JP7070559B2 - 封止用フィルム及び封止構造体、並びにこれらの製造方法 - Google Patents
封止用フィルム及び封止構造体、並びにこれらの製造方法 Download PDFInfo
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- JP7070559B2 JP7070559B2 JP2019514668A JP2019514668A JP7070559B2 JP 7070559 B2 JP7070559 B2 JP 7070559B2 JP 2019514668 A JP2019514668 A JP 2019514668A JP 2019514668 A JP2019514668 A JP 2019514668A JP 7070559 B2 JP7070559 B2 JP 7070559B2
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- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
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- C—CHEMISTRY; METALLURGY
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C—CHEMISTRY; METALLURGY
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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Landscapes
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Description
熱硬化性樹脂は、1分子中に2個以上の反応性官能基を有している。本実施形態では、例えば、反応性官能基と他の反応性官能基とが熱により反応することで三次架橋構造が形成され、封止用フィルムが硬化される。反応性官能基と反応する他の反応性官能基は、熱硬化性樹脂が有する反応性官能基であってよく、硬化剤が有する反応性官能基であってもよい。
第1実施形態の封止用フィルムは、樹脂Aがエポキシ樹脂を含む。反応性官能基当量が250g/molより大きいエポキシ樹脂は、1分子中に2個以上のエポキシ基を有し、かつ、エポキシ基当量が250g/molより大きい樹脂であれば特に制限なく用いることができる。
第2実施形態の封止用フィルムは、樹脂Aがフェノール樹脂を含む。反応性官能基当量が250g/molより大きいフェノール樹脂は、1分子中に2個以上のフェノール性水酸基を有し、かつ、フェノール性水酸基当量が250g/molより大きい樹脂であれば、特に制限なく公知のフェノール樹脂を用いることができる。
本実施形態の封止用フィルムは、熱硬化性成分として、硬化剤(熱硬化性樹脂に該当する成分は除く)を含有してもよい。硬化剤としては、特に限定されないが、フェノール系硬化剤、酸無水物系硬化剤、活性エステル系硬化剤、シアネートエステル系硬化剤などが挙げられる。熱硬化性樹脂がエポキシ樹脂を含む場合、硬化剤としては、エポキシ基と反応する官能基を1分子中に2個以上有する化合物であれば特に制限なく用いることができる。また、熱硬化性樹脂がフェノール樹脂を含む場合、硬化剤としては、フェノール性水酸基と反応する官能基を1分子中に2個以上有する化合物であれば特に制限なく用いることができる。硬化剤は、1種を単独で用いてもよく、2種以上を併用してもよい。熱硬化性樹脂が、異なる反応性官能基を有する複数の樹脂を含む場合、反応性官能基の種類に応じて複数種の硬化剤を併用してよい。
