JP6586479B2 - 発光ダイオードパッケージの作製方法 - Google Patents
発光ダイオードパッケージの作製方法 Download PDFInfo
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- JP6586479B2 JP6586479B2 JP2018051058A JP2018051058A JP6586479B2 JP 6586479 B2 JP6586479 B2 JP 6586479B2 JP 2018051058 A JP2018051058 A JP 2018051058A JP 2018051058 A JP2018051058 A JP 2018051058A JP 6586479 B2 JP6586479 B2 JP 6586479B2
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- phosphor
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- glass frit
- glass
- containing layer
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- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000011521 glass Substances 0.000 claims description 355
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 250
- 239000000203 mixture Substances 0.000 claims description 116
- 239000002131 composite material Substances 0.000 claims description 78
- 239000000463 material Substances 0.000 claims description 73
- 238000000034 method Methods 0.000 claims description 69
- 239000002245 particle Substances 0.000 claims description 53
- 238000005245 sintering Methods 0.000 claims description 42
- 229910044991 metal oxide Inorganic materials 0.000 claims description 41
- 150000004706 metal oxides Chemical class 0.000 claims description 41
- 239000011159 matrix material Substances 0.000 claims description 33
- 239000011858 nanopowder Substances 0.000 claims description 28
- 239000013078 crystal Substances 0.000 claims description 22
- 238000010304 firing Methods 0.000 claims description 20
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 16
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 15
- 229910021193 La 2 O 3 Inorganic materials 0.000 claims description 12
- 229910018068 Li 2 O Inorganic materials 0.000 claims description 11
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 11
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 claims description 10
- 229910052731 fluorine Inorganic materials 0.000 claims description 10
- 229910006404 SnO 2 Inorganic materials 0.000 claims description 9
- 239000002223 garnet Substances 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000011230 binding agent Substances 0.000 claims description 6
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 claims description 4
- 239000002270 dispersing agent Substances 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 claims description 4
- 230000001376 precipitating effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 137
- 239000000843 powder Substances 0.000 description 46
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 40
- 239000000654 additive Substances 0.000 description 39
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 34
- 239000002585 base Substances 0.000 description 27
- 239000008188 pellet Substances 0.000 description 25
- 239000008393 encapsulating agent Substances 0.000 description 21
- 230000003287 optical effect Effects 0.000 description 20
- 239000011787 zinc oxide Substances 0.000 description 20
- 230000000996 additive effect Effects 0.000 description 19
- 238000010438 heat treatment Methods 0.000 description 14
- 229920001296 polysiloxane Polymers 0.000 description 13
- 229920000642 polymer Polymers 0.000 description 11
- 238000004458 analytical method Methods 0.000 description 10
- 239000011575 calcium Substances 0.000 description 10
- 210000003298 dental enamel Anatomy 0.000 description 10
- 238000000227 grinding Methods 0.000 description 9
- 230000001965 increasing effect Effects 0.000 description 9
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 9
- 229910003564 SiAlON Inorganic materials 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 8
