JP6087432B2 - フレキシブルプリント回路及びフレキシブルプリント回路の製造方法 - Google Patents
フレキシブルプリント回路及びフレキシブルプリント回路の製造方法 Download PDFInfo
- Publication number
- JP6087432B2 JP6087432B2 JP2015520143A JP2015520143A JP6087432B2 JP 6087432 B2 JP6087432 B2 JP 6087432B2 JP 2015520143 A JP2015520143 A JP 2015520143A JP 2015520143 A JP2015520143 A JP 2015520143A JP 6087432 B2 JP6087432 B2 JP 6087432B2
- Authority
- JP
- Japan
- Prior art keywords
- layer portion
- conductive layer
- flexible printed
- printed circuit
- fpc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
- A61B5/25—Bioelectric electrodes therefor
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
- A61B5/25—Bioelectric electrodes therefor
- A61B5/251—Means for maintaining electrode contact with the body
- A61B5/257—Means for maintaining electrode contact with the body using adhesive means, e.g. adhesive pads or tapes
- A61B5/259—Means for maintaining electrode contact with the body using adhesive means, e.g. adhesive pads or tapes using conductive adhesive means, e.g. gels
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
- A61B5/25—Bioelectric electrodes therefor
- A61B5/271—Arrangements of electrodes with cords, cables or leads, e.g. single leads or patient cord assemblies
- A61B5/273—Connection of cords, cables or leads to electrodes
- A61B5/274—Connection of cords, cables or leads to electrodes using snap or button fasteners
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Description
Claims (3)
- 基板層部分と導電層部分とを備えるフレキシブルプリント回路であって、前記導電層部分は前記基板層部分の上に重ねられており、
前記基板層部分がそれ自体に形成された開口部を有しており、前記開口部の上に前記導電層部分の一部が位置づけられて、部分的に取り外し可能なタブを形成しており、前記タブが、前記フレキシブルプリント回路の一部分を前記フレキシブルプリント回路の別の部分から分離し始めるために使用され、
前記導電層部分は、前記フレキシブルプリント回路の前記一部分を規定する溝を備え、前記溝は、使用時に前記一部分を前記別の部分から分離するのを誘導するように構成される、フレキシブルプリント回路。 - 基板層部分と導電層部分とを備えるフレキシブルプリント回路であって、前記導電層部分は前記基板層部分の上に重ねられており、
前記基板層部分がそれ自体に形成された複数の開口部を有しており、各開口部の上に前記導電層部分の異なった部分が位置づけられて、部分的に取り外し可能な複数のタブを形成しており、各タブは、前記フレキシブルプリント回路の一部分を前記フレキシブルプリント回路の別の部分から分離し始めるために使用され、
前記導電層部分は、前記フレキシブルプリント回路の前記一部分を規定する溝を備え、前記溝は、使用時に前記一部分を前記別の部分から分離するのを誘導するように構成される、フレキシブルプリント回路。 - フレキシブルプリント回路の製造方法であって、
基板層部分の上に導電層部分を形成する工程と、
開口部の上に前記導電層部分の一部が位置づけられて、部分的に取り外し可能なタブを形成するように、前記基板層部分に前記開口部を形成する工程であって、前記タブは、前記フレキシブルプリント回路の一部分を前記フレキシブルプリント回路の別の部分から分離し始めるために使用されるものである、工程と、を含み、
前記導電層部分は、前記フレキシブルプリント回路の前記一部分を規定する溝を備え、前記溝は、使用時に前記一部分を前記別の部分から分離するのを誘導するように構成される、方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2012/044855 WO2014003779A1 (en) | 2012-06-29 | 2012-06-29 | A flexible printed circuit and a method of fabricating a flexible printed circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015525967A JP2015525967A (ja) | 2015-09-07 |
JP6087432B2 true JP6087432B2 (ja) | 2017-03-01 |
Family
ID=49783706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015520143A Expired - Fee Related JP6087432B2 (ja) | 2012-06-29 | 2012-06-29 | フレキシブルプリント回路及びフレキシブルプリント回路の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10420215B2 (ja) |
JP (1) | JP6087432B2 (ja) |
KR (1) | KR20150023887A (ja) |
CN (1) | CN104412719B (ja) |
TW (1) | TW201406252A (ja) |
WO (1) | WO2014003779A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11552432B2 (en) | 2019-08-12 | 2023-01-10 | High Speed Interconnects, Llc | Methods and apparatus for RF shield and cable attachment system |
FR3107143A1 (fr) * | 2020-02-06 | 2021-08-13 | Armor Beautiful Light | Dispositif électronique destiné à être raccordé à un connecteur électrique et procédé de raccordement associé |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
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US2964587A (en) * | 1956-11-16 | 1960-12-13 | Otis N Minot | Tape conductor |
