JP7332095B2 - 基板の処理法 - Google Patents
基板の処理法 Download PDFInfo
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- JP7332095B2 JP7332095B2 JP2020112773A JP2020112773A JP7332095B2 JP 7332095 B2 JP7332095 B2 JP 7332095B2 JP 2020112773 A JP2020112773 A JP 2020112773A JP 2020112773 A JP2020112773 A JP 2020112773A JP 7332095 B2 JP7332095 B2 JP 7332095B2
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- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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Description
Claims (10)
- 第1面(4)と、前記第1面(4)の反対側にある第2面(6)とを有する基板(2)を処理する方法において、
表の面(12)と、前記表の面(12)の反対側にある裏の面(14)とを有する保護フィルム(8)を準備するステップと、
前記基板(2)を保持する為の保持フレーム(10)を準備するステップであって、前記保持フレーム(10)は、中央開口部(16)を有する、前記ステップと、
前記保護フィルム(8)によって前記保持フレーム(10)の前記開口部(16)を閉鎖するように前記保護フィルム(8)の前記裏の面(14)に前記保持フレーム(10)を付けるステップと、
前記基板(2)の前記第1面(4)または前記基板(2)の前記第2面を前記保護フィルム(8)の前記表の面(12)に付けるステップと、
前記保護フィルム(8)の前記表の面(12)に付けられた前記基板(2)の面の反対側にある前記基板(2)の面から前記基板(2)を処理、および/または、前記保護フィルム(8)の前記表の面(12)に付けられた前記基板の面から前記基板(2)を処理するステップと、
検査装置(22)を準備するステップと、
前記検査装置(22)によって、前記保護フィルム(8)を通して、前記保護フィルム(8)の前記表の面(12)に付けられる前記基板(2)の面を検査するステップと、
を含み、
前記保護フィルム(8)の前記表の面(12)に前記基板(2)の前記第1面(4)または前記基板(2)の前記第2面(6)を付けるステップは、
前記保護フィルム(8)の前記表の面(12)の少なくとも中央領域が、前記基板(2)の前記第1面(4)または前記基板(2)の第2面(6)と直接接触するように、前記基板(2)の前記第1面(4)または前記基板(2)の前記第2面(6)に前記保護フィルム(8)を加える工程を含み、
クッション層が、前記保護フィルムの裏の面に付けられ、
前記保持フレームが前記保護フィルムの前記裏の面に付けられる領域において、前記保護フィルムの前記裏の面と前記保持フレームとの間に前記クッション層が存在しないように前記保護フィルムの前記裏の面に前記保持フレームが付けられる、方法。 - 第1面(4)と、前記第1面(4)の反対側にある第2面(6)とを有する基板(2)を処理する方法において、
表の面(12)と、前記表の面(12)の反対側にある裏の面(14)とを有する保護フィルム(8)を準備するステップと、
前記基板(2)を保持する為の保持フレーム(10)を準備するステップであって、前記保持フレーム(10)は、中央開口部(16)を有する、前記ステップと、
前記保護フィルム(8)によって前記保持フレーム(10)の前記開口部(16)を閉鎖するように前記保護フィルム(8)の前記裏の面(14)に前記保持フレーム(10)を付けるステップと、
前記基板(2)の前記第1面(4)または前記基板(2)の前記第2面を前記保護フィルム(8)の前記表の面(12)に付けるステップと、
前記保護フィルム(8)の前記表の面(12)に付けられた前記基板(2)の面の反対側にある前記基板(2)の面から前記基板(2)を処理、および/または、前記保護フィルム(8)の前記表の面(12)に付けられた前記基板の面から前記基板(2)を処理するステップと、
