CN110582528A - 密封用膜和密封结构体、以及它们的制造方法 - Google Patents

密封用膜和密封结构体、以及它们的制造方法 Download PDF

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Publication number
CN110582528A
CN110582528A CN201880027799.XA CN201880027799A CN110582528A CN 110582528 A CN110582528 A CN 110582528A CN 201880027799 A CN201880027799 A CN 201880027799A CN 110582528 A CN110582528 A CN 110582528A
Authority
CN
China
Prior art keywords
resin
functional group
reactive functional
mol
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201880027799.XA
Other languages
English (en)
Chinese (zh)
Inventor
渡濑裕介
野村丰
石毛纮之
铃木雅彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CN110582528A publication Critical patent/CN110582528A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
CN201880027799.XA 2017-04-28 2018-04-27 密封用膜和密封结构体、以及它们的制造方法 Pending CN110582528A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017-090356 2017-04-28
JP2017090356 2017-04-28
PCT/JP2018/017268 WO2018199309A1 (ja) 2017-04-28 2018-04-27 封止用フィルム及び封止構造体、並びにこれらの製造方法

Publications (1)

Publication Number Publication Date
CN110582528A true CN110582528A (zh) 2019-12-17

Family

ID=63918457

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880027799.XA Pending CN110582528A (zh) 2017-04-28 2018-04-27 密封用膜和密封结构体、以及它们的制造方法

Country Status (5)

Country Link
JP (1) JP7070559B2 (ko)
KR (1) KR102441766B1 (ko)
CN (1) CN110582528A (ko)
TW (1) TWI746841B (ko)
WO (1) WO2018199309A1 (ko)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218496A (ja) * 2007-02-28 2008-09-18 Namics Corp 封止用樹脂フィルム
JP2013036029A (ja) * 2011-07-08 2013-02-21 Hitachi Chemical Co Ltd コンプレッション成形用半導体封止樹脂材料及び半導体装置
JP2013041987A (ja) * 2011-08-16 2013-02-28 Sumitomo Bakelite Co Ltd 半導体装置の製造方法、及び一括封止基板
CN103681530A (zh) * 2012-08-29 2014-03-26 日东电工株式会社 电子部件密封用热固化性树脂片、树脂密封型半导体装置及该半导体装置的制造方法
JP2014095063A (ja) * 2012-10-11 2014-05-22 Panasonic Corp 封止用エポキシ樹脂無機複合シート
CN106030846A (zh) * 2014-02-18 2016-10-12 株式会社Lg化学 封装膜及包括该封装膜的有机电子装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5053687B2 (ja) * 2007-04-06 2012-10-17 日東電工株式会社 半導体装置製造用接着シート
JP2010031149A (ja) * 2008-07-29 2010-02-12 Shin-Etsu Chemical Co Ltd 光半導体素子封止用樹脂組成物
JP5943898B2 (ja) 2012-11-29 2016-07-05 日東電工株式会社 熱硬化性樹脂シート及び電子部品パッケージの製造方法
JP6041933B2 (ja) 2012-11-29 2016-12-14 日東電工株式会社 熱硬化性樹脂シート及び電子部品パッケージの製造方法
JP2014197670A (ja) 2013-03-07 2014-10-16 日東電工株式会社 半導体装置の製造方法及び熱硬化性樹脂シート
CN105531297A (zh) * 2013-09-10 2016-04-27 日本化药株式会社 环氧树脂混合物、环氧树脂组合物、固化物和半导体装置
US9873771B2 (en) * 2014-06-04 2018-01-23 Hitachi Chemical Company, Ltd. Film-like epoxy resin composition, method of producing film-like epoxy resin composition, and method of producing semiconductor device
WO2018003590A1 (ja) * 2016-06-28 2018-01-04 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリント配線基板および半導体装置
JP6891427B2 (ja) * 2016-09-09 2021-06-18 住友ベークライト株式会社 樹脂シート

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218496A (ja) * 2007-02-28 2008-09-18 Namics Corp 封止用樹脂フィルム
JP2013036029A (ja) * 2011-07-08 2013-02-21 Hitachi Chemical Co Ltd コンプレッション成形用半導体封止樹脂材料及び半導体装置
JP2013041987A (ja) * 2011-08-16 2013-02-28 Sumitomo Bakelite Co Ltd 半導体装置の製造方法、及び一括封止基板
CN103681530A (zh) * 2012-08-29 2014-03-26 日东电工株式会社 电子部件密封用热固化性树脂片、树脂密封型半导体装置及该半导体装置的制造方法
JP2014095063A (ja) * 2012-10-11 2014-05-22 Panasonic Corp 封止用エポキシ樹脂無機複合シート
CN106030846A (zh) * 2014-02-18 2016-10-12 株式会社Lg化学 封装膜及包括该封装膜的有机电子装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
吴懿平 等编著: "《电子组装技术》", 31 December 2006, 华中科技大学出版社 *

Also Published As

Publication number Publication date
KR20190138774A (ko) 2019-12-16
TWI746841B (zh) 2021-11-21
JP7070559B2 (ja) 2022-05-18
WO2018199309A1 (ja) 2018-11-01
JPWO2018199309A1 (ja) 2020-03-12
KR102441766B1 (ko) 2022-09-07
TW201843287A (zh) 2018-12-16

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Application publication date: 20191217