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DE3588033T2 (de) * | 1984-10-08 | 1996-02-08 | Nitto Denko Corp | Biomedizinische Elektrode. |
US4674512A (en) * | 1986-02-03 | 1987-06-23 | Lectec Corporation | Medical electrode for monitoring and diagnostic use |
JPH0436809Y2 (ja) * | 1986-12-24 | 1992-08-31 | ||
US4990724A (en) * | 1989-12-04 | 1991-02-05 | Motorola, Inc. | Method and apparatus for electrically interconnecting opposite sides of a flex circuit |
WO1991018957A1 (en) * | 1990-06-08 | 1991-12-12 | Minnesota Mining And Manufacturing Company | Reworkable adhesive for electronic applications |
JPH0648700B2 (ja) * | 1990-12-27 | 1994-06-22 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 導電性層の剥離防止構造を有するtabテープ |
JP3457308B2 (ja) * | 1991-11-15 | 2003-10-14 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | 二相複合導性感圧接着剤の施された生物医療電極 |
US5387126A (en) * | 1993-08-16 | 1995-02-07 | Motorola, Inc. | Configurable circuit substrate |
US5640763A (en) | 1995-06-06 | 1997-06-24 | Pulse Engineering, Inc. | Method for depanelizing electrical circuitry |
JPH1098081A (ja) * | 1996-09-24 | 1998-04-14 | Hitachi Cable Ltd | 半導体チップ実装用のテープキャリア及びその製造方法 |
US5868671A (en) * | 1997-01-28 | 1999-02-09 | Hewlett-Packard Company | Multiple ECG electrode strip |
JP3356076B2 (ja) * | 1998-08-19 | 2002-12-09 | ソニーケミカル株式会社 | フレキシブルプリント配線板及びその製造方法 |
WO2003009658A1 (en) | 2001-07-16 | 2003-01-30 | Aselsan Elektronik Sanayi Ve Ticaret A.S. | Method for singulating flexible circuit |
US6751493B2 (en) * | 2002-01-09 | 2004-06-15 | Unilead International, Inc. | Universal electrocardiogram sensor positioning mask with repositionable sensors and method for employing same |
US7371970B2 (en) | 2002-12-06 | 2008-05-13 | Flammer Jeffrey D | Rigid-flex circuit board system |
CN100579333C (zh) * | 2003-01-23 | 2010-01-06 | 东丽株式会社 | 电路基板用部件、电路基板的制造方法及电路基板的制造装置 |
TWI356658B (en) | 2003-01-23 | 2012-01-11 | Toray Industries | Members for circuit board, method and device for m |
KR100704936B1 (ko) * | 2005-06-22 | 2007-04-09 | 삼성전기주식회사 | 전자부품 내장 인쇄회로기판 및 그 제작방법 |
US7620439B2 (en) * | 2005-08-04 | 2009-11-17 | 3M Innovative Properties Company | Conductive adhesives and biomedical articles including same |
JP4753749B2 (ja) | 2006-03-03 | 2011-08-24 | 日東電工株式会社 | 配線回路基板集合体シートおよびその製造方法 |
JP5012184B2 (ja) | 2007-05-08 | 2012-08-29 | 船井電機株式会社 | フレキシブル基板シートと同基板シートを用いた回路基板の組立方法 |
CN101431863B (zh) | 2007-11-05 | 2010-12-08 | 富葵精密组件(深圳)有限公司 | 软性印刷电路板背胶贴合方法 |
JP2009188114A (ja) * | 2008-02-05 | 2009-08-20 | Three M Innovative Properties Co | フレキシブルプリント回路基板の接続方法及び当該方法で得られる電子機器 |
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-
2012
- 2012-06-29 US US14/396,964 patent/US10420215B2/en not_active Expired - Fee Related
- 2012-06-29 CN CN201280074379.XA patent/CN104412719B/zh not_active Expired - Fee Related
- 2012-06-29 WO PCT/US2012/044855 patent/WO2014003779A1/en active Application Filing
- 2012-06-29 KR KR20157002088A patent/KR20150023887A/ko not_active Application Discontinuation
- 2012-06-29 JP JP2015520143A patent/JP6087432B2/ja not_active Expired - Fee Related
-
2013
- 2013-06-17 TW TW102121424A patent/TW201406252A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2014003779A1 (en) | 2014-01-03 |
TW201406252A (zh) | 2014-02-01 |
US20150144381A1 (en) | 2015-05-28 |
CN104412719B (zh) | 2018-01-26 |
CN104412719A (zh) | 2015-03-11 |
JP2015525967A (ja) | 2015-09-07 |
KR20150023887A (ko) | 2015-03-05 |
US10420215B2 (en) | 2019-09-17 |
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