を含み、
前記保護フィルム(8)の前記表の面(12)に前記基板(2)の前記第1面(4)または前記基板(2)の前記第2面(6)を付けるステップは、
前記保護フィルム(8)の前記表の面(12)の少なくとも中央領域が、前記基板(2)の前記第1面(4)または前記基板(2)の第2面(6)と直接接触するように、前記基板(2)の前記第1面(4)または前記基板(2)の前記第2面(6)に前記保護フィルム(8)を加える工程を含み、
クッション層が、前記保護フィルムの裏の面に付けられ、
前記保持フレームが前記保護フィルムの前記裏の面に付けられる領域において、前記保護フィルムの前記裏の面と前記保持フレームとの間に前記クッション層が存在しないように前記保護フィルムの前記裏の面に前記保持フレームが付けられ、
前記基板(2)は、前記保護フィルム(8)の前記表の面(12)に付けられた前記基板(2)の面から前記基板(2)が処理され、前記保護フィルム(8)の前記表の面(12)に付けられた前記基板(2)の面から前記基板(2)を処理するステップは、
前記保護フィルム(8)の前記表の面(12)に付けられた前記基板(2)の面から放射線で前記基板(2)を照射する工程を含む、方法。 - 前記基板(2)の前記第1面(4)または前記基板(2)の前記第2面(6)を前記保護フィルム(8)の前記表の面(12)に付けるステップは、
前記基板(2)の前記第1面(4)または前記基板(2)の前記第2面(6)が前記保護フィルム(8)の前記表の面(12)に付けられるように、前記基板(2)の前記第1面(4)または前記基板(2)の前記第2面(6)に前記保護フィルム(8)を加える間および/または加えた後、前記保護フィルム(8)に外部刺激を加える工程を更に含む、請求項1又は2に記載の方法。 - 前記保護フィルム(8)の前記裏の面(14)に前記保持フレーム(10)を付けるステップは、
前記保護フィルム(8)の前記裏の面(14)が前記保持フレーム(10)と直接接触するように、前記保護フィルム(8)を前記保持フレーム(10)に加える工程と、
前記保持フレーム(10)が前記保護フィルム(8)の前記裏の面(14)に付けられるように、前記保護フィルム(8)を前記保持フレーム(10)に加える間および/または加えた後、前記保護フィルム(8)に外部刺激を加える工程と、
を含む、請求項1~3のいずれか一項に記載の方法。 - 前記保護フィルム(8)に前記外部刺激を加える工程は、
前記保護フィルム(8)を加熱すること及び/又は前記保護フィルム(8)を冷却すること及び/又は前記保護フィルム(8)に真空を加えること及び/又は光で前記保護フィルム(8)を放射することを含む、請求項3又は4に記載の方法。 - 少なくとも一つの分割ラインが前記基板(2)の前記第1面(4)に形成され、前記基板(2)の前記第1面(4)が前記保護フィルム(8)の前記表の面(12)に付けられる、請求項1~5のいずれか一項に記載の方法。
- 前記保護フィルム(8)に接着層が設けられ、前記接着層が前記保護フィルム(8)の前記表の面(12)の周辺領域のみに設けられ、前記基板(2)の前記第1面(4)または前記基板(2)の前記第2面(6)が前記保護フィルム(8)の前記表の面(12)に付けられ、前記接着層が、前記基板(2)の前記第1面(4)または前記基板(2)の前記第2面(6)の周辺部分のみと接触するようになる、請求項1~6のいずれか一項に記載の方法。
- 前記基板(2)が、前記保護フィルム(8)の前記表の面(12)に付けられた前記基板(2)の面の反対側にある前記基板(2)の面から処理され、前記保護フィルム(8)の前記表の面(12)に付けられた前記基板(2)の面の反対側にある前記基板(2)の面から前記基板(2)を処理するステップは、
前記保護フィルム(8)の前記表の面(12)に付けられた前記基板(2)の面の反対側にある前記基板(2)の面から前記基板を切断および/または研削および/または研磨する工程を含む、請求項1~7のいずれか一項に記載の方法。 - 第1面(4)と、前記第1面(4)の反対側にある第2面(6)とを有する基板(2)を処理する方法において、
表の面(12)と、前記表の面(12)の反対側にある裏の面(14)とを有する保護シーティング(8)を準備するステップと、
