JP6864113B2 - 感電保護素子、その製造方法及びこれを具備した携帯用電子装置 - Google Patents
感電保護素子、その製造方法及びこれを具備した携帯用電子装置 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims description 27
- 239000003990 capacitor Substances 0.000 claims description 123
- 238000005476 soldering Methods 0.000 claims description 69
- 238000000465 moulding Methods 0.000 claims description 32
- 238000010304 firing Methods 0.000 claims description 29
- 239000002003 electrode paste Substances 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 15
- 229910052709 silver Inorganic materials 0.000 claims description 15
- 238000004891 communication Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 229910052763 palladium Inorganic materials 0.000 claims description 9
- 229910052697 platinum Inorganic materials 0.000 claims description 9
- 230000002265 prevention Effects 0.000 claims description 6
- 230000008054 signal transmission Effects 0.000 claims description 6
- 238000003780 insertion Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 description 30
- 230000003068 static effect Effects 0.000 description 30
- 239000000463 material Substances 0.000 description 19
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- -1 BaTIO 3 Inorganic materials 0.000 description 1
- 229910017493 Nd 2 O 3 Inorganic materials 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/22—Electrostatic or magnetic shielding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/144—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being welded or soldered
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/1006—Thick film varistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/12—Overvoltage protection resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/14—Protection against electric or thermal overload
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
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Description
Claims (12)
- 複数のシート層及び前記各シート層上に備えられる複数のキャパシタ電極を含み、感電防止機能及び通信信号伝達機能を有するキャパシタ部;
前記複数のシート層のうち最外郭に配置されたシート層上に前記キャパシタ部の両端側から中央側に延長形成され、同時焼成用電極からなる一対のソルダリング用電極;
前記複数のシート層の両端に備えられて前記複数のキャパシタ電極と前記一対のソルダリング用電極を連結する一対の端子電極;
前記一対のソルダリング用電極にソルダーによって連結され、単一の部品からなるバリスタ;及び
前記バリスタ、前記一対のソルダリング用電極及び前記端子電極の一側をモールディングするモールディング部;を含み、
前記一対の端子電極は前記ソルダリング用電極の一部を覆うように備えられた第1部分、前記第1部分に対向して前記キャパシタ部の一面の一部を覆うように備えられた第2部分及び前記第1部分と第2部分とを連結する第3部分を含む、感電保護素子。 - 前記同時焼成用電極はAgとPdまたはAgとPtを含み、
前記一対の端子電極はAg、Pt、Pd、Cu、Niのうち少なくとも1種以上を含む、請求項1に記載の感電保護素子。 - 前記一対のソルダリング用電極は互いに100μm以上離隔し、その間の間隔は前記バリスタの外部電極間の長さより小さい、請求項1に記載の感電保護素子。
- 前記モールディング部の厚さは前記バリスタの厚さより20μm〜50μm大きく、
前記バリスタの厚さは前記キャパシタ部の厚さより大きい、請求項1に記載の感電保護素子。 - 前記第1部分及び前記第2部分は同じ幅を有し、その幅が50μm以上であり、前記一対の端子電極のそれぞれの第1部分の間の間隔が前記バリスタの長さより大きいか同じである、請求項1に記載の感電保護素子。
- 前記バリスタは、
複数のバリスタ層;
前記複数のバリスタ層のうち同一のバリスタ層上に一定の間隔で離隔して供えられた少なくとも二つの第1内部電極;
前記複数の第1内部電極と他のバリスタ層上に備えられる少なくとも一つの第2内部電極;及び
前記複数のバリスタ層の両側に備えられて前記第1内部電極及び前記第2内部電極の中の一つとそれぞれ連結される一対の外部電極;を含む、請求項1に記載の感電保護素子。 - 導電性ケースから外側に突出して形成される先端部を含む伝導体;
回路部;及び
前記伝導体と回路部を電気的に連結する請求項1〜請求項6のいずれか一項に記載された感電保護素子を含む、携帯用電子装置。 - 前記伝導体はサイドキーを含み、
前記先端部は外部機器と連結のためのコネクタの挿入口の一端を含む、請求項7に記載の携帯用電子装置。 - キャパシタ電極が備えられた複数のシート層を積層するステップ;
前記複数のシート層のうち最外郭に配置されたシート層上に前記複数のシート層の両端側から中央側に同時焼成用電極ペーストを塗布するステップ;
前記複数のシート層を焼成するステップ;
前記同時焼成用電極ペーストによって形成された一対のソルダリング用電極と前記複数のキャパシタ電極が連結されるように、前記複数のシート層の両端に一対の端子電極を形成するステップ;
前記一対のソルダリング用電極上に単一の部品からなるバリスタをソルダリングするステップ;及び
前記バリスタ、前記一対のソルダリング用電極及び前記端子電極の一側をモールディング部材でモールディングするステップ;を含み、
