JP6762651B2 - 加工方法 - Google Patents
加工方法 Download PDFInfo
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- JP6762651B2 JP6762651B2 JP2016031350A JP2016031350A JP6762651B2 JP 6762651 B2 JP6762651 B2 JP 6762651B2 JP 2016031350 A JP2016031350 A JP 2016031350A JP 2016031350 A JP2016031350 A JP 2016031350A JP 6762651 B2 JP6762651 B2 JP 6762651B2
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- Prior art keywords
- suction
- chips
- holding
- holding table
- workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
4 基台
4a 開口
6 X軸移動テーブル
8 防塵防滴カバー
10 保持テーブル(保持手段)
12 治具ベース
12a 上面
12b 第1流路
12c 第2流路
14 保持治具
14a 保持面
14b 下面
14c 逃げ溝
14d 貫通孔
16 切削ユニット
18 支持構造
20 切削ユニット移動機構
22 Y軸ガイドレール
24 Y軸移動プレート
26 Y軸ボールネジ
28 Z軸ガイドレール
30 Z軸移動プレート
32 Z軸ボールネジ
34 Z軸パルスモータ
36 撮像ユニット
38 切削ブレード
40 切削液供給ノズル
42a,42b,42c 開閉弁
44 吸引源
46 供給源
48 吸引ユニット(吸引手段)
50 吸引ヘッド
52 吸引路
54 開閉弁
56 吸引源
62 研削装置
64 保持テーブル(保持手段)
64a 保持面
64b 流路
66a,66b 開閉弁
68 吸引源
70 供給源
72 研削ユニット
74 スピンドル
76 マウント
78 研削ホイール
80 ホイール基台
82 研削砥石
84 吸引ユニット(吸引手段)
86 吸引ヘッド
88 吸引路
90 開閉弁
92 吸引源
11,41 被加工物
13 金属枠体
13a 表面
13b 裏面
15 デバイス領域
17 外周余剰領域
19 分割予定ライン(ストリート)
21 樹脂層
23 ステージ
31,51 チップ
Claims (2)
- 交差する複数の分割予定ラインが設定された被加工物を加工する加工方法であって、
被加工物を保持テーブルで保持する保持ステップと、
該保持テーブルに保持された被加工物を該分割予定ラインに沿って分割し複数のチップを形成する分割ステップと、
該分割ステップを実施した後、該保持テーブルの一部を覆うように配置され下端の開口内に該複数のチップを収容して吸引する吸引ヘッドと、該吸引ヘッドに接続された吸引路と、を有する吸引ユニットで該保持テーブル上の該複数のチップを吸引し、該吸引路を介して該複数のチップを該保持テーブルから搬出する搬出ステップと、を備え、
該搬出ステップでは、該複数のチップに液体を供給しつつ該液体とともに該複数のチップを該吸引ユニットで吸引し、該吸引路を介して該複数のチップを該保持テーブルから搬出することを特徴とする加工方法。 - 前記搬出ステップでは、前記保持テーブルに接続された流路に対して供給源から流体を供給しながら、前記吸引路に接続された吸引源の負圧を前記吸引ヘッドに作用させることで、該吸引源へと向かう該流体の流れを発生させることを特徴とする請求項1に記載の加工方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016031350A JP6762651B2 (ja) | 2016-02-22 | 2016-02-22 | 加工方法 |
TW106101025A TWI734727B (zh) | 2016-02-22 | 2017-01-12 | 加工方法 |
SG10201700917TA SG10201700917TA (en) | 2016-02-22 | 2017-02-06 | Workpiece processing method |
CN201710089251.5A CN107104079B (zh) | 2016-02-22 | 2017-02-20 | 加工方法 |
US15/438,238 US10056296B2 (en) | 2016-02-22 | 2017-02-21 | Workpiece processing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016031350A JP6762651B2 (ja) | 2016-02-22 | 2016-02-22 | 加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017152442A JP2017152442A (ja) | 2017-08-31 |
JP6762651B2 true JP6762651B2 (ja) | 2020-09-30 |
Family
