JP7324023B2 - ダイシングテープ - Google Patents

ダイシングテープ Download PDF

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Publication number
JP7324023B2
JP7324023B2 JP2019054576A JP2019054576A JP7324023B2 JP 7324023 B2 JP7324023 B2 JP 7324023B2 JP 2019054576 A JP2019054576 A JP 2019054576A JP 2019054576 A JP2019054576 A JP 2019054576A JP 7324023 B2 JP7324023 B2 JP 7324023B2
Authority
JP
Japan
Prior art keywords
adhesive layer
pressure
sensitive adhesive
dicing tape
acrylate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019054576A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020155689A (ja
Inventor
友二 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2019054576A priority Critical patent/JP7324023B2/ja
Priority to TW109106736A priority patent/TWI837315B/zh
Priority to KR1020200033004A priority patent/KR20200112705A/ko
Priority to CN202010211027.0A priority patent/CN111725122A/zh
Publication of JP2020155689A publication Critical patent/JP2020155689A/ja
Application granted granted Critical
Publication of JP7324023B2 publication Critical patent/JP7324023B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/005—Presence of polyester in the release coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
JP2019054576A 2019-03-22 2019-03-22 ダイシングテープ Active JP7324023B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019054576A JP7324023B2 (ja) 2019-03-22 2019-03-22 ダイシングテープ
TW109106736A TWI837315B (zh) 2019-03-22 2020-03-02 切割帶
KR1020200033004A KR20200112705A (ko) 2019-03-22 2020-03-18 다이싱 테이프
CN202010211027.0A CN111725122A (zh) 2019-03-22 2020-03-20 切割带

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019054576A JP7324023B2 (ja) 2019-03-22 2019-03-22 ダイシングテープ

Publications (2)

Publication Number Publication Date
JP2020155689A JP2020155689A (ja) 2020-09-24
JP7324023B2 true JP7324023B2 (ja) 2023-08-09

Family

ID=72559791

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019054576A Active JP7324023B2 (ja) 2019-03-22 2019-03-22 ダイシングテープ

Country Status (3)

Country Link
JP (1) JP7324023B2 (ko)
KR (1) KR20200112705A (ko)
CN (1) CN111725122A (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102521063B1 (ko) * 2021-03-25 2023-04-13 율촌화학 주식회사 내용제성이 우수한 다이싱 테이프

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006120850A (ja) 2004-10-21 2006-05-11 Anritsu Corp 半導体チップの製造方法
JP2007277282A (ja) 2006-04-03 2007-10-25 Nitto Denko Corp 半導体ウエハ加工用粘着シート
WO2015133420A1 (ja) 2014-03-03 2015-09-11 リンテック株式会社 半導体関連部材加工用シートおよび当該シートを用いるチップの製造方法
JP2018115333A (ja) 2018-03-20 2018-07-26 リンテック株式会社 粘着テープおよび半導体装置の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003007646A (ja) 2001-06-18 2003-01-10 Nitto Denko Corp ダイシング用粘着シートおよび切断片の製造方法
JP5901422B2 (ja) * 2012-05-15 2016-04-13 古河電気工業株式会社 半導体ウェハのダイシング方法およびこれに用いる半導体加工用ダイシングテープ
JP2014037458A (ja) 2012-08-13 2014-02-27 Tokyo Ohka Kogyo Co Ltd 接着剤組成物、接着フィルムおよび貼付方法
JP5607847B1 (ja) * 2013-11-29 2014-10-15 古河電気工業株式会社 半導体加工用粘着テープ
KR101676025B1 (ko) * 2016-06-30 2016-11-15 (주) 화인테크놀리지 반도체 웨이퍼의 하프커팅 후 이면 연삭 가공용 자외선 경화형 점착시트

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006120850A (ja) 2004-10-21 2006-05-11 Anritsu Corp 半導体チップの製造方法
JP2007277282A (ja) 2006-04-03 2007-10-25 Nitto Denko Corp 半導体ウエハ加工用粘着シート
WO2015133420A1 (ja) 2014-03-03 2015-09-11 リンテック株式会社 半導体関連部材加工用シートおよび当該シートを用いるチップの製造方法
JP2018115333A (ja) 2018-03-20 2018-07-26 リンテック株式会社 粘着テープおよび半導体装置の製造方法

Also Published As

Publication number Publication date
TW202039745A (zh) 2020-11-01
JP2020155689A (ja) 2020-09-24
KR20200112705A (ko) 2020-10-05
CN111725122A (zh) 2020-09-29

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