JP6017999B2 - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
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- JP6017999B2 JP6017999B2 JP2013052915A JP2013052915A JP6017999B2 JP 6017999 B2 JP6017999 B2 JP 6017999B2 JP 2013052915 A JP2013052915 A JP 2013052915A JP 2013052915 A JP2013052915 A JP 2013052915A JP 6017999 B2 JP6017999 B2 JP 6017999B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
9 基板
12 チャンバ
14 基板保持部
15 基板回転機構
81 環状開口
100 拡大密閉空間
120 チャンバ空間
121 チャンバ本体
122 チャンバ蓋部
131 チャンバ開閉機構
160 側方空間
161 (外側)カップ部
161a 内側カップ部
162 (外側)カップ部移動機構
162a 内側カップ部移動機構
188 (外側)スキャンノズル
188a 内側スキャンノズル
188b スキャンノズル
881,881a 吐出ヘッド
882 ヘッド支持部
891,891a ヘッド回転機構
J1 中心軸
S11〜S15,S21〜S23 ステップ
Claims (8)
- 基板を処理する基板処理装置であって、
チャンバ空間を形成するチャンバ本体およびチャンバ蓋部を有し、前記チャンバ蓋部により前記チャンバ本体の上部開口を閉塞することにより前記チャンバ空間を密閉するチャンバと、
前記チャンバ蓋部を前記チャンバ本体に対して上下方向に相対的に移動するチャンバ開閉機構と、
前記チャンバ空間に配置され、水平状態で基板を保持する基板保持部と、
上下方向を向く中心軸を中心として前記基板を前記基板保持部と共に回転する基板回転機構と、
前記チャンバの外側に全周に亘って位置し、前記チャンバの外周に側方空間を形成し、前記チャンバ蓋部が前記チャンバ本体から離間することにより前記基板の周囲に形成される環状開口を介して、回転する前記基板から飛散する処理液を受けるカップ部と、
前記側方空間において前記チャンバまたは前記カップ部に取り付けられ、前記環状開口を介して前記基板の上方へと移動して前記基板上に処理液を供給する、または、前記環状開口を介して前記基板上に処理液を供給する処理液供給部と、
を備え、
前記環状開口が形成された状態で、前記カップ部が前記チャンバ蓋部に接することにより、前記チャンバ空間および前記側方空間が1つの拡大密閉空間となることを特徴とする基板処理装置。 - 請求項1に記載の基板処理装置であって、
前記処理液供給部が、
処理液を吐出する吐出ヘッドと、
水平方向に延びる部材であり、自由端部に前記吐出ヘッドが固定され、固定端部が前記側方空間において前記チャンバまたは前記カップ部に取り付けられるヘッド支持部と、
を備え、
前記基板処理装置が、前記固定端部を中心として前記ヘッド支持部を前記吐出ヘッドと共に回転するヘッド回転機構をさらに備え、
前記基板上に処理液が供給される際には、前記ヘッド回転機構により前記ヘッド支持部が回転することにより、前記吐出ヘッドが前記環状開口を介して前記基板の上方へと移動することを特徴とする基板処理装置。 - 請求項2に記載の基板処理装置であって、
前記ヘッド回転機構が、前記拡大密閉空間の外側に配置されることを特徴とする基板処理装置。 - 請求項3に記載の基板処理装置であって、
前記カップ部を、前記環状開口の外側の液受け位置と、前記液受け位置よりも下方の退避位置との間で上下方向に移動するカップ部移動機構をさらに備え、
前記ヘッド回転機構が、前記カップ部の上部に固定され、前記カップ部と共に上下方向に移動することを特徴とする基板処理装置。 - 請求項3に記載の基板処理装置であって、
前記ヘッド回転機構が、前記チャンバ蓋部に固定され、前記チャンバ蓋部と共に前記チャンバ本体部に対して相対的に上下方向に移動することを特徴とする基板処理装置。 - 請求項2ないし5のいずれかに記載の基板処理装置であって、
前記吐出ヘッドが、前記基板回転機構により回転する前記基板の上方にて、所定の移動経路に沿って往復移動しつつ前記基板上に処理液を供給することを特徴とする基板処理装置。 - 請求項1ないし6のいずれかに記載の基板処理装置であって、
前記拡大密閉空間において前記環状開口の外側に全周に亘って位置し、回転する前記基板から飛散する処理液を受ける他のカップ部と、
前記他のカップ部を、前記環状開口の外側の液受け位置と、前記液受け位置よりも下方の退避位置との間で前記カップ部から独立して上下方向に移動する内側カップ部移動機構と、
をさらに備えることを特徴とする基板処理装置。 - 請求項1ないし7のいずれかに記載の基板処理装置であって、
前記処理液供給部が前記側方空間に収容された状態で、前記処理液供給部からのプリディスペンスが行われることを特徴とする基板処理装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013052915A JP6017999B2 (ja) | 2013-03-15 | 2013-03-15 | 基板処理装置 |
PCT/JP2014/054880 WO2014141890A1 (ja) | 2013-03-15 | 2014-02-27 | 基板処理装置 |
CN201480015567.4A CN105122426B (zh) | 2013-03-15 | 2014-02-27 | 基板处理装置 |
US14/776,963 US20160042980A1 (en) | 2013-03-15 | 2014-02-27 | Substrate processing apparatus |
KR1020157025225A KR101699657B1 (ko) | 2013-03-15 | 2014-02-27 | 기판 처리 장치 |
TW103109412A TWI501310B (zh) | 2013-03-15 | 2014-03-14 | 基板處理裝置 |
