JP7053832B2 - 回路形成方法、および回路形成装置 - Google Patents
回路形成方法、および回路形成装置 Download PDFInfo
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- JP7053832B2 JP7053832B2 JP2020529936A JP2020529936A JP7053832B2 JP 7053832 B2 JP7053832 B2 JP 7053832B2 JP 2020529936 A JP2020529936 A JP 2020529936A JP 2020529936 A JP2020529936 A JP 2020529936A JP 7053832 B2 JP7053832 B2 JP 7053832B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/10—Formation of a green body
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Dispersion Chemistry (AREA)
- Composite Materials (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
図1に回路形成装置10を示す。回路形成装置10は、搬送装置20と、第1造形ユニット22と、第2造形ユニット24と、第3造形ユニット26と、装着ユニット27と、制御装置(図2参照)28とを備える。それら搬送装置20と第1造形ユニット22と第2造形ユニット24と第3造形ユニット26と装着ユニット27とは、回路形成装置10のベース29の上に配置されている。ベース29は、概して長方形状をなしており、以下の説明では、ベース29の長手方向をX軸方向、ベース29の短手方向をY軸方向、X軸方向及びY軸方向の両方に直交する方向をZ軸方向と称して説明する。
上記第1実施例では、導電性樹脂ペースト150が配線136の端部に連結されるように形成されているが、第2実施例では、導電性樹脂ペースト150が、配線136の上に形成される。詳しくは、樹脂積層体130の上に配線136が形成される際に、従来の手法と同様に、金属インクが樹脂積層体130の上面に吐出される。つまり、金属インクの端が、電子部品138の電極140の配設予定位置の外縁の内側に位置するように、金属インクが樹脂積層体130の上面に吐出される。これにより、図4に示すように、従来の手法と同形状の配線136が、樹脂積層体130の上面に形成される。
Claims (3)
- ナノメートルサイズの金属微粒子を含有する金属含有液をベース上に塗布し、その金属含有液を焼成することで、配線を形成する配線形成工程と、
マイクロメートルサイズの金属粒子を含有し前記金属含有液よりも導電性が低い樹脂ペーストを、前記配線形成工程において形成された配線の上面、かつ、電子部品のそれぞれの電極の配設予定位置に前記配線の端部を覆い、縁部において、前記ベースの上面に密着するように塗布するペースト塗布工程と、
前記電子部品を、前記ペースト塗布工程において塗布された樹脂ペーストに前記電子部品の電極が接触するように、前記ベース上に載置する部品載置工程と
を含む回路形成方法。 - 薄膜状に塗布された硬化性樹脂を硬化させて樹脂層を形成し、その樹脂層を積層させることで、前記ベースを形成するベース形成工程を、更に含む請求項1に記載の回路形成方法。
- ナノメートルサイズの金属微粒子を含有する金属含有液を塗布する第1塗布装置と、
マイクロメートルサイズの金属粒子を含有し前記金属含有液よりも導電性が低い樹脂ペーストを塗布する第2塗布装置と、
前記金属含有液を焼成する焼成装置と、
電極を有する電子部品を保持する保持装置と、
制御装置と
を備え、
前記制御装置が、
前記第1塗布装置により前記金属含有液をベース上に塗布し、その金属含有液を前記焼成装置により焼成することで、配線を形成する配線形成部と、
前記第2塗布装置により前記樹脂ペーストを、前記配線形成部により形成された配線の上面、かつ、前記電子部品のそれぞれの電極の配設予定位置に前記配線の端部を覆い、縁部において、前記ベースの上面に密着するように塗布するペースト塗布部と、
前記ペースト塗布部により塗布された樹脂ペーストに前記電子部品の電極が接触するように、前記電子部品を前記保持装置により前記ベース上に載置する部品載置部と
を有する回路形成装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2018/026444 WO2020012626A1 (ja) | 2018-07-13 | 2018-07-13 | 回路形成方法、および回路形成装置 |
Publications (2)
Publication Number | Publication Date |
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JPWO2020012626A1 JPWO2020012626A1 (ja) | 2021-02-15 |
JP7053832B2 true JP7053832B2 (ja) | 2022-04-12 |
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JP2020529936A Active JP7053832B2 (ja) | 2018-07-13 | 2018-07-13 | 回路形成方法、および回路形成装置 |
Country Status (4)
Country | Link |
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US (1) | US20210267054A1 (ja) |
JP (1) | JP7053832B2 (ja) |
CN (1) | CN112385322A (ja) |
WO (1) | WO2020012626A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7230276B2 (ja) * | 2020-04-03 | 2023-02-28 | 株式会社Fuji | 回路形成方法および回路形成装置 |
WO2023079607A1 (ja) * | 2021-11-04 | 2023-05-11 | 株式会社Fuji | 回路形成方法、および回路形成装置 |
WO2023157111A1 (ja) * | 2022-02-16 | 2023-08-24 | 株式会社Fuji | 電気回路形成方法、および電気回路形成装置 |
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JP2001143529A (ja) | 1999-11-12 | 2001-05-25 | Nippon Handa Kk | クリームハンダ配合による導電性接合剤およびそれを使用した接合方法 |
JP2004241514A (ja) | 2003-02-05 | 2004-08-26 | Mitsui Chemicals Inc | 多層回路基板およびその製造方法 |
JP2006216735A (ja) | 2005-02-03 | 2006-08-17 | Alps Electric Co Ltd | 電子部品実装基板 |
