JP6181358B2 - ベーク処理システム及び有機el素子の有機機能膜の積層体の製造方法 - Google Patents
ベーク処理システム及び有機el素子の有機機能膜の積層体の製造方法 Download PDFInfo
- Publication number
- JP6181358B2 JP6181358B2 JP2012164541A JP2012164541A JP6181358B2 JP 6181358 B2 JP6181358 B2 JP 6181358B2 JP 2012164541 A JP2012164541 A JP 2012164541A JP 2012164541 A JP2012164541 A JP 2012164541A JP 6181358 B2 JP6181358 B2 JP 6181358B2
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- JP
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- Prior art keywords
- substrate
- baking
- load lock
- processing system
- bake
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 75
- 230000008569 process Effects 0.000 title claims description 61
- 238000004519 manufacturing process Methods 0.000 title description 21
- 239000000758 substrate Substances 0.000 claims description 182
- 238000012546 transfer Methods 0.000 claims description 84
- 238000012545 processing Methods 0.000 claims description 77
- 238000001816 cooling Methods 0.000 claims description 62
- 239000011368 organic material Substances 0.000 claims description 43
- 230000032258 transport Effects 0.000 claims description 40
- 238000007641 inkjet printing Methods 0.000 claims description 33
- 238000001035 drying Methods 0.000 claims description 30
- 238000001291 vacuum drying Methods 0.000 claims description 21
- 239000011261 inert gas Substances 0.000 claims description 19
- 238000010438 heat treatment Methods 0.000 claims description 14
- 230000006870 function Effects 0.000 claims description 8
- 238000005401 electroluminescence Methods 0.000 description 35
- 239000007789 gas Substances 0.000 description 18
- 238000002347 injection Methods 0.000 description 16
- 239000007924 injection Substances 0.000 description 16
- 230000005525 hole transport Effects 0.000 description 14
- 230000003028 elevating effect Effects 0.000 description 10
- 238000003780 insertion Methods 0.000 description 10
- 230000037431 insertion Effects 0.000 description 10
- 230000007246 mechanism Effects 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- 238000003860 storage Methods 0.000 description 8
- 239000002826 coolant Substances 0.000 description 5
- 239000000112 cooling gas Substances 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012164541A JP6181358B2 (ja) | 2012-07-25 | 2012-07-25 | ベーク処理システム及び有機el素子の有機機能膜の積層体の製造方法 |
PCT/JP2013/066044 WO2014017194A1 (ja) | 2012-07-25 | 2013-06-11 | ベーク処理システム |
CN201610591115.1A CN106206378B (zh) | 2012-07-25 | 2013-06-11 | 减压干燥装置 |
KR1020157004615A KR101663005B1 (ko) | 2012-07-25 | 2013-06-11 | 베이크 처리 시스템 및 유기 el 소자의 유기 기능막의 적층체의 제조 방법 |
CN201380039479.3A CN104488358B (zh) | 2012-07-25 | 2013-06-11 | 烘焙处理***及有机el元件的有机功能膜的层叠体的制造方法 |
TW102126466A TWI584426B (zh) | 2012-07-25 | 2013-07-24 | A baking treatment system, and an organic EL film of an organic EL element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012164541A JP6181358B2 (ja) | 2012-07-25 | 2012-07-25 | ベーク処理システム及び有機el素子の有機機能膜の積層体の製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017003059A Division JP6476215B2 (ja) | 2017-01-12 | 2017-01-12 | 減圧乾燥装置、減圧乾燥方法及びベーク処理システム |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014026764A JP2014026764A (ja) | 2014-02-06 |
