JP6550516B1 - パネル、pcbおよびpcbの製造方法 - Google Patents
パネル、pcbおよびpcbの製造方法 Download PDFInfo
- Publication number
- JP6550516B1 JP6550516B1 JP2018173324A JP2018173324A JP6550516B1 JP 6550516 B1 JP6550516 B1 JP 6550516B1 JP 2018173324 A JP2018173324 A JP 2018173324A JP 2018173324 A JP2018173324 A JP 2018173324A JP 6550516 B1 JP6550516 B1 JP 6550516B1
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- pcb
- stay
- panel
- length
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 150000003071 polychlorinated biphenyls Chemical class 0.000 claims abstract description 16
- 238000010438 heat treatment Methods 0.000 claims description 15
- 238000005520 cutting process Methods 0.000 claims description 12
- 238000005476 soldering Methods 0.000 claims description 2
- ZGHQUYZPMWMLBM-UHFFFAOYSA-N 1,2-dichloro-4-phenylbenzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1 ZGHQUYZPMWMLBM-UHFFFAOYSA-N 0.000 abstract description 41
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 239000010410 layer Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000000275 quality assurance Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
12 PCB
12x X方向側面
12y Y方向側面
14 部品
16 キャビティ
18 ステー
18a,18d キャビティステー
20 枠体
22 延長線
24 切取線
26 孔
28,28a ステー跡
Claims (5)
- 1以上のPCBが複数のステーによって枠体または隣接する他のPCBに接続されたパネルであって、
前記PCBは表面にキャビティが形成されており、
前記ステーのうち、前記キャビティからみて前記PCBの側面までの距離が短い第1方向に設けられるものをキャビティステーとし、
前記キャビティステーは、前記キャビティにおける前記第1方向に直交する第2方向の両端を前記第1方向に延長した延長線を含み、前記第2方向の長さが前記キャビティよりも長いことを特徴とするパネル。 - 請求項1に記載のパネルにおいて、
前記キャビティステーは、前記第2方向の長さが前記キャビティの4倍以下であることを特徴とするパネル。 - 請求項1または2に記載のパネルにおいて、
前記キャビティステーは、前記キャビティからみて前記第1方向の両側にそれぞれ1つずつ設けられることを特徴とするパネル。 - 請求項1〜3のいずれか1項に記載のパネルと、少なくとも前記キャビティに設けられた電子部品とを加熱することでリフローはんだ付けする加熱工程と、
前記ステーを切断する切断工程と、
を有することを特徴とするPCBの製造方法。 - 表面にキャビティが形成されたPCBであって、
前記キャビティからの距離が短い第1方向の側面にはパネルから切り離されたステー跡を有し、
前記ステー跡は、前記キャビティにおける前記第1方向に直交する第2方向の両端を前記第1方向に延長した延長線を含み、前記第2方向について前記キャビティよりも長いことを特徴とするPCB。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018173324A JP6550516B1 (ja) | 2018-09-18 | 2018-09-18 | パネル、pcbおよびpcbの製造方法 |
CN201910444800.5A CN110913575B (zh) | 2018-09-18 | 2019-05-27 | 面板、pcb以及pcb的制造方法 |
US16/574,985 US11058008B2 (en) | 2018-09-18 | 2019-09-18 | PCB panel, PCB, and manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018173324A JP6550516B1 (ja) | 2018-09-18 | 2018-09-18 | パネル、pcbおよびpcbの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6550516B1 true JP6550516B1 (ja) | 2019-07-24 |
JP2020047692A JP2020047692A (ja) | 2020-03-26 |
Family
ID=67390342
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018173324A Active JP6550516B1 (ja) | 2018-09-18 | 2018-09-18 | パネル、pcbおよびpcbの製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11058008B2 (ja) |
JP (1) | JP6550516B1 (ja) |
CN (1) | CN110913575B (ja) |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
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US4689103A (en) * | 1985-11-18 | 1987-08-25 | E. I. Du Pont De Nemours And Company | Method of manufacturing injection molded printed circuit boards in a common planar array |
JPH0528072U (ja) * | 1991-09-17 | 1993-04-09 | 株式会社富士通ゼネラル | プリント基板反り防止構造 |
JPH09162506A (ja) * | 1995-12-05 | 1997-06-20 | Rohm Co Ltd | 電子部品の絶縁基板及びその製造方法 |
WO1999041781A1 (en) * | 1998-02-10 | 1999-08-19 | Nissha Printing Co., Ltd. | Base sheet for semiconductor module, method for manufacturing base sheet for semiconductor module, and semiconductor module |
JP2003198073A (ja) * | 2001-12-26 | 2003-07-11 | Toshiba Corp | 回路基板及び携帯情報機器 |
JP3777131B2 (ja) * | 2002-03-01 | 2006-05-24 | 株式会社住友金属マイクロデバイス | 電子部品実装方法 |
US7266869B2 (en) * | 2003-07-30 | 2007-09-11 | Kyocera Corporation | Method for manufacturing a piezoelectric oscillator |
JP2005347711A (ja) * | 2004-06-07 | 2005-12-15 | Sony Corp | プリント配線板 |
CN100420003C (zh) * | 2005-03-29 | 2008-09-17 | 鸿富锦精密工业(深圳)有限公司 | 一种陶瓷基板及其分断方法 |
JP4343962B2 (ja) * | 2007-01-19 | 2009-10-14 | Okiセミコンダクタ株式会社 | 半導体装置の製造方法及び半導体装置 |
US20090200648A1 (en) * | 2008-02-08 | 2009-08-13 | Apple Inc. | Embedded die system and method |
JP5383545B2 (ja) * | 2009-05-27 | 2014-01-08 | 京セラ株式会社 | 多数個取り配線基板および配線基板 |
JP2010283074A (ja) | 2009-06-03 | 2010-12-16 | Mitsubishi Electric Corp | 基板の製造方法、基板およびセラミック基板 |
JP5355246B2 (ja) * | 2009-06-25 | 2013-11-27 | 京セラ株式会社 | 多数個取り配線基板および配線基板ならびに電子装置 |
JP5455028B2 (ja) * | 2009-10-30 | 2014-03-26 | パナソニック株式会社 | 回路基板構造体 |
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JP6008204B2 (ja) * | 2011-07-29 | 2016-10-19 | パナソニックIpマネジメント株式会社 | 素子搭載用基板、ならびに半導体モジュールおよびその製造方法 |
US9215802B2 (en) * | 2011-12-27 | 2015-12-15 | Ngk Spark Plug Co., Ltd. | Wiring substrate and multi-piece wiring substrate |
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JP5285819B1 (ja) * | 2012-11-07 | 2013-09-11 | 太陽誘電株式会社 | 電子回路モジュール |
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JP2015222741A (ja) * | 2014-05-22 | 2015-12-10 | 京セラサーキットソリューションズ株式会社 | 多数個取り配線基板およびその製造方法 |
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-
2018
- 2018-09-18 JP JP2018173324A patent/JP6550516B1/ja active Active
-
2019
- 2019-05-27 CN CN201910444800.5A patent/CN110913575B/zh active Active
- 2019-09-18 US US16/574,985 patent/US11058008B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20200113062A1 (en) | 2020-04-09 |
CN110913575A (zh) | 2020-03-24 |
CN110913575B (zh) | 2023-07-18 |
US11058008B2 (en) | 2021-07-06 |
JP2020047692A (ja) | 2020-03-26 |
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