JP6724264B2 - フェノール樹脂及びその製造方法、並びにエポキシ樹脂組成物及びその硬化物 - Google Patents

フェノール樹脂及びその製造方法、並びにエポキシ樹脂組成物及びその硬化物 Download PDF

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Publication number
JP6724264B2
JP6724264B2 JP2019566373A JP2019566373A JP6724264B2 JP 6724264 B2 JP6724264 B2 JP 6724264B2 JP 2019566373 A JP2019566373 A JP 2019566373A JP 2019566373 A JP2019566373 A JP 2019566373A JP 6724264 B2 JP6724264 B2 JP 6724264B2
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epoxy resin
less
resin composition
phenol resin
resin
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Japanese (ja)
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JPWO2019189023A1 (ja
Inventor
晴彦 中川
晴彦 中川
慎司 岡本
慎司 岡本
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Meiwa Plastic Industries Ltd
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Meiwa Plastic Industries Ltd
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Priority to JP2020085127A priority Critical patent/JP7347322B2/ja
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Priority to JP2023135098A priority patent/JP2023166442A/ja
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C08G8/08Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
    • C08G8/12Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with monohydric phenols having only one hydrocarbon substituent ortho on para to the OH group, e.g. p-tert.-butyl phenol
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols
    • C08G59/621Phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
JP2019566373A 2018-03-27 2019-03-25 フェノール樹脂及びその製造方法、並びにエポキシ樹脂組成物及びその硬化物 Active JP6724264B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2020085127A JP7347322B2 (ja) 2018-03-27 2020-05-14 フェノール樹脂及びその製造方法、並びにエポキシ樹脂組成物及びその硬化物
JP2023135098A JP2023166442A (ja) 2018-03-27 2023-08-23 フェノール樹脂及びその製造方法、並びにエポキシ樹脂組成物及びその硬化物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018060488 2018-03-27
JP2018060488 2018-03-27
PCT/JP2019/012584 WO2019189023A1 (ja) 2018-03-27 2019-03-25 フェノール樹脂及びその製造方法、並びにエポキシ樹脂組成物及びその硬化物

Related Child Applications (1)

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JP2020085127A Division JP7347322B2 (ja) 2018-03-27 2020-05-14 フェノール樹脂及びその製造方法、並びにエポキシ樹脂組成物及びその硬化物

Publications (2)

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JPWO2019189023A1 JPWO2019189023A1 (ja) 2020-04-30
JP6724264B2 true JP6724264B2 (ja) 2020-07-15

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Family Applications (3)

Application Number Title Priority Date Filing Date
JP2019566373A Active JP6724264B2 (ja) 2018-03-27 2019-03-25 フェノール樹脂及びその製造方法、並びにエポキシ樹脂組成物及びその硬化物
JP2020085127A Active JP7347322B2 (ja) 2018-03-27 2020-05-14 フェノール樹脂及びその製造方法、並びにエポキシ樹脂組成物及びその硬化物
JP2023135098A Pending JP2023166442A (ja) 2018-03-27 2023-08-23 フェノール樹脂及びその製造方法、並びにエポキシ樹脂組成物及びその硬化物

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Application Number Title Priority Date Filing Date
JP2020085127A Active JP7347322B2 (ja) 2018-03-27 2020-05-14 フェノール樹脂及びその製造方法、並びにエポキシ樹脂組成物及びその硬化物
JP2023135098A Pending JP2023166442A (ja) 2018-03-27 2023-08-23 フェノール樹脂及びその製造方法、並びにエポキシ樹脂組成物及びその硬化物

Country Status (5)

Country Link
JP (3) JP6724264B2 (zh)
KR (1) KR20200138171A (zh)
CN (1) CN111936540B (zh)
TW (1) TWI801541B (zh)
WO (1) WO2019189023A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102623238B1 (ko) * 2020-09-11 2024-01-10 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
CN118176231A (zh) 2021-11-19 2024-06-11 纳美仕有限公司 固化性树脂组合物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2823057B2 (ja) * 1990-12-20 1998-11-11 日本化薬株式会社 エポキシ樹脂の製造方法
JPH08258077A (ja) 1996-04-22 1996-10-08 Nitto Denko Corp 半導体装置
TWI243839B (en) * 1998-12-24 2005-11-21 Chang Chun Plastics Co Ltd Epoxy resin and resin-sealed type semiconductor apparatus
JP2000290352A (ja) * 1999-04-07 2000-10-17 Sumitomo Durez Co Ltd エポキシ樹脂硬化剤およびその製造方法
JP2002220563A (ja) * 2000-10-20 2002-08-09 Kansai Paint Co Ltd 缶内面用水性被覆組成物
JP4435791B2 (ja) 2001-11-16 2010-03-24 旭有機材工業株式会社 ノボラック型フェノール樹脂の製造方法及びレジンコーテッドサンド
KR100708249B1 (ko) * 2002-08-30 2007-04-16 아사히 유키자이 고교 가부시키가이샤 노볼락형 페놀 수지의 제조방법
JP4398299B2 (ja) * 2004-05-19 2010-01-13 旭有機材工業株式会社 鋳型用有機粘結剤及びこれを用いて得られる鋳物砂組成物並びに鋳型
WO2010103745A1 (ja) * 2009-03-11 2010-09-16 住友ベークライト株式会社 半導体封止用樹脂組成物及び半導体装置
US8394911B2 (en) * 2010-02-03 2013-03-12 Dic Corporation Phenol resin composition, production method therefor, curable resin composition, cured product thereof, and printed circuit board
JP6385850B2 (ja) * 2015-02-17 2018-09-05 アイカSdkフェノール株式会社 フェノール樹脂、フェノール樹脂の製造方法、樹脂組成物およびポリウレタンフォーム

Also Published As

Publication number Publication date
WO2019189023A1 (ja) 2019-10-03
JPWO2019189023A1 (ja) 2020-04-30
JP7347322B2 (ja) 2023-09-20
KR20200138171A (ko) 2020-12-09
CN111936540B (zh) 2023-10-03
TWI801541B (zh) 2023-05-11
TW201942170A (zh) 2019-11-01
CN111936540A (zh) 2020-11-13
JP2020117734A (ja) 2020-08-06
JP2023166442A (ja) 2023-11-21

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