JP6160893B1 - レジスト剥離液 - Google Patents

レジスト剥離液 Download PDF

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Publication number
JP6160893B1
JP6160893B1 JP2017523005A JP2017523005A JP6160893B1 JP 6160893 B1 JP6160893 B1 JP 6160893B1 JP 2017523005 A JP2017523005 A JP 2017523005A JP 2017523005 A JP2017523005 A JP 2017523005A JP 6160893 B1 JP6160893 B1 JP 6160893B1
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JP
Japan
Prior art keywords
mass
water
hydrazine
resist
stripping solution
Prior art date
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JP2017523005A
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English (en)
Japanese (ja)
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JPWO2018061064A1 (ja
Inventor
真一郎 淵上
真一郎 淵上
佑典 鬼頭
佑典 鬼頭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Application granted granted Critical
Publication of JP6160893B1 publication Critical patent/JP6160893B1/ja
Priority to TW106133105A priority Critical patent/TWI629353B/zh
Publication of JPWO2018061064A1 publication Critical patent/JPWO2018061064A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2017523005A 2016-09-30 2016-09-30 レジスト剥離液 Active JP6160893B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW106133105A TWI629353B (zh) 2016-09-30 2017-09-27 Receptor stripping solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2016/004436 WO2018061064A1 (ja) 2016-09-30 2016-09-30 レジスト剥離液

Publications (2)

Publication Number Publication Date
JP6160893B1 true JP6160893B1 (ja) 2017-07-12
JPWO2018061064A1 JPWO2018061064A1 (ja) 2018-10-04

Family

ID=59308856

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017523005A Active JP6160893B1 (ja) 2016-09-30 2016-09-30 レジスト剥離液

Country Status (4)

Country Link
JP (1) JP6160893B1 (zh)
CN (1) CN107995960B (zh)
TW (1) TWI629353B (zh)
WO (1) WO2018061064A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6692029B1 (ja) * 2019-03-25 2020-05-13 パナソニックＩｐマネジメント株式会社 レジスト剥離液
JP6823821B1 (ja) * 2019-11-20 2021-02-03 パナソニックＩｐマネジメント株式会社 レジスト剥離液

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3828513A1 (de) * 1988-08-23 1990-03-01 Merck Patent Gmbh Abloesemittel fuer fotoresists
JPH06298974A (ja) * 1993-04-14 1994-10-25 Mitsui Toatsu Chem Inc ポリイミド樹脂のエッチング方法
JPH0887117A (ja) * 1994-09-16 1996-04-02 Tokyo Ohka Kogyo Co Ltd レジスト用剥離液組成物
JPH08334905A (ja) * 1995-06-08 1996-12-17 Tokyo Ohka Kogyo Co Ltd レジスト用剥離液組成物
JPH0996911A (ja) * 1995-09-29 1997-04-08 Tokyo Ohka Kogyo Co Ltd レジスト用剥離液組成物
JPH09311467A (ja) * 1996-05-21 1997-12-02 Nitto Denko Corp レジスト剥離剤
JPH10239865A (ja) * 1997-02-24 1998-09-11 Jsr Corp ネガ型フォトレジスト用剥離液組成物
JP2000056480A (ja) * 1998-08-10 2000-02-25 Tokyo Ohka Kogyo Co Ltd レジスト用剥離液組成物およびこれを用いたレジスト剥離方法
JP2001022096A (ja) * 1999-07-02 2001-01-26 Nippon Zeon Co Ltd ポジ型レジスト用剥離液
JP2001022095A (ja) * 1999-07-02 2001-01-26 Nippon Zeon Co Ltd ポジ型レジスト用剥離液
WO2001021750A1 (fr) * 1999-09-24 2001-03-29 Tokuyama Corporation Detergent
JP2002162754A (ja) * 2000-11-28 2002-06-07 Nippon Zeon Co Ltd レジスト用剥離液とその利用
JP2003068699A (ja) * 2001-08-23 2003-03-07 Showa Denko Kk サイドウォール除去液
JP2003255565A (ja) * 2001-12-27 2003-09-10 Tokyo Ohka Kogyo Co Ltd ホトレジスト用剥離液
JP2004045774A (ja) * 2002-07-11 2004-02-12 Mitsubishi Gas Chem Co Inc レジスト剥離液組成物
WO2016101333A1 (zh) * 2014-12-23 2016-06-30 郑玢 一种光阻残留物清洗液

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4810764B2 (ja) * 2001-06-29 2011-11-09 三菱瓦斯化学株式会社 レジスト剥離剤組成物
KR100718527B1 (ko) * 2006-04-12 2007-05-16 테크노세미켐 주식회사 네거티브 포토레지스트용 박리액 조성물
JP4716225B2 (ja) * 2007-05-15 2011-07-06 ナガセケムテックス株式会社 フォトレジスト剥離剤組成物
JP5575318B1 (ja) * 2013-09-02 2014-08-20 パナソニック株式会社 レジスト剥離液
JP6277511B2 (ja) * 2013-10-18 2018-02-14 パナソニックＩｐマネジメント株式会社 レジスト剥離液

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3828513A1 (de) * 1988-08-23 1990-03-01 Merck Patent Gmbh Abloesemittel fuer fotoresists
JPH06298974A (ja) * 1993-04-14 1994-10-25 Mitsui Toatsu Chem Inc ポリイミド樹脂のエッチング方法
JPH0887117A (ja) * 1994-09-16 1996-04-02 Tokyo Ohka Kogyo Co Ltd レジスト用剥離液組成物
JPH08334905A (ja) * 1995-06-08 1996-12-17 Tokyo Ohka Kogyo Co Ltd レジスト用剥離液組成物
JPH0996911A (ja) * 1995-09-29 1997-04-08 Tokyo Ohka Kogyo Co Ltd レジスト用剥離液組成物
JPH09311467A (ja) * 1996-05-21 1997-12-02 Nitto Denko Corp レジスト剥離剤
JPH10239865A (ja) * 1997-02-24 1998-09-11 Jsr Corp ネガ型フォトレジスト用剥離液組成物
JP2000056480A (ja) * 1998-08-10 2000-02-25 Tokyo Ohka Kogyo Co Ltd レジスト用剥離液組成物およびこれを用いたレジスト剥離方法
JP2001022096A (ja) * 1999-07-02 2001-01-26 Nippon Zeon Co Ltd ポジ型レジスト用剥離液
JP2001022095A (ja) * 1999-07-02 2001-01-26 Nippon Zeon Co Ltd ポジ型レジスト用剥離液
WO2001021750A1 (fr) * 1999-09-24 2001-03-29 Tokuyama Corporation Detergent
JP2002162754A (ja) * 2000-11-28 2002-06-07 Nippon Zeon Co Ltd レジスト用剥離液とその利用
JP2003068699A (ja) * 2001-08-23 2003-03-07 Showa Denko Kk サイドウォール除去液
JP2003255565A (ja) * 2001-12-27 2003-09-10 Tokyo Ohka Kogyo Co Ltd ホトレジスト用剥離液
JP2004045774A (ja) * 2002-07-11 2004-02-12 Mitsubishi Gas Chem Co Inc レジスト剥離液組成物
WO2016101333A1 (zh) * 2014-12-23 2016-06-30 郑玢 一种光阻残留物清洗液

Also Published As

Publication number Publication date
TWI629353B (zh) 2018-07-11
CN107995960B (zh) 2019-03-12
JPWO2018061064A1 (ja) 2018-10-04
CN107995960A (zh) 2018-05-04
TW201814036A (zh) 2018-04-16
WO2018061064A1 (ja) 2018-04-05

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