JP6522667B2 - 基板両面処理システム及び方法 - Google Patents
基板両面処理システム及び方法 Download PDFInfo
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Description
図11は、図8の実施形態に対応する単一ウエハサセプタ1105の実施形態を示す。ウエハは、その周縁で凹部1132に載置されている。破線で示すマグネット1134は、ウエハの全周でキャリア内に設けられる。位置合わせピン1160は外マスクをサセプタ1105に位置合わせするために用いられる。外マスクの実施形態は、下側からの視点で図12に示される。外マスク1245は、プレス加工されたシート金属で製造される。外マスク1245は、キャリア1205の位置合わせピン1260に対応する位置合わせ孔又は凹部1262を有する。外マスク1245は、サセプタを被覆して保護するように配置される。
Claims (17)
- 真空処理チャンバで基板を処理するためのシステムであって、
複数のキャリアと、複数の磁化ローラと、フリッピングステーションとを含み、
前記キャリアのそれぞれは、前記システム全体にわたって基板を支持して移送するように構成され、
前記キャリアのそれぞれは、各基板の両面を露出させながら基板を保持するためのクリップを含み、
前記キャリアのそれぞれは、その両端における2つの常磁性コモンレールを含み、
前記複数の磁化ローラは、前記コモンレールを係合して磁気的に保持することにより、前記キャリアを前記システム全体にわたって移送し、
前記フリッピングステーションは、回転軸に連結される回転可能なフレームを含み、前記複数の磁化ローラのサブセットは、前記フレームの両端に配置される、システム。 - 前記キャリアのそれぞれは、1×n(ここで、nは1より大きい整数である)基板の線形アレイを支持するように構成される、請求項1に記載のシステム。
- 前記キャリアのそれぞれは、異なるサイズの様々な基板を保持するように構成される2つのスライドレールをさらに含む、請求項1に記載のシステム。
- 前記スライドレールは、閉鎖位置においてバネで付勢される、請求項3に記載のシステム。
- 前記キャリアは、前記真空処理チャンバ内において垂直方向に移送される、請求項1に記載のシステム。
- 処理完了後に、前記キャリアをロードステーションに戻すためのコンベアをさらに含む、請求項1に記載のシステム。
- 前記コンベアは、大気環境において前記真空処理チャンバの上方を通過する、請求項6に記載のシステム。
- 前記複数の磁化ローラのそれぞれは回転シャフトを含み、前記回転シャフトは、交互の磁気極性でその回転シャフトに取り付けられた複数の磁気ホイールを有する、請求項1に記載のシステム。
- 前記回転シャフトのそれぞれは、可撓性テンションエレメントによって回転する、請求項8に記載のシステム。
- 前記可撓性テンションエレメントは、ベルト又はチェーンを含む、請求項9に記載のシステム。
- ロード/アンロードステーションと連結するキャリアエレベータをさらに含む、請求項1に記載のシステム。
- 前記キャリアエレベータは、複数の垂直配向コンベアベルトを含み、各コンベアベルトは、前記コモンレールに係合するように延びている複数のピンを有する、請求項11に記載のシステム。
- 前記ロード/アンロードステーションは、転入基板コンベアと、送出基板コンベアと、
基板ロードリフターと、基板アンロードリフターと、前記キャリアがその基板を取り外すように作動されるように構成されるキャリアクチュエータとを含む、請求項11に記載のシステム。 - 前記キャリアにマスクをロードするためのマスクロード器具をさらに含む、請求項13に記載のシステム。
- 前記ロード/アンロードステーションは、上部キャリア移送部と、前記上部キャリア移送部の下方において垂直方向に離間する下部キャリア移送部とを含み、前記転入基板コンベア及び前記送出基板コンベアは、前記上部キャリア移送部と前記下部キャリア移送部との間に垂直に位置するスペースを通過する、請求項13に記載のシステム。
- 前記ロード/アンロードステーションは、前記キャリアにロードされた基板を位置合わせするように構成される伸縮自在な基板位置合わせピンをさらに含む、請求項11に記載のシステム。
- 異なるサイズ及び異なる種類の基板とともに使用され得る汎用キャリアであって、
前記汎用キャリアの両端に1つずつ設けられ、移送器具と係合するための2つの走行レールと、
前記走行レールの端部にそれぞれ接続された2つの細長いサイドバーと、
前記サイドバーに設けられ、基板の表面に接触することなく基板を保持するために基板のエッジと係合するように構成される複数の保持クリップと、
各前記走行レールに設けられ、それぞれスライド操作を利用して対応するサイドバーを開閉するように構成される2つのアクチュエータと、
所望のスライド位置において対応するサイドバーをロックするように、アクチュエータに設けられるロッキング器具とを含む、汎用キャリア。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201461942594P | 2014-02-20 | 2014-02-20 | |
US61/942,594 | 2014-02-20 | ||
US201461943999P | 2014-02-24 | 2014-02-24 | |
US61/943,999 | 2014-02-24 | ||
PCT/US2015/016799 WO2015127191A1 (en) | 2014-02-20 | 2015-02-20 | System and method for bi-facial processing of substrates |
Publications (2)
Publication Number | Publication Date |
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JP2017512386A JP2017512386A (ja) | 2017-05-18 |
JP6522667B2 true JP6522667B2 (ja) | 2019-05-29 |
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Application Number | Title | Priority Date | Filing Date |
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JP2016570916A Expired - Fee Related JP6522667B2 (ja) | 2014-02-20 | 2015-02-20 | 基板両面処理システム及び方法 |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP3108030B1 (ja) |
JP (1) | JP6522667B2 (ja) |
KR (1) | KR102327286B1 (ja) |
CN (1) | CN106460164B (ja) |
MY (1) | MY181905A (ja) |
SG (3) | SG10201807710WA (ja) |
TW (1) | TWI696231B (ja) |
WO (1) | WO2015127191A1 (ja) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102104688B1 (ko) | 2012-04-19 | 2020-05-29 | 인테벡, 인코포레이티드 | 태양 전지 제조를 위한 이중 마스크 장치 |
US10062600B2 (en) | 2012-04-26 | 2018-08-28 | Intevac, Inc. | System and method for bi-facial processing of substrates |
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KR20160137989A (ko) | 2016-12-02 |
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