JP7347658B2 - 基板処理装置及び基板処理方法 - Google Patents
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Engineering & Computer Science (AREA)
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- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
前記処理モジュールへの前記基板の搬入及び搬出が共通の搬送機構で行われ、前記中継モジュールへの前記基板への搬入、搬出が互いに異なる搬送機構で行われ、前記モジュール群により構成される基板の搬送経路を順番に前記基板が搬送されるように、当該搬送経路において割り当てられた区間を各々搬送する複数の搬送機構と、
前記複数の搬送機構のうちの一つをなし、前記基板の搬送経路のうちの互いに離れた第1の区間及び第2の区間の搬送に共用され、前記複数の中継モジュールのうち前記第1の区間に含まれる第1の中継モジュール、前記第2の区間に含まれる第2の中継モジュールの各々に前記基板を搬送する共用搬送機構と、
前記第1の中継モジュール、第2の中継モジュールの各々から前記搬送経路の下流側に見て、直近の前記処理モジュールの手前の中継モジュールに至るまでの各区間における前記基板の搬送状況に基づき、前記共用搬送機構が第1の中継モジュール及び第2の中継モジュールのうちのいずれへ前記基板を搬送するかの決定を行う決定部と、
を備える。
10 制御部
IRAMB 搬送機構
IRAMC 搬送機構
SBU バッファモジュール
TRS10 受け渡しモジュール
PIR 露光後洗浄モジュール
W ウエハ
Claims (11)
- 基板を各々処理する複数の処理モジュールと、前記複数の処理モジュール間で当該基板を搬送するために前記基板が各々載置される複数の中継モジュールと、を含むモジュール群と、
前記処理モジュールへの前記基板の搬入及び搬出が共通の搬送機構で行われ、前記中継モジュールへの前記基板への搬入、搬出が互いに異なる搬送機構で行われ、前記モジュール群により構成される基板の搬送経路を順番に前記基板が搬送されるように、当該搬送経路において割り当てられた区間を各々搬送する複数の搬送機構と、
前記複数の搬送機構のうちの一つをなし、前記基板の搬送経路のうちの互いに離れた第1の区間及び第2の区間の搬送に共用され、前記複数の中継モジュールのうち前記第1の区間に含まれる第1の中継モジュール、前記第2の区間に含まれる第2の中継モジュールの各々に前記基板を搬送する共用搬送機構と、
前記第1の中継モジュール、第2の中継モジュールの各々から前記搬送経路の下流側に見て、直近の前記処理モジュールの手前の中継モジュールに至るまでの各区間における前記基板の搬送状況に基づき、前記共用搬送機構が第1の中継モジュール及び第2の中継モジュールのうちのいずれへ前記基板を搬送するかの決定を行う決定部と、
を備える基板処理装置。 - 前記決定部は、前記第1の区間における前記第1の中継モジュールの上流側の中継モジュール及び前記第2の区間における前記第2の中継モジュールの上流側の中継モジュールの各々における前記基板の搬送状況に基づき、前記決定を行う請求項1記載の基板処理装置。
- 前記第1の中継モジュールの上流側の中継モジュール及び前記第2の中継モジュールの上流側の中継モジュールの各々における前記基板の搬送状況は、各中継モジュールに搬送可能な基板の枚数である請求項2記載の基板処理装置。
- 前記決定部は、前記共用搬送機構が直前に前記基板を搬送した区間に応じて、前記決定を行う請求項2記載の基板処理装置。
- 前記直近の前記処理モジュールの手前の中継モジュールに至るまでの各区間における前記基板の搬送状況は、当該各区間における基板の枚数である請求項1記載の基板処理装置。
- 前記第1の中継モジュールから前記搬送経路の下流側に見て直近の前記処理モジュールの手前の中継モジュールに至るまでの区間、あるいは前記第2の中継モジュールから前記搬送経路の下流側に見て直近の前記処理モジュールの手前の中継モジュールに至るまでの区間には、前記共用搬送機構による前記基板の搬送が行われない中継モジュールが含まれる請求項1記載の基板処理装置。
- 前記第1の区間は、前記第1の中継モジュールの上流側に設けられる一の処理モジュールと、当該一の処理モジュールの上流側に設けられる第3の中継モジュールと、を含み、
前記共用搬送機構は、前記一の処理モジュールにおいて処理済みの基板と、前記第3の中継モジュールから搬出した基板との入れ替えを行うために基板を各々保持する複数の保持部を備え、
前記決定部は、当該一の処理モジュールから処理済みの基板を搬出可能であり、且つ前記第3の中継モジュールに基板が搬送されていない状態で前記決定を行う請求項1記載の基板処理装置。 - 前記決定部は、前記一の処理モジュールから処理済みの基板を搬出可能になってから、前記決定による搬送を行うまでの時間設定を行う請求項7記載の基板処理装置。
- 前記決定部は、
前記搬送経路における前記第1の区間よりも前段で、搬送を受け持つ搬送機構毎に分けられる各区間について、後段の区間へと基板を搬送する予想の時間間隔を算出し、
前記時間設定は、前記各区間の予想の時間間隔に基づいて行われる請求項8記載の基板処理装置。 - 前記予想の時間間隔は、一つの区間に含まれる前記処理モジュールの数と、当該処理モジュールにおいて必要な基板の滞在時間と、に基づいて算出される請求項9記載の基板処理装置。
- 複数の処理モジュールで基板を各々処理する工程と、
前記複数の処理モジュール間で当該基板を受け渡すために複数の中継モジュールに前記基板を各々載置する工程と、
