JP6988482B2 - 接着剤フィルム及びその製造方法、接着剤テープ、並びに接着剤フィルム用リール - Google Patents

接着剤フィルム及びその製造方法、接着剤テープ、並びに接着剤フィルム用リール Download PDF

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Publication number
JP6988482B2
JP6988482B2 JP2017564179A JP2017564179A JP6988482B2 JP 6988482 B2 JP6988482 B2 JP 6988482B2 JP 2017564179 A JP2017564179 A JP 2017564179A JP 2017564179 A JP2017564179 A JP 2017564179A JP 6988482 B2 JP6988482 B2 JP 6988482B2
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JP
Japan
Prior art keywords
conductive
adhesive
adhesive layer
adhesive film
thickness
Prior art date
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Active
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JP2017564179A
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English (en)
Japanese (ja)
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JPWO2017130789A1 (ja
Inventor
貴 立澤
勝 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
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Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2017130789A1 publication Critical patent/JPWO2017130789A1/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/04—Kinds or types
    • B65H75/08—Kinds or types of circular or polygonal cross-section
    • B65H75/14—Kinds or types of circular or polygonal cross-section with two end flanges
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)
JP2017564179A 2016-01-29 2017-01-17 接着剤フィルム及びその製造方法、接着剤テープ、並びに接着剤フィルム用リール Active JP6988482B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016015470 2016-01-29
JP2016015470 2016-01-29
PCT/JP2017/001366 WO2017130789A1 (ja) 2016-01-29 2017-01-17 接着剤フィルム及びその製造方法、接着剤テープ、並びに接着剤フィルム用リール

Publications (2)

Publication Number Publication Date
JPWO2017130789A1 JPWO2017130789A1 (ja) 2018-11-22
JP6988482B2 true JP6988482B2 (ja) 2022-01-05

Family

ID=59397691

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017564179A Active JP6988482B2 (ja) 2016-01-29 2017-01-17 接着剤フィルム及びその製造方法、接着剤テープ、並びに接着剤フィルム用リール

Country Status (5)

Country Link
JP (1) JP6988482B2 (zh)
KR (1) KR20180111858A (zh)
CN (3) CN114196334A (zh)
TW (1) TWI750149B (zh)
WO (1) WO2017130789A1 (zh)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60218628A (ja) * 1984-04-13 1985-11-01 Sharp Corp 液晶表示素子電極接続方法
JP5196703B2 (ja) * 2004-01-15 2013-05-15 デクセリアルズ株式会社 接着フィルム
CN101901972B (zh) * 2006-04-12 2012-07-04 日立化成工业株式会社 电路连接用粘接膜、电路部件的连接结构以及电路部件的连接方法
JP2011003924A (ja) * 2006-08-25 2011-01-06 Hitachi Chem Co Ltd 回路接続材料、これを用いた回路部材の接続構造及びその製造方法
JP4862944B2 (ja) * 2007-12-17 2012-01-25 日立化成工業株式会社 回路接続材料
JP2009194359A (ja) * 2008-01-16 2009-08-27 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路部材の接続構造及び回路部材の接続方法
CN102017816A (zh) * 2008-04-28 2011-04-13 日立化成工业株式会社 电路连接材料、膜状粘接剂、粘接剂卷以及电路连接结构体
CN102712834B (zh) * 2010-03-12 2014-11-26 日立化成株式会社 粘接材料卷轴
KR101659128B1 (ko) * 2013-09-30 2016-09-22 제일모직주식회사 이방성 도전 필름 및 이를 이용한 반도체 장치
KR101628440B1 (ko) * 2013-10-31 2016-06-08 제일모직주식회사 이방성 도전 필름 및 이를 이용한 반도체 장치
JP6297381B2 (ja) * 2014-03-26 2018-03-20 デクセリアルズ株式会社 接着フィルム、フィルム巻装体、接続体の製造方法

Also Published As

Publication number Publication date
KR20180111858A (ko) 2018-10-11
JPWO2017130789A1 (ja) 2018-11-22
TW201739864A (zh) 2017-11-16
CN114196334A (zh) 2022-03-18
CN114262577A (zh) 2022-04-01
CN108603078A (zh) 2018-09-28
TWI750149B (zh) 2021-12-21
WO2017130789A1 (ja) 2017-08-03

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