本実施形態の封止用フィルムは、熱硬化性成分として、硬化促進剤を含有してもよい。硬化促進剤としては、特に制限なく用いることができるが、アミン系の硬化促進剤及びリン系の硬化促進剤からなる群より選ばれる少なくとも1種が好ましい。硬化促進剤としては、特に、優れた熱伝導率を有する硬化物が得られやすい観点、誘導体が豊富である観点、及び、所望の活性温度が得られやすい観点から、アミン系の硬化促進剤が好ましく、イミダゾール化合物、脂肪族アミン及び脂環族アミンからなる群より選ばれる少なくとも1種がより好ましく、イミダゾール化合物が更に好ましい。イミダゾール化合物としては、2-フェニル-4-メチルイミダゾール、1-ベンジル-2-メチルイミダゾール等が挙げられる。硬化促進剤は、1種を単独で用いてもよく、2種以上を併用してもよい。硬化促進剤の市販品としては、四国化成工業株式会社製の「2P4MZ」及び「1B2MZ」等が挙げられる。
無機充填剤としては、従来公知の無機充填剤を使用でき、特に限定されない。無機充填剤の構成材料としては、シリカ類(無定形シリカ、結晶性シリカ、溶融シリカ、球状シリカ、合成シリカ、中空シリカ等)、硫酸バリウム、チタン酸バリウム、タルク、クレー、雲母粉、炭酸マグネシウム、炭酸カルシウム、酸化アルミニウム(アルミナ)、水酸化アルミニウム、酸化マグネシウム、水酸化マグネシウム、窒化ケイ素、窒化アルミニウム、ホウ酸アルミニウム、窒化ホウ素、チタン酸バリウム、チタン酸ストロンチウム、チタン酸カルシウム、チタン酸マグネシウム、チタン酸ビスマス、酸化チタン、ジルコン酸バリウム、ジルコン酸カルシウムなどが挙げられる。表面改質(例えば、シラン化合物による表面処理)等により、樹脂組成物中での分散性の向上効果、及び、ワニス中での沈降抑制効果が得られやすい観点、並びに、比較的小さい熱膨張率を有するために所望の硬化膜特性が得られやすい観点では、シリカ類を含む無機充填材が好ましい。高い熱伝導性が得られる観点では、酸化アルミニウムを含む無機充填材が好ましい。無機充填剤は、1種を単独で用いてもよく、2種以上を併用してもよい。
本実施形態の封止用フィルムは、必要に応じて、エラストマー(可とう剤)を含有してもよい。エラストマーは、分散性及び溶解性に優れる観点から、ポリブタジエン粒子、スチレンブタジエン粒子、アクリル系エラストマー、シリコーンパウダ、シリコーンオイル及びシリコーンオリゴマからなる群より選ばれる少なくとも1種を用いることが好ましい。エラストマーは、1種を単独で用いてもよく、2種以上を併用してもよい。
本実施形態の封止用フィルムは、他の添加剤を更に含有することができる。このような添加剤の具体例としては、顔料、染料、離型剤、酸化防止剤、表面張力調整剤等を挙げることができる。
本実施形態の封止用フィルム2は、熱硬化性樹脂として反応性官能基当量が250g/molより大きい樹脂と、無機充填材と、を含有する樹脂組成物を準備する工程(準備工程)と、該樹脂組成物をフィルム状に成形する工程(成形工程)と、を備える。
本実施形態の封止構造体は、被封止体と、当該被封止体を封止する本実施形態の封止用フィルムの硬化物(封止部)と、を備える。封止構造体としては、電子部品装置等が挙げられる。電子部品装置は、被封止体として電子部品を備える。電子部品としては、半導体素子;半導体ウエハ;集積回路;半導体デバイス;SAWフィルタ等のフィルタ;センサ等の受動部品などが挙げられる。半導体ウエハを個片化することにより得られる半導体素子を用いてもよい。電子部品装置は、電子部品として半導体素子又は半導体ウエハを備える半導体装置;プリント配線板等であってもよい。本実施形態の封止構造体は、複数の被封止体を備えていてもよい。複数の被封止体は、互いに同一の種類であってもよく、互いに異なる種類であってもよい。
(熱硬化性樹脂)
A1:柔軟性骨格含有ビスフェノールA型エポキシ樹脂(DIC株式会社製、商品名「EXA4816」、エポキシ基当量:403g/eq、25℃にて液状を示すエポキシ樹脂)
A2:柔軟性骨格含有ビスフェノールA型エポキシ樹脂(DIC株式会社製、商品名「EXA4850-1000」、エポキシ基当量:350g/eq、25℃にて液状を示すエポキシ樹脂)
