JP6617050B2 - 基板撮像装置 - Google Patents
基板撮像装置 Download PDFInfo
- Publication number
- JP6617050B2 JP6617050B2 JP2016031361A JP2016031361A JP6617050B2 JP 6617050 B2 JP6617050 B2 JP 6617050B2 JP 2016031361 A JP2016031361 A JP 2016031361A JP 2016031361 A JP2016031361 A JP 2016031361A JP 6617050 B2 JP6617050 B2 JP 6617050B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- wafer
- substrate
- unit
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims description 80
- 238000003384 imaging method Methods 0.000 title claims description 60
- 230000002093 peripheral effect Effects 0.000 claims description 38
- 238000005286 illumination Methods 0.000 claims description 33
- 238000000149 argon plasma sintering Methods 0.000 claims description 20
- 230000003287 optical effect Effects 0.000 claims description 20
- 238000009792 diffusion process Methods 0.000 claims description 11
- 238000012545 processing Methods 0.000 description 91
- 238000010438 heat treatment Methods 0.000 description 22
- 238000007689 inspection Methods 0.000 description 18
- 239000011248 coating agent Substances 0.000 description 16
- 238000000576 coating method Methods 0.000 description 16
- 238000000034 method Methods 0.000 description 14
- 239000007788 liquid Substances 0.000 description 13
- 238000012546 transfer Methods 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000011161 development Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 230000006870 function Effects 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000007687 exposure technique Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N7/00—Television systems
- H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
- H04N7/183—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast for receiving images from a single remote source
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70225—Optical aspects of catadioptric systems, i.e. comprising reflective and refractive elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/70—Circuitry for compensating brightness variation in the scene
- H04N23/74—Circuitry for compensating brightness variation in the scene by influencing the scene brightness using illuminating means
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/90—Arrangement of cameras or camera modules, e.g. multiple cameras in TV studios or sports stadiums
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8812—Diffuse illumination, e.g. "sky"
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Pathology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Quality & Reliability (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
