CN100420003C - 一种陶瓷基板及其分断方法 - Google Patents

一种陶瓷基板及其分断方法 Download PDF

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CN100420003C
CN100420003C CNB2005100339115A CN200510033911A CN100420003C CN 100420003 C CN100420003 C CN 100420003C CN B2005100339115 A CNB2005100339115 A CN B2005100339115A CN 200510033911 A CN200510033911 A CN 200510033911A CN 100420003 C CN100420003 C CN 100420003C
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ceramic substrate
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dividing
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孔小花
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- Core Of Electronic Science And Technology (zhongshan) Co Ltd
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Hon Hai Precision Industry Co Ltd
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Abstract

一种陶瓷基板，其内嵌有多个电路单元，陶瓷基板上表面边缘分布有多个辨识点，其每相对的两个辨识点分别与电路单元之间隙处对应，下表面具有多个裂片线分布于多个电路单元之间的间隙位置，陶瓷基板上表面分布有多个辨识点的区域为第一区域，分布有多个电路单元的区域为第二区域。该陶瓷基板分断方法包括以下步骤：在陶瓷基板上表面第一区域贴胶带；在陶瓷基板上表面灌封胶；去除胶带；根据陶瓷基板上表面辨识点的位置切割封胶；沿陶瓷基板下表面的裂片线分断陶瓷基板。该分断方法可以提高切割速度，减少切割刀具的磨损，提升产品良率，降低成本。