JP2014026764A5 JP2014026764A5 (zh) | 2015-06-11 |
JP6181358B2 true JP6181358B2 (ja) | 2017-08-16 |
Family
ID=49997011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012164541A Expired - Fee Related JP6181358B2 (ja) | 2012-07-25 | 2012-07-25 | ベーク処理システム及び有機el素子の有機機能膜の積層体の製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6181358B2 (zh) |
KR (1) | KR101663005B1 (zh) |
CN (2) | CN106206378B (zh) |
TW (1) | TWI584426B (zh) |
WO (1) | WO2014017194A1 (zh) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11975546B2 (en) | 2008-06-13 | 2024-05-07 | Kateeva, Inc. | Gas enclosure assembly and system |
US10434804B2 (en) | 2008-06-13 | 2019-10-08 | Kateeva, Inc. | Low particle gas enclosure systems and methods |
US12018857B2 (en) | 2008-06-13 | 2024-06-25 | Kateeva, Inc. | Gas enclosure assembly and system |
EP3787016B1 (en) | 2013-12-26 | 2023-09-20 | Kateeva, Inc. | Apparatus and techniques for thermal treatment of electronic devices |
KR102022816B1 (ko) | 2014-01-21 | 2019-11-04 | 카티바, 인크. | 전자 장치 인캡슐레이션을 위한 기기 및 기술 |
JP6189780B2 (ja) * | 2014-04-01 | 2017-08-30 | 東京エレクトロン株式会社 | 基板処理システム |
JP6189781B2 (ja) * | 2014-04-01 | 2017-08-30 | 東京エレクトロン株式会社 | 熱処理装置、熱処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム |
WO2015162892A1 (ja) * | 2014-04-22 | 2015-10-29 | 株式会社Joled | 有機el表示パネルの製造方法および有機el表示パネルの製造システム |
WO2015168036A1 (en) | 2014-04-30 | 2015-11-05 | Kateeva, Inc. | Gas cushion apparatus and techniques for substrate coating |
JP6639175B2 (ja) * | 2015-09-29 | 2020-02-05 | 東京エレクトロン株式会社 | 乾燥装置及び乾燥処理方法 |
KR20180082498A (ko) * | 2015-11-16 | 2018-07-18 | 카티바, 인크. | 기판을 열처리하기 위한 시스템 및 방법 |
KR102525361B1 (ko) | 2016-04-27 | 2023-04-25 | 삼성디스플레이 주식회사 | 감압 건조 장치 및 이를 이용한 막 제조 방법 |
JP6675931B2 (ja) * | 2016-05-23 | 2020-04-08 | 東京エレクトロン株式会社 | 基板処理システム、基板処理方法及び正孔注入層形成装置 |
JP6918461B2 (ja) * | 2016-09-23 | 2021-08-11 | 東京エレクトロン株式会社 | 減圧乾燥システム、および減圧乾燥方法 |
US10861731B2 (en) * | 2017-01-19 | 2020-12-08 | Axcelis Technologies, Inc. | Radiant heating presoak |
KR102041318B1 (ko) * | 2017-10-17 | 2019-11-06 | 세메스 주식회사 | 기판 처리 방법 및 장치 |
US10720348B2 (en) * | 2018-05-18 | 2020-07-21 | Applied Materials, Inc. | Dual load lock chamber |
CN109166966A (zh) * | 2018-08-10 | 2019-01-08 | 深圳市华星光电半导体显示技术有限公司 | 一种显示器件的制备方法及有机发光显示器件 |
CN111384310A (zh) * | 2018-12-29 | 2020-07-07 | 广东聚华印刷显示技术有限公司 | 有机薄膜的成膜方法及其应用 |
TWI755659B (zh) * | 2019-12-09 | 2022-02-21 | 天虹科技股份有限公司 | 降低氮化鋁的表面氧化物生成的方法與設備 |
JP6878557B2 (ja) * | 2019-12-24 | 2021-05-26 | 東京エレクトロン株式会社 | 乾燥装置及び乾燥処理方法 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3779393B2 (ja) * | 1996-09-06 | 2006-05-24 | 東京エレクトロン株式会社 | 処理システム |
US5944857A (en) * | 1997-05-08 | 1999-08-31 | Tokyo Electron Limited | Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor |
KR100401959B1 (ko) * | 2001-06-02 | 2003-10-17 | 주식회사 태평양 | 토코페롤 유도체를 사용하여 레시틴을 안정화하는 방법 |
JP5134182B2 (ja) * | 2001-07-13 | 2013-01-30 | ブルックス オートメーション インコーポレイテッド | 独立多エンドエフェクタを備えた基板移送装置 |
JP2003142260A (ja) | 2001-10-31 | 2003-05-16 | Seiko Epson Corp | 有機el素子の製造方法及び製造装置 |
JP2002334783A (ja) * | 2002-03-14 | 2002-11-22 | Idemitsu Kosan Co Ltd | 有機エレクトロルミネッセンス素子の製造装置 |
US20040040504A1 (en) * | 2002-08-01 | 2004-03-04 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing apparatus |
JP3687666B2 (ja) * | 2002-11-18 | 2005-08-24 | セイコーエプソン株式会社 | 乾燥装置及びこれを備えるワーク処理装置 |
JP2004171862A (ja) * | 2002-11-19 | 2004-06-17 | Seiko Epson Corp | 有機el装置の製造装置、有機el装置の製造方法、有機el装置、並びに電子機器 |
JP4453251B2 (ja) * | 2002-12-26 | 2010-04-21 | セイコーエプソン株式会社 | 描画作業ライン |
JP4493926B2 (ja) * | 2003-04-25 | 2010-06-30 | 株式会社半導体エネルギー研究所 | 製造装置 |
KR20050040512A (ko) * | 2003-10-29 | 2005-05-03 | 삼성전자주식회사 | 베이크 장치 |
JP4342327B2 (ja) * | 2004-01-26 | 2009-10-14 | 住友化学株式会社 | 枚葉塗膜形成方法 |
KR100571841B1 (ko) * | 2004-06-21 | 2006-04-17 | 삼성전자주식회사 | 베이크 시스템 |
KR20060007847A (ko) * | 2004-07-22 | 2006-01-26 | 삼성전자주식회사 | 반도체 웨이퍼 베이크 장치 |
KR100666349B1 (ko) * | 2005-03-04 | 2007-01-11 | 세메스 주식회사 | 증착 장치 및 상기 장치에서 마스크를 회수하는 방법. |
JP4301219B2 (ja) * | 2005-08-01 | 2009-07-22 | セイコーエプソン株式会社 | 減圧乾燥方法、機能膜の製造方法および電気光学装置の製造方法、電気光学装置、液晶表示装置、有機el表示装置、並びに電子機器 |
JP2007265715A (ja) | 2006-03-28 | 2007-10-11 | Hioki Ee Corp | 有機el素子製造装置 |
JP4987539B2 (ja) * | 2007-03-29 | 2012-07-25 | 株式会社九州日昌 | 加熱装置 |
TW200930135A (en) * | 2007-08-31 | 2009-07-01 | Tokyo Electron Ltd | Organic electronic device, organic electronic device manufacturing method, organic electronic device manufacturing apparatus, substrate processing system, protection film structure and storage medium with control program stored therein |
JP4850811B2 (ja) * | 2007-11-06 | 2012-01-11 | 東京エレクトロン株式会社 | 載置台、処理装置および処理システム |
JP2009187681A (ja) * | 2008-02-01 | 2009-08-20 | Tokyo Electron Ltd | 有機薄膜の形成方法及び有機デバイス |
JP5108557B2 (ja) * | 2008-02-27 | 2012-12-26 | 東京エレクトロン株式会社 | ロードロック装置および基板冷却方法 |
JP5478280B2 (ja) * | 2010-01-27 | 2014-04-23 | 東京エレクトロン株式会社 | 基板加熱装置および基板加熱方法、ならびに基板処理システム |
-
2012
- 2012-07-25 JP JP2012164541A patent/JP6181358B2/ja not_active Expired - Fee Related
-
2013
- 2013-06-11 WO PCT/JP2013/066044 patent/WO2014017194A1/ja active Application Filing
- 2013-06-11 CN CN201610591115.1A patent/CN106206378B/zh active Active
- 2013-06-11 CN CN201380039479.3A patent/CN104488358B/zh not_active Expired - Fee Related
- 2013-06-11 KR KR1020157004615A patent/KR101663005B1/ko active IP Right Grant
- 2013-07-24 TW TW102126466A patent/TWI584426B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR20150038252A (ko) | 2015-04-08 |
CN104488358B (zh) | 2016-08-17 |
TW201419467A (zh) | 2014-05-16 |
TWI584426B (zh) | 2017-05-21 |
CN104488358A (zh) | 2015-04-01 |
WO2014017194A1 (ja) | 2014-01-30 |
JP2014026764A (ja) | 2014-02-06 |
KR101663005B1 (ko) | 2016-10-06 |
CN106206378B (zh) | 2020-12-01 |
CN106206378A (zh) | 2016-12-07 |
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