JP6738373B2 - 基板処理装置および基板処理方法 - Google Patents

基板処理装置および基板処理方法 Download PDF

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Publication number: JP6738373B2
Authority: JP; Japan
Prior art keywords: substrate; floating; measuring device; nozzle; horizontal position
Prior art date: 2018-05-31
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

JP2018104960A

Other languages

English (en)

Japanese (ja)

Other versions

JP2019209229A (ja

Inventor

富藤　幸雄

幸雄富藤

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Screen Holdings Co Ltd

Original Assignee

Screen Holdings Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2018-05-31

Filing date

2018-05-31

Publication date

2020-08-12

2018-05-31 Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd

2018-05-31 Priority to JP2018104960A priority Critical patent/JP6738373B2/ja

2019-05-10 Priority to KR1020190055109A priority patent/KR102474713B1/ko

2019-05-16 Priority to TW108116954A priority patent/TWI745691B/zh

2019-05-21 Priority to CN201920736103.2U priority patent/CN209785888U/zh

2019-12-12 Publication of JP2019209229A publication Critical patent/JP2019209229A/ja

2020-08-12 Application granted granted Critical

2020-08-12 Publication of JP6738373B2 publication Critical patent/JP6738373B2/ja

Status Active legal-status Critical Current

2038-05-31 Anticipated expiration legal-status Critical

Links

239000000758 substrate Substances 0.000 title claims description 370
238000012545 processing Methods 0.000 title claims description 121
238000003672 processing method Methods 0.000 title claims description 10
230000007246 mechanism Effects 0.000 claims description 94
238000000576 coating method Methods 0.000 claims description 83
239000011248 coating agent Substances 0.000 claims description 81
238000005259 measurement Methods 0.000 claims description 79
239000007788 liquid Substances 0.000 claims description 66
238000005339 levitation Methods 0.000 claims description 51
238000011144 upstream manufacturing Methods 0.000 claims description 47
238000012546 transfer Methods 0.000 claims description 15
238000013459 approach Methods 0.000 claims description 10
230000007723 transport mechanism Effects 0.000 claims description 9
238000007599 discharging Methods 0.000 claims description 4
238000012423 maintenance Methods 0.000 description 12
230000003028 elevating effect Effects 0.000 description 10
238000000034 method Methods 0.000 description 10
230000005856 abnormality Effects 0.000 description 8
238000004140 cleaning Methods 0.000 description 8
230000006870 function Effects 0.000 description 7
230000003287 optical effect Effects 0.000 description 7
230000002093 peripheral effect Effects 0.000 description 7
230000008569 process Effects 0.000 description 7
230000032258 transport Effects 0.000 description 7
230000002159 abnormal effect Effects 0.000 description 5
238000012986 modification Methods 0.000 description 5
230000004048 modification Effects 0.000 description 5
230000004044 response Effects 0.000 description 5
238000010586 diagram Methods 0.000 description 3
230000014509 gene expression Effects 0.000 description 3
239000004065 semiconductor Substances 0.000 description 3
239000004973 liquid crystal related substance Substances 0.000 description 2
230000001141 propulsive effect Effects 0.000 description 2
238000003860 storage Methods 0.000 description 2
239000000919 ceramic Substances 0.000 description 1
230000008859 change Effects 0.000 description 1
239000000470 constituent Substances 0.000 description 1
238000007796 conventional method Methods 0.000 description 1
238000001514 detection method Methods 0.000 description 1
238000001035 drying Methods 0.000 description 1
230000000694 effects Effects 0.000 description 1
238000005401 electroluminescence Methods 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
239000011159 matrix material Substances 0.000 description 1
238000001179 sorption measurement Methods 0.000 description 1

Images

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
- H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Coating Apparatus (AREA)
Liquid Crystal (AREA)
Application Of Or Painting With Fluid Materials (AREA)
Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

JP2018104960A 2018-05-31 2018-05-31 基板処理装置および基板処理方法 Active JP6738373B2 (ja)

Priority Applications (4)

Application Number	Priority Date	Filing Date	Title
JP2018104960A JP6738373B2 (ja)	2018-05-31	2018-05-31	基板処理装置および基板処理方法
KR1020190055109A KR102474713B1 (ko)	2018-05-31	2019-05-10	기판 처리 장치 및 기판 처리 방법
TW108116954A TWI745691B (zh)	2018-05-31	2019-05-16	基板處理裝置及基板處理方法
CN201920736103.2U CN209785888U (zh)	2018-05-31	2019-05-21	基板处理装置

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2018104960A JP6738373B2 (ja)	2018-05-31	2018-05-31	基板処理装置および基板処理方法

Publications (2)

Publication Number	Publication Date
JP2019209229A JP2019209229A (ja)	2019-12-12
JP6738373B2 true JP6738373B2 (ja)	2020-08-12

Family

ID=68805684

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2018104960A Active JP6738373B2 (ja)	2018-05-31	2018-05-31	基板処理装置および基板処理方法

Country Status (4)

Country	Link
JP (1)	JP6738373B2 (zh)
KR (1)	KR102474713B1 (zh)
CN (1)	CN209785888U (zh)
TW (1)	TWI745691B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20230137402A1 (en)	2021-10-29	2023-05-04	Semes Co., Ltd.	Substrate treating apparatus and substrate treating method using the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4673180B2 (ja) *	2005-10-13	2011-04-20	東京エレクトロン株式会社	塗布装置及び塗布方法
JP4578381B2 (ja) *	2005-10-19	2010-11-10	東京エレクトロン株式会社	塗布方法及び塗布装置
JP5346643B2 (ja) *	2009-03-27	2013-11-20	大日本スクリーン製造株式会社	基板塗布装置および基板塗布方法
JP5486030B2 (ja)	2012-02-15	2014-05-07	東京エレクトロン株式会社	塗布装置

2018
- 2018-05-31 JP JP2018104960A patent/JP6738373B2/ja active Active
2019
- 2019-05-10 KR KR1020190055109A patent/KR102474713B1/ko active IP Right Grant
- 2019-05-16 TW TW108116954A patent/TWI745691B/zh active
- 2019-05-21 CN CN201920736103.2U patent/CN209785888U/zh active Active

Also Published As

Publication number	Publication date
KR102474713B1 (ko)	2022-12-05
CN209785888U (zh)	2019-12-13
TWI745691B (zh)	2021-11-11
KR20190136927A (ko)	2019-12-10
JP2019209229A (ja)	2019-12-12
TW202000562A (zh)	2020-01-01

Legal Events

Date	Code	Title	Description
2019-04-01	A621	Written request for application examination	Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190401
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2020-05-21	A521	Request for written amendment filed	Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200521
2020-06-25	TRDD	Decision of grant or rejection written
2020-06-30	A01	Written decision to grant a patent or to grant a registration (utility model)	Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200630
2020-07-21	A61	First payment of annual fees (during grant procedure)	Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200717
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Publication	Publication Date	Title
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