A3:オルトクレゾールノボラック型エポキシ樹脂(DIC株式会社製、商品名「N500P-1」、エポキシ基当量:201g/eq、25℃にて液状を示さないエポキシ樹脂)
B1:炭化水素基含有フェノール樹脂(フェノール性水酸基当量:140g/eq)
B2:ナフタレン骨格含有ノボラック型フェノール樹脂(新日鉄住金化学株式会社製、商品名「SN475N」、フェノール性水酸基当量:205g/eq)
B3:ナフタレン骨格含有ノボラック型フェノール樹脂(新日鉄住金化学株式会社製、商品名「SN395」、フェノール性水酸基当量:110g/eq)
(硬化促進剤)
C1:イミダゾール(四国化成工業株式会社製、商品名「2P4MZ」)
(エラストマー)
D1:アクリル酸エステルポリマー(ナガセケムテックス株式会社製、商品名「SG-280 EK23」、分子量90万)
(無機充填材)
E1:シリカ(株式会社アドマテックス製、商品名「SX-E2」、フェニルアミノシラン処理、平均粒径:5.8μm)
(実施例1)
0.5Lのポリエチレン容器にMEKを100g入れ、A1を18.8g、A3を56.3g、B1を45.7g、D1を12.1g、E1を866.7g入れ、撹拌羽で撹拌し、無機充填材E1を分散した。その後、硬化剤C1を0.4g加えて、更に30分撹拌した。得られた混合液をナイロン製#150メッシュ(開口106μm)でろ過し、ろ液を採取した。これによりワニス状エポキシ樹脂組成物を得た。このワニス状エポキシ樹脂組成物を、塗工機を使用してPETフィルム上に、以下の条件で塗布した。これにより、厚さ210μmの封止用フィルムを支持体(PETフィルム)上に作製した。
・塗布ヘッド方式:コンマ
・塗布及び乾燥速度:0.5m/分
・乾燥条件(温度/炉長):80℃/1.5m、100℃/1.5m
・フィルム状の支持体:厚さ38μmのPETフィルム
使用した材料(A1、A3、B1、C1、D1、及びE1)の種類及び配合量を表1に示すように変更したこと以外は、実施例1と同様にして、実施例2~4及び比較例1のワニス状エポキシ樹脂組成物を得た。次いで、実施例1のワニス状エポキシ樹脂に代えて、実施例2~4及び比較例1のワニス状エポキシ樹脂組成物をそれぞれ用いたこと以外は、実施例1と同様にして、実施例2~4及び比較例1の封止用フィルム(厚さ210μm)を得た。なお、表1中の各材料の配合量は、封止用フィルムの全質量を基準とした配合量(質量%)である。
以下の方法で、封止構造体の反り及び割れ、並びに封止用フィルムの硬化後の弾性率及びガラス転移温度を評価した。なお、封止用フィルムの硬化後の弾性率及びガラス転移温度の評価では、実施例及び比較例のワニス状エポキシ樹脂組成物を用いて以下の条件で作製した厚さ110μmの封止用フィルムを用いた。
・塗布ヘッド方式:コンマ
・塗布及び乾燥速度:1m/分
・乾燥条件(温度/炉長):80℃/1.5m、100℃/1.5m
・フィルム状の支持体:厚さ38μmのPETフィルム
以下の条件で、厚さ210μmの封止用フィルムを厚さ800μmのシリコンウエハ(12インチサイズ)にラミネートし、未硬化の封止構造体(エポキシ樹脂封止体)を得た。
・ラミネータ装置:名機製作所製真空加圧ラミネータMVLP-500
・ラミネート温度:90℃
・ラミネート圧力:0.5MPa
・真空引き時間:30秒
・ラミネート時間:40秒
・オーブン:エスペック株式会社製SAFETY OVEN SPH-201
・オーブン温度:140℃
・時間:120分
・反り測定ステージ装置名:コムス社製CP-500
・反り測定レーザー光装置名:キーエンス社製LK-030
A:反り量≦2.0mm
B:反り量>2.0mm
以下の条件で、実施例及び比較例の封止用フィルムを銅箔にラミネートし、銅箔付き封止用フィルムを得た。
・ラミネータ装置:名機製作所製真空加圧ラミネータMVLP-500
・ラミネート温度:110℃
・ラミネート圧力:0.5MPa