US20140152383A1 (en) | 2012-11-30 | 2014-06-05 | Dmitri E. Nikonov | Integrated circuits and systems and methods for producing the same |
JP2014527474A (ja) | 2011-07-13 | 2014-10-16 | ヌボトロニクス,エルエルシー | 電子的および機械的な構造を製作する方法 |
WO2016075823A1 (ja) | 2014-11-14 | 2016-05-19 | 富士機械製造株式会社 | 配線基板作製方法および配線基板作製装置 |
JP2016531770A (ja) | 2013-06-24 | 2016-10-13 | プレジデント アンド フェローズ オブ ハーバード カレッジ | 印刷3次元(3d)機能部品および製造方法 |
US20170253751A1 (en) | 2016-01-22 | 2017-09-07 | Voxel8, Inc. | 3d printable composite waterborne dispersions |
JP2017516295A5 (ja) | 2015-03-25 | 2018-02-22 | ||
US20180154573A1 (en) | 2015-05-19 | 2018-06-07 | Dst Innovations Limited | A Circuit Board and Component Fabrication Apparatus |
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JPH0831679B2 (ja) * | 1993-06-18 | 1996-03-27 | 帝国通信工業株式会社 | フレキシブル基板への電子部品の取付構造及びその取付方法 |
JPH08330712A (ja) * | 1995-06-01 | 1996-12-13 | Teikoku Tsushin Kogyo Co Ltd | 基板へのチップ型電子部品の取付方法 |
JP2002057423A (ja) * | 2000-08-07 | 2002-02-22 | Matsushita Electric Ind Co Ltd | 導電性ペーストを用いた回路基板とその製造方法 |
JP4135565B2 (ja) * | 2003-06-06 | 2008-08-20 | 松下電器産業株式会社 | 電子回路装置およびその製造方法 |
EP1720389B1 (en) * | 2005-04-25 | 2019-07-03 | Brother Kogyo Kabushiki Kaisha | Method for forming pattern and a wired board |
JP2006332615A (ja) * | 2005-04-25 | 2006-12-07 | Brother Ind Ltd | パターン形成方法 |
WO2008047918A1 (fr) * | 2006-10-20 | 2008-04-24 | Nec Corporation | Structure de paquet de dispositifs électroniques et procédé de fabrication correspondant |
JP2014017364A (ja) * | 2012-07-09 | 2014-01-30 | Panasonic Corp | 部品実装基板の製造システム、および製造方法 |
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JP6554541B2 (ja) * | 2015-07-13 | 2019-07-31 | 株式会社Fuji | 配線形成方法および配線形成装置 |
-
2018
- 2018-07-13 US US17/253,398 patent/US20210267054A1/en not_active Abandoned
- 2018-07-13 JP JP2020529936A patent/JP7053832B2/ja active Active
- 2018-07-13 WO PCT/JP2018/026444 patent/WO2020012626A1/ja active Application Filing
- 2018-07-13 CN CN201880095507.6A patent/CN112385322A/zh active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001143529A (ja) | 1999-11-12 | 2001-05-25 | Nippon Handa Kk | クリームハンダ配合による導電性接合剤およびそれを使用した接合方法 |
JP2004241514A (ja) | 2003-02-05 | 2004-08-26 | Mitsui Chemicals Inc | 多層回路基板およびその製造方法 |
JP2006216735A (ja) | 2005-02-03 | 2006-08-17 | Alps Electric Co Ltd | 電子部品実装基板 |
JP2014527474A (ja) | 2011-07-13 | 2014-10-16 | ヌボトロニクス,エルエルシー | 電子的および機械的な構造を製作する方法 |
US20140152383A1 (en) | 2012-11-30 | 2014-06-05 | Dmitri E. Nikonov | Integrated circuits and systems and methods for producing the same |
JP2016531770A (ja) | 2013-06-24 | 2016-10-13 | プレジデント アンド フェローズ オブ ハーバード カレッジ | 印刷3次元(3d)機能部品および製造方法 |
WO2016075823A1 (ja) | 2014-11-14 | 2016-05-19 | 富士機械製造株式会社 | 配線基板作製方法および配線基板作製装置 |
JP2017516295A5 (ja) | 2015-03-25 | 2018-02-22 | ||
US20180154573A1 (en) | 2015-05-19 | 2018-06-07 | Dst Innovations Limited | A Circuit Board and Component Fabrication Apparatus |
US20170253751A1 (en) | 2016-01-22 | 2017-09-07 | Voxel8, Inc. | 3d printable composite waterborne dispersions |
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US20210267054A1 (en) | 2021-08-26 |
WO2020012626A1 (ja) | 2020-01-16 |
CN112385322A (zh) | 2021-02-19 |
JPWO2020012626A1 (ja) | 2021-02-15 |
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