JP7062548B2 - 多層プリント配線板の製造方法、および多層プリント配線板 - Google Patents

多層プリント配線板の製造方法、および多層プリント配線板 Download PDF

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Publication number
JP7062548B2
JP7062548B2 JP2018139780A JP2018139780A JP7062548B2 JP 7062548 B2 JP7062548 B2 JP 7062548B2 JP 2018139780 A JP2018139780 A JP 2018139780A JP 2018139780 A JP2018139780 A JP 2018139780A JP 7062548 B2 JP7062548 B2 JP 7062548B2
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JP
Japan
Prior art keywords
protective film
wiring board
main surface
printed wiring
insulating resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018139780A
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English (en)
Japanese (ja)
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JP2020017634A (ja
Inventor
文彦 松田
祥司 高野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Priority to JP2018139780A priority Critical patent/JP7062548B2/ja
Priority to US16/446,031 priority patent/US10765000B2/en
Priority to CN201910609761.XA priority patent/CN110785026A/zh
Priority to TW108126156A priority patent/TWI816844B/zh
Publication of JP2020017634A publication Critical patent/JP2020017634A/ja
Application granted granted Critical
Publication of JP7062548B2 publication Critical patent/JP7062548B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2018139780A 2018-07-25 2018-07-25 多層プリント配線板の製造方法、および多層プリント配線板 Active JP7062548B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018139780A JP7062548B2 (ja) 2018-07-25 2018-07-25 多層プリント配線板の製造方法、および多層プリント配線板
US16/446,031 US10765000B2 (en) 2018-07-25 2019-06-19 Method for manufacturing multilayer printed circuit board
CN201910609761.XA CN110785026A (zh) 2018-07-25 2019-07-08 多层印刷线路板的制造方法和多层印刷线路板
TW108126156A TWI816844B (zh) 2018-07-25 2019-07-24 多層印刷線路板的製造方法和多層印刷線路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018139780A JP7062548B2 (ja) 2018-07-25 2018-07-25 多層プリント配線板の製造方法、および多層プリント配線板

Publications (2)

Publication Number Publication Date
JP2020017634A JP2020017634A (ja) 2020-01-30
JP7062548B2 true JP7062548B2 (ja) 2022-05-17

Family

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JP2018139780A Active JP7062548B2 (ja) 2018-07-25 2018-07-25 多層プリント配線板の製造方法、および多層プリント配線板

Country Status (4)

Country Link
US (1) US10765000B2 (zh)
JP (1) JP7062548B2 (zh)
CN (1) CN110785026A (zh)
TW (1) TWI816844B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110290921B (zh) * 2017-03-06 2021-09-14 株式会社村田制作所 覆金属箔层压板、电路基板、以及多层电路基板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001024323A (ja) 1999-07-12 2001-01-26 Ibiden Co Ltd 導電性ペーストの充填方法および多層プリント配線板用の片面回路基板の製造方法
JP2001160669A (ja) 1999-12-02 2001-06-12 Ibiden Co Ltd 導電性バンプを備えたプリント基板、およびそのプリント基板の製造方法
JP2002049043A (ja) 2000-05-25 2002-02-15 Sharp Corp 積層型液晶表示装置及びその製造方法
JP2003209146A (ja) 2002-01-16 2003-07-25 Seiko Instruments Inc テープ状実装構造体およびそれを用いた実装方法
JP2008010858A (ja) 2006-05-30 2008-01-17 Mitsubishi Plastics Ind Ltd キャビティー部を有する多層配線基板
JP2015061058A (ja) 2013-09-20 2015-03-30 日本メクトロン株式会社 多層プリント配線板の製造方法、および多層プリント配線板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2631287B2 (ja) * 1987-06-30 1997-07-16 日本メクトロン 株式会社 混成多層回路基板の製造法
US5828126A (en) * 1992-06-17 1998-10-27 Vlsi Technology, Inc. Chip on board package with top and bottom terminals
JP3758746B2 (ja) * 1996-06-12 2006-03-22 藤森工業株式会社 剥離シート、それを用いた粘着製品及びその製造方法
EP0831528A3 (en) * 1996-09-10 1999-12-22 Hitachi Chemical Company, Ltd. Multilayer wiring board for mounting semiconductor device and method of producing the same
JP4486196B2 (ja) * 1999-12-08 2010-06-23 イビデン株式会社 多層プリント配線板用片面回路基板およびその製造方法
JP4401070B2 (ja) * 2002-02-05 2010-01-20 ソニー株式会社 半導体装置内蔵多層配線基板及びその製造方法
JP2004127970A (ja) * 2002-09-30 2004-04-22 Denso Corp 多層基板用素板の製造方法およびその素板を用いた多層基板の製造方法
JP4996838B2 (ja) 2005-09-29 2012-08-08 三菱樹脂株式会社 多層配線基板
JP2011066293A (ja) 2009-09-18 2011-03-31 Murata Mfg Co Ltd 樹脂基板およびその製造方法、ならびに導電性ペースト
JP6138026B2 (ja) 2013-11-12 2017-05-31 日本メクトロン株式会社 導電ペーストの充填方法、および多層プリント配線板の製造方法
JP2015154032A (ja) * 2014-02-19 2015-08-24 株式会社東芝 配線基板とそれを用いた半導体装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001024323A (ja) 1999-07-12 2001-01-26 Ibiden Co Ltd 導電性ペーストの充填方法および多層プリント配線板用の片面回路基板の製造方法
JP2001160669A (ja) 1999-12-02 2001-06-12 Ibiden Co Ltd 導電性バンプを備えたプリント基板、およびそのプリント基板の製造方法
JP2002049043A (ja) 2000-05-25 2002-02-15 Sharp Corp 積層型液晶表示装置及びその製造方法
JP2003209146A (ja) 2002-01-16 2003-07-25 Seiko Instruments Inc テープ状実装構造体およびそれを用いた実装方法
JP2008010858A (ja) 2006-05-30 2008-01-17 Mitsubishi Plastics Ind Ltd キャビティー部を有する多層配線基板
JP2015061058A (ja) 2013-09-20 2015-03-30 日本メクトロン株式会社 多層プリント配線板の製造方法、および多層プリント配線板

Also Published As

Publication number Publication date
CN110785026A (zh) 2020-02-11
US10765000B2 (en) 2020-09-01
US20200037443A1 (en) 2020-01-30
JP2020017634A (ja) 2020-01-30
TWI816844B (zh) 2023-10-01
TW202007536A (zh) 2020-02-16

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