JP7070559B2 - 封止用フィルム及び封止構造体、並びにこれらの製造方法 - Google Patents

封止用フィルム及び封止構造体、並びにこれらの製造方法 Download PDF

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JP7070559B2
JP7070559B2 JP2019514668A JP2019514668A JP7070559B2 JP 7070559 B2 JP7070559 B2 JP 7070559B2 JP 2019514668 A JP2019514668 A JP 2019514668A JP 2019514668 A JP2019514668 A JP 2019514668A JP 7070559 B2 JP7070559 B2 JP 7070559B2
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Prior art keywords
resin
functional group
reactive functional
mass
mol
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Japanese (ja)
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JPWO2018199309A1 (ja
Inventor
裕介 渡瀬
豊 野村
紘之 石毛
雅彦 鈴木
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP2019514668A 2017-04-28 2018-04-27 封止用フィルム及び封止構造体、並びにこれらの製造方法 Active JP7070559B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017090356 2017-04-28
JP2017090356 2017-04-28
PCT/JP2018/017268 WO2018199309A1 (ja) 2017-04-28 2018-04-27 封止用フィルム及び封止構造体、並びにこれらの製造方法

Publications (2)

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JPWO2018199309A1 JPWO2018199309A1 (ja) 2020-03-12
JP7070559B2 true JP7070559B2 (ja) 2022-05-18

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JP2019514668A Active JP7070559B2 (ja) 2017-04-28 2018-04-27 封止用フィルム及び封止構造体、並びにこれらの製造方法

Country Status (5)

Country Link
JP (1) JP7070559B2 (ko)
KR (1) KR102441766B1 (ko)
CN (1) CN110582528A (ko)
TW (1) TWI746841B (ko)
WO (1) WO2018199309A1 (ko)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218496A (ja) 2007-02-28 2008-09-18 Namics Corp 封止用樹脂フィルム
JP2008258492A (ja) 2007-04-06 2008-10-23 Nitto Denko Corp 半導体装置製造用接着シート
JP2013041987A (ja) 2011-08-16 2013-02-28 Sumitomo Bakelite Co Ltd 半導体装置の製造方法、及び一括封止基板
JP2014095063A (ja) 2012-10-11 2014-05-22 Panasonic Corp 封止用エポキシ樹脂無機複合シート
WO2015037584A1 (ja) 2013-09-10 2015-03-19 日本化薬株式会社 エポキシ樹脂混合物、エポキシ樹脂組成物、硬化物および半導体装置
JP2016148054A (ja) 2011-07-08 2016-08-18 日立化成株式会社 コンプレッション成形用半導体封止樹脂材料及び半導体装置
WO2018003590A1 (ja) 2016-06-28 2018-01-04 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリント配線基板および半導体装置
JP2018041889A (ja) 2016-09-09 2018-03-15 住友ベークライト株式会社 樹脂シート

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010031149A (ja) * 2008-07-29 2010-02-12 Shin-Etsu Chemical Co Ltd 光半導体素子封止用樹脂組成物
JP5768023B2 (ja) * 2012-08-29 2015-08-26 日東電工株式会社 電子部品封止用熱硬化性樹脂シート、樹脂封止型半導体装置、及び樹脂封止型半導体装置の製造方法
JP5943898B2 (ja) 2012-11-29 2016-07-05 日東電工株式会社 熱硬化性樹脂シート及び電子部品パッケージの製造方法
JP6041933B2 (ja) 2012-11-29 2016-12-14 日東電工株式会社 熱硬化性樹脂シート及び電子部品パッケージの製造方法
JP2014197670A (ja) 2013-03-07 2014-10-16 日東電工株式会社 半導体装置の製造方法及び熱硬化性樹脂シート
KR20150097359A (ko) * 2014-02-18 2015-08-26 주식회사 엘지화학 봉지 필름 및 이를 포함하는 유기전자장치
US9873771B2 (en) * 2014-06-04 2018-01-23 Hitachi Chemical Company, Ltd. Film-like epoxy resin composition, method of producing film-like epoxy resin composition, and method of producing semiconductor device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218496A (ja) 2007-02-28 2008-09-18 Namics Corp 封止用樹脂フィルム
JP2008258492A (ja) 2007-04-06 2008-10-23 Nitto Denko Corp 半導体装置製造用接着シート
JP2016148054A (ja) 2011-07-08 2016-08-18 日立化成株式会社 コンプレッション成形用半導体封止樹脂材料及び半導体装置
JP2013041987A (ja) 2011-08-16 2013-02-28 Sumitomo Bakelite Co Ltd 半導体装置の製造方法、及び一括封止基板
JP2014095063A (ja) 2012-10-11 2014-05-22 Panasonic Corp 封止用エポキシ樹脂無機複合シート
WO2015037584A1 (ja) 2013-09-10 2015-03-19 日本化薬株式会社 エポキシ樹脂混合物、エポキシ樹脂組成物、硬化物および半導体装置
WO2018003590A1 (ja) 2016-06-28 2018-01-04 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリント配線基板および半導体装置
JP2018041889A (ja) 2016-09-09 2018-03-15 住友ベークライト株式会社 樹脂シート

Also Published As

Publication number Publication date
KR20190138774A (ko) 2019-12-16
TWI746841B (zh) 2021-11-21
WO2018199309A1 (ja) 2018-11-01
JPWO2018199309A1 (ja) 2020-03-12
CN110582528A (zh) 2019-12-17
KR102441766B1 (ko) 2022-09-07
TW201843287A (zh) 2018-12-16

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