図1に示されるように、基板処理システム1(基板処理装置)は、塗布現像装置2(基板処理装置)と、コントローラ10(制御部)とを備える。基板処理システム1には、露光装置3が併設されている。露光装置3は、基板処理システム1のコントローラ10と通信可能なコントローラ(図示せず)を備える。露光装置3は、塗布現像装置2との間でウエハW(基板)を授受して、ウエハWの表面Wa(図10等参照)に形成された感光性レジスト膜の露光処理(パターン露光)を行うように構成されている。具体的には、液浸露光等の方法により感光性レジスト膜(感光性被膜)の露光対象部分に選択的にエネルギー線を照射する。エネルギー線としては、例えばArFエキシマレーザー、KrFエキシマレーザー、g線、i線、又は極端紫外線(EUV:Extreme Ultraviolet)が挙げられる。
続いて、図4〜図20を参照して、検査ユニットU3についてさらに詳しく説明する。検査ユニットU3は、図4〜図6に示されるように、筐体100と、回転保持サブユニット200(回転保持部)と、表面撮像サブユニット300と、周縁撮像サブユニット400(基板撮像装置)と、裏面撮像サブユニット500とを有する。各サブユニット200〜500は、筐体100内に配置されている。筐体100のうち一端壁には、ウエハWを筐体100の内部に搬入及び筐体100の外部に搬出するための搬入出口101が形成されている。
コントローラ10は、図21に示されるように、機能モジュールとして、読取部M1と、記憶部M2と、処理部M3と、指示部M4とを有する。これらの機能モジュールは、コントローラ10の機能を便宜上複数のモジュールに区切ったものに過ぎず、コントローラ10を構成するハードウェアがこのようなモジュールに分かれていることを必ずしも意味するものではない。各機能モジュールは、プログラムの実行により実現されるものに限られず、専用の電気回路(例えば論理回路)、又は、これを集積した集積回路(ASIC:Application Specific Integrated Circuit)により実現されるものであってもよい。
本実施形態では、ミラー部材430が、保持台201の回転軸に対して傾斜すると共に保持台201に保持されたウエハWの端面Wcと裏面Wbの周縁領域Wdとに対向する反射面432を有している。また、本実施形態では、カメラ410の撮像素子412に、保持台201に保持されたウエハWの表面Waの周縁領域Wdからの光と、保持台201に保持されたウエハWの端面Wcからの光がミラー部材430の反射面432で反射された反射光とが共に、レンズ411を介して入力される。そのため、ウエハWの表面Waの周縁領域WdとウエハWの端面Wcとの双方が、1台のカメラ410で同時に撮像される。従って、複数のカメラが不要となる結果、複数のカメラを設置するためのスペースも不要となる。また、カメラ410を移動させるための機構も不要であるので、当該機構を設置するためのスペースも不要となる。このように、本実施形態では、検査ユニットU3の装置構成が極めて簡略化される。その結果、機器トラブルを抑制しつつ、検査ユニットU3の小型化及び低コスト化を図ることが可能となる。
以上、本開示に係る実施形態について詳細に説明したが、本発明の要旨の範囲内で種々の変形を上記の実施形態に加えてもよい。例えば、反射面432は、保持台201の回転軸に対して傾斜すると共に保持台201に保持されたウエハWの端面Wcと裏面Wbの周縁領域Wdとに対向していればよく、湾曲面以外の他の形状(例えば、平坦面)を呈していてもよい。
Claims (4)
- 基板を保持して回転させるように構成された回転保持部と、
前記回転保持部の回転軸に対して傾斜すると共に、前記回転保持部に保持された前記基板の端面と裏面の周縁領域とに対向する反射面を有するミラー部材と、
前記回転保持部に保持された前記基板の表面の周縁領域からの第1の光と、前記回転保持部に保持された前記基板の端面からの第2の光が前記ミラー部材の前記反射面で反射された反射光とが共にレンズを介して入力される撮像素子を有するカメラと、
光源と、前記光源からの光をその光軸に直交する第1の方向に拡散して拡散光を発生させる光拡散部材とを有する照明部とを備え、
前記照明部は、前記回転保持部に保持された前記基板の表面の周縁領域に前記拡散光を照射すると共に、前記回転保持部に保持された前記基板の端面に前記拡散光の前記ミラー部材からの反射光が到達するように前記ミラー部材の前記反射面に前記拡散光を照射する、基板撮像装置。 - 前記反射面は、前記回転保持部に保持された前記基板の端面から離れる側に向けて窪んだ湾曲面である、請求項1に記載の基板撮像装置。
- 前記第2の光が前記ミラー部材の前記反射面で反射されて前記レンズに至るまでの間の光路の途中に配置され、前記基板の端面の結像位置を前記撮像素子に合わせるように構成された焦点調節レンズを更に備える、請求項1又は2に記載の基板撮像装置。
- 前記照明部は、
前記光源からの光を散乱して散乱光を発生させる光散乱部材と、
前記光散乱部材からの前記散乱光を前記光拡散部材に透過させる、前記光拡散部材に向けて凸の円柱レンズとを更に有し、
前記円柱レンズは、前記光源からの光の光軸及び前記第1の方向の双方に直交する第2の方向に拡散させる、請求項1〜3のいずれか一項に記載の基板撮像装置。
Priority Applications (14)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016031361A JP6617050B2 (ja) | 2016-02-22 | 2016-02-22 | 基板撮像装置 |
CN201710068654.1A CN107104064B (zh) | 2016-02-22 | 2017-02-08 | 基板拍摄装置 |
CN202111215335.1A CN114070977A (zh) | 2016-02-22 | 2017-02-08 | 基板拍摄装置 |
CN202111214841.9A CN114071076A (zh) | 2016-02-22 | 2017-02-08 | 基板拍摄装置 |
KR1020170018051A KR102684594B1 (ko) | 2016-02-22 | 2017-02-09 | 기판 촬상 장치 |
