JP6104506B2 - 発光ダイオード・パッケージ用モールド構造体 - Google Patents
発光ダイオード・パッケージ用モールド構造体 Download PDFInfo
- Publication number
- JP6104506B2 JP6104506B2 JP2012008916A JP2012008916A JP6104506B2 JP 6104506 B2 JP6104506 B2 JP 6104506B2 JP 2012008916 A JP2012008916 A JP 2012008916A JP 2012008916 A JP2012008916 A JP 2012008916A JP 6104506 B2 JP6104506 B2 JP 6104506B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- package
- mold
- mold structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000009966 trimming Methods 0.000 claims description 21
- 238000007373 indentation Methods 0.000 claims 2
- 238000004806 packaging method and process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 12
- 238000005452 bending Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000000463 material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73215—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Description
11,21 パッケージ・モールド
12,26 キャビティ
13,201 発光ダイオード
14,23 電極リード
20 発光ダイオード・パッケージ用モールド構造体
22 陥入部
24 突出部
25 トリミング用ダイ
202 ボンディング・ワイヤ
Claims (5)
- 発光ダイオード実装用のキャビティが形成される前面と、該前面の反対側の後面と、を持つパッケージ・モールドと、
前記パッケージ・モールドの互いに反対側である第1側面、及び第2側面に一つずつ形成された一対の陥入部と、
前記一対の陥入部に対応する位置に形成された一対の突出部と、
前記パッケージ・モールドの前記第1側面、及び前記第2側面から前記前面に平行な平面に沿って突出した後、前記第1側面、及び第2側面に一つずつ密着するように折り曲げられ、前記一対の突出部から遠ざかる方向へ延長され、さらにそれぞれ前記パッケージ・モールドの前記後面と垂直を成す第3側面に沿うように折り曲げられた一組の電極リードと、を含むことを特徴とする発光ダイオード・パッケージ用モールド構造体。
- 前記陥入部は、前記パッケージ・モールドの発光ダイオード実装用のキャビティの反対側領域に形成されたことを特徴とする請求項1に記載の発光ダイオード・パッケージ用モールド構造体。
- 前記陥入部は、トリミング用ダイが挿入される領域であることを特徴とする請求項1または2に記載の発光ダイオード・パッケージ用モールド構造体。
- 前記パッケージ・モールド及び前記電極リードの間隔は、0.4mmより小さいことを特徴とする請求項1に記載の発光ダイオード・パッケージ用モールド構造体。
- SMD(service mount device)型の発光ダイオード・パッケージ用モールド構造体であることを特徴とする請求項1から4の何れか1項に記載の発光ダイオード・パッケージ用モールド構造体。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2011-0005981 | 2011-01-20 | ||
KR1020110005981A KR101725221B1 (ko) | 2011-01-20 | 2011-01-20 | 발광 다이오드 패키지용 몰드 구조체 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012151479A JP2012151479A (ja) | 2012-08-09 |
JP6104506B2 true JP6104506B2 (ja) | 2017-03-29 |
Family
ID=44720630
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012008916A Active JP6104506B2 (ja) | 2011-01-20 | 2012-01-19 | 発光ダイオード・パッケージ用モールド構造体 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8692138B2 (ja) |
EP (1) | EP2479809B1 (ja) |
JP (1) | JP6104506B2 (ja) |
KR (1) | KR101725221B1 (ja) |
CN (1) | CN102610732B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200014485A (ko) * | 2018-08-01 | 2020-02-11 | 강원대학교산학협력단 | 파종기용 모판 자동적재 장치 및 그 제어방법 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102161273B1 (ko) * | 2014-03-25 | 2020-09-29 | 엘지이노텍 주식회사 | 발광 소자 패키지 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5647124A (en) * | 1994-04-25 | 1997-07-15 | Texas Instruments Incorporated | Method of attachment of a semiconductor slotted lead to a substrate |
JP3532395B2 (ja) * | 1997-10-03 | 2004-05-31 | 株式会社ルネサステクノロジ | 半導体装置の製造方法、プレス金型、ガイドレール |
JP3556833B2 (ja) * | 1998-05-29 | 2004-08-25 | ローム株式会社 | 半導体パッケージケース |
KR100457380B1 (ko) * | 2002-05-06 | 2004-11-16 | 삼성전기주식회사 | 광마우스용 칩 온 보드 리드 패키지 및 그에 사용되는렌즈커버 |
JP3991961B2 (ja) * | 2002-09-05 | 2007-10-17 | 日亜化学工業株式会社 | 側面発光型発光装置 |
US7183588B2 (en) * | 2004-01-08 | 2007-02-27 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light emission device |
JP4789433B2 (ja) * | 2004-06-30 | 2011-10-12 | 三洋電機株式会社 | Led表示器用筺体及びled表示器 |
US7635915B2 (en) * | 2006-04-26 | 2009-12-22 | Cree Hong Kong Limited | Apparatus and method for use in mounting electronic elements |
KR100764449B1 (ko) | 2006-10-24 | 2007-10-05 | 삼성전기주식회사 | 발광소자 패키지 |
KR100928635B1 (ko) | 2007-08-30 | 2009-11-27 | 주식회사 루멘스 | 측면 발광 다이오드 패키지 |
US7737546B2 (en) * | 2007-09-05 | 2010-06-15 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Surface mountable semiconductor package with solder bonding features |
AU2009211784B2 (en) * | 2008-02-08 | 2013-10-10 | Nichia Corporation | Light emitting device |