前記基板(2)を保持する為の保持フレーム(10)を準備するステップであって、前記保持フレーム(10)は、中央開口部(16)を有する、前記ステップと、
前記保護シーティング(8)によって前記保持フレーム(10)の前記開口部(16)を閉鎖するように、前記保護シーティング(8)の前記表の面(12)または前記裏の面(14)に前記保持フレーム(10)を付けるステップと、
前記保護シーティング(8)の前記表の面(12)に、前記基板(2)の前記第1面(4)または前記基板(2)の前記第2面(6)を付けるステップと、
前記保護シーティング(8)の前記表の面(12)に付けられた前記基板(2)の面の反対側にある前記基板(2)の面から前記基板(2)を処理、および/または、
前記保護シーティング(8)の前記表の面(12)に付けられた前記基板(2)の面から前記基板(2)を処理するステップと、
検査装置(22)を準備するステップと、
前記検査装置(22)によって、前記保護シーティング(8)を通して、前記保護シーティング(8)の前記表の面(12)に付けられる前記基板(2)の面を検査するステップと、
を含み、
前記保護シーティング(8)の前記表の面(12)または前記裏の面(14)に前記保持フレーム(10)を付けるステップは、
前記保持フレーム(10)と、前記保護シーティング(8)の前記表の面(12)または前記裏の面(14)とが直接接触するように、前記保持フレーム(10)に前記保護シーティング(8)を加える工程と、
前記保持フレーム(10)が前記保護シーティング(8)の前記表の面(12)または前記裏の面(14)に付けられるように、前記保持フレーム(10)に前記保護シーティング(8)を加える間および/または加えた後、前記保護シーティング(8)に外部刺激を加える工程と、
を含み、
前記保護シーティング(8)に外部刺激を加える工程は、前記保護シーティング(8)の加熱を含む、方法。 - 第1面(4)と、前記第1面(4)の反対側にある第2面(6)とを有する基板(2)を処理する方法において、
表の面(12)と、前記表の面(12)の反対側にある裏の面(14)とを有する保護シーティング(8)を準備するステップと、
前記基板(2)を保持する為の保持フレーム(10)を準備するステップであって、前記保持フレーム(10)は、中央開口部(16)を有する、前記ステップと、
前記保護シーティング(8)によって前記保持フレーム(10)の前記開口部(16)を閉鎖するように、前記保護シーティング(8)の前記表の面(12)または前記裏の面(14)に前記保持フレーム(10)を付けるステップと、
前記保護シーティング(8)の前記表の面(12)に、前記基板(2)の前記第1面(4)または前記基板(2)の前記第2面(6)を付けるステップと、
前記保護シーティング(8)の前記表の面(12)に付けられた前記基板(2)の面の反対側にある前記基板(2)の面から前記基板(2)を処理、および/または、前記保護シーティング(8)の前記表の面(12)に付けられた前記基板(2)の面から前記基板(2)を処理するステップと、
を含み、
前記保護シーティング(8)の前記表の面(12)または前記裏の面(14)に前記保持フレーム(10)を付けるステップは、
前記保持フレーム(10)と、前記保護シーティング(8)の前記表の面(12)または前記裏の面(14)とが直接接触するように、前記保持フレーム(10)に前記保護シーティング(8)を加える工程と、
前記保持フレーム(10)が前記保護シーティング(8)の前記表の面(12)または前記裏の面(14)に付けられるように、前記保持フレーム(10)に前記保護シーティング(8)を加える間および/または加えた後、前記保護シーティング(8)に外部刺激を加える工程と、
を含み、
前記保護シーティング(8)に外部刺激を加える工程は、前記保護シーティング(8)の加熱を含み、
前記基板(2)は、前記保護シーティング(8)の前記表の面(12)に付けられた前記基板(2)の面から前記基板(2)が処理され、前記保護シーティング(8)の前記表の面(12)に付けられた前記基板(2)の面から前記基板(2)を処理するステップは、
前記保護シーティング(8)の前記表の面(12)に付けられた前記基板(2)の面から放射線で前記基板(2)を照射する工程を含む、方法。
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