JP6031905B2 - ノボラック型フェノール樹脂の製造方法、フォトレジスト用樹脂組成物の製造方法および液晶デバイスの製造方法 - Google Patents

ノボラック型フェノール樹脂の製造方法、フォトレジスト用樹脂組成物の製造方法および液晶デバイスの製造方法 Download PDF

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JP6031905B2
JP6031905B2 JP2012198809A JP2012198809A JP6031905B2 JP 6031905 B2 JP6031905 B2 JP 6031905B2 JP 2012198809 A JP2012198809 A JP 2012198809A JP 2012198809 A JP2012198809 A JP 2012198809A JP 6031905 B2 JP6031905 B2 JP 6031905B2
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type phenol
resin
phenol resin
photoresist
producing
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JP2012198809A
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Japanese (ja)
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JP2013079369A (ja
Inventor
純 真鳥
純 真鳥
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Priority to JP2012198809A priority Critical patent/JP6031905B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
    • C08G8/10—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with phenol
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
    • C08G8/12—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with monohydric phenols having only one hydrocarbon substituent ortho on para to the OH group, e.g. p-tert.-butyl phenol
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
JP2012198809A 2011-09-21 2012-09-10 ノボラック型フェノール樹脂の製造方法、フォトレジスト用樹脂組成物の製造方法および液晶デバイスの製造方法 Active JP6031905B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012198809A JP6031905B2 (ja) 2011-09-21 2012-09-10 ノボラック型フェノール樹脂の製造方法、フォトレジスト用樹脂組成物の製造方法および液晶デバイスの製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011205833 2011-09-21
JP2011205833 2011-09-21
JP2012198809A JP6031905B2 (ja) 2011-09-21 2012-09-10 ノボラック型フェノール樹脂の製造方法、フォトレジスト用樹脂組成物の製造方法および液晶デバイスの製造方法

Publications (2)

Publication Number Publication Date
JP2013079369A JP2013079369A (ja) 2013-05-02
JP6031905B2 true JP6031905B2 (ja) 2016-11-24

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JP2012198809A Active JP6031905B2 (ja) 2011-09-21 2012-09-10 ノボラック型フェノール樹脂の製造方法、フォトレジスト用樹脂組成物の製造方法および液晶デバイスの製造方法

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JP (1) JP6031905B2 (ko)
KR (1) KR20130031799A (ko)
TW (1) TWI546323B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016006358A1 (ja) 2014-07-09 2016-01-14 Dic株式会社 フェノール性水酸基含有樹脂、その製造方法、感光性組成物、レジスト材料、塗膜、硬化性組成物とその硬化物、及びレジスト下層膜
RU2677493C1 (ru) * 2018-02-07 2019-01-17 Федеральное государственное унитарное предприятие "Государственный научный центр "Научно-исследовательский институт органических полупродуктов и красителей" Алкилфенолоформальдегидные смолы - пленкообразующие для фоторезистов

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60189739A (ja) * 1984-03-09 1985-09-27 Japan Synthetic Rubber Co Ltd ポジ型感光性樹脂組成物
CA2023791A1 (en) * 1989-08-24 1991-02-25 Ayako Ida Radiation-sensitive positive resist composition
JP3472994B2 (ja) * 1995-02-17 2003-12-02 Ｊｓｒ株式会社 感放射線性樹脂組成物
JP3478378B2 (ja) * 1998-12-18 2003-12-15 Ｊｓｒ株式会社 アルカリ可溶性ノボラック樹脂
JP2000338660A (ja) * 1999-05-27 2000-12-08 Toray Ind Inc ポジ型電子線レジスト組成物およびこれを用いたレジストパターンの製造法
JP2002268214A (ja) * 2001-03-08 2002-09-18 Sumitomo Bakelite Co Ltd フォトレジスト用フェノ−ル樹脂
JP4156400B2 (ja) * 2003-02-24 2008-09-24 東京応化工業株式会社 ポジ型ホトレジスト組成物及びレジストパターンの形成方法
JP2005221515A (ja) * 2004-01-08 2005-08-18 Tokyo Ohka Kogyo Co Ltd システムｌｃｄ製造用ポジ型ホトレジスト組成物およびレジストパターンの形成方法
JP4929733B2 (ja) * 2005-01-28 2012-05-09 住友ベークライト株式会社 ノボラック型フェノール樹脂の製造方法
JP2007254547A (ja) * 2006-03-22 2007-10-04 Sumitomo Bakelite Co Ltd フォトレジスト用フェノール樹脂とその製造方法、及びフォトレジスト用樹脂組成物

Also Published As

Publication number Publication date
JP2013079369A (ja) 2013-05-02
TWI546323B (zh) 2016-08-21
KR20130031799A (ko) 2013-03-29
TW201323488A (zh) 2013-06-16

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