JP6913276B2 - 気密パッケージ - Google Patents
気密パッケージ Download PDFInfo
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- JP6913276B2 JP6913276B2 JP2017011774A JP2017011774A JP6913276B2 JP 6913276 B2 JP6913276 B2 JP 6913276B2 JP 2017011774 A JP2017011774 A JP 2017011774A JP 2017011774 A JP2017011774 A JP 2017011774A JP 6913276 B2 JP6913276 B2 JP 6913276B2
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- 239000011521 glass Substances 0.000 claims description 126
- 239000003566 sealing material Substances 0.000 claims description 110
- 239000000843 powder Substances 0.000 claims description 77
- 239000000758 substrate Substances 0.000 claims description 45
- 239000002131 composite material Substances 0.000 claims description 34
- 239000000945 filler Substances 0.000 claims description 26
- 229910052797 bismuth Inorganic materials 0.000 claims description 17
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 17
- 239000006096 absorbing agent Substances 0.000 claims description 12
- 239000002241 glass-ceramic Substances 0.000 claims description 7
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 101
- 238000007789 sealing Methods 0.000 description 44
- 239000002585 base Substances 0.000 description 32
- 238000004031 devitrification Methods 0.000 description 15
- 239000002245 particle Substances 0.000 description 13
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 12
- 239000000203 mixture Substances 0.000 description 10
- 230000003746 surface roughness Effects 0.000 description 10
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 239000003981 vehicle Substances 0.000 description 8
- 238000000926 separation method Methods 0.000 description 7
- 239000012298 atmosphere Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000009970 fire resistant effect Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- -1 polymethylstyrene Polymers 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N anhydrous diethylene glycol Natural products OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 229910000174 eucryptite Inorganic materials 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- CXWXQJXEFPUFDZ-UHFFFAOYSA-N tetralin Chemical compound C1=CC=C2CCCCC2=C1 CXWXQJXEFPUFDZ-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- 229910018068 Li 2 O Inorganic materials 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 229910007541 Zn O Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052878 cordierite Inorganic materials 0.000 description 2
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 2
- 238000007561 laser diffraction method Methods 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
- CUVLMZNMSPJDON-UHFFFAOYSA-N 1-(1-butoxypropan-2-yloxy)propan-2-ol Chemical compound CCCCOCC(C)OCC(C)O CUVLMZNMSPJDON-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- JDSQBDGCMUXRBM-UHFFFAOYSA-N 2-[2-(2-butoxypropoxy)propoxy]propan-1-ol Chemical compound CCCCOC(C)COC(C)COC(C)CO JDSQBDGCMUXRBM-UHFFFAOYSA-N 0.000 description 1
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- MFKRHJVUCZRDTF-UHFFFAOYSA-N 3-methoxy-3-methylbutan-1-ol Chemical compound COC(C)(C)CCO MFKRHJVUCZRDTF-UHFFFAOYSA-N 0.000 description 1
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 1
- 229940088601 alpha-terpineol Drugs 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007496 glass forming Methods 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229940117955 isoamyl acetate Drugs 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000379 polypropylene carbonate Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- 229910052844 willemite Inorganic materials 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- 229910000166 zirconium phosphate Inorganic materials 0.000 description 1
- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical compound [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
- 229910000500 β-quartz Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
- H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Glass Compositions (AREA)
- Optical Couplings Of Light Guides (AREA)
- Control And Other Processes For Unpacking Of Materials (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
