102019201031A1/de active Pending
-
2020
- 2020-01-27 US US17/426,006 patent/US20220151105A1/en not_active Abandoned
- 2020-01-27 CN CN202080010842.9A patent/CN113348376B/zh active Active
- 2020-01-27 JP JP2021543357A patent/JP7432947B2/ja active Active
- 2020-01-27 WO PCT/EP2020/051926 patent/WO2020157005A1/de unknown
- 2020-01-27 EP EP20702280.7A patent/EP3918366A1/de active Pending
- 2020-01-27 KR KR1020217024211A patent/KR102637236B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004092931A (ja) | 2002-08-29 | 2004-03-25 | Aisan Ind Co Ltd | 熱交換器 |
US20160178289A1 (en) | 2013-08-21 | 2016-06-23 | CoolChip Technologies, Inc. | Kinetic heat-sink with interdigitated heat-transfer fins |
US20170217382A1 (en) | 2016-01-29 | 2017-08-03 | Autoliv Asp, Inc. | Apparatuses For Mounting Camera Arrangements On Motor Vehicles |
JP2018050247A (ja) | 2016-09-23 | 2018-03-29 | パナソニックIpマネジメント株式会社 | 監視カメラ |
US20180109061A1 (en) | 2016-10-17 | 2018-04-19 | Waymo Llc | Thermal Rotary Link |
Also Published As
Publication number | Publication date |
---|---|
WO2020157005A1 (de) | 2020-08-06 |
KR102637236B1 (ko) | 2024-02-15 |
US20220151105A1 (en) | 2022-05-12 |
EP3918366A1 (de) | 2021-12-08 |
KR20210105426A (ko) | 2021-08-26 |
CN113348376A (zh) | 2021-09-03 |
CN113348376B (zh) | 2024-05-10 |
JP2022518558A (ja) | 2022-03-15 |
DE102019201031A1 (de) | 2020-07-30 |
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