Description

一种陶瓷基板及其分断方法
【技术领域】
本发明涉及一种半导体封装及制造工艺，尤其涉及一种封胶压模封装的陶瓷基板及其分断方法。
【背景技术】
众所周知，集成电路的应用日益广泛，举凡计算机网络、通讯设备、家用电气等均与集成电路息息相关。随着电子制造技术的不断发展演进，对集成电路的产品品质需求日益提升。在IC芯片轻、薄、短、小及多功能的要求下，使得电子产业之封装技术不断的推陈出新，为得到高良率和维持应有的生产效益，其中分断制造工艺的良率实为产品品质成功的关键因素之一。
传统的陶瓷基板，尤其是封胶压模制造工艺的陶瓷基板采用切割方法分离产品。参阅图12，为一普通陶瓷基板130的正面视图，在陶瓷基板130中内嵌有多个电路单元132，在其上下表面边缘部分对应于各个电路单元132的间隙位置分布有多个辨识点134。陶瓷基板130上表面与下表面的布局相同。图13为图12所示陶瓷基板130E-E向局部剖视图。参阅图14，对于封胶压模封装的陶瓷基板130，首先，在陶瓷基板130的上表面灌封胶136，用于包覆陶瓷基板130上多个电路单元132。由于陶瓷基板130上表面的辨识点134被封胶136覆盖，因此只能根据陶瓷基板下表面的辨识点134将陶瓷基板130上的电路单元132分断为独立的产品。参阅图15，为切割刀具138切割如图14所示的陶瓷基板130的剖视图。切割刀具138首先根据陶瓷基板130背面的辨识点134切割陶瓷基板130，然后切割封胶136。
又如，2002年7月16日公告的美国第6,420,244号专利揭示了一种制造晶圆级芯片尺寸封装(Wafer Lever of Chip Scale Package)的方法，其方法切割制造工艺中也是采用切割刀具将一具有多个芯片的基板切割成多个独立的芯片。
由于陶瓷基板具有硬而脆的特性，上述现有的陶瓷基板分断方法，均存在切割时容易引起陶瓷基板崩裂、切割速度慢、产能低、且切割刀具磨损快等缺陷，影响产品良率，增加生产成本。
针对上述不足，需要一种可减少切割刀具的磨损、提高切割速度、避免切割时引起陶瓷基板崩裂、降低成本的陶瓷基板分断方法。
【发明内容】
本发明所要解决的技术问题在于提供一种陶瓷基板，可便于切割刀具切割封胶，从而使陶瓷基板易于分断。
本发明所要解决的另一技术问题在于提供一种陶瓷基板分断方法，可实现在陶瓷基板分断的制造工艺中切割刀具不需直接切割陶瓷基板。
本发明提供的陶瓷基板具有上表面及下表面，上表面包括有靠近边缘部分的第一区域和中央部分的第二区域，其第一区域内分布有多个辨识点，下表面形成有多个裂片线，所述裂片线分别与第一区域内的两个相对辨识点的位置上下对应，封胶覆盖于陶瓷基板上表面的第二区域。
本发明提供的分断上述陶瓷基板的方法包括如下步骤：(a)在陶瓷基板上表面第二区域灌封胶；(b)根据陶瓷基板上表面辨识点的位置切割封胶；(c)沿陶瓷基板下表面上的裂片线分断陶瓷基板。
采用本发明所述的陶瓷基板，由于同时采用了辨识点和裂片线，一方面有利于切割刀具准确切割封胶。另一方面也使得在分断陶瓷基板时，切割刀具仅需切割封胶，大大提高了切割速度，减少切割刀具的磨损，防止了因切割陶瓷基板而引起的陶瓷基板崩裂，降低成本。
【附图说明】
图1表示本发明陶瓷基板正面视图。
图2表示图1的A-A向剖视图。
图3表示依本发明陶瓷基板分断方法，在陶瓷基板上表面四边贴胶带的正面视图。
图4表示图3的B-B向剖视图。
图5表示依本发明陶瓷基板分断方法，在陶瓷基板上表面四边胶带内部灌封胶后的正面视图。
图6表示图5的C-C向剖视图。
图7表示依本发明陶瓷基板分断方法，去除陶瓷基板上表面四边胶带后的正面视图。
图8表示图7的D-D向剖视图。
图9表示依本发明陶瓷基板分断方法，用切割刀具切割封胶后的剖视图。
图10表示依本发明陶瓷基板分断方法，在陶瓷基板上表面灌封胶的正面视图。
图11表示依本发明陶瓷基板分断方法，用切割刀具在陶瓷基板上表面灌封胶的四边切割封胶后的剖视图。
图12表示现有的陶瓷基板正面视图。
图13表示图12的E-E向剖视图。
图14表示依现有的陶瓷基板分断方法，在陶瓷基板上灌封胶后的剖视图。
图15表示依现有的陶瓷基板分断方法，用切割刀具切割陶瓷基板及封胶的剖视图。
【具体实施方式】
参阅图1，为本发明陶瓷基板100的正面视图。在陶瓷基板100中内嵌有多个电路单元102，所述电路单元102形成有多个间隙位置，在陶瓷基板100上表面的边缘部分分布有多个辨识点104，每相对的两个辨识点对应于其中一个间隙位置。在本实施方式中，定义陶瓷基板100上表面分布有多个辨识点104的区域为第一区域，定义分布有多个电路单元102的区域为第二区域。该多个辨识点104用于帮助辨识及确定多个电路单元102的准确位置。参阅图2，为本发明陶瓷基板100的A-A向的局部剖视图。该陶瓷基板100的下表面同样也包括有多个电路单元102。不同的是，在陶瓷基板100下表面各电路单元102的间隙处还分布有多条纵向和横向的裂片线106，并且所述裂片线106分别与每相对的两个辨识点104的位置上下对应。
参阅图3，在分断陶瓷基板100时，首先，在陶瓷基板100上表面第一区域上贴胶带108。胶带108以不覆盖任一电路单元102为宜。图4所示为图3的B-B向的局部剖视图。参阅图5，在陶瓷基板100上第二区域灌封胶110，其作用在于包覆多个电路单元102。在本发明的其他实施方式中，也可直接于陶瓷基板100上表面灌封胶，以提高工效。图6为图5的C-C向的局部剖视图。参阅图7，去除胶带108。图8为图7的D-D向的局部剖视图。参阅图9，根据陶瓷基板100上辨识点104的位置切割陶瓷基板100上的封胶110，形成切割道112，切割的深度可大于或等于封胶110的厚度。最后，沿陶瓷基板100下表面的裂片线106裂片，从而分断陶瓷基板100。对于裂片线106的深度，可根据陶瓷基板100的材料及厚度设计，一般为大于或等于1/5的陶瓷基板100厚度。
上述描述为本发明的第一较佳实施方式。图10及图11为本发明的第二较佳实施方式示意图。参阅图10，陶瓷基板120的与陶瓷基板100的布局相同，首先，在陶瓷基板120的上表面灌封胶124，封胶124覆盖整个陶瓷基板120的上表面。参阅图11，沿靠近陶瓷基板120上表面边缘的位置即上表面第一区域与第二区域的交界处切割封胶124，形成切割道126，切割的深度为大于或等于封胶124的厚度。然后，去除陶瓷基板120边缘的封胶124，露出陶瓷基板120上表面的辨识点，得到如图7所示相同的效果。其后的步骤与第一较佳实施方式相同，裂片线122深度也与第一较佳实施方式相同。