前記端子電極を形成するステップは、第1部分が前記ソルダリング用電極の一部を覆い、前記第1部分に対向して第2部分が前記最外郭に配置されたシート層の一面の一部を覆い、第3部分が前記第1部分と第2部分を連結するように前記一対の端子電極を形成する、感電保護素子の製造方法。 - 前記同時焼成用電極ペーストはAgとPdまたはAgとPtを含む、請求項9に記載の感電保護素子の製造方法。
- 前記塗布するステップは、前記焼成するステップ後に前記一対のソルダリング用電極が互いに100μm以上離隔し、その間の間隔が前記バリスタの外部電極間の長さより小さくなるように前記ペーストを塗布する、請求項9に記載の感電保護素子の製造方法。
- 前記端子電極を形成するステップは、前記第1部分及び前記第2部分が同じ幅を有し、その幅が50μm以上であり、前記一対の端子電極のそれぞれの第1部分の間の間隔が前記バリスタの長さより大きいか同じとなるように前記端子電極を形成する、請求項9に記載の感電保護素子の製造方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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KR1020170039971A KR102388189B1 (ko) | 2017-03-29 | 2017-03-29 | 커패시터 복합소자 및 이를 구비한 휴대용 전자장치 |
KR1020170039967A KR102379253B1 (ko) | 2017-03-29 | 2017-03-29 | 커패시터 복합소자, 및 그 제조 방법 |
KR10-2017-0039967 | 2017-03-29 | ||
KR10-2017-0039971 | 2017-03-29 | ||
PCT/KR2018/003507 WO2018182249A1 (ko) | 2017-03-29 | 2018-03-26 | 감전보호소자, 그 제조 방법 및 이를 구비한 휴대용 전자장치 |
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JP2020512695A JP2020512695A (ja) | 2020-04-23 |
JP6864113B2 true JP6864113B2 (ja) | 2021-04-21 |
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US (1) | US11177070B2 (ja) |
JP (1) | JP6864113B2 (ja) |
CN (1) | CN110520951B (ja) |
WO (1) | WO2018182249A1 (ja) |
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US10607777B2 (en) * | 2017-02-06 | 2020-03-31 | Avx Corporation | Integrated capacitor filter and integrated capacitor filter with varistor function |
US20200343051A1 (en) * | 2019-04-25 | 2020-10-29 | Avx Corporation | Integrated Component Including a Capacitor and Discrete Varistor |
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JPS6120739Y2 (ja) * | 1978-03-28 | 1986-06-21 | ||
JPS619804U (ja) * | 1984-06-22 | 1986-01-21 | 株式会社村田製作所 | ノイズ吸収用バリスタ |
JPS6120739A (ja) | 1984-07-10 | 1986-01-29 | 平岡織染株式会社 | 熱融着縫製可能な防水シ−トおよびその縫製方法 |
JPH059024U (ja) * | 1991-07-08 | 1993-02-05 | 株式会社村田製作所 | バリスタ機能付ノイズフイルタ |
JPH06283301A (ja) * | 1993-03-29 | 1994-10-07 | Mitsubishi Materials Corp | チップ型複合電子部品及びその製造方法 |
JP3631341B2 (ja) | 1996-10-18 | 2005-03-23 | Tdk株式会社 | 積層型複合機能素子およびその製造方法 |
JPH10199709A (ja) * | 1997-01-09 | 1998-07-31 | Tdk Corp | 積層型バリスタ |
JPH10241908A (ja) * | 1997-02-27 | 1998-09-11 | Mitsubishi Materials Corp | 複合素子及びその製造方法 |
JP2000228327A (ja) * | 1999-02-05 | 2000-08-15 | Murata Mfg Co Ltd | セラミック電子部品 |
JP2000232006A (ja) * | 1999-02-09 | 2000-08-22 | Murata Mfg Co Ltd | チップ型電子部品 |
JP2001035707A (ja) * | 1999-07-26 | 2001-02-09 | Tdk Corp | 積層チップバリスタ |
JP2004235300A (ja) * | 2003-01-29 | 2004-08-19 | Matsushita Electric Ind Co Ltd | チップ型電子部品 |
JP2012246905A (ja) * | 2011-05-31 | 2012-12-13 | Denso Corp | スタータ |
US9627142B2 (en) * | 2013-09-24 | 2017-04-18 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and board for mounting of the same |
KR20150135909A (ko) * | 2014-05-26 | 2015-12-04 | 삼성전기주식회사 | 복합 전자부품, 제조방법, 그 실장 기판 및 포장체 |
KR101585619B1 (ko) * | 2014-11-20 | 2016-01-15 | 주식회사 아모텍 | 감전보호소자 및 이를 구비한 휴대용 전자장치 |
KR101578544B1 (ko) * | 2014-11-20 | 2015-12-17 | 주식회사 아모텍 | 감전보호소자 및 이를 구비한 휴대용 전자장치 |
KR101608226B1 (ko) * | 2014-11-20 | 2016-04-14 | 주식회사 아모텍 | 감전보호소자 및 이를 구비한 휴대용 전자장치 |
KR101824904B1 (ko) * | 2015-04-01 | 2018-02-02 | 가부시키가이샤 무라타 세이사쿠쇼 | 콘덴서 소자, 및 그것을 포함하는 복합 전자부품 |
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CN110520951A (zh) | 2019-11-29 |
US11177070B2 (en) | 2021-11-16 |
US20200111611A1 (en) | 2020-04-09 |
WO2018182249A1 (ko) | 2018-10-04 |
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