JP6465386B2 - 配線基板及び電子部品装置と配線基板の製造方法及び電子部品装置の製造方法 - Google Patents
配線基板及び電子部品装置と配線基板の製造方法及び電子部品装置の製造方法 Download PDFInfo
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
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Description
図4〜図16は第1実施形態の配線基板及び電子部品装置を説明するための図である。以下、配線基板及び電子部品装置の製造方法を説明しながら、配線基板及び電子部品装置の構造について説明する。
図17〜図24は第2実施形態の配線基板及び電子部品装置を説明するための図である。
Claims (9)
- 第1配線層と、
前記第1配線層の上に形成された第1絶縁層と、
平面視で前記第1配線層と重なり合う領域の前記第1絶縁層の上に形成され、前記第1配線層と離間する複数の突出部を下面に備えた電子部品搭載パッドと、
前記第1絶縁層の上に形成され、前記電子部品搭載パッドの上に開口部が配置された第2絶縁層とを有し、
前記電子部品搭載パッドの突出部は、前記電子部品搭載パッドの周縁部に枠状に繋がって配置されていることを特徴とする配線基板。 - 前記第1絶縁層に形成され、前記第1配線層に到達するビアホールと、
前記第1絶縁層の上に形成され、前記ビアホール内のビア導体を介して前記第1配線層に接続されると共に、前記電子部品搭載パッドと同一層から形成された第2配線層とを有することを特徴とする請求項1に記載の配線基板。 - 前記電子部品搭載パッドと前記第1配線層とを接続する接続ビアが形成されていることを特徴とする請求項1又は2に記載の配線基板。
- 第1配線層と、
前記第1配線層の上に形成された第1絶縁層と、
平面視で前記第1配線層と重なり合う領域の前記第1絶縁層の上に形成され、前記第1配線層と離間する複数の突出部を下面に備えた電子部品搭載パッドと、
前記第1絶縁層の上に形成され、前記電子部品搭載パッドの上に開口部が配置された第2絶縁層と、
前記電子部品搭載パッドの上に搭載された電子部品とを有し、
前記電子部品搭載パッドの突出部は、前記電子部品搭載パッドの周縁部に枠状に繋がって配置されていることを特徴とする電子部品装置。 - 前記第1絶縁層に形成され、前記第1配線層に到達する第1ビアホールと、
前記第1絶縁層の上に形成され、前記第1ビアホール内のビア導体を介して前記第1配線層に接続されると共に、前記電子部品搭載パッドと同一層から形成された第2配線層とを有することを特徴とする請求項4に記載の電子部品装置。 - 前記第2絶縁層の上に形成され、前記電子部品を被覆する第3絶縁層と、
前記第3絶縁層に形成され、前記電子部品の接続端子に到達する第2ビアホールと、
前記第3絶縁層の上に形成され、前記第2ビアホール内のビア導体を介して前記電子部品の接続端子に接続される第3配線層とを有することを特徴とする請求項4又は5に記載の電子部品装置。 - 第1配線層の上に第1絶縁層を形成する工程と、
平面視で前記第1配線層と重なり合う領域の前記第1絶縁層の上面側に凹部を形成する工程と、
前記凹部を埋め込む複数の突出部を下面に備え、前記突出部が前記第1配線層と離間する電子部品搭載パッドを前記第1絶縁層の上に形成する工程と、
前記第1絶縁層の上に、前記電子部品搭載パッド上にレーザで開口部が形成された第2絶縁層を形成する工程とを有し、
前記電子部品搭載パッドを前記第1絶縁層の上に形成する工程において、前記電子部品搭載パッドの突出部を、前記電子部品搭載パッドの周縁部に枠状に繋げて形成することを特徴とする配線基板の製造方法。 - 前記凹部を形成する工程において、
レーザで前記第1絶縁層に前記凹部を形成し、かつ、前記レーザで前記第1絶縁層に前記第1配線層に到達するビアホールを形成し、
前記電子部品搭載パッドを形成する工程において、
前記ビアホール内のビア導体を介して前記第1配線層に接続される第2配線層を同時に形成することを特徴とする請求項7に記載の配線基板の製造方法。 - 第1配線層の上に第1絶縁層を形成する工程と、
平面視で前記第1配線層と重なり合う領域の前記第1絶縁層の上面側に凹部を形成する工程と、
前記凹部を埋め込む複数の突出部を下面に備え、前記突出部が前記第1配線層と離間する電子部品搭載パッドを前記第1絶縁層の上に形成する工程と、
前記第1絶縁層の上に、前記電子部品搭載パッドの上に開口部が配置された第2絶縁層
を形成する工程と、
前記電子部品搭載パッドの上に電子部品を搭載する工程とを有し、
前記電子部品搭載パッドを前記第1絶縁層の上に形成する工程において、前記電子部品搭載パッドの突出部を、前記電子部品搭載パッドの周縁部に枠状に繋げて形成することを特徴とする電子部品装置の製造方法。
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