JP6451017B2 - ファン−アウト半導体パッケージ - Google Patents
ファン−アウト半導体パッケージ Download PDFInfo
- Publication number
- JP6451017B2 JP6451017B2 JP2017031603A JP2017031603A JP6451017B2 JP 6451017 B2 JP6451017 B2 JP 6451017B2 JP 2017031603 A JP2017031603 A JP 2017031603A JP 2017031603 A JP2017031603 A JP 2017031603A JP 6451017 B2 JP6451017 B2 JP 6451017B2
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- layer
- connecting member
- fan
- opening
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Description
図1は電子機器システムの例を概略的に示すブロック図である。
一般に、半導体チップには、数多くの微細電気回路が集積されているが、それ自体が半導体完成品としての役割を果たすことはできず、外部からの物理的または化学的衝撃により損傷する可能性がある。したがって、半導体チップ自体をそのまま用いるのではなく、半導体チップをパッケージングして、パッケージ状態で電子機器などに用いている。
図3はファン−イン半導体パッケージのパッケージング前後を概略的に示した断面図である。
図7はファン−アウト半導体パッケージの概略的な形態を示した断面図である。
1010 メインボード
1020 チップ関連部品
1030 ネットワーク関連部品
1040 その他の部品
1050 カメラ
1060 アンテナ
1070 ディスプレイ
1080 電池
1090 信号ライン
1100 スマートフォン
1101 本体
1110 メインボード
1120 部品
1130 カメラ
2200 ファン−イン半導体パッケージ
2220 半導体チップ
2221 本体
2222 接続パッド
2223 パッシベーション膜
2240 連結部材
2241 絶縁層
2242 配線パターン
2243 ビア
2250 パッシベーション層
2260 アンダーバンプ金属層
2270 半田ボール
2280 アンダーフィル樹脂
2290 モールディング材
2500 メインボード
2301 インターポーザ基板
2302 インターポーザ基板
2100 ファン−アウト半導体パッケージ
2120 半導体チップ
2121 本体
2122 接続パッド
2140 連結部材
2141 絶縁層
2142 再配線層
2143 ビア
2150 パッシベーション層
2160 アンダーバンプ金属層
2170 半田ボール
100 半導体パッケージ
100A、100B、100C、100D、100E、100F ファン−アウト半導体パッケージ
110 第1連結部材
111、111a、111b、111c 絶縁層
112a、112b、112c、112d 再配線層
113、113a、113b、113c ビア
120 半導体チップ
121 本体
122 接続パッド
123 パッシベーション膜
130、135 封止材
140 第2連結部材
141 絶縁層
142 再配線層
143 ビア
150 パッシベーション層
151 開口部
160 アンダーバンプ金属層
170 接続端子
181 補強層
182 樹脂層
183 開口部
190 外部接続端子
Claims (24)
- 貫通孔を有する第1連結部材と、
前記第1連結部材の貫通孔に配置され、接続パッドが配置された活性面、及び前記活性面の反対側に配置された非活性面を有する半導体チップと、
前記第1連結部材及び前記半導体チップの非活性面の少なくとも一部を封止する封止材と、
前記第1連結部材及び前記半導体チップの活性面上に配置された第2連結部材と、
前記封止材を貫通する開口部と、
前記開口部の少なくとも一部を満たす外部接続端子と、を含み、
前記第1連結部材及び前記第2連結部材はそれぞれ、前記半導体チップの接続パッドと電気的に連結された再配線層を含み、
前記第1連結部材の再配線層は、前記開口部を介して少なくとも一部が露出して前記外部接続端子と連結されるパッドを含み、
前記開口部の壁面は、前記パッドの露出面より表面粗さが大きく、外部接続端子の一部によって充填されるボイドを有し、
前記開口部の前記封止材を貫通して形成された壁面には、前記外部接続端子で少なくとも一部が満たされた第4ボイドが存在し、
前記封止材は、絶縁樹脂、芯材、及びフィラーを含み、
前記第4ボイドの少なくとも一部は、前記芯材に形成されたリセスである、ファン−アウト半導体パッケージ。 - 前記封止材上に配置された補強層をさらに含み、
前記開口部は前記補強層を貫通し、