- 229910021485 fumed silica Inorganic materials 0.000 description 8
- 229910052797 bismuth Inorganic materials 0.000 description 7
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 7
- 229920006254 polymer film Polymers 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 7
- 238000000149 argon plasma sintering Methods 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 6
- 230000006870 function Effects 0.000 description 6
- 150000004820 halides Chemical class 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- 239000003570 air Substances 0.000 description 5
- 150000001450 anions Chemical class 0.000 description 5
- 229910052791 calcium Inorganic materials 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 230000006872 improvement Effects 0.000 description 5
- 239000002105 nanoparticle Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000004014 plasticizer Substances 0.000 description 5
- 229910016066 BaSi Inorganic materials 0.000 description 4
- 229910004283 SiO 4 Inorganic materials 0.000 description 4
- 229910004122 SrSi Inorganic materials 0.000 description 4
- 229910007472 ZnO—B2O3—SiO2 Inorganic materials 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229920000620 organic polymer Polymers 0.000 description 4
- 239000002244 precipitate Substances 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 229910052712 strontium Inorganic materials 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 3
- 239000005407 aluminoborosilicate glass Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000002320 enamel (paints) Substances 0.000 description 3
- 239000002241 glass-ceramic Substances 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229920005573 silicon-containing polymer Polymers 0.000 description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- NXQMCAOPTPLPRL-UHFFFAOYSA-N 2-(2-benzoyloxyethoxy)ethyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCCOCCOC(=O)C1=CC=CC=C1 NXQMCAOPTPLPRL-UHFFFAOYSA-N 0.000 description 2
- 229910000789 Aluminium-silicon alloy Inorganic materials 0.000 description 2
- 229910004706 CaSi2 Inorganic materials 0.000 description 2
- PPTKVNIUGOISNU-UHFFFAOYSA-N [Si]([O-])([O-])([O-])[O-].[Zn+2].[B+3].[Bi+3].[Si]([O-])([O-])([O-])[O-] Chemical compound [Si]([O-])([O-])([O-])[O-].[Zn+2].[B+3].[Bi+3].[Si]([O-])([O-])([O-])[O-] PPTKVNIUGOISNU-UHFFFAOYSA-N 0.000 description 2
- GGDJLFJAAWRCGR-UHFFFAOYSA-N [Si]([O-])([O-])([O-])[O-].[Zn+2].[Bi+3] Chemical compound [Si]([O-])([O-])([O-])[O-].[Zn+2].[Bi+3] GGDJLFJAAWRCGR-UHFFFAOYSA-N 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 2
- 125000000129 anionic group Chemical group 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000006059 cover glass Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- GNTDGMZSJNCJKK-UHFFFAOYSA-N divanadium pentaoxide Chemical compound O=[V](=O)O[V](=O)=O GNTDGMZSJNCJKK-UHFFFAOYSA-N 0.000 description 2
- 238000007580 dry-mixing Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004952 furnace firing Methods 0.000 description 2
- 239000005355 lead glass Substances 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000005368 silicate glass Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- AHSGHEXYEABOKT-UHFFFAOYSA-N 2-[2-(2-benzoyloxyethoxy)ethoxy]ethyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCCOCCOCCOC(=O)C1=CC=CC=C1 AHSGHEXYEABOKT-UHFFFAOYSA-N 0.000 description 1
- 238000010146 3D printing Methods 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- 229910002015 Aerosil® 150 Inorganic materials 0.000 description 1
- 229910002019 Aerosil® 380 Inorganic materials 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 229910052765 Lutetium Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 101100396546 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) tif-6 gene Proteins 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229910006776 Si—Zn Inorganic materials 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- KAMGYJQEWVDJBD-UHFFFAOYSA-N bismuth zinc borate Chemical compound B([O-])([O-])[O-].[Zn+2].[Bi+3] KAMGYJQEWVDJBD-UHFFFAOYSA-N 0.000 description 1
- 239000005385 borate glass Substances 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007590 electrostatic spraying Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000006112 glass ceramic composition Substances 0.000 description 1
- 239000000156 glass melt Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000005400 gorilla glass Substances 0.000 description 1
- 238000001513 hot isostatic pressing Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000386 microscopy Methods 0.000 description 1
- 238000009768 microwave sintering Methods 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000110 selective laser sintering Methods 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000004984 smart glass Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- PZTAGFCBNDBBFZ-UHFFFAOYSA-N tert-butyl 2-(hydroxymethyl)piperidine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CCCCC1CO PZTAGFCBNDBBFZ-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000002211 ultraviolet spectrum Methods 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- ZFZQOKHLXAVJIF-UHFFFAOYSA-N zinc;boric acid;dihydroxy(dioxido)silane Chemical compound [Zn+2].OB(O)O.O[Si](O)([O-])[O-] ZFZQOKHLXAVJIF-UHFFFAOYSA-N 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
- C03C10/0054—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing PbO, SnO2, B2O3
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
- C03C14/006—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of microcrystallites, e.g. of optically or electrically active material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
- C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/095—Glass compositions containing silica with 40% to 90% silica, by weight containing rare earths
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C4/00—Compositions for glass with special properties
- C03C4/12—Compositions for glass with special properties for luminescent glass; for fluorescent glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
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Description
8モル%までのLi2O、20モル%までのBaO、1モル%までのSb2O3、及び
19モル%までのAl2O3を含む。
ガラス組成物
約21モル%までのK2O、約25モル%までのNa2O、及び/または約20モル%までの他のアルカリ酸化物;
アルカリ酸化物の含有量を増加させずにガラスを安定化させるための、約25モル%までのBaO、SrO、MgO、CaOなどのアルカリ土類酸化物、特に、ガラスフリットの焼結に要する温度を上昇させずにガラス組成物の屈折率を増加させるためのBaO;
ガラス組成物を着色せずに透明にするための、約5モル%までのSb2O3+CeO2+SnO2;
結晶化ガラス組成物を作製するための、約40モル%までのAl2O3+Y2O3;
ガラス組成物の屈折率を増加させ、透明ガラスを作製し、さらに特別な場合にはLa−AG蛍光体を結晶化するための、約25モル%までのLa2O3;
種々の赤い色温度にシフトさせるガーネットを析出する結晶化ガラスを作製するための、25モル%までのLa2O3+Lu2O3+Gd2O3+Tb2O3+Eu2O3+Pr2O3、特に、ガラス母材自体に黄色を残すためのPr2O3;
ガラス組成物の屈折率を増加させるための、約60モル%までのBi2O3、TeO2、Ta2O5、Nb2O5、P2O5、特にTeO2及びBi2O3;並びに
ガラス組成物の屈折率を増加させると共にガラス組成物の耐久性を高めるための、25モル%までのTiO2+ZrO2を挙げることができる。
ガラスの種類
ガラスフリット
添加剤
蛍光体含有層
方法
実施例
ガラスフリット複合物を焼結して、ガラス母材に蛍光体を分散させてなる蛍光体含有層を形成すること、及び
発光ダイオードからの光が前記蛍光体含有層を透過するように前記蛍光体含有層を配置することを含み、
前記ガラスフリット複合物は、
約20〜60モル%のSiO2、
約14〜50モル%のZnO、及び
約3〜28モル%のB2O3
を含む混合物を焼成することによって形成されるガラスフリットを含む、方法。
約1〜21モル%のK2O、
約1〜25モル%のNa2O、
25モル%までのBaO+MgO+CaO+SrO、
60モル%までのBi2O3+TeO2+Ta2O5+Nb2O5+P2O5、
40モル%までのLa2O3+Lu2O3+Pr2O3+Gd2O3+Tb2O3+Eu2O3、
25モル%までのTiO2+ZrO2、
5モル%までのSb2O3+CeO2+SnO2、
20モル%までのLi2O+Cs2O+Rb2O、
40モル%までのY2O3+Al2O3、及び
アニオン変性剤としての25モル%までのF+S+Se
をさらに含む、項目1に記載の方法。
約33〜50モル%のSiO2、
