JP6934407B2 - 加工装置 - Google Patents

加工装置 Download PDF

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Publication number
JP6934407B2
JP6934407B2 JP2017226530A JP2017226530A JP6934407B2 JP 6934407 B2 JP6934407 B2 JP 6934407B2 JP 2017226530 A JP2017226530 A JP 2017226530A JP 2017226530 A JP2017226530 A JP 2017226530A JP 6934407 B2 JP6934407 B2 JP 6934407B2
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Japan
Prior art keywords
user terminal
processing
operator
setting screen
control unit
Prior art date
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Application number
JP2017226530A
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English (en)
Japanese (ja)
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JP2019096175A (ja
Inventor
香一 牧野
香一 牧野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2017226530A priority Critical patent/JP6934407B2/ja
Priority to KR1020180136367A priority patent/KR102510829B1/ko
Priority to TW107141768A priority patent/TWI791685B/zh
Priority to CN201811404217.3A priority patent/CN109860075B/zh
Publication of JP2019096175A publication Critical patent/JP2019096175A/ja
Application granted granted Critical
Publication of JP6934407B2 publication Critical patent/JP6934407B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Numerical Control (AREA)
  • User Interface Of Digital Computer (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2017226530A 2017-11-27 2017-11-27 加工装置 Active JP6934407B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017226530A JP6934407B2 (ja) 2017-11-27 2017-11-27 加工装置
KR1020180136367A KR102510829B1 (ko) 2017-11-27 2018-11-08 가공 장치
TW107141768A TWI791685B (zh) 2017-11-27 2018-11-23 加工裝置
CN201811404217.3A CN109860075B (zh) 2017-11-27 2018-11-23 加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017226530A JP6934407B2 (ja) 2017-11-27 2017-11-27 加工装置

Publications (2)

Publication Number Publication Date
JP2019096175A JP2019096175A (ja) 2019-06-20
JP6934407B2 true JP6934407B2 (ja) 2021-09-15

Family

ID=66844969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017226530A Active JP6934407B2 (ja) 2017-11-27 2017-11-27 加工装置

Country Status (4)

Country Link
JP (1) JP6934407B2 (ko)
KR (1) KR102510829B1 (ko)
CN (1) CN109860075B (ko)
TW (1) TWI791685B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7275824B2 (ja) * 2019-05-09 2023-05-18 村田機械株式会社 工作機械システム
JP7446136B2 (ja) * 2020-03-26 2024-03-08 東京エレクトロン株式会社 制御システム、制御方法、及び基板処理装置

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2735448B2 (ja) * 1992-12-15 1998-04-02 三菱電機株式会社 Ｉｄカード及びそれを用いた半導体製造システム
JP4500402B2 (ja) * 2000-03-09 2010-07-14 キヤノン株式会社 ファインダー装置及びそれを用いた光学機器
JP2007109967A (ja) * 2005-10-14 2007-04-26 Tokyo Electron Ltd 半導体処理装置
KR101132291B1 (ko) * 2008-03-18 2012-04-05 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치 및 기판 처리 시스템
US8509954B2 (en) * 2009-08-21 2013-08-13 Allure Energy, Inc. Energy management system and method
JP5678468B2 (ja) * 2010-05-06 2015-03-04 株式会社リコー 画像処理システム及び動作管理方法
JP2011255472A (ja) * 2010-06-10 2011-12-22 Disco Corp 加工装置
JP2012000701A (ja) 2010-06-15 2012-01-05 Disco Corp 加工装置
US9142122B2 (en) * 2010-11-25 2015-09-22 Panasonic Intellectual Property Corporation Of America Communication device for performing wireless communication with an external server based on information received via near field communication
JP2014010745A (ja) 2012-07-02 2014-01-20 Disco Abrasive Syst Ltd 加工装置
JP2014063423A (ja) * 2012-09-24 2014-04-10 Disco Abrasive Syst Ltd 加工装置
JP6098232B2 (ja) * 2013-03-01 2017-03-22 大日本印刷株式会社 店舗支援システム、携帯端末、通信装置、およびプログラム
JP5935771B2 (ja) * 2013-07-30 2016-06-15 ブラザー工業株式会社 レーザ加工システム
JP5907624B2 (ja) * 2013-09-13 2016-04-26 シャープ株式会社 情報処理装置
DE102013220865A1 (de) * 2013-10-15 2015-04-16 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren und System zum Fernbedienen einer Werkzeugmaschine mittels eines mobilen Kommunikationsgeräts
JP6206099B2 (ja) * 2013-11-05 2017-10-04 セイコーエプソン株式会社 画像表示システム、画像表示システムを制御する方法、および、頭部装着型表示装置
JP6382554B2 (ja) * 2014-03-31 2018-08-29 パナソニック デバイスＳｕｎｘ株式会社 レーザ加工装置
KR20160016579A (ko) * 2014-07-31 2016-02-15 삼성전자주식회사 특정 영역에서 애플리케이션을 실행하는 휴대 단말 및 그 방법
JP6149822B2 (ja) * 2014-08-21 2017-06-21 コニカミノルタ株式会社 情報処理システム、情報処理装置、携帯端末装置およびプログラム
DE102014217880A1 (de) 2014-09-08 2016-03-10 Robert Bosch Gmbh Anordnung und Verfahren zu deren Betrieb
CN105527845A (zh) * 2014-10-20 2016-04-27 上海本星电子科技有限公司 一种智能家居控制***以及智能控制软件***
TW201618928A (zh) * 2014-11-24 2016-06-01 弘訊科技股份有限公司 射出成形設備
JP6194876B2 (ja) * 2014-12-12 2017-09-13 コニカミノルタ株式会社 画像処理装置、その制御方法、およびプログラム
WO2016199251A1 (ja) * 2015-06-10 2016-12-15 三菱電機ビルテクノサービス株式会社 設備保守管理システム、設備保守装置及びプログラム
JP6575326B2 (ja) * 2015-11-27 2019-09-18 コニカミノルタ株式会社 画像形成システム、画像形成装置およびプログラム
JP6661354B2 (ja) * 2015-12-04 2020-03-11 キヤノン株式会社 通信装置及び制御方法
JP2019125736A (ja) 2018-01-18 2019-07-25 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理システム、半導体装置の製造方法、基板処理装置、プログラム

Also Published As

Publication number Publication date
CN109860075A (zh) 2019-06-07
TWI791685B (zh) 2023-02-11
KR102510829B1 (ko) 2023-03-15
KR20190062191A (ko) 2019-06-05
CN109860075B (zh) 2023-10-03
TW201925936A (zh) 2019-07-01
JP2019096175A (ja) 2019-06-20

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