JP7150579B2 - インダクタンス素子及び電子機器 - Google Patents
インダクタンス素子及び電子機器 Download PDFInfo
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- JP7150579B2 JP7150579B2 JP2018224210A JP2018224210A JP7150579B2 JP 7150579 B2 JP7150579 B2 JP 7150579B2 JP 2018224210 A JP2018224210 A JP 2018224210A JP 2018224210 A JP2018224210 A JP 2018224210A JP 7150579 B2 JP7150579 B2 JP 7150579B2
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- 239000004020 conductor Substances 0.000 claims description 118
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 239000004332 silver Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000007769 metal material Substances 0.000 claims description 8
- 229910000859 α-Fe Inorganic materials 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 5
- 230000035699 permeability Effects 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 230000004907 flux Effects 0.000 description 31
- 238000004088 simulation Methods 0.000 description 17
- 238000009826 distribution Methods 0.000 description 10
- 239000000696 magnetic material Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 230000012447 hatching Effects 0.000 description 4
- 239000006249 magnetic particle Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910005347 FeSi Inorganic materials 0.000 description 1
- 229910003962 NiZn Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Coils Of Transformers For General Uses (AREA)
Description
サンプル1は、高さ寸法Hと幅寸法Wを共に0.8mmとし、W/Hの値を1とした。
サンプル2は、高さ寸法Hを0.533mm、幅寸法Wを0.8mmとし、W/Hの値を1.5とした。
サンプル3は、高さ寸法Hを0.4mm、幅寸法Wを0.8mmとし、W/Hの値を2とした。
サンプル4は、高さ寸法Hを0.2mm、幅寸法Wを0.8mmとし、W/Hの値を4とした。
12 上面
14 下面
16a、16b 端面
18a、18b 側面
30、30a 内部導体
32 内部導体領域
50a、50b 外部電極
80 回路基板
82 ランド電極
84 半田
100、200、300、400 インダクタンス素子
500 電子機器
Claims (5)
- 長さ寸法L、高さ寸法H、幅寸法Wで規定される直方体形状を有し、高さ寸法Hに対する幅寸法Wの比W/Hの値が2以上である絶縁性の基体部と、
前記基体部に内蔵され、前記基体部の断面において、前記断面に垂直で同一の方向に電流を流すことが可能な1本の内部導体と、
前記基体部の表面に、前記1本の内部導体が前記断面に垂直で同一の方向に電流を流すことが可能となるように前記1本の内部導体の両端部にそれぞれ接続されて設けられる一対の外部電極と、を備え、
前記基体部は、前記1本の内部導体の周りを囲む領域の比透磁率が5以上であり、
前記基体部の前記断面において、前記1本の内部導体の高さ方向と幅方向で最も外側に位置する部分に接して前記1本の内部導体を囲む長方形の内部導体領域の高さ寸法をEh、幅寸法をEwとした場合に、前記内部導体領域の高さ寸法Ehに対する幅寸法Ewの比Ew/Ehの値を前記基体部の高さ寸法Hに対する幅寸法Wの比W/Hで割った値(Ew/Eh)/(W/H)は3以上である、インダクタンス素子。 - 長さ寸法L、高さ寸法H、幅寸法Wで規定される直方体形状を有し、高さ寸法Hに対する幅寸法Wの比W/Hの値が1.5以上である絶縁性の基体部と、
前記基体部に内蔵され、前記基体部の高さ方向に並んで設けられ、前記基体部の断面において、前記断面に垂直で同一の方向に電流を流すことが可能な複数の内部導体と、
前記基体部の表面に、前記複数の内部導体が前記断面に垂直で同一の方向に電流を流すことが可能となるように前記複数の内部導体の両端部にそれぞれ接続されて設けられ、前記複数の内部導体各々の一端が共通に接続された一方の外部電極と他端が共通に接続された他方の外部電極とを有する一対の外部電極と、を備え、
前記基体部の前記断面において、前記複数の内部導体の高さ方向と幅方向で最も外側に位置する部分に接して前記複数の内部導体を囲む長方形の内部導体領域の高さ寸法をEh、幅寸法をEwとした場合に、前記内部導体領域の高さ寸法Ehに対する幅寸法Ewの比Ew/Ehの値は、前記基体部の高さ寸法Hに対する幅寸法Wの比W/Hの値よりも大きい、インダクタンス素子。 - 前記基体部の寸法は、長さ寸法L>幅寸法W>高さ寸法Hを満たす、請求項1または2記載のインダクタンス素子。
- 前記基体部は、磁性金属材料又はフェライト材料を含んで形成され、
前記内部導体は、銀、銅、若しくは銀又は銅の少なくとも一方を含む合金のどれか1種類以上を含んで形成される、請求項1から3のいずれか一項記載のインダクタンス素子。 - 請求項1から4のいずれか一項記載のインダクタンス素子と、
前記インダクタンス素子が実装される回路基板と、を備える電子機器。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018224210A JP7150579B2 (ja) | 2018-11-29 | 2018-11-29 | インダクタンス素子及び電子機器 |
US16/685,988 US11532424B2 (en) | 2018-11-29 | 2019-11-15 | Inductance element and electronic device |
CN201911139493.6A CN111243836B (zh) | 2018-11-29 | 2019-11-20 | 电感元件和电子器件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018224210A JP7150579B2 (ja) | 2018-11-29 | 2018-11-29 | インダクタンス素子及び電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020088289A JP2020088289A (ja) | 2020-06-04 |