前記処理モジュールへの前記基板の搬入及び搬出を共通の搬送機構で行う工程と、
前記中継モジュールへの前記基板への搬入、搬出を互いに異なる搬送機構で行う工程と、
前記複数の処理モジュールと前記複数の中継モジュールとからなるモジュール群により構成される基板の搬送経路について、複数の搬送機構に各々割り当てられた区間にて基板を搬送し、当該搬送経路にて順番に前記基板を搬送する工程と、
前記複数の搬送機構のうちの一つをなす共用搬送機構により、前記基板の搬送経路のうちの互いに離れた、前記複数の中継モジュールを構成する第1の中継モジュールを含む第1の区間、及び前記複数の中継モジュールを構成する第2の中継モジュールを含む第2の区間の搬送に共用される共用搬送機構により、前記第1の中継モジュール及び第2の中継モジュールへの搬送を行う工程と、
前記第1の中継モジュール、第2の中継モジュールの各々から前記搬送経路の下流側に見て、直近の前記処理モジュールの手前の中継モジュールに至るまでの各区間における前記基板の搬送状況に基づき、前記共用搬送機構が第1の中継モジュール及び第2の中継モジュールのうちのいずれへ前記基板を搬送するかを決定する工程と、
を備える基板処理方法。
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JP2020069929 | 2020-04-08 | ||
JP2020069929 | 2020-04-08 | ||
PCT/JP2021/013061 WO2021205918A1 (ja) | 2020-04-08 | 2021-03-26 | 基板処理装置及び基板処理方法 |
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US (1) | US20230152716A1 (ja) |
JP (1) | JP7347658B2 (ja) |
KR (1) | KR20220164746A (ja) |
CN (1) | CN115362530A (ja) |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005243776A (ja) | 2004-02-25 | 2005-09-08 | Dainippon Screen Mfg Co Ltd | 基板搬送装置 |
JP2010147424A (ja) | 2008-12-22 | 2010-07-01 | Tokyo Electron Ltd | 塗布、現像装置、塗布、現像方法及び記憶媒体 |
JP2015060919A (ja) | 2013-09-18 | 2015-03-30 | 東京エレクトロン株式会社 | 塗布、現像装置、塗布、現像方法及び記憶媒体 |
JP2016066643A (ja) | 2014-09-22 | 2016-04-28 | 株式会社Screenホールディングス | 基板処理装置、制御方法、およびコンピュータプログラム |
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- 2021-03-25 TW TW110110741A patent/TW202141677A/zh unknown
- 2021-03-26 KR KR1020227037971A patent/KR20220164746A/ko active Search and Examination
- 2021-03-26 US US17/917,503 patent/US20230152716A1/en active Pending
- 2021-03-26 JP JP2022514413A patent/JP7347658B2/ja active Active
- 2021-03-26 CN CN202180026301.XA patent/CN115362530A/zh active Pending
- 2021-03-26 WO PCT/JP2021/013061 patent/WO2021205918A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005243776A (ja) | 2004-02-25 | 2005-09-08 | Dainippon Screen Mfg Co Ltd | 基板搬送装置 |
JP2010147424A (ja) | 2008-12-22 | 2010-07-01 | Tokyo Electron Ltd | 塗布、現像装置、塗布、現像方法及び記憶媒体 |
JP2015060919A (ja) | 2013-09-18 | 2015-03-30 | 東京エレクトロン株式会社 | 塗布、現像装置、塗布、現像方法及び記憶媒体 |
JP2016066643A (ja) | 2014-09-22 | 2016-04-28 | 株式会社Screenホールディングス | 基板処理装置、制御方法、およびコンピュータプログラム |
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TW202141677A (zh) | 2021-11-01 |
US20230152716A1 (en) | 2023-05-18 |
WO2021205918A1 (ja) | 2021-10-14 |
JPWO2021205918A1 (ja) | 2021-10-14 |
KR20220164746A (ko) | 2022-12-13 |
CN115362530A (zh) | 2022-11-18 |
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