TW108139612A TWI728536B (zh) | 2016-02-22 | 2017-02-20 | 基板拍攝裝置 |
TW110112481A TWI834967B (zh) | 2016-02-22 | 2017-02-20 | 基板拍攝裝置 |
TW106105501A TWI679711B (zh) | 2016-02-22 | 2017-02-20 | 基板拍攝裝置 |
US15/437,869 US10523905B2 (en) | 2016-02-22 | 2017-02-21 | Substrate imaging apparatus |
SG10201913414WA SG10201913414WA (en) | 2016-02-22 | 2017-02-22 | Substrate imaging apparatus |
SG10201701397QA SG10201701397QA (en) | 2016-02-22 | 2017-02-22 | Substrate imaging apparatus |
US16/680,894 US10958879B2 (en) | 2016-02-22 | 2019-11-12 | Substrate imaging apparatus |
US17/189,669 US11832026B2 (en) | 2016-02-22 | 2021-03-02 | Substrate imaging apparatus |
US18/475,544 US20240022693A1 (en) | 2016-02-22 | 2023-09-27 | Substrate imaging apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016031361A JP6617050B2 (ja) | 2016-02-22 | 2016-02-22 | 基板撮像装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019174071A Division JP6827086B2 (ja) | 2019-09-25 | 2019-09-25 | 基板撮像装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017152443A JP2017152443A (ja) | 2017-08-31 |
JP6617050B2 true JP6617050B2 (ja) | 2019-12-04 |
Family
ID=59629586
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016031361A Active JP6617050B2 (ja) | 2016-02-22 | 2016-02-22 | 基板撮像装置 |
Country Status (6)
Country | Link |
---|---|
US (4) | US10523905B2 (ja) |
JP (1) | JP6617050B2 (ja) |
KR (1) | KR102684594B1 (ja) |
CN (3) | CN114071076A (ja) |
SG (2) | SG10201701397QA (ja) |
TW (3) | TWI728536B (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9965848B2 (en) * | 2015-12-23 | 2018-05-08 | Kla-Tencor Corporation | Shape based grouping |
JP7029914B2 (ja) * | 2017-09-25 | 2022-03-04 | 東京エレクトロン株式会社 | 基板処理装置 |
US10714366B2 (en) * | 2018-04-12 | 2020-07-14 | Kla-Tencor Corp. | Shape metric based scoring of wafer locations |
JP7007993B2 (ja) * | 2018-07-06 | 2022-01-25 | 東レエンジニアリング株式会社 | ダイシングチップ検査装置 |
JP7157580B2 (ja) | 2018-07-19 | 2022-10-20 | 東京エレクトロン株式会社 | 基板検査方法及び基板検査装置 |
JP7232586B2 (ja) * | 2018-07-31 | 2023-03-03 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
JP7202828B2 (ja) * | 2018-09-26 | 2023-01-12 | 東京エレクトロン株式会社 | 基板検査方法、基板検査装置および記録媒体 |
JP7349240B2 (ja) * | 2018-10-05 | 2023-09-22 | 東京エレクトロン株式会社 | 基板倉庫及び基板検査方法 |
CN111650813B (zh) | 2019-03-04 | 2024-04-16 | 东京毅力科创株式会社 | 基板处理装置、基板检查装置及方法、以及记录介质 |
JP7379104B2 (ja) | 2019-03-04 | 2023-11-14 | 東京エレクトロン株式会社 | 基板検査装置、基板処理装置、基板検査方法、及びコンピュータ読み取り可能な記録媒体 |
CN110702696A (zh) * | 2019-10-14 | 2020-01-17 | 珠海博明视觉科技有限公司 | 一种磁瓦表面缺陷检测装置 |
TW202137358A (zh) * | 2020-02-19 | 2021-10-01 | 日商東京威力科創股份有限公司 | 資訊處理方法、資訊處理裝置及電腦可讀取記錄媒體 |
JP7482702B2 (ja) * | 2020-06-30 | 2024-05-14 | 東京エレクトロン株式会社 | 基板処理装置 |