US17/095,954 US11621176B2 (en) | 2013-03-15 | 2020-11-12 | Substrate processing apparatus |
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JP2013052915A JP6017999B2 (ja) | 2013-03-15 | 2013-03-15 | 基板処理装置 |
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JP2014179491A JP2014179491A (ja) | 2014-09-25 |
JP6017999B2 true JP6017999B2 (ja) | 2016-11-02 |
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US (2) | US20160042980A1 (ja) |
JP (1) | JP6017999B2 (ja) |
KR (1) | KR101699657B1 (ja) |
CN (1) | CN105122426B (ja) |
TW (1) | TWI501310B (ja) |
WO (1) | WO2014141890A1 (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109461685B (zh) * | 2014-02-27 | 2022-03-08 | 株式会社思可林集团 | 基板处理装置 |
JP6392046B2 (ja) * | 2014-09-17 | 2018-09-19 | 株式会社Screenホールディングス | 基板処理装置 |
JP6333184B2 (ja) * | 2015-01-09 | 2018-05-30 | 東京エレクトロン株式会社 | 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体 |
TWI661479B (zh) * | 2015-02-12 | 2019-06-01 | 日商思可林集團股份有限公司 | 基板處理裝置、基板處理系統以及基板處理方法 |
US10730059B2 (en) | 2015-03-05 | 2020-08-04 | SCREEN Holdings Co., Ltd. | Substrate processing method and substrate processing apparatus |
US10037902B2 (en) * | 2015-03-27 | 2018-07-31 | SCREEN Holdings Co., Ltd. | Substrate processing device and substrate processing method |
JP6467292B2 (ja) * | 2015-05-29 | 2019-02-13 | 株式会社Screenホールディングス | 基板処理装置 |
CN106803477B (zh) * | 2015-11-25 | 2020-01-03 | 无锡华瑛微电子技术有限公司 | 半导体处理装置及其方法 |
JP6626762B2 (ja) * | 2016-03-30 | 2019-12-25 | 株式会社Screenホールディングス | 基板処理装置 |
JP6934732B2 (ja) * | 2016-03-31 | 2021-09-15 | 芝浦メカトロニクス株式会社 | 基板処理装置及び基板処理方法 |
JP6712482B2 (ja) * | 2016-03-31 | 2020-06-24 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
JP6722551B2 (ja) * | 2016-08-31 | 2020-07-15 | 株式会社Screenホールディングス | 基板処理方法 |
JP6706564B2 (ja) * | 2016-09-23 | 2020-06-10 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
US11498100B2 (en) | 2017-03-06 | 2022-11-15 | Acm Research (Shanghai) Inc. | Apparatus for cleaning semiconductor substrates |
JP7138334B2 (ja) * | 2018-06-08 | 2022-09-16 | 株式会社エアレックス | 作業フード |
JP7175122B2 (ja) * | 2018-08-02 | 2022-11-18 | 東京エレクトロン株式会社 | 基板処理装置、および基板処理方法 |
WO2022254486A1 (ja) * | 2021-05-31 | 2022-12-08 | 株式会社荏原製作所 | プリウェットモジュール、およびプリウェット方法 |
JP2022188425A (ja) | 2021-06-09 | 2022-12-21 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6228561B1 (en) * | 1996-02-01 | 2001-05-08 | Tokyo Electron Limited | Film forming method and film forming apparatus |
JP3713447B2 (ja) * | 2001-04-05 | 2005-11-09 | 東京エレクトロン株式会社 | 現像処理装置 |
US7171973B2 (en) * | 2001-07-16 | 2007-02-06 | Tokyo Electron Limited | Substrate processing apparatus |
JP4074814B2 (ja) * | 2002-01-30 | 2008-04-16 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
