JP6844971B2 - 研削装置 - Google Patents
研削装置 Download PDFInfo
- Publication number
- JP6844971B2 JP6844971B2 JP2016171855A JP2016171855A JP6844971B2 JP 6844971 B2 JP6844971 B2 JP 6844971B2 JP 2016171855 A JP2016171855 A JP 2016171855A JP 2016171855 A JP2016171855 A JP 2016171855A JP 6844971 B2 JP6844971 B2 JP 6844971B2
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- Prior art keywords
- plate
- shaped work
- layer
- water
- grinding
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- 238000000227 grinding Methods 0.000 title claims description 89
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 93
- 238000005259 measurement Methods 0.000 claims description 60
- 239000006059 cover glass Substances 0.000 claims description 42
- 239000012530 fluid Substances 0.000 claims description 26
- 230000003287 optical effect Effects 0.000 claims description 17
- 239000010410 layer Substances 0.000 claims 12
- 239000002356 single layer Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 32
- 229920005989 resin Polymers 0.000 description 32
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 26
- 229910052710 silicon Inorganic materials 0.000 description 26
- 239000010703 silicon Substances 0.000 description 26
- 239000007921 spray Substances 0.000 description 18
- 238000005507 spraying Methods 0.000 description 6
- 238000001035 drying Methods 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Description
式(1)
b=a/1.33
20 保持テーブル
40 研削手段
47 研削砥石
60 非接触厚み測定器
62 発光部
64 受光部
65 カバーガラス
70 測定光保護部
71 ケース
73 開口
75 切換部
L0 測定光
L1 第1の反射光
L2 第2の反射光
S1 水層
S2 エア層
W 板状ワーク
W1 シリコンウエーハ(板状ワーク)
W2 樹脂層(板状ワーク)
Claims (1)
- 一層又は上層と下層の二層からなる板状ワークを保持する保持テーブルと、該保持テーブルが保持した板状ワークを研削砥石で研削する研削手段と、該研削手段で研削される板状ワークに測定光を照射させ板状ワークの上面で反射した第1の反射光と上面を通過した該測定光が該一層の下面又は該上層と該下層との界面で反射した第2の反射光とを受光して該第1の反射光と該第2の反射光との光路差から板状ワークの厚み又は上層の厚みを測定する非接触厚み測定器と、を備える研削装置であって、
該非接触厚み測定器は、該測定光と該第1の反射光と該第2の反射光とを透過するカバーガラスと、該カバーガラスと該保持テーブルが保持する板状ワークとの間に形成する測定光保護部、とを備え、
該測定光保護部は、該保持テーブルが保持した板状ワークと該カバーガラスとの間を流体で満たす開口を有するケースと、該ケースに供給する流体を水とエアとに切り換え可能な切換部とを備え、
該一層で形成された板状ワークの場合は、該板状ワークの上面と該カバーガラスの下面との間を水で満たし水層を形成させ、板状ワークの厚みを測定しながら研削し、
該二層で形成された板状ワークの場合は、該板状ワークの上面と該カバーガラスの下面との間をエアで満たしエア層を形成させ、該上層の厚みを測定しながら研削する研削装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016171855A JP6844971B2 (ja) | 2016-09-02 | 2016-09-02 | 研削装置 |
TW106125668A TWI726134B (zh) | 2016-09-02 | 2017-07-31 | 磨削裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016171855A JP6844971B2 (ja) | 2016-09-02 | 2016-09-02 | 研削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018034283A JP2018034283A (ja) | 2018-03-08 |
JP6844971B2 true JP6844971B2 (ja) | 2021-03-17 |
Family
ID=61566856
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016171855A Active JP6844971B2 (ja) | 2016-09-02 | 2016-09-02 | 研削装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6844971B2 (ja) |
TW (1) | TWI726134B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7507576B2 (ja) | 2020-03-17 | 2024-06-28 | 株式会社東京精密 | 研削装置 |
JP2023000307A (ja) | 2021-06-17 | 2023-01-04 | 株式会社ディスコ | 研削装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5958148A (en) * | 1996-07-26 | 1999-09-28 | Speedfam-Ipec Corporation | Method for cleaning workpiece surfaces and monitoring probes during workpiece processing |
US6967715B2 (en) * | 2002-12-06 | 2005-11-22 | International Business Machines Corporation | Method and apparatus for optical film measurements in a controlled environment |
EP1868231A1 (en) * | 2005-04-04 | 2007-12-19 | Shin-Etsu Handotai Co., Ltd | Bonded wafer manufacturing method, bonded wafer, and plane polishing apparatus |
JP2006313883A (ja) * | 2005-04-04 | 2006-11-16 | Shin Etsu Handotai Co Ltd | 貼り合わせウエーハの製造方法及び貼り合わせウエーハ並びに平面研削装置 |
JP5101312B2 (ja) * | 2008-01-17 | 2012-12-19 | 株式会社ディスコ | 厚み計測装置及び該厚み計測装置を備えた研削装置 |
WO2009131892A2 (en) * | 2008-04-21 | 2009-10-29 | Applied Materials, Inc. | Methods and apparatus for measuring substrate edge thickness during polishing |
JP5731806B2 (ja) * | 2010-12-02 | 2015-06-10 | 株式会社ディスコ | 研削装置 |
JP5795942B2 (ja) * | 2011-11-11 | 2015-10-14 | 株式会社ディスコ | Sawデバイス用ウェーハの研削方法 |
JP6145342B2 (ja) * | 2013-07-12 | 2017-06-07 | 株式会社荏原製作所 | 膜厚測定装置、膜厚測定方法、および膜厚測定装置を備えた研磨装置 |
JP6441056B2 (ja) * | 2014-12-10 | 2018-12-19 | 株式会社ディスコ | 研削装置 |
-
2016
- 2016-09-02 JP JP2016171855A patent/JP6844971B2/ja active Active
-
2017
- 2017-07-31 TW TW106125668A patent/TWI726134B/zh active
Also Published As
Publication number | Publication date |
---|---|
TWI726134B (zh) | 2021-05-01 |
JP2018034283A (ja) | 2018-03-08 |
TW201811506A (zh) | 2018-04-01 |
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