US11921054B2 (en) | 2020-09-16 | 2024-03-05 | Globalwafers Co., Ltd. | Cleaved semiconductor wafer camera system |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4611115A (en) * | 1985-01-14 | 1986-09-09 | Richland Glass Company, Inc. | Laser etch monitoring system |
JP3482425B2 (ja) * | 1995-03-31 | 2003-12-22 | 株式会社ナノテックス | 検査装置 |
JP3140664B2 (ja) * | 1995-06-30 | 2001-03-05 | 松下電器産業株式会社 | 異物検査方法及び装置 |
JPH11339042A (ja) | 1998-05-26 | 1999-12-10 | Sanko:Kk | 基板ウェハー判定装置及び判定方法 |
JP2000065753A (ja) * | 1998-08-26 | 2000-03-03 | Olympus Optical Co Ltd | 画像取り込み装置 |
US6809809B2 (en) * | 2000-11-15 | 2004-10-26 | Real Time Metrology, Inc. | Optical method and apparatus for inspecting large area planar objects |
EP1393546B1 (en) * | 2001-05-15 | 2008-11-05 | Ebara Corporation | A socket contact and feed-through device |
JP2003090803A (ja) * | 2001-09-19 | 2003-03-28 | Mitsubishi Electric Corp | 被処理基板欠陥検査装置、これを用いた半導体製造装置、及び被処理基板欠陥検査方法 |
JP2003344307A (ja) * | 2002-05-31 | 2003-12-03 | Cradle Corp | 光学検査装置 |
JP2004343082A (ja) | 2003-04-17 | 2004-12-02 | Asml Netherlands Bv | 凹面および凸面を含む集光器を備えたリトグラフ投影装置 |
JP2007155448A (ja) * | 2005-12-02 | 2007-06-21 | Olympus Corp | 端面検査装置 |
JP4908925B2 (ja) * | 2006-02-08 | 2012-04-04 | 株式会社日立ハイテクノロジーズ | ウェハ表面欠陥検査装置およびその方法 |
JP2007251143A (ja) | 2006-02-15 | 2007-09-27 | Olympus Corp | 外観検査装置 |
WO2007145223A1 (ja) * | 2006-06-12 | 2007-12-21 | Sharp Kabushiki Kaisha | 起伏検査装置、起伏検査方法、起伏検査装置の制御プログラム、記録媒体 |
JP2008135583A (ja) * | 2006-11-29 | 2008-06-12 | Tokyo Electron Ltd | 塗布膜形成装置および塗布膜形成方法 |
JP5276833B2 (ja) * | 2007-02-28 | 2013-08-28 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法及び欠陥検査装置 |
DE102007024525B4 (de) * | 2007-03-19 | 2009-05-28 | Vistec Semiconductor Systems Gmbh | Vorrichtung und Verfahren zur Bewertung von Defekten am Randbereich eines Wafers |
US7656519B2 (en) * | 2007-08-30 | 2010-02-02 | Kla-Tencor Corporation | Wafer edge inspection |
TWI512865B (zh) * | 2008-09-08 | 2015-12-11 | Rudolph Technologies Inc | 晶圓邊緣檢查技術 |
JP5443938B2 (ja) * | 2009-10-19 | 2014-03-19 | Juki株式会社 | 電子部品実装装置 |
JP5479253B2 (ja) * | 2010-07-16 | 2014-04-23 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法、プログラム及びコンピュータ記憶媒体 |
KR20120045309A (ko) * | 2010-10-29 | 2012-05-09 | 한미반도체 주식회사 | 웨이퍼 검사장치 및 이를 구비한 웨이퍼 검사 시스템 |
CN102564739A (zh) * | 2011-12-27 | 2012-07-11 | 中国科学院光电技术研究所 | 一种光焦度计 |
JP5673577B2 (ja) * | 2012-02-07 | 2015-02-18 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
JP3178129U (ja) * | 2012-06-21 | 2012-08-30 | 東京エレクトロン株式会社 | 基板検査装置 |
JP6118102B2 (ja) * | 2012-12-21 | 2017-04-19 | 東京エレクトロン株式会社 | 基板位置検出装置及びこれを用いた基板処理装置、成膜装置 |
JP2014163961A (ja) * | 2013-02-21 | 2014-09-08 | Canon Inc | ミラーユニットおよび画像取得装置 |
-
2016
- 2016-02-22 JP JP2016031361A patent/JP6617050B2/ja active Active