10 パッケージ基体
11 ガラス蓋
12 基部
13 枠部14 内部素子(深紫外LED素子)
15 封着材料層
16 枠部の頂部の内側端縁
17 枠部の頂部の外側端縁
18 ガラス蓋の端縁
19 レーザー照射装置
L レーザー光
Claims (6)
- パッケージ基体とガラス蓋とが封着材料層を介して気密封着された気密パッケージにおいて、
パッケージ基体が、基部と基部上に設けられた枠部とを有し、
パッケージ基体の枠部内に、内部素子が収容されており、
パッケージ基体の枠部の頂部とガラス蓋の間に封着材料層が配されており、
封着材料層が、少なくともガラス粉末と耐火性フィラー粉末を含み、且つ実質的にレーザー吸収材を含まない複合粉末の焼結体であり、
封着材料層が、枠部の頂部の内側端縁から離間した位置に形成されると共に、枠部の頂部の外側端縁から離間した位置に形成されており、
枠部の頂部の内側端縁と封着材料層の離間距離は、ガラス蓋の端縁と封着材料層の離間距離より長いことを特徴とする気密パッケージ。 - 封着材料層が、枠部の頂部の内側端縁から50μm以上離間した位置に形成されると共に、枠部の頂部の外側端縁から50μm以上離間した位置に形成されていることを特徴とする請求項1に記載の気密パッケージ。
- 封着材料層が、ガラス蓋の端縁から50μm以上離間した位置に形成されていることを特徴とする請求項1又は2に記載の気密パッケージ。
- 封着材料層が、少なくともビスマス系ガラス粉末と耐火性フィラー粉末を含み、且つ実質的にレーザー吸収材を含まない複合粉末の焼結体であることを特徴とする請求項1〜3の何れかに記載の気密パッケージ。
- 封着材料層の平均厚みが8.0μm未満であると共に、封着材料層の平均幅が75〜1000μmであることを特徴とする請求項1〜4の何れかに記載の気密パッケージ。
- パッケージ基体が、ガラス、ガラスセラミック、窒化アルミニウム、酸化アルミニウムの何れか、或いはこれらの複合材料であることを特徴とする請求項1〜5の何れかに記載の気密パッケージ。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017011774A JP6913276B2 (ja) | 2017-01-26 | 2017-01-26 | 気密パッケージ |
US16/477,967 US11043616B2 (en) | 2017-01-26 | 2017-12-26 | Airtight package |
CN201780069058.3A CN109923665B (zh) | 2017-01-26 | 2017-12-26 | 气密封装体 |
KR1020197008774A KR102380455B1 (ko) | 2017-01-26 | 2017-12-26 | 기밀 패키지 |
PCT/JP2017/046681 WO2018139148A1 (ja) | 2017-01-26 | 2017-12-26 | 気密パッケージ |
TW107100117A TWI769209B (zh) | 2017-01-26 | 2018-01-03 | 氣密封裝體 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017011774A JP6913276B2 (ja) | 2017-01-26 | 2017-01-26 | 気密パッケージ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018120974A JP2018120974A (ja) | 2018-08-02 |
JP6913276B2 true JP6913276B2 (ja) | 2021-08-04 |
Family
ID=62977963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017011774A Active JP6913276B2 (ja) | 2017-01-26 | 2017-01-26 | 気密パッケージ |
Country Status (6)
Country | Link |
---|---|
US (1) | US11043616B2 (ja) |
JP (1) | JP6913276B2 (ja) |
KR (1) | KR102380455B1 (ja) |
CN (1) | CN109923665B (ja) |
TW (1) | TWI769209B (ja) |
WO (1) | WO2018139148A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110249421B (zh) * | 2017-02-07 | 2023-10-24 | 日本电气硝子株式会社 | 气密封装体 |
JP7168903B2 (ja) * | 2018-09-06 | 2022-11-10 | 日本電気硝子株式会社 | 気密パッケージ |
WO2023281961A1 (ja) * | 2021-07-05 | 2023-01-12 | 日本電気硝子株式会社 | 封着材料層付きガラス基板及び気密パッケージの製造方法 |
Family Cites Families (19)
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US5256470A (en) * | 1990-10-11 | 1993-10-26 | Aluminum Company Of America | Crystal growth inhibitor for glassy low dielectric inorganic composition |
JP4936152B2 (ja) * | 2000-03-15 | 2012-05-23 | セイコーエプソン株式会社 | 圧電振動子の製造方法 |
JP3982263B2 (ja) * | 2002-01-08 | 2007-09-26 | セイコーエプソン株式会社 | 圧電デバイスの封止方法 |
JP4669305B2 (ja) * | 2005-03-09 | 2011-04-13 | 日本特殊陶業株式会社 | 配線基板 |
EP2460780A4 (en) * | 2009-07-31 | 2013-12-04 | Asahi Glass Co Ltd | SEALING GLASS, SEALING MATERIAL AND PASTE FOR SEALING MATERIAL FOR SEMICONDUCTOR DEVICES, AND SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF |
JP2012012231A (ja) * | 2010-06-29 | 2012-01-19 | Central Glass Co Ltd | 無鉛低融点ガラス組成物 |
EP2624293B1 (en) * | 2010-09-28 | 2018-03-07 | Kyocera Corporation | Semiconductor device housing package and electronic apparatus using the same |
KR20130119319A (ko) * | 2010-10-01 | 2013-10-31 | 니폰 덴키 가라스 가부시키가이샤 | 전기소자 패키지 |
JP2013239609A (ja) * | 2012-05-16 | 2013-11-28 | Asahi Glass Co Ltd | 気密部材とその製造方法 |
JP2014015350A (ja) * | 2012-07-09 | 2014-01-30 | Nippon Electric Glass Co Ltd | 色素増感型太陽電池用封着材料 |
WO2014192686A1 (ja) * | 2013-05-28 | 2014-12-04 | 日本電気硝子株式会社 | 複合粉末、複合粉末ペースト及び着色層付きガラス板 |
JP2014236202A (ja) | 2013-06-05 | 2014-12-15 | 旭硝子株式会社 | 発光装置 |
EP3051582B1 (en) * | 2013-09-27 | 2020-01-22 | Kyocera Corporation | Lid body, package, and electronic apparatus |
WO2015060248A1 (ja) * | 2013-10-21 | 2015-04-30 | 日本電気硝子株式会社 | 封着材料 |
JP6297935B2 (ja) * | 2014-06-19 | 2018-03-20 | 京セラ株式会社 | 発光装置 |
JP2016027610A (ja) * | 2014-06-27 | 2016-02-18 | 旭硝子株式会社 | パッケージ基板、パッケージ、および電子デバイス |
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WO2016129255A1 (ja) * | 2015-02-13 | 2016-08-18 | 日本板硝子株式会社 | レーザ加工用ガラス及びそれを用いた孔付きガラスの製造方法 |
TWI686968B (zh) | 2015-02-26 | 2020-03-01 | 日商日本電氣硝子股份有限公司 | 氣密封裝及其製造方法 |
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