JP6738373B2 - 基板処理装置および基板処理方法 - Google Patents
基板処理装置および基板処理方法 Download PDFInfo
- Publication number
- JP6738373B2 JP6738373B2 JP2018104960A JP2018104960A JP6738373B2 JP 6738373 B2 JP6738373 B2 JP 6738373B2 JP 2018104960 A JP2018104960 A JP 2018104960A JP 2018104960 A JP2018104960 A JP 2018104960A JP 6738373 B2 JP6738373 B2 JP 6738373B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- floating
- measuring device
- nozzle
- horizontal position
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000758 substrate Substances 0.000 title claims description 370
- 238000012545 processing Methods 0.000 title claims description 121
- 238000003672 processing method Methods 0.000 title claims description 10
- 230000007246 mechanism Effects 0.000 claims description 94
- 238000000576 coating method Methods 0.000 claims description 83
- 239000011248 coating agent Substances 0.000 claims description 81
- 238000005259 measurement Methods 0.000 claims description 79
- 239000007788 liquid Substances 0.000 claims description 66
- 238000005339 levitation Methods 0.000 claims description 51
- 238000011144 upstream manufacturing Methods 0.000 claims description 47
- 238000012546 transfer Methods 0.000 claims description 15
- 238000013459 approach Methods 0.000 claims description 10
- 230000007723 transport mechanism Effects 0.000 claims description 9
- 238000007599 discharging Methods 0.000 claims description 4
- 238000012423 maintenance Methods 0.000 description 12
- 230000003028 elevating effect Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 230000005856 abnormality Effects 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 8
- 230000006870 function Effects 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 230000032258 transport Effects 0.000 description 7
- 230000002159 abnormal effect Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 230000004044 response Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000014509 gene expression Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000001141 propulsive effect Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
- H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Liquid Crystal (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018104960A JP6738373B2 (ja) | 2018-05-31 | 2018-05-31 | 基板処理装置および基板処理方法 |
KR1020190055109A KR102474713B1 (ko) | 2018-05-31 | 2019-05-10 | 기판 처리 장치 및 기판 처리 방법 |
TW108116954A TWI745691B (zh) | 2018-05-31 | 2019-05-16 | 基板處理裝置及基板處理方法 |
CN201920736103.2U CN209785888U (zh) | 2018-05-31 | 2019-05-21 | 基板处理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018104960A JP6738373B2 (ja) | 2018-05-31 | 2018-05-31 | 基板処理装置および基板処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019209229A JP2019209229A (ja) | 2019-12-12 |
JP6738373B2 true JP6738373B2 (ja) | 2020-08-12 |
Family
ID=68805684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018104960A Active JP6738373B2 (ja) | 2018-05-31 | 2018-05-31 | 基板処理装置および基板処理方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6738373B2 (zh) |
KR (1) | KR102474713B1 (zh) |
CN (1) | CN209785888U (zh) |
TW (1) | TWI745691B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20230137402A1 (en) | 2021-10-29 | 2023-05-04 | Semes Co., Ltd. | Substrate treating apparatus and substrate treating method using the same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4673180B2 (ja) * | 2005-10-13 | 2011-04-20 | 東京エレクトロン株式会社 | 塗布装置及び塗布方法 |
JP4578381B2 (ja) * | 2005-10-19 | 2010-11-10 | 東京エレクトロン株式会社 | 塗布方法及び塗布装置 |
JP5346643B2 (ja) * | 2009-03-27 | 2013-11-20 | 大日本スクリーン製造株式会社 | 基板塗布装置および基板塗布方法 |
JP5486030B2 (ja) | 2012-02-15 | 2014-05-07 | 東京エレクトロン株式会社 | 塗布装置 |
-
2018
- 2018-05-31 JP JP2018104960A patent/JP6738373B2/ja active Active
-
2019
- 2019-05-10 KR KR1020190055109A patent/KR102474713B1/ko active IP Right Grant
- 2019-05-16 TW TW108116954A patent/TWI745691B/zh active
- 2019-05-21 CN CN201920736103.2U patent/CN209785888U/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR102474713B1 (ko) | 2022-12-05 |
CN209785888U (zh) | 2019-12-13 |
TWI745691B (zh) | 2021-11-11 |
KR20190136927A (ko) | 2019-12-10 |
JP2019209229A (ja) | 2019-12-12 |
TW202000562A (zh) | 2020-01-01 |
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