-
2017
- 2017-02-08 CN CN202111214841.9A patent/CN114071076A/zh active Pending
- 2017-02-08 CN CN202111215335.1A patent/CN114070977A/zh active Pending
- 2017-02-08 CN CN201710068654.1A patent/CN107104064B/zh active Active
- 2017-02-09 KR KR1020170018051A patent/KR102684594B1/ko active IP Right Grant
- 2017-02-20 TW TW108139612A patent/TWI728536B/zh active
- 2017-02-20 TW TW110112481A patent/TWI834967B/zh active
- 2017-02-20 TW TW106105501A patent/TWI679711B/zh active
- 2017-02-21 US US15/437,869 patent/US10523905B2/en active Active
- 2017-02-22 SG SG10201701397QA patent/SG10201701397QA/en unknown
- 2017-02-22 SG SG10201913414WA patent/SG10201913414WA/en unknown
-
2019
- 2019-11-12 US US16/680,894 patent/US10958879B2/en active Active
-
2021
- 2021-03-02 US US17/189,669 patent/US11832026B2/en active Active
-
2023
- 2023-09-27 US US18/475,544 patent/US20240022693A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CN114071076A (zh) | 2022-02-18 |
TW202129787A (zh) | 2021-08-01 |
SG10201701397QA (en) | 2017-09-28 |
KR102684594B1 (ko) | 2024-07-15 |
TWI834967B (zh) | 2024-03-11 |
TW202004940A (zh) | 2020-01-16 |
US20210185282A1 (en) | 2021-06-17 |
CN114070977A (zh) | 2022-02-18 |
US11832026B2 (en) | 2023-11-28 |
CN107104064B (zh) | 2021-11-09 |
TWI728536B (zh) | 2021-05-21 |
US20200084422A1 (en) | 2020-03-12 |
TWI679711B (zh) | 2019-12-11 |
US20240022693A1 (en) | 2024-01-18 |
JP2017152443A (ja) | 2017-08-31 |
US20170244936A1 (en) | 2017-08-24 |
TW201740481A (zh) | 2017-11-16 |
SG10201913414WA (en) | 2020-03-30 |
KR20170098694A (ko) | 2017-08-30 |
CN107104064A (zh) | 2017-08-29 |
US10958879B2 (en) | 2021-03-23 |
US10523905B2 (en) | 2019-12-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6617050B2 (ja) | 基板撮像装置 | |
JP6444909B2 (ja) | 基板処理方法、基板処理装置及びコンピュータ読み取り可能な記録媒体 | |
JP7202828B2 (ja) | 基板検査方法、基板検査装置および記録媒体 | |
JP7314237B2 (ja) | 基板撮像装置及び基板撮像方法 | |
JP6972270B2 (ja) | 照明モジュール及び基板撮像装置 | |
JP6827086B2 (ja) | 基板撮像装置 | |
KR20240112790A (ko) | 기판 촬상 장치 | |
KR20240112789A (ko) | 기판 촬상 장치 | |
JP6608507B2 (ja) | 基板処理方法、基板処理装置及びコンピュータ読み取り可能な記録媒体 | |
JP6788089B2 (ja) | 基板処理方法、基板処理装置及びコンピュータ読み取り可能な記録媒体 | |
JP7038178B2 (ja) | 基板処理方法、基板処理装置及びコンピュータ読み取り可能な記録媒体 | |
TW202420460A (zh) | 基板拍攝裝置及基板拍攝方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20181127 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190802 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190806 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190924 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20191015 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20191111 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6617050 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |