SG10201807691XA - System and method for bi-facial processing of substrates - Google Patents
System and method for bi-facial processing of substratesInfo
- Publication number
- SG10201807691XA SG10201807691XA SG10201807691XA SG10201807691XA SG10201807691XA SG 10201807691X A SG10201807691X A SG 10201807691XA SG 10201807691X A SG10201807691X A SG 10201807691XA SG 10201807691X A SG10201807691X A SG 10201807691XA SG 10201807691X A SG10201807691X A SG 10201807691XA
- Authority
- SG
- Singapore
- Prior art keywords
- substrates
- carriers
- processing
- chambers
- facial processing
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 8
- 238000000034 method Methods 0.000 title abstract 2
- 239000000969 carrier Substances 0.000 abstract 5
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
SYSTEM AND METHOD FOR BI-FACIAL PROCESSING OF SUBSTRATES A system for processing substrates in plasma chambers, such that all substrates transport and loading/unloading operations are performed in atmospheric environment, but processing is performed in vacuum environment. The substrates are transported throughout the system on carriers. The system’s chambers are arranged linearly, such that carriers move from one chamber directly to the next. A conveyor, placed above or below the system’s chambers, returns the carriers to the system’s entry area after processing is completed. The carriers are configured for supporting substrates of different sizes. The carriers are also configured for flipping the substrates such that both surfaces of the substrates may be processed. Figure 18
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201461942594P | 2014-02-20 | 2014-02-20 | |
US201461943999P | 2014-02-24 | 2014-02-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201807691XA true SG10201807691XA (en) | 2018-10-30 |
Family
ID=53879007
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201807710WA SG10201807710WA (en) | 2014-02-20 | 2015-02-20 | System and method for bi-facial processing of substrates |
SG11201606935VA SG11201606935VA (en) | 2014-02-20 | 2015-02-20 | System and method for bi-facial processing of substrates |
SG10201807691XA SG10201807691XA (en) | 2014-02-20 | 2015-02-20 | System and method for bi-facial processing of substrates |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201807710WA SG10201807710WA (en) | 2014-02-20 | 2015-02-20 | System and method for bi-facial processing of substrates |
SG11201606935VA SG11201606935VA (en) | 2014-02-20 | 2015-02-20 | System and method for bi-facial processing of substrates |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP3108030B1 (en) |
JP (1) | JP6522667B2 (en) |
KR (1) | KR102327286B1 (en) |
CN (1) | CN106460164B (en) |
MY (1) | MY181905A (en) |
SG (3) | SG10201807710WA (en) |
TW (1) | TWI696231B (en) |
WO (1) | WO2015127191A1 (en) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102104688B1 (en) | 2012-04-19 | 2020-05-29 | 인테벡, 인코포레이티드 | Dual-mask arrangement for solar cell fabrication |
US10062600B2 (en) | 2012-04-26 | 2018-08-28 | Intevac, Inc. | System and method for bi-facial processing of substrates |
KR102072872B1 (en) | 2012-04-26 | 2020-02-03 | 인테벡, 인코포레이티드 | System architecture for vacuum processing |
TWI662646B (en) | 2014-08-05 | 2019-06-11 | 美商因特瓦克公司 | Implant masking and alignment |
KR102447219B1 (en) * | 2015-10-01 | 2022-09-23 | 인테벡, 인코포레이티드 | Wafer plate and mask arrangement for substrate fabrication |
CN110168749A (en) * | 2016-11-18 | 2019-08-23 | 应用材料公司 | The replacement and overturning chamber design formed for heterojunction solar battery |
WO2018113671A1 (en) * | 2016-12-19 | 2018-06-28 | P2I Ltd | A jig for surface modification processes |
DE102017106373A1 (en) * | 2017-03-24 | 2018-09-27 | Nexwafe Gmbh | Process chamber guide, process chamber and method for guiding a substrate carrier to a process position |
CN107245755B (en) * | 2017-04-21 | 2019-05-21 | 深圳技术大学 | Light assisted electrochemical etching device suitable for the synchronous experiment of Multi-example |
KR102006435B1 (en) * | 2017-09-01 | 2019-08-01 | 주식회사 한화 | Boat device |
TWI679506B (en) * | 2018-09-14 | 2019-12-11 | 富揚鋼構有限公司 | Planning method for turning over steel construction materials |
CN108315697B (en) * | 2018-01-16 | 2019-12-10 | 电子科技大学 | Preparation method of double-sided biaxial texture MgO film |
KR101962738B1 (en) * | 2018-04-23 | 2019-03-27 | (주)에이디엠 | Sheet Separating Apparatus and Mask Manufacturing System Having The Same |
WO2019205351A1 (en) * | 2018-04-24 | 2019-10-31 | 君泰创新(北京)科技有限公司 | Double-sided coating apparatus and carrier plate processing unit thereof |
CN108766916A (en) * | 2018-04-28 | 2018-11-06 | 东莞帕萨电子装备有限公司 | Ion implanting runs sheet devices and ion implanting runs piece method |
WO2019228611A1 (en) * | 2018-05-29 | 2019-12-05 | Applied Materials, Inc. | Methods of handling masks in a vacuum system, and vacuum system |
KR102549429B1 (en) * | 2018-05-31 | 2023-06-28 | 어플라이드 머티어리얼스, 인코포레이티드 | Multi-Substrate Processing on Digital Lithography Systems |
CN110600412A (en) * | 2018-06-12 | 2019-12-20 | 君泰创新(北京)科技有限公司 | Positioning transmission mechanism and positioning transmission production system |
US11414748B2 (en) * | 2019-09-25 | 2022-08-16 | Intevac, Inc. | System with dual-motion substrate carriers |
TWI693871B (en) * | 2019-01-29 | 2020-05-11 | 友威科技股份有限公司 | Vertical continuous etching machine |
JP2022524886A (en) | 2019-03-27 | 2022-05-10 | ヤスカワ ユーロップ テクノロジー リミテッド | Semiconductor reversing device |
KR20210081794A (en) * | 2019-12-24 | 2021-07-02 | 캐논 톡키 가부시키가이샤 | Rotation driving apparatus, film-forming system including the same, manufacturing method of electronic device and carrier for carrying subjectto be carried used in the film-forming apparatus |
KR102593602B1 (en) * | 2021-01-06 | 2023-10-23 | 한화솔루션 주식회사 | Wafer boat and plate for wafer boat |
CN112631087B (en) * | 2021-01-25 | 2022-04-22 | 苏州源卓光电科技有限公司 | Double-face processing system and processing method |
CN114005775A (en) * | 2021-10-29 | 2022-02-01 | 德鸿半导体设备(浙江)有限公司 | Substrate processing system and method |
CN114750057B (en) * | 2022-06-13 | 2022-09-02 | 富芯微电子有限公司 | Back thinning equipment and process for producing composite fast recovery diode |
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US3775644A (en) * | 1972-09-20 | 1973-11-27 | Communications Satellite Corp | Adjustable microstrip substrate holder |
EP0648698B1 (en) * | 1992-07-07 | 1998-01-07 | Ebara Corporation | Magnetically levitated carrying apparatus |
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US6783534B2 (en) * | 2002-07-29 | 2004-08-31 | Hamid M. Mehdizadeh | Bone wax applicator |
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JP5079114B2 (en) * | 2010-03-30 | 2012-11-21 | 住友化学株式会社 | Substrate transport mechanism and substrate support device in polarizing film laminating apparatus |
JP5582895B2 (en) * | 2010-07-09 | 2014-09-03 | キヤノンアネルバ株式会社 | Substrate holder stocker apparatus, substrate processing apparatus, and substrate holder moving method using the substrate holder stocker apparatus |
TW201327712A (en) * | 2011-11-01 | 2013-07-01 | Intevac Inc | System architecture for plasma processing solar wafers |
JP6205368B2 (en) * | 2011-12-27 | 2017-09-27 | インテヴァック インコーポレイテッド | System configuration for combined static and pass-by processing |
TW201346050A (en) * | 2012-02-06 | 2013-11-16 | Tokyo Electron Ltd | Film-forming apparatus and film-forming method |
KR102104688B1 (en) * | 2012-04-19 | 2020-05-29 | 인테벡, 인코포레이티드 | Dual-mask arrangement for solar cell fabrication |
WO2013163623A1 (en) * | 2012-04-26 | 2013-10-31 | Intevac, Inc. | Narrow source for physical vapor deposition processing |
KR102072872B1 (en) * | 2012-04-26 | 2020-02-03 | 인테벡, 인코포레이티드 | System architecture for vacuum processing |
-
2015
- 2015-02-20 CN CN201580018902.0A patent/CN106460164B/en not_active Expired - Fee Related
- 2015-02-20 SG SG10201807710WA patent/SG10201807710WA/en unknown
- 2015-02-20 SG SG11201606935VA patent/SG11201606935VA/en unknown
- 2015-02-20 JP JP2016570916A patent/JP6522667B2/en not_active Expired - Fee Related
- 2015-02-20 SG SG10201807691XA patent/SG10201807691XA/en unknown
- 2015-02-20 MY MYPI2016703040A patent/MY181905A/en unknown
- 2015-02-20 KR KR1020167024317A patent/KR102327286B1/en active IP Right Grant
- 2015-02-20 WO PCT/US2015/016799 patent/WO2015127191A1/en active Application Filing
- 2015-02-20 EP EP15751417.5A patent/EP3108030B1/en not_active Not-in-force
- 2015-02-24 TW TW104105775A patent/TWI696231B/en active
Also Published As
Publication number | Publication date |
---|---|
TWI696231B (en) | 2020-06-11 |
MY181905A (en) | 2021-01-13 |
EP3108030A1 (en) | 2016-12-28 |
SG11201606935VA (en) | 2016-10-28 |
TW201541546A (en) | 2015-11-01 |
WO2015127191A1 (en) | 2015-08-27 |
JP6522667B2 (en) | 2019-05-29 |
KR102327286B1 (en) | 2021-11-16 |
CN106460164B (en) | 2019-02-22 |
JP2017512386A (en) | 2017-05-18 |
EP3108030B1 (en) | 2018-09-12 |
SG10201807710WA (en) | 2018-10-30 |
EP3108030A4 (en) | 2017-08-23 |
CN106460164A (en) | 2017-02-22 |
KR20160137989A (en) | 2016-12-02 |
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