・真空引き時間:30秒
・ラミネート時間:40秒
・オーブン:エスペック株式会社製SAFETY OVEN SPH-201
・オーブン温度:140℃
・時間:120分
・測定装置:DVE(株式会社レオロジ製DVE-V4)
・測定温度:25~300℃
・昇温速度:5℃/min
A:弾性率(30℃)≦25GPa
B:弾性率(30℃)>25GPa
A:ガラス転移温度(℃)≧100
B:ガラス転移温度(℃)<100
評価結果を表1に示す。
Claims (12)
- 熱硬化性樹脂と、無機充填材と、を含有する封止用フィルムの製造方法であって、
前記熱硬化性樹脂として反応性官能基当量が250g/molより大きい樹脂と、前記無機充填材と、を含有する樹脂組成物を準備する工程と、
前記樹脂組成物をフィルム状に成形する工程と、を備え、
前記樹脂組成物は、硬化後のガラス転移温度が80~180℃であり、
前記反応性官能基当量が250g/molより大きい樹脂は、反応性官能基当量が300~410g/molである樹脂を含む、封止用フィルムの製造方法。 - 前記樹脂組成物は、前記熱硬化性樹脂として、反応性官能基当量が100~210g/molである樹脂を更に含有する、請求項1に記載の封止用フィルムの製造方法。
- 前記樹脂組成物は、前記熱硬化性樹脂として、前記反応性官能基当量が250g/molより大きい樹脂の反応性官能基当量に対し1/2.9~1/2倍の反応性官能基当量を有する樹脂を更に含有する、請求項1又は2に記載の封止用フィルムの製造方法。
- 前記反応性官能基当量が250g/molより大きい樹脂はエポキシ樹脂を含む、請求項1~3のいずれか一項に記載の封止用フィルムの製造方法。
- 前記封止用フィルムの膜厚は20~250μmである、請求項1~4のいずれか一項に記載の封止用フィルムの製造方法。
- 熱硬化性樹脂と、無機充填材と、を含有し、
前記熱硬化性樹脂は、反応性官能基当量が250g/molより大きい樹脂を含み、
硬化後のガラス転移温度は80~180℃であり、
前記反応性官能基当量が250g/molより大きい樹脂は、反応性官能基当量が300~410g/molである樹脂を含む、封止用フィルム。 - 前記熱硬化性樹脂は、反応性官能基当量が100~210g/molである樹脂を更に含む、請求項6に記載の封止用フィルム。
- 前記熱硬化性樹脂は、前記反応性官能基当量が250g/molより大きい樹脂の反応性官能基当量に対し1/2.9~1/2倍の反応性官能基当量を有する樹脂を更に含む、請求項6又は7に記載の封止用フィルム。
- 前記反応性官能基当量が250g/molより大きい樹脂はエポキシ樹脂を含む、請求項6~8のいずれか一項に記載の封止用フィルム。
- 膜厚は20~250μmである、請求項6~9のいずれか一項に記載の封止用フィルム。
- 被封止体と、当該被封止体を封止する請求項6~10のいずれか一項に記載の封止用フィルムの硬化物と、を備える封止構造体。
- 請求項1~5のいずれか一項に記載の方法により得られる封止用フィルム、又は、請求項6~10のいずれか一項に記載の封止用フィルムを用いて、被封止体を封止する工程を備える、封止構造体の製造方法。
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KR20190138774A (ko) | 2019-12-16 |
TWI746841B (zh) | 2021-11-21 |
WO2018199309A1 (ja) | 2018-11-01 |
JPWO2018199309A1 (ja) | 2020-03-12 |
CN110582528A (zh) | 2019-12-17 |
KR102441766B1 (ko) | 2022-09-07 |
TW201843287A (zh) | 2018-12-16 |
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