ID=59630079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016031350A Active JP6762651B2 (ja) | 2016-02-22 | 2016-02-22 | 加工方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10056296B2 (ja) |
JP (1) | JP6762651B2 (ja) |
CN (1) | CN107104079B (ja) |
SG (1) | SG10201700917TA (ja) |
TW (1) | TWI734727B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6887722B2 (ja) * | 2016-10-25 | 2021-06-16 | 株式会社ディスコ | ウェーハの加工方法及び切削装置 |
JP7043346B2 (ja) * | 2018-05-18 | 2022-03-29 | 株式会社ディスコ | 切削装置 |
CN108581605A (zh) * | 2018-05-18 | 2018-09-28 | 江苏沃元精密机械有限公司 | 一种金属切削床 |
JP7149248B2 (ja) * | 2019-10-31 | 2022-10-06 | Towa株式会社 | 洗浄モジュール、切断装置及び切断品の製造方法 |
JP7149249B2 (ja) * | 2019-10-31 | 2022-10-06 | Towa株式会社 | 搬送モジュール、切断装置及び切断品の製造方法 |
CN114121726A (zh) * | 2021-11-05 | 2022-03-01 | 星源电子科技(深圳)有限公司 | 一种用于Micro-LED芯片加工的封装*** |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2635889B2 (ja) * | 1992-06-24 | 1997-07-30 | 株式会社東芝 | ダイボンディング装置 |
JPH1140520A (ja) * | 1997-07-23 | 1999-02-12 | Toshiba Corp | ウェーハの分割方法及び半導体装置の製造方法 |
JP3912923B2 (ja) * | 1999-02-09 | 2007-05-09 | ローム株式会社 | エキスパンションシートからのチップ片の剥離装置 |
JP2000340528A (ja) * | 1999-05-31 | 2000-12-08 | M Tec Kk | 微小チップピックアップ装置 |
JP4312304B2 (ja) | 1999-07-13 | 2009-08-12 | 株式会社ディスコ | Csp基板分割装置 |
JP2004014956A (ja) * | 2002-06-11 | 2004-01-15 | Shinko Electric Ind Co Ltd | 微小半導体素子の加工処理方法 |
JP5947010B2 (ja) * | 2011-09-15 | 2016-07-06 | 株式会社ディスコ | 分割装置 |
JP5858837B2 (ja) * | 2012-03-23 | 2016-02-10 | 株式会社ディスコ | 吸引保持手段の被加工物離脱方法 |
JP6101557B2 (ja) * | 2013-05-10 | 2017-03-22 | 株式会社ディスコ | 切削装置 |
JP6081868B2 (ja) * | 2013-06-18 | 2017-02-15 | 株式会社ディスコ | 切削装置 |
JP6162568B2 (ja) * | 2013-10-17 | 2017-07-12 | 株式会社ディスコ | 研削装置及びウエーハの搬出方法 |
JP2016039186A (ja) * | 2014-08-05 | 2016-03-22 | 株式会社ディスコ | ウエーハの加工方法 |
-
2016
- 2016-02-22 JP JP2016031350A patent/JP6762651B2/ja active Active
-
2017
- 2017-01-12 TW TW106101025A patent/TWI734727B/zh active
- 2017-02-06 SG SG10201700917TA patent/SG10201700917TA/en unknown
- 2017-02-20 CN CN201710089251.5A patent/CN107104079B/zh active Active
- 2017-02-21 US US15/438,238 patent/US10056296B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2017152442A (ja) | 2017-08-31 |
US20170243787A1 (en) | 2017-08-24 |
US10056296B2 (en) | 2018-08-21 |
CN107104079A (zh) | 2017-08-29 |
TW201740445A (zh) | 2017-11-16 |
SG10201700917TA (en) | 2017-09-28 |
TWI734727B (zh) | 2021-08-01 |
CN107104079B (zh) | 2023-01-13 |
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