約15〜20モル%のZnO、
約16〜21モル%のB2O3、
約2〜5モル%のK2O、
約3〜7モル%のNa2O、
約8モル%までのLi2O、
約20モル%までのBaO、
約1.0モル%までのSb2O3、及び
約19モル%までのAl2O3
を含む、項目2に記載の方法。
約20〜60モル%のSiO2、
約14〜50モル%のZnO、
約3〜28モル%のB2O3、
約1〜21モル%のK2O、
約1〜25モル%のNa2O、
25モル%までのBaO+MgO+CaO+SrO、
60モル%までのBi2O3+TeO2+Ta2O5+Nb2O5+P2O5、
25モル%までのLa2O3+Lu2O3+Pr2O3+Gd2O3+Tb2O3+Eu2O3、
25モル%までのTiO2+ZrO2、
5モル%までのSb2O3+CeO2+SnO2、
20モル%までのLi2O+Cs2O+Rb2O、
40モル%までのY2O3+Al2O3、及び
アニオンとしての25モル%までのF+S+Se
を含む、発光ダイオードパッケージ。
約20〜60モル%のSiO2、
約14〜50モル%のZnO、
約3〜28モル%のB2O3、
約1〜21モル%のK2O、
約1〜25モル%のNa2O、
25モル%までのBaO+MgO+CaO+SrO、
60モル%までのBi2O3+TeO2+Ta2O5+Nb2O5+P2O5、
25モル%までのLa2O3+Lu2O3+Pr2O3+Gd2O3+Tb2O3+Eu2O3、
25モル%までのTiO2+ZrO2、
5モル%までのSb2O3+CeO2+SnO2、
20モル%までのLi2O+Cs2O+Rb2O、
40モル%までのY2O3+Al2O3、及び
アニオンとしての25モル%までのF+S+Se
を含む、発光ダイオードパッケージ。
約20〜60モル%のSiO2、
約14〜50モル%のZnO、
約3〜28モル%のB2O3、
約1〜21モル%のK2O、
約1〜25モル%のNa2O、
25モル%までのBaO+MgO+CaO+SrO、
60モル%までのBi2O3+TeO2+Ta2O5+Nb2O5+P2O5、
25モル%までのLa2O3+Lu2O3+Pr2O3+Gd2O3+Tb2O3+Eu2O3、
25モル%までのTiO2+ZrO2、
5モル%までのSb2O3+CeO2+SnO2、
20モル%までのLi2O+Cs2O+Rb2O、
40モル%までのY2O3+Al2O3、及び
アニオンとしての25モル%までのF+S+Se
を含む、蛍光体含有層。
i)前記光学装置からの光が前記蛍光体含有層を透過すること、
ii)前記光学装置からの光が前記蛍光体含有層によって反射されること、
のうちの少なくとも1つを満たす光学装置。
Claims (15)
- 発光ダイオードパッケージの作製方法であって、
ガラスフリット複合物を焼結して、ガラス母材に分散された蛍光体を含む蛍光体含有層を形成する工程、及び
発光ダイオードからの光が前記蛍光体含有層を透過するように前記蛍光体含有層を配置する工程を含み、
前記ガラスフリット複合物は、
20〜60モル%のSiO2、
14〜50モル%のZnO、及び
3〜28モル%のB2O3
を含む混合物を焼成することによって形成されるガラスフリットを含み、
前記ガラスフリット複合物は0.1〜3.0重量%の分散金属酸化物ナノ粉末をさらに含み、
前記分散金属酸化物ナノ粉末は0.007μm〜0.1μmの平均粒子サイズを有する、方法。 - 発光ダイオードパッケージの作製方法であって、
ガラスフリット複合物を焼結して、ガラス母材に分散された蛍光体を含む蛍光体含有層を形成する工程、及び
発光ダイオードからの光が前記蛍光体含有層を透過するように前記蛍光体含有層を配置する工程を含み、
前記ガラスフリット複合物は、
20〜60モル%のSiO 2 、
14〜50モル%のZnO、及び
3〜28モル%のB 2 O 3
を含む混合物を焼成することによって形成されるガラスフリットを含み、
前記ガラスフリット複合物は0.1〜3.0重量%の分散金属酸化物ナノ粉末をさらに含み、
前記分散金属酸化物ナノ粉末は100〜380m 2 /gのB.E.T表面積を有する、方法。 - 前記混合物は、
1〜21モル%のK2O、
1〜25モル%のNa2O、
25モル%までのBaO+MgO+CaO+SrO、
60モル%までのBi2O3+TeO2+Ta2O5+Nb2O5+P2O5+V2O5、
25モル%までのLa2O3+Lu2O3+Pr2O3+Gd2O3+Tb2O3+Eu2O3、
25モル%までのTiO2+ZrO2、
5モル%までのSb2O3+CeO2+SnO2、
20モル%までのLi2O+Cs2O+Rb2O、
40モル%までのY2O3+Al2O3、及び
25モル%までのF+S+Se
をさらに含む、請求項1又は2に記載の方法。 - 前記混合物は、
33〜50モル%のSiO2、
15〜20モル%のZnO、
16〜21モル%のB2O3、
2〜5モル%のK2O、
3〜7モル%のNa2O、
8モル%までのLi2O、
20モル%までのBaO、
1モル%までのSb2O3、及び
19モル%までのAl2O3
を含む、請求項1又は2に記載の方法。 - 前記ガラスフリット複合物は1種以上の蛍光体を含む、請求項1又は2に記載の方法。
- 前記ガラスフリット複合物を予備焼結する工程をさらに含む、請求項1又は2に記載の方法。
- 前記ガラスフリット複合物は、焼結中に蛍光体結晶を析出させるために意図的に添加された種材料を含む、請求項1又は2に記載の方法。
- 前記種材料は0.1〜10μmの平均粒子サイズを有する、請求項7に記載の方法。
- 2種類以上の蛍光体結晶を析出させ、1種類はアルミニウムガーネット構造をなす、請求項7に記載の方法。
- 前記金属酸化物ナノ粉末は0.01〜5.0μmの平均サイズを有する、請求項1又は2に記載の方法。
- 前記ガラスフリットは0.1〜50μmの粒子サイズを有する、請求項1又は2に記載の方法。
- 1050℃未満で焼結を実施する、請求項1又は2に記載の方法。
- 前記ガラスフリット複合物は、溶媒、分散剤及び結合剤を含む成形滑り材で構成され、
前記成形滑り材を可撓性基材に塗布し、その上で焼結して、テープ形状の前記蛍光体含有層を形成する、請求項1又は2に記載の方法。 - 前記蛍光体はイットリウム・アルミニウム・ガーネットを含む、請求項1又は2に記載の方法。
- 前記分散金属酸化物ナノ粉末は100〜380m2/gのB.E.T表面積を有する、請求項1に記載の方法。
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-
2016
- 2016-01-27 US US15/007,364 patent/US9871176B2/en active Active
- 2016-01-28 EP EP16153072.0A patent/EP3050857A1/en not_active Withdrawn
- 2016-02-02 CN CN201610074090.8A patent/CN106410016B/zh not_active Expired - Fee Related
- 2016-02-02 JP JP2016017645A patent/JP2016196394A/ja active Pending
- 2016-02-02 TW TW105103217A patent/TWI592376B/zh not_active IP Right Cessation
-
2018
- 2018-03-19 JP JP2018051058A patent/JP6586479B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW201630829A (zh) | 2016-09-01 |
EP3050857A1 (en) | 2016-08-03 |
US20160225966A1 (en) | 2016-08-04 |
TWI592376B (zh) | 2017-07-21 |
US9871176B2 (en) | 2018-01-16 |
CN106410016B (zh) | 2021-08-20 |
JP2018145088A (ja) | 2018-09-20 |
JP2016196394A (ja) | 2016-11-24 |
CN106410016A (zh) | 2017-02-15 |
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