TW554075B (en) * | 2002-04-17 | 2003-09-21 | Grand Plastic Technology Corp | Puddle etching method of thin film using spin processor |
US7584760B2 (en) * | 2002-09-13 | 2009-09-08 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus |
JP4535967B2 (ja) | 2005-08-19 | 2010-09-01 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP4666494B2 (ja) * | 2005-11-21 | 2011-04-06 | 大日本スクリーン製造株式会社 | 基板処理装置 |
TWI314487B (en) * | 2005-11-22 | 2009-09-11 | Hiwin Tech Corp | Tooth-shaped processing method for a ball screw |
KR101062253B1 (ko) * | 2006-06-16 | 2011-09-06 | 도쿄엘렉트론가부시키가이샤 | 액 처리 장치 |
KR100749547B1 (ko) * | 2006-08-01 | 2007-08-14 | 세메스 주식회사 | 기판 처리 장치 |
JP4926933B2 (ja) * | 2007-12-14 | 2012-05-09 | 東京エレクトロン株式会社 | 基板洗浄装置および基板洗浄方法 |
JP5015847B2 (ja) * | 2008-04-07 | 2012-08-29 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法、プログラムならびに記録媒体 |
KR101068872B1 (ko) * | 2010-03-12 | 2011-09-30 | 세메스 주식회사 | 약액 공급 유닛 및 이를 갖는 기판 처리 장치 |
JP5371862B2 (ja) * | 2010-03-30 | 2013-12-18 | 大日本スクリーン製造株式会社 | 基板処理装置および処理液温度測定方法 |
KR101258002B1 (ko) * | 2010-03-31 | 2013-04-24 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리장치 및 기판처리방법 |
JP5358505B2 (ja) * | 2010-03-31 | 2013-12-04 | 大日本スクリーン製造株式会社 | 基板処理装置 |
US8926788B2 (en) * | 2010-10-27 | 2015-01-06 | Lam Research Ag | Closed chamber for wafer wet processing |
KR101512560B1 (ko) * | 2012-08-31 | 2015-04-15 | 가부시키가이샤 스크린 홀딩스 | 기판처리장치 |
US10229846B2 (en) * | 2013-12-25 | 2019-03-12 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus |
JP6279954B2 (ja) * | 2014-03-28 | 2018-02-14 | 株式会社Screenホールディングス | 基板処理装置 |
KR101972294B1 (ko) * | 2014-03-28 | 2019-04-24 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 기판 처리 방법 |
JP6467292B2 (ja) * | 2015-05-29 | 2019-02-13 | 株式会社Screenホールディングス | 基板処理装置 |
-
2013
- 2013-03-15 JP JP2013052915A patent/JP6017999B2/ja active Active
-
2014
- 2014-02-27 WO PCT/JP2014/054880 patent/WO2014141890A1/ja active Application Filing
- 2014-02-27 KR KR1020157025225A patent/KR101699657B1/ko active IP Right Grant
- 2014-02-27 CN CN201480015567.4A patent/CN105122426B/zh active Active
- 2014-02-27 US US14/776,963 patent/US20160042980A1/en not_active Abandoned
- 2014-03-14 TW TW103109412A patent/TWI501310B/zh active
-
2020
- 2020-11-12 US US17/095,954 patent/US11621176B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR101699657B1 (ko) | 2017-01-24 |
CN105122426A (zh) | 2015-12-02 |
JP2014179491A (ja) | 2014-09-25 |
CN105122426B (zh) | 2018-01-02 |
TWI501310B (zh) | 2015-09-21 |
KR20150119307A (ko) | 2015-10-23 |
US20210066094A1 (en) | 2021-03-04 |
TW201501194A (zh) | 2015-01-01 |
US20160042980A1 (en) | 2016-02-11 |
WO2014141890A1 (ja) | 2014-09-18 |
US11621176B2 (en) | 2023-04-04 |
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