前記開口部の前記補強層を貫通して形成された壁面には、前記外部接続端子で少なくとも一部が満たされた第1ボイドが存在する、請求項1に記載のファン−アウト半導体パッケージ。 - 前記補強層は、絶縁樹脂、芯材、及びフィラーを含み、
前記第1ボイドの少なくとも一部は、前記芯材に形成されたリセスである、請求項2に記載のファン−アウト半導体パッケージ。 - 貫通孔を有する第1連結部材と、
前記第1連結部材の貫通孔に配置され、接続パッドが配置された活性面、及び前記活性面の反対側に配置された非活性面を有する半導体チップと、
前記第1連結部材及び前記半導体チップの非活性面の少なくとも一部を封止する封止材と、
前記第1連結部材及び前記半導体チップの活性面上に配置された第2連結部材と、
前記封止材を貫通する開口部と、
前記開口部の少なくとも一部を満たす外部接続端子と、を含み、
前記第1連結部材及び前記第2連結部材はそれぞれ、前記半導体チップの接続パッドと電気的に連結された再配線層を含み、
前記第1連結部材の再配線層は、前記開口部を介して少なくとも一部が露出して前記外部接続端子と連結されるパッドを含み、
前記開口部の壁面は、前記パッドの露出面より表面粗さが大きく、外部接続端子の一部によって充填されるボイドを有し、
前記封止材上に配置された補強層をさらに含み、
前記開口部は前記補強層を貫通し、
前記開口部の前記補強層を貫通して形成された壁面には、前記外部接続端子で少なくとも一部が満たされた第1ボイドが存在し、
前記補強層は、絶縁樹脂、芯材、及びフィラーを含み、
前記第1ボイドの少なくとも一部は、前記芯材に形成されたリセスである、ファン−アウト半導体パッケージ。 - 前記第1ボイドの他の一部は、前記絶縁樹脂に形成されたリセスである、請求項3または4に記載のファン−アウト半導体パッケージ。
- 前記芯材はガラス繊維を含み、
前記フィラーは無機フィラーを含む、請求項3から請求項5のいずれか1項に記載のファン−アウト半導体パッケージ。 - 前記補強層上に配置された樹脂層をさらに含み、
前記開口部は前記樹脂層を貫通し、
前記開口部の前記樹脂層を貫通して形成された壁面には、前記外部接続端子で少なくとも一部が満たされた第2ボイドが存在する、請求項2から請求項6の何れか一項に記載のファン−アウト半導体パッケージ。 - 前記樹脂層は絶縁樹脂及びフィラーを含み、
前記第2ボイドの少なくとも一部は、前記絶縁樹脂に形成されたリセスである、請求項7に記載のファン−アウト半導体パッケージ。 - 前記開口部の前記封止材を貫通して形成された壁面には、前記外部接続端子で少なくとも一部が満たされた第3ボイドが存在する、請求項2から請求項8の何れか一項に記載のファン−アウト半導体パッケージ。
- 前記封止材は絶縁樹脂及びフィラーを含み、
前記第3ボイドの少なくとも一部は、前記封止材に形成されたリセスである、請求項9に記載のファン−アウト半導体パッケージ。 - 前記開口部の前記封止材を貫通して形成された壁面には、前記外部接続端子で少なくとも一部が満たされた第4ボイドが存在する、請求項4、および請求項4に従属する請求項5から請求項10の何れか一項に記載のファン−アウト半導体パッケージ。
- 前記封止材は、絶縁樹脂、芯材、及びフィラーを含み、
前記第4ボイドの少なくとも一部は、前記芯材に形成されたリセスである、請求項11に記載のファン−アウト半導体パッケージ。 - 前記第4ボイドの他の一部は、前記絶縁樹脂に形成されたリセスである、請求項12に記載のファン−アウト半導体パッケージ。
- 前記封止材上に配置された樹脂層をさらに含み、
前記開口部は前記樹脂層を貫通し、
前記開口部の前記樹脂層を貫通して形成された壁面には、前記外部接続端子で少なくとも一部が満たされた第5ボイドが存在する、請求項1から請求項13の何れか一項に記載のファン−アウト半導体パッケージ。 - 前記樹脂層は絶縁樹脂及びフィラーを含み、
前記第5ボイドの少なくとも一部は、前記絶縁樹脂に形成されたリセスである、請求項14に記載のファン−アウト半導体パッケージ。 - 前記第1連結部材は、第1絶縁層と、前記第2連結部材と接して前記第1絶縁層に埋め込まれた第1再配線層と、前記第1絶縁層の前記第1再配線層が埋め込まれた側の反対側上に配置された第2再配線層と、を含み、
前記第1及び第2再配線層は前記接続パッドと電気的に連結されている、請求項1から請求項15の何れか一項に記載のファン−アウト半導体パッケージ。 - 前記第1連結部材は、前記第1絶縁層上に配置されて前記第2再配線層を覆う第2絶縁層と、前記第2絶縁層上に配置された第3再配線層と、をさらに含み、
前記第3再配線層は前記接続パッドと電気的に連結されている、請求項16に記載のファン−アウト半導体パッケージ。 - 前記第1連結部材は、第1絶縁層と、前記第1絶縁層の両面に配置された第1再配線層及び第2再配線層と、前記第1絶縁層上に配置されて前記第1再配線層を覆う第2絶縁層と、前記第2絶縁層上に配置された第3再配線層と、を含み、