Claims (15)

1. 一种陶瓷基板，其具有上表面及下表面，上表面包括有靠近边缘部分的第一区域和中央部分的第二区域，其第一区域内分布有多个辨识点，下表面形成有多个裂片线，所述裂片线分别与第一区域内的两个相对辨识点的位置上下对应，其特征在于：陶瓷基板上表面的第二区域覆盖有封胶。
2. 如权利要求1所述的陶瓷基板，其特征在于所述第二区域内嵌有多个电路单元。
3. 如权利要求2所述的陶瓷基板，其特征在于所述每相对的两个辨识点分别与各电路单元的间隙对应。
4. 如权利要求2所述的陶瓷基板，其特征在于所述多个裂片线形成于陶瓷基板下表面多个电路单元的间隙处。
5. 如权利要求1所述的陶瓷基板，其特征在于所述多个裂片线的深度大于或等于1/5陶瓷基板的厚度。
6. 一种陶瓷基板分断方法，该陶瓷基板包括有上表面及下表面，上表面包括有靠近边缘部分的第一区域和中央部分的第二区域，其第一区域内分布有多个辨识点，下表面形成有多个裂片线，所述裂片线分别与第一区域内的两个相对辨识点的位置上下对应，其特征在于该分断方法包括以下步骤：
(a)在陶瓷基板上表面第二区域灌封胶；
(b)根据陶瓷基板上表面辨识点的位置切割封胶；
(c)沿陶瓷基板下表面上的裂片线分断陶瓷基板。
7. 如权利要求6所述的陶瓷基板分断方法，其特征在于所述第二区域内嵌有多个电路单元。
8. 如权利要求6所述的陶瓷基板分断方法，其特征在于所述步骤(a)包括：
(a1)在陶瓷基板上表面第一区域上贴胶带；
(a2)在陶瓷基板上表面灌封胶；
(a3)去除胶带。
9. 如权利要求6所述的陶瓷基板分断方法，其特征在于所述步骤(b)中切割封胶的深度大于或等于封胶的厚度。
10. 如权利要求6所述的陶瓷基板分断方法，其特征在于所述裂片线的深度为大于或等于1/5陶瓷基板厚度。
11. 如权利要求6所述的陶瓷基板分断方法，其特征在于所述步骤(a)包括：
(a11)在陶瓷基板上表面灌封胶；
(a22)沿陶瓷基板第一区域和第二区域交界处切割封胶；
(a33)去除陶瓷基板边缘的封胶，以露出辨识点。
12. 如权利要求11所述的陶瓷基板分断方法，其特征在于所述步骤(a22)中切割封胶的深度大于或等于封胶的厚度。
13. 一种陶瓷基板分断方法，该陶瓷基板包括有上表面及下表面，上表面包括有靠近边缘部分的第一区域和中央部分的第二区域，其第一区域内分布有多个辨识点，第二区域内分布有多个电路单元，每相对的两个辨识点分别与各电路单元的间隙位置对应，下表面形成有多个裂片线，所述裂片线分别与第一区域内的两个相对辨识点的位置上下对应，其特征在于该分断方法包括以下步骤：
(a)在陶瓷基板上表面第一区域上贴胶带；
(b)在陶瓷基板上表面灌封胶；
(c)去除胶带；
(d)根据陶瓷基板上表面上辨识点的位置切割封胶；
(e)沿陶瓷基板下表面上的裂片线分断陶瓷基板。
14. 如权利要求13所述的陶瓷基板分断方法，其特征在于所述步骤(d)中切割封胶的深度大于或等于封胶的厚度。
15. 如权利要求13所述的陶瓷基板分断方法，其特征在于所述裂片线的深度为大于或等于1/5陶瓷基板的厚度。
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