JP7150579B2 true JP7150579B2 (ja) | 2022-10-11 |
Family
ID=70850839
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018224210A Active JP7150579B2 (ja) | 2018-11-29 | 2018-11-29 | インダクタンス素子及び電子機器 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11532424B2 (ja) |
JP (1) | JP7150579B2 (ja) |
CN (1) | CN111243836B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022026519A (ja) * | 2020-07-31 | 2022-02-10 | 太陽誘電株式会社 | アレイ型インダクタ |
JP7264133B2 (ja) * | 2020-08-26 | 2023-04-25 | 株式会社村田製作所 | インダクタ部品 |
WO2022181177A1 (ja) * | 2021-02-26 | 2022-09-01 | 株式会社村田製作所 | インダクタ部品 |
WO2022181181A1 (ja) * | 2021-02-26 | 2022-09-01 | 株式会社村田製作所 | 電子部品、及び電子部品の製造方法 |
JPWO2022181178A1 (ja) * | 2021-02-26 | 2022-09-01 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000068130A (ja) | 1998-08-21 | 2000-03-03 | Tdk Corp | コイル装置 |
JP2000164431A (ja) | 1998-11-25 | 2000-06-16 | Tokin Corp | インダクタ |
JP2003272923A (ja) | 2002-03-15 | 2003-09-26 | Matsushita Electric Ind Co Ltd | 電子部品 |
JP2005129589A (ja) | 2003-10-21 | 2005-05-19 | Tdk Corp | 磁気結合素子 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09246048A (ja) * | 1996-03-06 | 1997-09-19 | Hitachi Aic Inc | フェライトビーズ |
JPH10144526A (ja) * | 1996-11-05 | 1998-05-29 | Murata Mfg Co Ltd | 積層チップインダクタ |
JP2000323336A (ja) * | 1999-03-11 | 2000-11-24 | Taiyo Yuden Co Ltd | インダクタ及びその製造方法 |
JP4307822B2 (ja) * | 2002-11-13 | 2009-08-05 | スミダコーポレーション株式会社 | 積層インダクタンス素子 |
JP5398676B2 (ja) * | 2009-09-24 | 2014-01-29 | 日本碍子株式会社 | コイル埋設型インダクタおよびその製造方法 |
CN103035357A (zh) | 2012-12-03 | 2013-04-10 | 深圳顺络电子股份有限公司 | 层叠电感器 |
CN106062903B (zh) * | 2014-03-04 | 2018-08-28 | 株式会社村田制作所 | 电感器装置、电感器阵列和多层基板以及电感器装置的制造方法 |
JP6534880B2 (ja) * | 2015-07-14 | 2019-06-26 | 太陽誘電株式会社 | インダクタ及びプリント基板 |
US20170178797A1 (en) * | 2015-12-21 | 2017-06-22 | Infineon Technologies Austria Ag | Surface Mount Inductor for Placement Over a Power Stage of a Power Converter |
CN107452463B (zh) | 2016-05-31 | 2021-04-02 | 太阳诱电株式会社 | 线圈部件 |
JP6819632B2 (ja) * | 2018-03-01 | 2021-01-27 | 株式会社村田製作所 | 表面実装インダクタ |
US20220037083A1 (en) * | 2020-07-31 | 2022-02-03 | Taiyo Yuden Co., Ltd. | Inductor array |
-
2018
- 2018-11-29 JP JP2018224210A patent/JP7150579B2/ja active Active
-
2019
- 2019-11-15 US US16/685,988 patent/US11532424B2/en active Active
- 2019-11-20 CN CN201911139493.6A patent/CN111243836B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000068130A (ja) | 1998-08-21 | 2000-03-03 | Tdk Corp | コイル装置 |
JP2000164431A (ja) | 1998-11-25 | 2000-06-16 | Tokin Corp | インダクタ |
JP2003272923A (ja) | 2002-03-15 | 2003-09-26 | Matsushita Electric Ind Co Ltd | 電子部品 |
JP2005129589A (ja) | 2003-10-21 | 2005-05-19 | Tdk Corp | 磁気結合素子 |
Non-Patent Citations (1)
Title |
---|
「SMD Beads and Chokes」、Application note、Extended range for EMI noise suppression、米国、FERROXCUBE、Date of release: October 2006、p.3-7 |
Also Published As
Publication number | Publication date |
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JP2020088289A (ja) | 2020-06-04 |
US20200176170A1 (en) | 2020-06-04 |
US11532424B2 (en) | 2022-12-20 |
CN111243836A (zh) | 2020-06-05 |
CN111243836B (zh) | 2023-06-06 |
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