前記第1〜第3再配線層は前記接続パッドと電気的に連結されている、請求項1から請求項17の何れか一項に記載のファン−アウト半導体パッケージ。 - 前記第1連結部材は、前記第1絶縁層上に配置されて前記第2再配線層を覆う第3絶縁層と、前記第3絶縁層上に配置された第4再配線層と、をさらに含み、
前記第4再配線層は前記接続パッドと電気的に連結されている、請求項18に記載のファン−アウト半導体パッケージ。 - 貫通孔を有する第1連結部材と、
前記第1連結部材の貫通孔に配置され、接続パッドが配置された活性面、及び前記活性面の反対側に配置された非活性面を有する半導体チップと、
前記第1連結部材及び前記半導体チップの非活性面の少なくとも一部を封止する封止材と、前記第1連結部材及び前記半導体チップの活性面上に配置された第2連結部材と、
前記封止材上に配置され、開口部を有する補強層と、
前記開口部の少なくとも一部を満たす外部接続端子と、を含み、
前記第1連結部材及び前記第2連結部材はそれぞれ、前記半導体チップの接続パッドと電気的に連結された再配線層を含み、
前記開口部の壁面には前記外部接続端子で満たされたボイドが存在し、
前記補強層は、絶縁樹脂、芯材、及びフィラーを含み、
前記ボイドの少なくとも一部は、前記芯材に形成されたリセスである、ファン−アウト半導体パッケージ。 - 第1再配線層及び貫通孔を有する第1連結部材と、
前記第1連結部材の貫通孔に配置され、接続パッドが配置された活性面、及び前記活性面の反対側に配置された非活性面を有する半導体チップと、
前記第1連結部材及び前記半導体チップの非活性面の少なくとも一部を封止するカバーと、
前記第1連結部材、及び前記半導体チップの活性面上に配置され、第2再配線層を含む第2連結部材と、
前記第1連結部材の少なくとも一部を露出させるように前記カバーを貫通する開口部と、
前記開口部の少なくとも一部を満たし、前記開口部によって露出している前記第1連結部材の少なくとも一部と電気的に連結された外部接続端子と、を含み、
前記第1及び第2再配線層は前記半導体チップの接続パッドと電気的に連結され、
前記開口部は、前記開口部と相対する前記カバーの側面に配置された複数のリセスを露出させ、
前記外部接続端子は前記複数のリセスを満たす複数の突出部を含み、
前記開口部は前記カバーに埋め込まれたコア層を貫通し、
前記コア層の前記複数のリセスに挿入された突出部の挿入深さは、前記カバーの他の領域の他のリセスに挿入された突出部の挿入深さより大きい、ファン−アウト半導体パッケージ。 - 前記カバーは、前記コア層の両側に配置された絶縁層、及び前記絶縁層に分散されたフィラーを含む、請求項21に記載のファン−アウト半導体パッケージ。
- 前記コア層はガラス繊維及びフィラーを含む、請求項22に記載のファン−アウト半導体パッケージ。
- 前記開口部の壁面は、前記第1連結部材の露出している少なくとも一部の表面粗さより大きい表面粗さを有する、請求項21に記載のファン−アウト半導体パッケージ。
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JP6705096B2 (ja) * | 2013-08-21 | 2020-06-03 | インテル・コーポレーション | バンプレスビルドアップ層(bbul)用のバンプレスダイ−パッケージインターフェースを備えるパッケージアセンブリ、コンピューティングデバイス、及びパッケージアセンブリの製造方法 |
JP5662551B1 (ja) * | 2013-12-20 | 2015-01-28 | 新光電気工業株式会社 | 配線基板、半導体装置及び配線基板の製造方法 |
US9527723B2 (en) * | 2014-03-13 | 2016-12-27 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming microelectromechanical systems (MEMS) package |
TW201543641A (zh) | 2014-05-12 | 2015-11-16 | Xintex Inc | 晶片封裝體及其製造方法 |
JP2016134497A (ja) * | 2015-01-19 | 2016-07-25 | 凸版印刷株式会社 | 配線基板積層体及びこれを用いた半導体装置の製造方法 |
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TW201824466A (zh) | 2018-07-01 |
US10886230B2 (en) | 2021-01-05 |
CN107887361A (zh) | 2018-04-06 |
US20180096940A1 (en) | 2018-04-05 |
US20180096941A1 (en) | 2018-04-05 |
KR20180036095A (ko) | 2018-04-09 |
KR101952864B1 (ko) | 2019-02-27 |
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