KR20090102209A (ko) | 2008-03-25 | 2009-09-30 | 서울반도체 주식회사 | Led 실장용 인쇄회로기판 |
CN101546754A (zh) * | 2008-03-26 | 2009-09-30 | 富准精密工业(深圳)有限公司 | 发光二极管模组 |
JP2010003877A (ja) * | 2008-06-20 | 2010-01-07 | Panasonic Corp | リードフレームおよび光半導体パッケージおよび光半導体装置および光半導体パッケージの製造方法 |
JP5464825B2 (ja) * | 2008-07-23 | 2014-04-09 | ローム株式会社 | Ledモジュール |
US7923739B2 (en) * | 2009-06-05 | 2011-04-12 | Cree, Inc. | Solid state lighting device |
KR20110005981A (ko) | 2009-07-13 | 2011-01-20 | 현대중공업 주식회사 | 선박 건조 시의 자재 관리 방법 |
JP3160994U (ja) * | 2010-04-30 | 2010-07-15 | サンケン電気株式会社 | 樹脂成形リードフレーム |
-
2011
- 2011-01-20 KR KR1020110005981A patent/KR101725221B1/ko active IP Right Grant
- 2011-08-24 US US13/216,913 patent/US8692138B2/en active Active
- 2011-09-13 EP EP11180993.5A patent/EP2479809B1/en active Active
- 2011-12-29 CN CN201110460452.4A patent/CN102610732B/zh active Active
-
2012
- 2012-01-19 JP JP2012008916A patent/JP6104506B2/ja active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200014485A (ko) * | 2018-08-01 | 2020-02-11 | 강원대학교산학협력단 | 파종기용 모판 자동적재 장치 및 그 제어방법 |
KR102145426B1 (ko) * | 2018-08-01 | 2020-08-18 | 강원대학교산학협력단 | 파종기용 모판 자동적재 장치 및 그 제어방법 |
Also Published As
Publication number | Publication date |
---|---|
KR20120084551A (ko) | 2012-07-30 |
JP2012151479A (ja) | 2012-08-09 |
CN102610732A (zh) | 2012-07-25 |
US20120186848A1 (en) | 2012-07-26 |
EP2479809A2 (en) | 2012-07-25 |
CN102610732B (zh) | 2016-05-25 |
KR101725221B1 (ko) | 2017-04-11 |
EP2479809A3 (en) | 2016-01-06 |
EP2479809B1 (en) | 2019-09-11 |
US8692138B2 (en) | 2014-04-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5331108B2 (ja) | 発光素子パッケージ及びその製造方法 | |
US9461207B2 (en) | Light emitting device, and package array for light emitting device | |
JP2007189150A (ja) | 低背ledデバイス用リードフレーム及びその製造方法 | |
TWI505519B (zh) | 發光二極體燈條及其製造方法 | |
JP2014049764A (ja) | 側面型発光ダイオードパッケージ及びその製造方法 | |
CN103390603A (zh) | 引线框架和使用该引线框架的半导体装置封装件 | |
US9159893B2 (en) | Light emitting device including lead having terminal part and exposed part, and method for manufacturing the same | |
TW201324879A (zh) | 封裝體及發光裝置 | |
US9615493B2 (en) | Light emitting device, and method for manufacturing circuit board | |
JP6104506B2 (ja) | 発光ダイオード・パッケージ用モールド構造体 | |
JP4914710B2 (ja) | 発光素子実装パッケージ用リードフレームおよびその製造方法 | |
TWI509834B (zh) | 發光二極體封裝結構及其製造方法 | |
TWI750228B (zh) | 發光裝置及其製造方法 | |
US20120314419A1 (en) | Heat dissipation structure of light-emitting diode | |
CN103545415B (zh) | 发光二极管的制造方法 | |
JP7432002B2 (ja) | オプトエレクトロニクス半導体素子のためのケーシングおよびオプトエレクトロニクス半導体素子 | |
US20150162498A1 (en) | Light emitting diode package and method for manufacturing the same | |
US10243107B2 (en) | Light emitting device and method for manufacturing thereof | |
US20150162497A1 (en) | Light emitting diode package and method for manufacuring the same | |
JP2007042700A (ja) | 表面実装型半導体装置 | |
JP5359135B2 (ja) | 発光装置 | |
JP2015037103A (ja) | 半導体装置及び半導体装置の製造方法 | |
TW201513410A (zh) | 發光二極體製造方法 | |
JP2012234977A (ja) | Led発光素子用リードフレーム基板とその製造方法、およびled発光素子装置とその製造方法 | |
JP2020074488A (ja) | 発光装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20120814 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20130321 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150105 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150206 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20151027 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20151117 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160217 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160712 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160929 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170221 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170301 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6104506 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |