JP6434877B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6434877B2 JP6434877B2 JP2015166575A JP2015166575A JP6434877B2 JP 6434877 B2 JP6434877 B2 JP 6434877B2 JP 2015166575 A JP2015166575 A JP 2015166575A JP 2015166575 A JP2015166575 A JP 2015166575A JP 6434877 B2 JP6434877 B2 JP 6434877B2
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
- H10B43/23—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
- H10B43/27—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/764—Air gaps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/5329—Insulating materials
- H01L23/53295—Stacked insulating layers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
Description
図1では、図2に示す絶縁膜42、43、48の図示を省略している。
Claims (5)
- 基板と、
前記基板上に設けられ、第1空隙を介して積層された複数の電極膜を有する積層体と、
前記積層体の積層方向に延び、前記積層体を前記積層方向に対して交差する第1方向に分離し、前記第1空隙に通じる第2空隙と、
前記積層体の上に設けられ、前記第2空隙の上端を覆う第1絶縁膜と、
前記積層体内を前記積層方向に延びる半導体膜と、
電荷蓄積膜を有する積層膜であって、前記電極膜の側面と、前記電極膜の前記側面に対向する前記半導体膜の側面との間に設けられ、前記電極膜の前記側面および前記半導体膜の前記側面に接する積層膜と、
前記複数の電極膜の階段状の端部を覆う第2絶縁膜と、
前記第2絶縁膜内を前記積層方向に延び、前記複数の電極膜の前記階段状の端部に達する複数のコンタクトビアと、
を備え、
前記階段状の端部における前記コンタクトビアが配置された部分の上面は、前記第1空隙を介さずに前記第2絶縁膜で直接覆われている半導体装置。 - 基板と、
前記基板上に設けられ、第1空隙を介して積層された複数の電極膜を有する積層体と、
前記積層体の積層方向に延び、前記積層体を前記積層方向に対して交差する第1方向に分離し、前記第1空隙に通じる第2空隙と、
前記積層体の上に設けられ、前記第2空隙の上端を覆う第1絶縁膜と、
前記積層体内を前記積層方向に延びる半導体膜と、
電荷蓄積膜を有する積層膜であって、前記電極膜の側面と、前記電極膜の前記側面に対向する前記半導体膜の側面との間に設けられ、前記電極膜の前記側面および前記半導体膜の前記側面に接する積層膜と、
前記積層方向に延び、前記基板に接し、前記積層体を前記第1方向に分離する配線部と、
を備え、
前記第2空隙は、前記配線部の側面に隣接して前記積層方向に延びている半導体装置。 - 前記第2空隙を前記第1方向に挟んで対向する前記複数の電極膜間の間隔は、前記第1空隙を介して前記積層方向で隣接する前記複数の電極膜間の間隔よりも大きい請求項1または2に記載の半導体装置。
- 前記電荷蓄積膜は、前記積層膜の前記第1空隙に隣接する部分で前記積層方向に分断されている請求項1〜3のいずれか1つに記載の半導体装置。
- 前記複数の電極膜の端部を覆う第2絶縁膜の前記第1空隙に隣接する表面に沿った前記複数の電極膜間の沿面距離は、前記積層方向で隣接する前記複数の電極膜間の間隔よりも大きい請求項1〜4のいずれか1つに記載の半導体装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015166575A JP6434877B2 (ja) | 2015-08-26 | 2015-08-26 | 半導体装置 |
TW106131070A TWI644397B (zh) | 2015-08-26 | 2015-12-01 | 半導體裝置 |
TW104140213A TWI604563B (zh) | 2015-08-26 | 2015-12-01 | 半導體裝置及其製造方法 |
US15/001,991 US10319734B2 (en) | 2015-08-26 | 2016-01-20 | Semiconductor memory device having air gap |
US16/398,386 US20190259777A1 (en) | 2015-08-26 | 2019-04-30 | Semiconductor device and method for manufacturing same |
Applications Claiming Priority (1)
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JP2015166575A JP6434877B2 (ja) | 2015-08-26 | 2015-08-26 | 半導体装置 |
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JP2017045825A JP2017045825A (ja) | 2017-03-02 |
JP6434877B2 true JP6434877B2 (ja) | 2018-12-05 |
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US (2) | US10319734B2 (ja) |
JP (1) | JP6434877B2 (ja) |
TW (2) | TWI604563B (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6832764B2 (ja) * | 2017-03-22 | 2021-02-24 | キオクシア株式会社 | 半導体記憶装置及びその製造方法 |
US9985049B1 (en) | 2017-04-28 | 2018-05-29 | Micron Technology, Inc. | Arrays of elevationally-extending strings of memory cells and methods of forming memory arrays |
KR101985590B1 (ko) * | 2017-07-28 | 2019-06-03 | 한양대학교 산학협력단 | 집적도를 개선시킨 3차원 플래시 메모리 및 그 제조 방법 |
JP6842386B2 (ja) * | 2017-08-31 | 2021-03-17 | キオクシア株式会社 | 半導体装置 |
JP2019050330A (ja) | 2017-09-12 | 2019-03-28 | 東芝メモリ株式会社 | 半導体装置 |
KR102467452B1 (ko) * | 2017-10-13 | 2022-11-17 | 에스케이하이닉스 주식회사 | 반도체 장치 및 그 제조 방법 |
JP2021089905A (ja) * | 2018-03-20 | 2021-06-10 | キオクシア株式会社 | 半導体記憶装置 |
WO2019244373A1 (ja) | 2018-06-19 | 2019-12-26 | キオクシア株式会社 | メモリデバイス |
US10629732B1 (en) * | 2018-10-09 | 2020-04-21 | Micron Technology, Inc. | Elevationally-extending transistors, devices comprising elevationally-extending transistors, and methods of forming a device comprising elevationally-extending transistors |
JP2020150079A (ja) * | 2019-03-12 | 2020-09-17 | キオクシア株式会社 | 半導体記憶装置およびその製造方法 |
JP2020150234A (ja) | 2019-03-15 | 2020-09-17 | キオクシア株式会社 | 半導体記憶装置 |
CN111557048B (zh) * | 2020-03-25 | 2021-09-10 | 长江存储科技有限责任公司 | 三维存储器件及其制作方法 |
US11476332B2 (en) | 2020-06-02 | 2022-10-18 | Micron Technology, Inc. | Integrated assemblies, and methods of forming integrated assemblies |
JP2022041699A (ja) * | 2020-09-01 | 2022-03-11 | キオクシア株式会社 | 半導体装置 |
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KR100814418B1 (ko) * | 2006-10-12 | 2008-03-18 | 삼성전자주식회사 | 불휘발성 메모리 장치의 제조 방법 |
US7472013B1 (en) * | 2007-07-20 | 2008-12-30 | Gm Global Technology Operations, Inc. | System and method for estimating volumetric efficiency for engines with intake and exhaust cam phasers |
JP4691124B2 (ja) | 2008-03-14 | 2011-06-01 | 株式会社東芝 | 不揮発性半導体記憶装置の製造方法 |
JP5364394B2 (ja) | 2009-02-16 | 2013-12-11 | 株式会社東芝 | 不揮発性半導体記憶装置 |
JP2011204773A (ja) * | 2010-03-24 | 2011-10-13 | Toshiba Corp | 不揮発性半導体記憶装置の製造方法、及び不揮発性半導体記憶装置 |
US9536970B2 (en) * | 2010-03-26 | 2017-01-03 | Samsung Electronics Co., Ltd. | Three-dimensional semiconductor memory devices and methods of fabricating the same |
KR101778287B1 (ko) * | 2010-08-30 | 2017-09-14 | 삼성전자주식회사 | 반도체 메모리 소자 및 그 제조방법 |
JP2012089587A (ja) | 2010-10-15 | 2012-05-10 | Toshiba Corp | 半導体装置およびその製造方法 |
JP5593283B2 (ja) * | 2011-08-04 | 2014-09-17 | 株式会社東芝 | 半導体記憶装置及びその製造方法 |
CN103117245A (zh) | 2011-11-17 | 2013-05-22 | 盛美半导体设备(上海)有限公司 | 空气隙互联结构的形成方法 |
KR20130136249A (ko) * | 2012-06-04 | 2013-12-12 | 에스케이하이닉스 주식회사 | 반도체 장치 및 그 제조 방법 |
JP2014175348A (ja) | 2013-03-06 | 2014-09-22 | Toshiba Corp | 不揮発性半導体記憶装置 |
US8946023B2 (en) * | 2013-03-12 | 2015-02-03 | Sandisk Technologies Inc. | Method of making a vertical NAND device using sequential etching of multilayer stacks |
JP2014187286A (ja) * | 2013-03-25 | 2014-10-02 | Toshiba Corp | 不揮発性半導体記憶装置 |
WO2015115002A1 (ja) * | 2014-01-29 | 2015-08-06 | 株式会社日立国際電気 | 微細パターンの形成方法、半導体装置の製造方法、基板処理装置及び記録媒体 |
US9825051B2 (en) * | 2014-10-22 | 2017-11-21 | Sandisk Technologies Llc | Three dimensional NAND device containing fluorine doped layer and method of making thereof |
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2015
- 2015-08-26 JP JP2015166575A patent/JP6434877B2/ja active Active
- 2015-12-01 TW TW104140213A patent/TWI604563B/zh active
- 2015-12-01 TW TW106131070A patent/TWI644397B/zh active
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2016
- 2016-01-20 US US15/001,991 patent/US10319734B2/en active Active
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2019
- 2019-04-30 US US16/398,386 patent/US20190259777A1/en not_active Abandoned
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Publication number | Publication date |
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JP2017045825A (ja) | 2017-03-02 |
US20190259777A1 (en) | 2019-08-22 |
TW201709410A (zh) | 2017-03-01 |
TWI644397B (zh) | 2018-12-11 |
TWI604563B (zh) | 2017-11-01 |
US10319734B2 (en) | 2019-06-11 |
TW201816938A (zh) | 2018-05-01 |
US20170062459A1 (en) | 2017-03-02 |
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